CN219456569U

CN219456569U - Radiator suitable for high-speed QSFP-DD optical module

Info

Publication number: CN219456569U
Application number: CN202223385813.6U
Authority: CN
Inventors: 袁国生
Original assignee: HANGZHOU ECI COMMUNICATION CO Ltd
Current assignee: HANGZHOU ECI COMMUNICATION CO Ltd
Priority date: 2022-12-16
Filing date: 2022-12-16
Publication date: 2023-08-01
Anticipated expiration: 2032-12-16

Abstract

The utility model discloses a radiator suitable for a high-speed QSFP-DD optical module, which comprises a cuboid main body radiator, a radiating flat plate, a heat conducting pipe, a heat conducting block and a small fin, wherein the radiating flat plate is covered on the top surface of the main body radiator and connected with the main body radiator, the heat conducting pipe is positioned on the bottom surface of the main body radiator, and the heat conducting block and the small fin are covered above the heat conducting pipe. The radiator main body is formed by milling the section bar, and has a simple structure; the heat conduction pipe part has extremely high heat conductivity, and the heat conduction capacity is 400 times higher than that of a solid copper rod in general, so that the heat can be extremely quickly transmitted to a lower-temperature area; the heat conducting block part is formed by milling, and the smooth and flat contact surface increases the contact area with the optical module, so that heat conduction is facilitated; the small fin parts are welded at the tail parts of the radiators, so that the area of the whole radiator is increased, the heat exchange area is increased, and the formed airtight air duct is more beneficial to radiating.

Description

Radiator suitable for high-speed QSFP-DD optical module

Technical Field

The utility model relates to the field of optical communication, in particular to a radiator suitable for a high-speed QSFP-DD optical module.

Background

With the rapid expansion of the construction of the fifth generation mobile communication technology (5thGenerationMobile CommunicationTechnology,5G) communication network and the high-capacity data center in the world, the demand for communication bandwidth also rapidly increases, and the rapid increase of the demand for super 100Gbit/s optical transmission capacity of the 5G optical transmission network in a convergence layer and a core layer and the demand for bandwidth in the data center both promote the rapid large-scale deployment of 200/400Gbit/s optical modules with higher transmission rates.

In recent years, a 200/400Gbit/s optical module in a dual-density four-channel small-sized pluggable package (QSFP-DD) form is favored by a telecommunication market and a data center market due to the advantages of relatively low power consumption and small volume and convenience in high-density deployment, but the use environment of the QSFP-DD packaged optical module is limited due to the problem of heat dissipation condition deterioration caused by high speed and small volume.

The conventional aluminum QSFP-DD radiator used at present has a simple structure, as shown in fig. 1, the radiator is fixed on a QSFP-DD cage in a buckle mode, only has fins and a substrate, the radiating area is not large enough, the heat conduction efficiency is low, the radiator is difficult to adapt to the working environment of a high-speed QSFP-DD optical module, and a novel radiator is urgently required to be developed to meet the radiating requirement of the 200/400Gbit/s QSFP-DD optical module.

Disclosure of Invention

The utility model aims to solve the problems and provide a radiator applicable to a high-speed QSFP-DD optical module, which can meet the heat radiation requirement of the 200/400Gbit/s QSFP-DD optical module.

The utility model is realized by the following technical scheme:

the utility model discloses a radiator suitable for a high-speed QSFP-DD optical module, which is characterized by comprising a cuboid main body radiator, radiating flat fins, a heat conduction pipe, a heat conduction block and a small fin, wherein the radiating flat fins are covered on the top surface of the main body radiator and are connected with the main body radiator, the heat conduction pipe is positioned on the bottom surface of the main body radiator, and the heat conduction block and the small fin are covered above the heat conduction pipe.

As a further improvement, the main body radiator comprises a substrate and a plurality of fins which are arranged on the substrate, are perpendicular to the substrate and are arranged in a clearance way, wherein the substrate and the fins are integrated and are formed by processing an aluminum profile.

As a further improvement, the radiating flat fin is a copper sheet, covers the rear section of the top surface of the main body radiator and is fixed on the fin, and the length of the radiating flat fin is 22-60mm.

As a further improvement, the bottom of the substrate is provided with a groove, and the heat conduction heat pipe is embedded in the groove.

As a further improvement, the heat conduction heat pipe is evaporation-condensation type heat exchange equipment, heat transmission is realized through state change of working medium in the pipe, and the working medium is distilled water and the like.

As a further improvement, the heat conducting block is covered above the heat conducting pipe and fixed on the substrate, and is positioned at the front section of the bottom of the main body radiator, and the length of the heat conducting block is 38mm.

As a further improvement, the small fin is positioned at the rear section of the bottom of the main body radiator, covers the upper part of the heat conduction heat pipe, is fixed on the substrate, has the length of 15-40mm, is bent by an aluminum sheet to form a rectangular wave shape, and forms a plurality of rectangular air channels.

The beneficial effects of the utility model are as follows:

1. the radiator main body is formed by milling the section bar, and has a simple structure;

2. the heat conduction pipe part of the utility model has extremely high heat conductivity, and under normal conditions, the heat conduction capacity is 400 times higher than that of a solid copper rod, so that the heat can be extremely rapidly transmitted to a lower temperature area;

3. the heat conducting block part is formed by milling, and the smooth and flat contact surface increases the contact area with the optical module, so that the heat conduction is facilitated;

4. the small fin parts are welded at the tail parts of the radiators, so that the area of the whole radiator is increased, the heat exchange area is increased, and the formed closed air duct is more beneficial to radiating.

Drawings

FIG. 1 is a schematic diagram of a prior art heat sink;

FIG. 2 is a schematic view of the disassembled structure of the device of the present utility model;

fig. 3 is a schematic view of the structure of the device of the present utility model.

In the figure, 1 is a main body radiator, 2 is a radiating flat fin, 3 is a heat conducting pipe, 4 is a heat conducting block, 5 is a small fin, 6 is a fin, and 7 is a substrate.

Detailed Description

The utility model discloses a radiator suitable for a high-speed QSFP-DD optical module, and FIG. 2 is a schematic diagram of a split structure of the device; fig. 3 is a schematic view of the structure of the device of the present utility model. A radiator enhancement radiator suitable for a high-speed QSFP-DD optical module and capable of meeting the radiating requirement of a 200/400Gbit/s QSFP-DD optical module comprises a cuboid main body radiator 1, radiating fins 2 which cover the top surface of the main body radiator 1 and are connected with the main body radiator 1, a heat conducting pipe 3 positioned on the bottom surface of the main body radiator 1, and a heat conducting block 4 and a small fin 5 which cover the upper part of the heat conducting pipe. The main body radiator 1 comprises a substrate 7 and a plurality of fins 6 which are arranged on the substrate 7 in a clearance way and perpendicular to the substrate 7, wherein the substrate 7 and the fins 6 are integrated and are formed by processing an aluminum profile. The radiating flat plate 2 is a copper sheet, covers the rear section of the top surface of the main body radiator 1, is fixed on the fins 6, and the length of the radiating flat plate 2 is 22-60mm. The bottom of the substrate 7 is provided with a groove, and the heat conduction heat pipe is embedded in the groove. The heat conduction heat pipe is evaporation-condensation type heat exchange equipment, and realizes heat transmission by means of state change of working medium in the pipe, and is provided by a professional manufacturer; the working medium is distilled water, etc. The heat conducting block 4 is covered above the heat conducting pipe and fixed on the substrate 7, and is positioned at the front section of the bottom of the main body radiator 1, and the length of the heat conducting block is 38mm. The small fin 5 is positioned at the rear section of the bottom of the main body radiator 1, covers the upper part of the heat conduction heat pipe, is fixed on the substrate 7, has the length of 15-40mm, is formed by bending an aluminum sheet material into a rectangular wave shape, and forms a plurality of rectangular air channels. The radiating flat fin 2 is processed by copper sheet materials and welded at the rear end of the top of the main body radiator 1, and the small fin 5 increases the radiating area of the whole radiator and forms an air duct, thereby being more beneficial to radiating.

The foregoing is not intended to limit the utility model, and it should be noted that variations, modifications, additions and substitutions are possible, without departing from the scope of the utility model as disclosed in the accompanying claims.

Claims

1. The radiator suitable for the high-speed QSFP-DD optical module is characterized by comprising a cuboid main body radiator, radiating flat fins which cover the top surface of the main body radiator and are connected with the main body radiator, a heat conduction conduit positioned on the bottom surface of the main body radiator, and a heat conduction block and a small fin which cover the heat conduction conduit.

2. The heat sink for a high-speed QSFP-DD optical module according to claim 1, wherein the main body heat sink comprises a base and a plurality of fins arranged on the base perpendicularly to the base and in a gap arrangement, the base and the fins are integrated, and the base and the fins are formed by processing an aluminum profile.

3. The heat sink for a high-speed QSFP-DD optical module according to claim 2, wherein the heat sink plate is a copper sheet, covers the rear section of the top surface of the main body heat sink, is fixed to the fins, and has a length of 22-60mm.

4. The heat sink for a high-speed QSFP-DD optical module according to claim 2, wherein the base has a recess formed in a bottom thereof, and the heat pipe is embedded in the recess.

5. The heat sink for a high-speed QSFP-DD optical module according to claim 4, wherein the heat-conducting heat pipe is an evaporation-condensation type heat exchange device, and the heat transfer is achieved by a change in state of the working medium in the pipe.

6. The heat sink for a high-speed QSFP-DD optical module according to claim 1, 2, 3, 4 or 5, wherein the heat conducting block is covered over the heat conducting pipe and fixed to the base, and is located at a front section of the bottom of the main body heat sink, and has a length of 38mm.

7. The heat sink for a high-speed QSFP-DD optical module according to claim 6, wherein the small fins are located at a rear section of the bottom of the main body heat sink, cover over the heat-conducting heat pipe, and are fixed on the base, and have a length of 15-40mm, and the small fins are formed by bending an aluminum sheet material to form rectangular waves, and form a plurality of rectangular air channels.