WO2016192497A1

WO2016192497A1 - Subrack and subrack assembly structure

Info

Publication number: WO2016192497A1
Application number: PCT/CN2016/080524
Authority: WO
Inventors: 孟祥泉
Original assignee: 中兴通讯股份有限公司
Priority date: 2015-06-03
Filing date: 2016-04-28
Publication date: 2016-12-08
Also published as: CN106304770A

Abstract

A subrack and subrack assembly structure. The subrack comprises a subrack casing and a single board mounted on the subrack casing. The subrack casing is provided with an air inlet channel and an air outlet thereon. The single board is mounted between the air inlet channel and the air outlet. The subrack further comprises a first air partition plate provided at an end of the air inlet channel near an inlet thereof, dividing the inlet of the air inlet channel into upper and lower portions. The subrack in an embodiment of the present invention has a simple structure and a good heat dissipation performance, and allows more air flows to pass by components located at the rear of the single board, thus effectively improving heat dissipation for the components at the rear of the single board.

Description

Plug and box assembly structure

Technical field

Embodiments of the present invention relate to, but are not limited to, a jacking and bayonet assembly structure.

Background technique

With the rapid development of the Internet and 3G/4G services, the demand for scheduling capacity of transmission switching equipment is increasing. The high-speed, compact communication equipment has become the mainstream trend, but the power consumption of the equipment is higher, but the heat dissipation Space is smaller, and heat dissipation issues are often a key factor limiting device capacity and performance.

At present, the majority of the subrack type box-type equipment is the structure shown in FIG. 1 and FIG. 2 below, and the rear part is the back board 1 , and the multiple board 2 is inserted in the sub-frame. 3, the backboard 1 is mounted with a backplane socket 4, and the front panel 3 of the front panel 2 forms a closed space in the subrack; the fan 5 is installed on the upper part of the subrack, and the lower part of the subrack is reserved between the ground and the ground. The 2U high air inlet duct 6 causes the subrack to blow air from the lower air inlet passage to dissipate heat to the internal board.

However, since the subrack slot is generally deep, most of the wind flow enters from a position close to the air inlet passage, and the position inside the slot tends to be small in wind speed, and the heat dissipation effect is not good.

Summary of the invention

The following is an overview of the topics detailed in this document. This Summary is not intended to limit the scope of the claims.

The embodiment of the invention provides a structure of a plug-in box and a plug-in box assembly to improve the heat dissipation of the device at the rear of the board.

According to an aspect of an embodiment of the present invention, a plug-in box is provided, including a plug-in housing and a single board mounted on the plug-in housing. The plug-in housing is provided with an air inlet passage and an air outlet, and the single-board Installed between the air inlet passage and the air outlet, the insertion box further includes: a first air partition panel, wherein the first air partition panel is disposed at an end of the air inlet passage near the inlet thereof to partition the inlet portion of the air inlet passage into the upper portion, The next two parts.

Optionally, the plane of the single board is perpendicular to the plane where the first air partition is located.

Optionally, the width of the first air baffle along the distribution direction of the veneer is the same as the width of the air inlet channel.

Optionally, the first air baffle is disposed below the veneer, and the first air baffle is mounted on the plug case.

Optionally, one end of the veneer away from the air outlet is located in the air inlet channel, and the first air baffle is fixed on a portion of the veneer located in the air inlet channel.

Optionally, a second air baffle is disposed in a gap between two adjacent single boards, and the second air baffle extends from an end of the gap close to the first air baffle toward an end of the gap close to the air outlet.

Optionally, one end of the single board remote from the air outlet is located in the air inlet passage, and an end of the second air partition board adjacent to the first air partition is located in the air inlet passage.

Optionally, one end of the second air baffle near the air outlet is inclined toward the front side of the veneer.

Optionally, the optical module device and the heat sink are mounted on the board, the optical module device and the heat sink are arranged along the air inlet direction of the air inlet channel, and the second air partition plate is located between the optical module device and the heat sink.

Optionally, the portion of the single board located in the air inlet passage has a device forbidden area, and the device forbidden area is located at a position of the single board opposite to the first air blocking board.

According to another aspect of an embodiment of the present invention, a hopper assembly structure is provided, the cradle assembly structure comprising two reversely disposed insertion boxes and a cross plate between the two insertion boxes, and the two insertion boxes The inlet passages are all located close to the cross plate, and the insertion box is the above-mentioned insertion box.

The insertion box in the embodiment of the present invention includes a plug-in housing and a single board mounted on the plug-in housing. The first air-proof panel is disposed in the air inlet passage, and the first air-proof panel is disposed below the single-board This allows the first baffle to divide the inlet section of the inlet passage into upper and lower sections. Thus, when the airflow is blown in from the air inlet passage, since the airflow is branched from the inlet section of the air inlet duct into two parts, one part flows upward from the upper end of the direct first windshield and the other part bypasses the first windshield Flowing upwards, the portion of the airflow flows through the device at the rear of the board, thereby increasing heat dissipation to the device at the rear of the board.

In the embodiment of the invention, the insertion box has a simple structure and good heat dissipation performance, so that more airflow flows through the device at the rear of the single board, thereby effectively improving heat dissipation of the device at the rear of the single board.

Other features and advantages of the embodiments of the invention will be set forth in the description in the description which The objectives and other advantages of the invention may be realized and obtained by means of the structure particularly pointed in the appended claims.

Other aspects will be apparent upon reading and understanding the drawings and detailed description.

BRIEF abstract

The drawings are intended to provide a further understanding of the embodiments of the present invention, and are intended to be a part of the present invention, and the description of the present invention is not intended to limit the invention. In the drawing:

Figure 1 shows a front view of a plug-in box in the related art;

Figure 2 shows a side view of the plug box in the related art;

Figure 3 is a front elevational view showing the insertion box in the embodiment of the present invention;

Figure 4 shows a side view of the subrack of Figure 3;

Figure 5 is a front elevational view showing the insertion box in another embodiment of the present invention;

Figure 6 shows a side view of the subrack of Figure 5 in the present invention;

Fig. 7 is a view showing the structure of a structure of a sub-assembly assembly in an embodiment of the present invention.

Wherein, the above figures include the following reference numerals:

10, insert case; 11, air inlet channel; 20, single board; 21, device forbidden area; 22, extension; 23, veneer panel; 30, fan; 40, first air barrier; , second air partition; 60, optical module device; 70, heat sink; 80, cross board; 91, back board; 92, back board socket; 100, cross board.

Preferred embodiment of the invention

It should be noted that the embodiments in the present application and the features in the embodiments may be combined with each other without conflict. The invention will be described in detail below with reference to the drawings in conjunction with the embodiments.

If you want to improve the heat dissipation capability of the large-power devices on the board in the related technology, you can only increase the fan speed and increase the size of the heat sink. However, it is often limited by the environmental noise requirements and board space, and the space for improvement is not large. Therefore, the inventor of the present application proposes:

According to an aspect of an embodiment of the present invention, a subrack is provided. Referring to FIGS. 3-6, as shown in FIGS. 3 and 4, the subrack includes a subrack housing 10 and is mounted to the subrack housing 10. The upper board 20 is provided with an air inlet passage 11 and an air outlet port, and the single board 20 is installed in the air inlet passage. Between 11 and the air outlet, the insertion box further includes: a first air barrier 40 disposed at an end of the air inlet passage 11 near the inlet thereof to partition the inlet section of the air inlet passage 11 into the upper portion, The next two parts.

The insertion box in the embodiment of the present invention includes the insertion box housing 10 and the single board 20 mounted on the insertion box housing 10. The first air distribution plate 40 is disposed in the air inlet passage 11 and the first air distribution plate 40 is disposed. Provided below the veneer 20, this causes the first baffle 40 to divide the inlet section of the inlet duct 11 into upper and lower portions. Thus, when the air flow is blown in from the air inlet passage 11, since the air flow is branched from the inlet portion of the air inlet passage 11 into two portions, one portion flows upward from the upper end of the direct first wind shield 40, and the other portion bypasses the first partition. After the wind plate 40 flows upward, the part of the airflow flows through the device at the rear of the single board 20, thereby improving the heat dissipation of the device at the rear of the single board 20.

The insertion box of the invention has the advantages of simple structure and good heat dissipation performance, and can allow more airflow to flow through the device at the rear of the single board, thereby effectively improving the heat dissipation of the device at the rear of the single board.

It is worth noting that the front, rear, up, and down directions of the subrack refer to the orientation of the subrack during normal operation. The “front” is the side where the veneer panel 23 is located, and the “back” is the back panel. On one side, the air inlet passage 11 is located below the air outlet. In the present application, the air inlet passage is located below the single board 20, and the air outlet is located above the single board 20. Therefore, a portion of the inlet section adjacent to the single board 20 is an upper portion, and a portion away from the single board 20 is a lower portion.

In the present application, the direction in which the air inlet passage 11 extends is the same as the direction in which the veneers 20 are distributed. The length of the first wind shield 40 along the air inlet direction of the air inlet passage 11 is smaller than the length of the air inlet passage 11.

Preferably, the plane in which the veneer 20 is located is perpendicular to the plane in which the first baffle 40 is located. In the embodiment of the present invention, by making the plane of the single board 20 and the plane of the first windshield 40, it is advantageous that the airflow after the splitting flows to the front half and the second half of the single board 20, respectively.

Preferably, the width of the first wind shield 40 along the distribution direction of the veneer 20 is the same as the width of the air inlet passage 11. In this way, the shunting effect of the inlet section of the inlet duct 11 on the air flow is improved.

Preferably, the first wind shield 40 is located at a middle portion of the air inlet passage 11 in the vertical direction. Preferably, the first air fence 40 is located on a center line of the air inlet duct 11.

Preferably, as shown in FIGS. 3 and 4, the first air baffle 40 is disposed below the veneer 20, and the first air baffle 40 is mounted on the sub case 10. Thus, the fixing of the first air partition 40 is conveniently achieved.

Preferably, as shown in FIG. 5 and FIG. 6 , one end of the veneer 20 away from the air outlet is located in the air inlet channel 11 , and the first air baffle 40 is fixed on a portion of the veneer 20 located in the air inlet channel 11 . . In the present application, the lower end of the veneer 20 extends downward, and the portion that protrudes into the air inlet passage 11 is an extending portion 22, and the first air baffle 40 is mounted on the extending portion 22, which conveniently realizes the first The fixing of a windshield 40.

Preferably, as shown in FIG. 5, a second air baffle 50 is disposed in a gap between two adjacent single boards 20, and the second air baffle 50 is oriented from an end of the gap close to the first air baffle 40. The end of the gap extends near the air outlet.

In the present application, by providing the second air baffle 50 in the gap between two adjacent single boards 20, the devices in the front and rear portions of the single board 20 are conveniently isolated, thereby achieving splitting. Preferably, the second air fence 50 is disposed on the single board 20.

Preferably, one end of the single board 20 remote from the air outlet is located in the air inlet passage 11 , and an end of the second air partition 50 adjacent to the first air partition 40 is located in the air inlet duct 11 . At this time, the first air baffle 40 is also disposed on the veneer 20, and the second air baffle 50 is in contact with the first air baffle 40, thus improving the air blocking effect.

Preferably, one end of the second air fence 50 near the air outlet is inclined toward the front side of the single board 20. This arrangement is advantageous in that the junction temperature difference of the chips on the single board 20 is small.

Preferably, the optical module device 60 and the heat sink 70 are mounted on the single board 20, the optical module device 60 and the heat sink 70 are arranged along the air inlet direction of the air inlet passage 11, and the second air gap plate 50 is located at the optical module device 60 and Between the radiators 70. In this way, the difference in junction temperature between the chips on the single board 20 is reduced.

Preferably, the length of the first wind shield 40 in the air inlet direction of the air inlet passage 11 is greater than the length of the optical module device 60.

Preferably, the portion of the veneer 20 located in the air inlet passage 11 has a device forbidden area 21, and the device forbidden area 21 is located at a position of the veneer 20 opposite to the first air baffle 40. In this device, the forbidden area 21 can only be arranged with a smaller device, and it is generally required to block a device having a height of more than 3 mm to prevent the device from obstructing the airflow.

Preferably, as shown in FIG. 3 to FIG. 6 , the insertion box further includes a back plate 91 disposed on the back side of the single board 20 , and the back board 91 is provided with a back board socket 92 , and the device on the single board 20 . Plugged into the backplane socket 92 by a plug.

Preferably, a fan 30 is disposed on a side of the veneer 20 adjacent to the air outlet, and the airflow is sucked from the air inlet passage 11 to the air outlet by the rotation of the fan 30.

Preferably, the front panel of the single board 20 is provided with a single board panel 23, and the single board 20 is vertically connected to the single board panel 23.

According to another aspect of an embodiment of the present invention, there is provided a plug-in assembly structure, as shown in FIG. 7, comprising two reversely disposed insertion boxes and a cross plate 80 between the two insertion boxes, and two The inlet passages 11 of the sub-tanks are all disposed adjacent to the cross-board 80, which is the sub-box of any of the above-mentioned applications.

Preferably, the backing plate 91 of the two insertion boxes and the backing plate 91 of the cross plate in the structure of the insertion box assembly are of unitary structure.

The embodiment of the invention innovates on the basis of the existing structure, and proposes a structural design of the partial isolation air duct, which is used for the heat dissipation channel of the optical module and the main control chip and the like, which are isolated from each other, the two parts are Do not affect each other. It has been verified that this design method is beneficial to improve the heat dissipation of devices with higher power consumption on the single board, and some devices that are susceptible to ambient temperature are protected from crosstalk.

The embodiment of the invention relates to a subrack insertion box device using a partial isolation air duct, in particular to a communication device using a subrack insertion box structure, such as an optical transmission network (OTN), a packet transmission network (PTN), a router, and the like in the communication field. The front panel of the device has a number of slots that can be inserted into the board to implement external service access. The backplane is used to exchange information with the backplane of the subrack. The backplane implements communication between boards in different slots. The link and subrack implement the corresponding functions according to the type of the inserted board.

Rack size unit U: unit acronym, is the unit used by the Electronic Industries Alliance (EIA) to calibrate equipment such as servers and network switches. A rack unit is actually 44.45 mm in height, 1.75 inches in width and 19 inches in width.

Optical module: A device that converts optical signals with data information into high-speed electrical signals by implementing photoelectric conversion on a single board.

Main control chip: A device that implements electrical signal protocol processing on a single board. The optical module and the main control chip are generally two devices with higher power consumption on the single board.

The present application needs to protect the design of the subrack structure using a partially isolated air duct.

The technical solution described in the present application mainly solves the problem of heat dissipation of the current slot-type subrack, ensures the effect of good heat dissipation inside the device, reduces the fan speed of the device, thereby avoiding the noise impact on the environment, and further realizing a larger capacity in a single slot. At the same time, low-power, green and environmentally friendly equipment performance.

The device configuration designed by the embodiment of the present invention is as shown in FIG. 3 to FIG. 7 , and the technical solutions adopted are described as follows:

The sub-rack insertion box of the partial isolation air duct of the invention lengthens the original veneer in the sub-frame and occupies half of the original lower air inlet passage. The first windshield in the horizontal direction is installed at the lower edge of the veneer in the subrack, and the first air baffle extends into the position of about half of the subrack, and the air inlet channel is divided into upper and lower portions.

At the same time, the second windshield in the vertical direction is installed on the single board, and the height is slightly smaller than the size of one slot. The air duct is divided into two parts, the front part and the back part, and the horizontal direction of the lower part of the sub-frame. A windshield forms an "L" shape as shown in Figures 4 and 6 below. In this way, two mutually separated heat dissipation channels are formed in the sub-frame: a part of the airflow dissipates heat through the upper half of the sub-chamber air inlet channel, and the other part passes through the lower half of the sub-chamber air inlet channel to the second half of the veneer The area is cooled. At the same time, for the design of safety and reliability, the extra part of the board can be retracted to a certain size.

After adopting this structure, the air duct partition on the single board can avoid the heat dissipation effect between the large power consumption devices. Since the devices with large heat generation on the board are generally optical modules and main control chips, they are often placed on the front and rear of the board. After air duct isolation, they are not affected by each other, and can be one side according to actual conditions. Provides more cooling space. At the same time, after the board is lengthened, the heat dissipation area of the large power chip is increased, so that the size of the heat sink can be increased. In addition, a common integrated heat sink can be used between multi-power devices, and there is no heat dissipation problem caused by thermal cascading of multi-power devices, which can effectively improve the heat dissipation problem of large power devices.

In the present application, as shown in FIG. 3 and FIG. 4, the subrack (the box housing) and the partition on the single board, wherein the vertical portion (the second air partition) is mounted on each single board, and the height is slightly smaller. The width of one slot; the lower horizontal portion (the first air baffle) is mounted in the sub-frame as an integral flat plate, and the horizontal partition placed in the middle of the lower air inlet passage 11 in the front view of the sub-rack box .

In the present application, the air inlet passage area of the front half of the veneer is a device with a height of more than 3 mm in the area on the single board, and the panel area is fully opened to provide an air inlet passage. The 1U length of the board is increased downwards, which occupies the original 2U air inlet channel position, which increases the layout of the board and the heat dissipation space. For In terms of safety and reliability considerations, the extra portion of the board can be retracted to a certain size. The original 2U public air inlet channel is compressed to 1U for the cooling air duct in the second half of the board.

Place a windshield on the board and subrack to form two isolated air ducts to avoid heat dissipation between the larger components on the board. On the basis of the original subrack structure, the size of the veneer is increased downward, occupying half of the space of the original common air inlet passage. The front panel of the board near the inlet air passage needs to be shielded from the height of more than 3 mm, and the corresponding panel area is fully open to provide the air inlet passage; the second half is not limited and can be used to increase the size of the heat sink of the power consumption chip.

In the present application, after the length of the board is increased, the heat dissipation space is increased, and a common integral heat sink can be used between the plurality of large power consumption chips, and the light module portion can also protrude the heat dissipation teeth upward and downward, which is beneficial to improve heat dissipation. effectiveness. With this configuration, the high-speed backplane socket on the board can be moved down to bring it closer to the lower cross-board.

The second air baffle 50 is disposed on the single board or the sub-frame. For example, an "L"-shaped windshield partition is placed on the single board to form an isolation air passage. At this time, the first air partition 40 and the second air partition 50 respectively A portion of the "L" shaped windshield is formed.

In an embodiment shown in FIG. 3 and FIG. 4, the isolated air channel subrack box shown in FIG. 3 and FIG. 4 is a basic application case, and the sub-frame is a layer structure, which satisfies the equipment application of small and medium capacity. The main features are: the lower part of the sub-frame is the entrance section of two independent air inlet channels, and the second board in the vertical direction is installed on the board in the sub-frame, and the veneer is extended downward, occupying half of the space of the original air inlet channel.

In another embodiment shown in Figures 5 and 6 of the present application, the horizontal first windshield 40 at the lower portion of the sub-rack is removed, and the mounting is performed on each of the veneers 20, and the second wind is blocked from the vertical direction. The board is one piece and the height is slightly smaller than the size of one slot. If some boards do not require an isolated duct design, there is no need to install a second air fence. However, the individual boards still need to be extended downwards, occupying half of the size of the original air inlet channel, and at the same time close to the position of the air inlet channel, the device with a height of more than 3 mm is prohibited as much as possible to provide a good air inlet passage.

This embodiment can be seen as an alternative to the solution described in the present invention. The main features are as follows: an "L" shaped air baffle, a first air baffle 40 and a second air baffle 50 are mounted on a single board in the subrack. A part of the "L" shaped air partition is formed separately, and the single board is extended downward, occupying half of the space of the original air inlet passage.

As shown in Figure 7, the three-layer subrack structure, the industry's latest large-capacity backplane implementation, is a belt-type design. The device is a three-layer structure, and the service processing boards are installed on the upper layer and the lower layer. The lower single board adopts an inverted installation manner and is symmetrical with the upper single board, and the heat dissipation structure of the present invention can be well applied. A cross-board is installed in the middle layer, and is connected to the upper and lower boards through the backplane routing. After adopting the structure of the present invention, the backplane sockets of the upper and lower veneers can be moved to the cross-board adjacent to the intermediate layer to shorten the length of the backplane trace.

The main features of the embodiment are as follows: the upper layer of the subrack is the upward blowing, and the lower layer is the downward blowing; the upper layer and the lower layer of the subrack are separated from each other by the independent air inlet passage; the upper and lower boards are moved to the intermediate layer to move the back panel socket. To shorten the length of the backplane trace of the cross-board with the middle layer.

From the above description, it can be seen that the above-mentioned embodiments of the present application achieve the following technical effects:

The subrack insertion box of the embodiment of the invention breaks the existing structural design rules, and improves the heat dissipation problem of the device without increasing the subrack size and the original veneer panel is unchanged, that is, the subrack appearance does not change.

Compared with the prior art, the optimal heat dissipation effect is achieved in a limited space, and a good heat dissipation scheme is provided for an increasingly trending high-speed, compact optical communication device.

The above description is only the preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes can be made to the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and scope of the present invention are intended to be included within the scope of the present invention.

Industrial applicability

The structure of the insertion box and the insertion box assembly provided by the embodiment of the invention includes a insertion box housing and a single board mounted on the insertion box housing, wherein the insertion box housing is provided with an air inlet passage and an air outlet, and the single insertion box The plate is installed between the air inlet channel and the air outlet port, and the insertion box further comprises: a first air baffle plate, the first air baffle plate is disposed at an end of the air inlet channel near the inlet thereof to partition the inlet portion of the air inlet channel into the upper portion The next two parts. In the embodiment of the invention, the insertion box has a simple structure and good heat dissipation performance, so that more airflow flows through the device at the rear of the single board, thereby effectively improving heat dissipation of the device at the rear of the single board.

Claims

A plug case includes a plug case (10) and a single board (20) mounted on the box housing (10), and the box housing (10) is provided with an air inlet passage (11) And an air outlet, and the single board (20) is installed between the air inlet passage (11) and the air outlet, the insertion box further comprising:

a first air baffle (40), the first air baffle (40) being disposed at an end of the air inlet passage (11) near an inlet thereof to partition an inlet section of the air inlet passage (11) into Upper and lower parts.
The subrack of claim 1 wherein the plane of the veneer (20) is perpendicular to a plane in which the first baffle (40) is located.
The subrack according to claim 1, wherein a width of said first air baffle (40) along a distribution direction of said veneer (20) is the same as a width of said air inlet passage (11).
The subrack according to claim 1, wherein the first air baffle (40) is disposed below the veneer (20), and the first air baffle (40) is mounted on the plug On the box housing (10).
The subrack according to claim 1, wherein an end of the single board (20) remote from the air outlet is located in the air inlet passage (11), and the first air partition (40) is fixed. On the portion of the veneer (20) that is located within the air inlet passage (11).
The subrack according to claim 1, wherein a second air baffle (50) is disposed in a gap between adjacent two of the veneers (20), and the second air baffle (50) Extending from an end of the gap close to the first air baffle (40) toward an end of the gap close to the air outlet.
The subrack according to claim 6, wherein an end of the veneer (20) remote from the air outlet is located in the air inlet passage (11), and the second air partition (50) An end adjacent to the first air baffle (40) is located within the air inlet passage (11).
The subrack according to claim 6, wherein an end of the second air baffle (50) adjacent to the air outlet is inclined toward a front side of the veneer (20).
The subrack according to claim 6, wherein the single board (20) is mounted with an optical module device (60) and a heat sink (70), the optical module device (60) and the heat sink (70) Arranged along the air inlet direction of the air inlet passage (11), and the second air barrier (50) is located between the optical module device (60) and the heat sink (70).
The subrack according to claim 5 or 7, wherein a portion of the veneer (20) located in the air inlet passage (11) has a device ban area (21), and the device ban area (21) Located at a position opposite to the first windshield (40) of the single board (20).
A plug-in assembly structure comprising two oppositely disposed insertion boxes and a cross plate (80) between the two insertion boxes, and inlet passages of the two of the insertion boxes (11) are both disposed adjacent to the cross plate (80), the plug box being the plug box according to any one of claims 1 to 10.