CN215068117U - Integrated cooling system of server - Google Patents
Integrated cooling system of server Download PDFInfo
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- CN215068117U CN215068117U CN202121481902.3U CN202121481902U CN215068117U CN 215068117 U CN215068117 U CN 215068117U CN 202121481902 U CN202121481902 U CN 202121481902U CN 215068117 U CN215068117 U CN 215068117U
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- heat dissipation
- laminar flow
- server
- pipe
- pipe network
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- 238000001816 cooling Methods 0.000 title abstract description 17
- 230000017525 heat dissipation Effects 0.000 claims abstract description 52
- 238000003466 welding Methods 0.000 claims abstract description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 6
- 239000010935 stainless steel Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000007788 liquid Substances 0.000 abstract description 6
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010622 cold drawing Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a server integrated heat dissipation system, which comprises a laminar flow pipe type memory heat dissipation device, a cold plate, a flow divider, a junction station and a pipe network, wherein the laminar flow pipe type memory heat dissipation device comprises a laminar flow pipe and a heat conduction plate; one end of the heat conducting plate is inserted into the laminar flow pipe, and the inner cavity of the laminar flow pipe is divided into two independent inner cavities; one end of the laminar flow pipe is communicated with the collecting pipe; the other end of the laminar flow pipe is communicated with the shunt; the pipe network comprises an inlet pipe network and an outlet pipe network; the cold plate is connected with the flow collector and the flow divider in a welding way through an inlet pipe network. The heat dissipation system effectively integrates heat dissipation devices of all heating bodies of the server, achieves system heat dissipation, solves the problems that the heat dissipation devices are complex, large in occupied space, increased in operation load of the whole system, poor in heat dissipation and the like, and guarantees the safety of the liquid cooling server.
Description
Technical Field
The utility model relates to a server heat dissipation technical field specifically is an integrated cooling system of server.
Background
Most computers used at present rely on cold air to cool the machine. However, in data centers, air cooling alone has not been sufficient to meet the heat dissipation requirements of high heat flux servers. The traditional air cooling mode and the currently used cold plate heat dissipation mode are both carried out in an indirect contact cooling mode, the heat transfer process is complex, contact thermal resistance and convection heat transfer thermal resistance exist, particularly in the liquid cooling plate heat dissipation mode, due to the fact that the liquid cooling plate and a pipeline are unstable in connection mode, flatness cannot be guaranteed, contact failure of a contact surface of the liquid cooling plate and a heating body is caused, the total thermal resistance is large, and heat transfer efficiency is low.
In addition, there is no system design for CPU, display card and memory bank in the prior art, the CPU and the display card are designed to deal with high-density heat dissipation, and an independent liquid cooling heat dissipation system is mostly adopted, and the more advanced heat dissipation mode of the memory bank is to fix the metal heat dissipation fins on the memory by heat conduction glue. If the quality of the heat-conducting adhesive is poor, a heat-resistant layer is formed between the memory and the metal radiating fin, the heat of memory particles cannot be conducted to the radiating fin, the heat-radiating effect cannot be achieved, and even the heat radiation of the memory is influenced. In addition, for the double-sided memory heat sink, some heat sinks are clamped by the spring fastener, and some heat sinks are buckled by the metal fastener; the barb of the metal buckle type fastener firmly hooks the heat dissipation sheets on the two sides, and the heat dissipation sheets are fixed by an adhesive, so that the user only needs to pull the fastener outwards towards the two sides if the user wants to take off the heat dissipation sheets, but the fastener is deformed by over-force, so that the fastener cannot be used again, and the memory can be damaged. The existing server adopts various heat dissipation systems, and heat dissipation devices with various structures finish heat dissipation of the server, so that the system structure is complex, the occupied space is large, the operation load of the whole system is increased, and the heat dissipation effect is poor. In view of the above-mentioned problems in the art, no effective solution has been proposed.
SUMMERY OF THE UTILITY MODEL
For solving the problem that provides in the above-mentioned background art, the utility model aims to provide an integrated cooling system of server, this cooling system have effectively integrateed each heat-generating body heat abstractor of server, realize the system heat dissipation, and it is complicated to have solved heat abstractor, and occupation space is big, and whole system operation load increases, and the bad scheduling problem of heat dissipation has guaranteed the safety of liquid cooling server.
In order to achieve the above object, the utility model provides a following technical scheme:
a server integrated heat dissipation system comprises a laminar flow tube type memory heat dissipation device, a cold plate, a flow divider, a flow combiner and a pipe network, wherein the laminar flow tube type memory heat dissipation device comprises a laminar flow tube and a heat conduction plate; one end of the heat conducting plate is inserted into the laminar flow pipe, and the inner cavity of the laminar flow pipe is divided into two independent inner cavities; one end of the laminar flow pipe is communicated with the collecting pipe; the other end of the laminar flow pipe is communicated with the shunt; the pipe network comprises an inlet pipe network and an outlet pipe network; and the cold plate is fixedly connected with the junction station and the flow divider through an inlet pipe network by welding.
Further, the heat conducting plate is arranged in parallel to the memory bank of the server.
Furthermore, the heat conducting plate is inserted into the end part in the laminar flow pipe, and a plurality of salient points are arranged on two sides of the heat conducting plate.
Furthermore, the cold plate is in close contact with the CPU of the server and the heating surface of the display card.
Further, an inlet interface is arranged at one end of the inlet pipe network; and an outlet port is formed at one end of the outlet pipe network.
Further, the inlet interface and the outlet interface are communicated with a heat exchange system outside the server.
Furthermore, the laminar flow pipe, the junction station, the pipe network, the outlet interface, the flow divider and the inlet interface are all stainless steel pipes.
Further, the heat conducting plate and the cold plate are both made of copper plates.
Furthermore, a plurality of fins are symmetrically arranged on the outer surfaces of the pipe network and the laminar flow pipe respectively.
Compared with the prior art, the beneficial effects of the utility model are that:
(1) according to the novel heat dissipation system, the laminar flow pipe, the junction station, the pipe network, the outlet interface, the flow divider and the inlet interface are made of stainless steel, and the structural integrity and the stability of the integrated heat dissipation system are realized by utilizing the characteristics of strong rigidity and high supporting force of the stainless steel;
(2) according to the novel heat dissipation system, the cold plate is made of copper materials, and the purpose of high-efficiency heat dissipation is achieved by utilizing the good heat conduction characteristic of the cold plate;
(3) this novel cooling system that provides, the mode that the heat-conducting plate adopted the inserted laminar flow pipe, cut apart into two independent inner chambers with the laminar flow pipe inner chamber, and heat-conducting plate inserted portion is provided with the bump, realizes promptly that cold district working medium and heat-conducting plate furthest contact take away the heat, can strengthen the inside working medium mobility of pipeline again, and the radiating effect is better.
(4) This novel cooling system that provides all is provided with the fin at the surface of pipe network and laminar flow pipe, and this design can show the rigidity that strengthens pipe network and laminar flow pipe, effectively improves whole frame's structural stability, has guaranteed the plane degree of heat dissipation key component, has improved the accuracy of installation position.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a structural diagram of the middle-layer flow tube type memory heat sink of the present invention;
FIG. 3 is a schematic cross-sectional view of the pipe network of the present invention;
in the figure: 1. laminar flow pipe, 2, reflux ware, 3, heat-conducting plate, 3-1, bump, 4, cold drawing, 5, pipe network, 6, export interface, 7, shunt, 8, import interface, 9, fin.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1, an integrated heat dissipation system for a server includes a laminar flow tube type memory heat dissipation device, a cold plate 4, a splitter 7, a junction station 2 and a pipe network 5, wherein the laminar flow tube type memory heat dissipation device includes a laminar flow tube 1 and a heat conduction plate 3; one end of the heat conducting plate 3 is inserted into the laminar flow pipe 1, and the inner cavity of the laminar flow pipe 1 is divided into two independent inner cavities; the heat conducting plate 3 is inserted into the end part in the laminar flow pipe 1, and a plurality of salient points 3-1 are arranged on the two sides of the heat conducting plate; the heat conducting plate 3 is arranged parallel to the memory bank of the server.
Specifically, one end of the laminar flow pipe 1 is communicated with the collecting pipe 2; the other end of the laminar flow pipe 1 is communicated with a shunt 7; the pipe network 5 comprises an inlet pipe network and an outlet pipe network; one end of the inlet pipe network is provided with an inlet interface 8; one end of the outlet pipe network is provided with an outlet interface 6; the inlet interface 8 and the outlet interface 6 are communicated with the external heat exchange system of the server.
The cold plate 4 is fixedly connected with the junction station 2 and the flow divider 7 through welding through an inlet pipe network; the cold plate 4 is closely contacted with the CPU and the display card heating surface of the server.
In this embodiment, the laminar flow pipe 1, the junction station 2, the pipe network 5, the outlet interface 6, the splitter 7 and the inlet interface 8 are all stainless steel pipes; the characteristics of strong rigidity and high supporting force of the stainless steel material are utilized to realize the structural integrity and stability of the integrated heat dissipation system; the heat conducting plate 3 and the cold plate 4 are made of copper plates, and the purpose of efficient heat dissipation is achieved.
In addition, a plurality of fins 9 are symmetrically arranged on the outer surfaces of the pipe network 5 and the laminar flow pipe 1 respectively; the fins 9 can obviously enhance the rigidity of the pipe network and the laminar flow pipe, effectively improve the structural stability of the whole frame, ensure the flatness of heat dissipation key parts and improve the accuracy of the installation position.
This neotype theory of operation does: a cooling working medium is introduced into an inlet interface 8 of the integrated heat dissipation system through an external heat exchange system, enters a flow divider 7 through a pipe network 5, enters the laminar flow pipe 1 through a part of the flow divider 7, transfers heat through a heat conduction plate 3, is taken away through working media in cavities at two sides in the laminar flow pipe 1, and enters the junction station 2; the working medium passes through 7 partly pipe networks 5 entering cold plate 4 through the shunt, and CPU and display card heat realize the heat transfer through contacting with cold drawing 4, take away the heat through inside working medium to enter into converging ware 2, the working medium switches on the hookup through pipe network 5, outlet port 6 and outside heat transfer system again, realizes the circulation heat dissipation.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. The integrated heat dissipation system for the server is characterized by comprising a laminar flow tube type memory heat dissipation device, a cold plate (4), a flow divider (7), a junction station (2) and a pipe network (5), wherein the laminar flow tube type memory heat dissipation device comprises a laminar flow tube (1) and a heat conduction plate (3); one end of the heat conducting plate (3) is inserted into the laminar flow pipe (1) to divide the inner cavity of the laminar flow pipe (1) into two independent inner cavities; one end of the laminar flow pipe (1) is communicated with the junction station (2); the other end of the laminar flow pipe (1) is communicated with the flow divider (7); the pipe network (5) comprises an inlet pipe network and an outlet pipe network; and the cold plate (4) is fixedly connected with the confluence device (2) and the flow divider (7) through an inlet pipe network by welding.
2. The integrated heat dissipation system of claim 1, wherein the heat-conducting plate (3) is arranged parallel to the memory banks of the server.
3. The integrated heat dissipation system of claim 1, wherein the heat conducting plate (3) is inserted into the end portion of the laminar flow tube (1) and has a plurality of protrusions (3-1) on both sides thereof.
4. The integrated heat dissipation system of server as claimed in claim 1, wherein the cold plate (4) is in close contact with the CPU and the display card heat-generating surface of the server.
5. The integrated heat dissipation system of server as claimed in claim 1, wherein an inlet port (8) is formed at one end of the inlet pipe network; and an outlet interface (6) is arranged at one end of the outlet pipe network.
6. The server integrated heat dissipation system of claim 5, wherein the inlet port (8) and the outlet port (6) are in communication with a heat exchange system external to the server.
7. The integrated heat dissipation system of the server, according to claim 1, wherein the laminar flow pipe (1), the flow combiner (2), the pipe network (5), the outlet interface (6), the flow divider (7) and the inlet interface (8) are all stainless steel pipes.
8. The integrated heat dissipation system of claim 1, wherein the heat conducting plate (3) and the cold plate (4) are both made of copper plates.
9. The integrated heat dissipation system of claim 1, wherein the outer surfaces of the network (5) and the laminar flow pipe (1) are symmetrically provided with a plurality of fins (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121481902.3U CN215068117U (en) | 2021-07-01 | 2021-07-01 | Integrated cooling system of server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121481902.3U CN215068117U (en) | 2021-07-01 | 2021-07-01 | Integrated cooling system of server |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215068117U true CN215068117U (en) | 2021-12-07 |
Family
ID=79226492
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121481902.3U Active CN215068117U (en) | 2021-07-01 | 2021-07-01 | Integrated cooling system of server |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215068117U (en) |
-
2021
- 2021-07-01 CN CN202121481902.3U patent/CN215068117U/en active Active
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Address after: 271400 office building of Haili auto parts science and Technology Park, middle section of Panlongshan Avenue, Ningyang Economic Development Zone, Tai'an City, Shandong Province Patentee after: Shandong Xingneng Thermal Energy Technology Co.,Ltd. Country or region after: China Address before: 271400 office building of Haili auto parts science and Technology Park, middle section of Panlongshan Avenue, Ningyang Economic Development Zone, Tai'an City, Shandong Province Patentee before: Shandong Haili Tongchuang Cooling Technology Development Co.,Ltd. Country or region before: China |