CN101795546A - Subrack and heat radiating method thereof - Google Patents
Subrack and heat radiating method thereof Download PDFInfo
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- CN101795546A CN101795546A CN200910004893A CN200910004893A CN101795546A CN 101795546 A CN101795546 A CN 101795546A CN 200910004893 A CN200910004893 A CN 200910004893A CN 200910004893 A CN200910004893 A CN 200910004893A CN 101795546 A CN101795546 A CN 101795546A
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Abstract
The embodiment of the invention provides a subrack and a heat radiating method thereof. The subrack comprises a subrack casing and a fan for driving air to flow, a back plate is arranged in the subrack casing, two sides of the back plate are respectively connected with electronic equipment, an air inlet channel is formed on the back plate and one end of the electronic equipment at the two sides of the back plate, an air inlet is arranged on the subrack casing on one side of the back plate, an air outlet channel is formed on the back plate and the other end of the electronic equipment at the two sides of the electronic equipment, an air outlet is arranged on the subrack casing on the other side of the back plate, the electronic equipment on one side of the back plate and the electronic equipment on the other side of the back plate are arranged in an interlaced way along the height direction of the back plate and arranged to be along the direction that the air flow flows through the electronic equipment, and the electronic equipment on one side of the back plate protrudes out of the electronic equipment on the other side of the back plate. By adopting the subrack structure of the embodiment, the height and the volume of the subrack can be effectively reduced on the basis of guaranteeing the radiating effect, thereby enhancing the compactness of the electronic products.
Description
Technical field
The present invention relates to a kind of communications field, particularly, relate to the heat dissipating method of a kind of subrack and subrack.
Background technology
Along with the development of electronic product, the hear rate of the electronic devices and components in the electronic product constantly increases, and the heat dissipation problem of electronic devices and components seems more and more important.The electronic radiation Technology Need guarantees that the electronic devices and components of electronic product are operated in the allowable temperature scope, thereby guarantees the reliability of electronic product work.
Heat dissipation can be divided into natural heat dissipation and forced air cooling.Wherein, forced air cooling is by the fans drive air heater members of flowing through, thereby takes the device heat out of equipment, and forced air cooling is used for the occasion that caloric value is big, ambient temperature is harsh more.
When using forced air cooling, generally speaking, wind speed or air quantity are big more, radiating effect is good more, but the fans drive air flows need overcome the systemic resistance of electronic product, systemic resistance also increases along with the increase of air quantity or wind speed, and therefore, a good heat sink conception need consider to reduce the draft loss of electronic product as far as possible.
It is high density that the another one development trend of electronic product or competitiveness embody, same professional ability, and electronic product is compact more, miniaturization competitive superiority more more.And reduce small product size or highly often cause the systemic resistance of electronic product to increase, and solve heat radiation better and form contradiction.
As shown in Figure 1, in existing a kind of subrack 10, electronic equipment 11,12 is as PCB, and perpendicular backboard 16 both sides that are installed in subrack 10 of inserting are provided with fan 13 in the subrack 10, be used to drive air current flow, thereby give electronic equipment 11,12 (as PCB) heat radiation.Subrack 10 has air inlet 14 and air outlet 15, the relatively low cold air of fan 13 actuation temperature enters from the air inlet 14 of subrack 10, pass through electronic equipment 11,12 then, electronic equipment 11 and 12 heats that produce are by relatively low chilled air cools, the heat of the electronic devices and components on the electronic equipment 11,12 is dispersed in the air then, and heated air is finally discharged from the air outlet 15 of subrack 10.
As shown in Figure 1, reach the heat radiation requirement, must guarantee certain air inlet height and air outlet height, thereby the gas-flow resistance of control subrack 10 makes enough air quantity can pass through subrack 10 in order to make electronic equipment.This has just caused the height of subrack 10 of prior art higher, causes subrack 10 configurable quantity in rack to reduce, and integrated level is not high, has reduced the competitiveness of electronic product.
Summary of the invention
The embodiment of the invention provides the heat dissipating method of a kind of subrack and subrack, can reduce the height or the volume of subrack on the basis that guarantees radiating effect.
The embodiment of the invention provides a kind of subrack, and this subrack comprises:
The subrack housing;
Backboard is installed in the described subrack housing, and is connected with electronic equipment respectively in the both sides of described backboard;
Fan is used to drive air current flow;
Air intake passage be formed on an end of the electronic equipment of described backboard and described backboard both sides, and in backboard one side, the subrack housing offers air inlet;
The air-out passage be formed on the other end of the electronic equipment of described backboard and described backboard both sides, and at the backboard opposite side, the subrack housing offers air outlet;
Wherein, the electronic equipment of described backboard one side and the electronic equipment of backboard opposite side shift to install along the backboard short transverse, and be arranged to, along the direction of airflow passes electronic equipment, the electronic equipment of described backboard one side protrudes in the electronic equipment of described backboard opposite side.
The embodiment of the invention also provides a kind of heat dissipating method of subrack, under the effect of fan, air-flow outside the subrack is from backboard one side, the air inlet that the subrack housing is offered flows into, the flow through air intake passage of an end of the electronic equipment that is formed on backboard and described backboard both sides, be formed on the air-out air channel of the other end of the electronic equipment of described backboard and described backboard both sides, through the backboard opposite side, the air outlet that the subrack housing is offered flows out, wherein, the electronic equipment of described backboard one side and the electronic equipment of backboard opposite side shift to install along the backboard short transverse, along the direction of airflow passes electronic equipment, the electronic equipment of described backboard one side is higher than the electronic equipment of described backboard opposite side.
As can be seen from the previous technical solutions, the electronic equipment of the backboard both sides of subrack shifts to install, and this shifts to install, direction along the airflow passes electronic equipment, the electronic equipment that closes on backboard one side of air inlet protrudes in the electronic equipment that closes on air outlet backboard opposite side, it is more reasonable that this makes that air intake passage and air-out passage spatially distribute, electronic equipment one end that can reduce the electronic equipment other end of backboard one side and backboard opposite side low value or do not have the regional space of value in heat radiation, the height or the volume of subrack have been reduced, and inlet and outlet is big or small unaffected, just the resistance of system does not almost increase, ventilation quantity and heat-sinking capability are guaranteed, thereby on the basis that does not influence radiating effect, improved the compactedness of equipment, efficiently solved the contradiction that reduces volume or height and assurance radiating effect in the prior art.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art, to do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below, apparently, accompanying drawing in describing below only is some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is a kind of subrack structure schematic diagram in the prior art;
Fig. 2 is that the radiating layout of Fig. 1 subrack in the prior art is analyzed schematic diagram;
Fig. 3 is the structural representation of a kind of subrack of the embodiment of the invention;
Fig. 4 is the fan of subrack in the embodiment of the invention, the relative position schematic diagram of two electronic equipments;
Fig. 5 is the perspective view of embodiment of the invention Fig. 4;
Fig. 6 is a kind of subrack structure schematic diagram of the another kind of embodiment of the present invention;
Fig. 7 is the another kind of subrack structure schematic diagram of the another kind of embodiment of the present invention;
Fig. 8 is a kind of subrack structure schematic diagram of another embodiment of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the invention, the technical scheme in the embodiment of the invention is clearly and completely described, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills belong to the scope of protection of the invention not making the every other embodiment that is obtained under the creative work prerequisite.
Therefore and do not mean that and limit in description, only be used for reference at this employed some term.For example, such as " on ", term such as D score, " top ", " below " is meant the direction in the accompanying drawing of institute's reference.Unless spell out in the literary composition, term " first ", " second " and other this type of number of relating to structure do not hint order or order.
As shown in Figure 3, the embodiment of the invention provides a kind of subrack 30, and this subrack 30 comprises subrack housing 31, backboard 32, electronic equipment 33,34, fan 37, air intake passage 35, air inlet 351, air-out passage 36 and air outlet 361.Wherein, backboard 32 is installed in this subrack housing 31, electronic equipment 33 is connected a side of backboard 32, electronic equipment 34 is connected the opposite side of backboard 32, electronic equipment 33 in backboard 32 and backboard 32 both sides, an end of 34 forms this air intake passage 35, air inlet 351 is arranged on the subrack housing 31 of backboard 32 1 sides, electronic equipment 33 in backboard 32 and backboard 32 both sides, 34 the other end forms this air-out passage 36, air outlet 361 is arranged on the subrack housing 31 of backboard opposite side, this fan 37 is used to drive air current flow, thereby makes subrack 351 outer air-flows with electronic equipment 33, the heat that produces during 34 work is taken out of outside the subrack housing 31.As shown in Figure 5, in an embodiment of the present invention, the electronic equipment 33 of backboard 32 1 sides shifts to install with the short transverse (airflow direction of the electronic equipment 33,34 of promptly flowing through) of the electronic equipment 34 of backboard 32 opposite sides along backboard 32, and be arranged to, along the direction of airflow passes electronic equipment, the electronic equipment 33 of backboard 32 1 sides protrudes in the electronic equipment 34 of backboard opposite side.
Continuous see also Fig. 3, backboard 32 can vertically be installed in the subrack housing 31.End at the electronic equipment 33,34 of backboard 32 and backboard 32 both sides forms this air intake passage 35, can for: below the electronic equipment 33,34 of backboard 32 and backboard 32 both sides, form this air intake passage 35; The other end at the electronic equipment 33,34 of backboard 32 and backboard 32 both sides forms this air-out passage 36, can for: above the electronic equipment 33,34 of backboard 32 and backboard 32 both sides, form this air-out passage 36.
Wherein, this wind inlet channel 35 is relative with this air inlet 351; Air-out air channel 36 is relative with this air outlet 361.
Wherein, air inlet 351 is arranged on the subrack housing 31 of backboard 32 1 sides, can be specially, and air inlet 351 is arranged on the sidewall 311 of subrack housing 31 of a side of backboard 32; In like manner: air outlet 361 is arranged on the subrack housing 31 of backboard opposite side, can be specially: air outlet 361 is arranged on the sidewall 312 of subrack housing 31 of backboard opposite side.
Be understandable that,, below the electronic equipment 33,34 of backboard 32 and backboard 32 both sides, can form this air-out passage 36, above the electronic equipment 33,34 of backboard 32 and backboard 32 both sides, form this air intake passage 35 for the subrack among Fig. 3 30.It is the top that air intake passage 35 is positioned at the electronic equipment 33,34 of backboard 32 and backboard 32 both sides; Air-out passage 36 is positioned at the below of the electronic equipment 33,34 of backboard 32 and backboard 32 both sides.Like this, the air inlet 351 among Fig. 3 just can be air outlet, and the air outlet 361 among Fig. 3 can be air inlet.
Below below the electronic equipment 33,34 of backboard 32 and backboard 32 both sides, to form this air intake passage 35, above the electronic equipment 33,34 of backboard 32 and backboard 32 both sides, form this air-out passage 36, air inlet is 351, and air outlet is 361 to set forth for example.Wherein, the direction of airflow passes electronic equipment 33,34 is bottom-up direction shown in the hollow arrow on the electronic equipment among Fig. 3 33,34.
The subrack 30 of the embodiment of the invention is when work, as shown in Figure 3, fan 37 drives subrack 351 outer air-flows and enters in the air intake passage 35 from air inlet 351, behind this airflow passes electronic equipment 33,34, air-out passage 36 through electronic equipment 33,34 tops, discharge outside the subracks 30 by air outlet 361 at last, thereby the torrid zone that produces during with electronic equipment 33,34 work goes out outside the subrack 30, realizes the heat radiation of this electronic equipment 33,34.
The radiating layout that sees also existing subrack 10 shown in Figure 2 is analyzed schematic diagram, in the radiator structure of existing subrack 10, in the air intake space 17 and the whole flow process in air-out space 18 electronic equipment 11,12 above of air-flow below the electronic equipment 11,12, flow gradually changes, wherein the waste in space to reducing the few of help of resistance of air-flow, has been caused in the zone of dash area in fact.And as shown in Figure 3, in the subrack 30 of the embodiment of the invention, utilize this electronic equipment 33,34 misconstruction, under the situation of air intake space below the assurance electronic equipment 33 and the air-out space invariance above the electronic equipment 34, can effectively reduce the space of electronic equipment 33 tops in the air intake space of electronic equipment 34 belows in the air intake passage 35 and the air-out passage 36, thereby, it is more reasonable to make that air intake passage 35 and air-out passage 36 spatially distribute, like this, the height or the volume of subrack 30 have not only been reduced, and air inlet 351 and air outlet 361 is big or small unaffected, just the resistance of system does not almost increase, ventilation quantity and heat-sinking capability also are guaranteed simultaneously, thereby on the basis that does not influence radiating effect, improved the compactedness of equipment, efficiently solved the contradiction that reduces volume or height and assurance radiating effect in the prior art.
In a preferred embodiment of the present invention, the electronic equipment 33 of backboard 32 1 sides and the dislocation size h of electronic equipment 34 on backboard 32 height of backboard 32 opposite sides more preferably greater than or equal 5mm (size that promptly misplaces h is more than the 5mm), and less than 1/2nd of electronic equipment 33,34 height, be beneficial to when guaranteeing radiating effect, more effectively reduce subrack 30 height.According to the occasion of subrack 30 uses and the size difference of subrack 30, this dislocation size h can be different, should can determine according to the actual needs of subrack 30 by concrete dislocation size h,, not do concrete qualification at this as long as can take into account radiating effect and the height or the volume that reduce subrack 30.
In an object lesson of embodiments of the invention, as shown in Figure 5, the electronic equipment 34 of the electronic equipment 33 of backboard 32 1 sides and backboard 32 opposite sides can be veneer, it for example can be the pcb board that has electronic devices and components, see also Fig. 3, shown in Figure 4, the veneer of backboard 32 1 sides (electronic equipment 33) is along the subrack housing 31 perpendicular backboards 32 that insert, and the veneer of backboard 32 opposite sides (electronic equipment 34) is along the subrack housing 31 perpendicular backboards 32 that insert.In this example, can and form described wind inlet channel 35 below the veneer of backboard 32 both sides and between the diapire 313 of subrack housing 31 in backboard 32, and offer described air inlet 351 in the antetheca 311 of described subrack housing 31.And in backboard 32 with forming air-out air channel 36 above the veneer of backboard 32 both sides and between the roof 314 of subrack housing 31, air outlet 361 can be opened in the rear wall 312 of subrack housing 31.
In embodiments of the present invention, though this electronic equipment 33,34 can be the PCB that has electronic devices and components, being not limited to certainly is PCB, it will be understood by those skilled in the art that, as required, can be arranged on any one interior electronic equipment that need dispel the heat of subrack.
Shown in Figure 5 as Fig. 3 one, in a kind of optional embodiment of the present invention, fan 37 can be arranged on air outlet 361 positions.Like this, as shown in Figure 3, under the effect of this fan 37, air enters from air inlet 351, and behind the air intake passage 35 of electronic equipment 33,34 belows, the electronic equipment 33,34 of flowing through is taken away the heat that electronic equipment 33,34 produces, after air-out passage 36, fan 37, air outlet 361 be discharged from outside the subrack 30.
In the variation of this optional embodiment, this fan 37 also can be arranged on the position (not shown) of air inlet 351, thereby air inlet 351 outer air are blown in the air intake passage 35, and behind electronic equipment 33,34, again by air-out passage 36, after air outlet 361 discharge outside the subracks 30, thereby the torrid zone that electronic equipment 33,34 is produced goes out outside the subrack 30, plays thermolysis.Certainly, according to the heat radiation needs, also can all be provided with fan 37 (not shown)s at air inlet 351 and air outlet 352 simultaneously.
In this optional embodiment, according to the heat radiation needs, this fan 37 can be one, also can be one group of fan (as shown in Figure 5) of a plurality of compositions.Described fan 37 can be the aerofoil fan of vertically placing.
As shown in Figure 6, in another optional embodiment of the present invention, can be respectively fan 371,372 be set in the top position of the corresponding electronic equipment 33 of air-out passage 36 and the top position of electronic equipment 34, thereby under the driving of this fan 371 and fan 372, air is entered from air inlet 351, and behind the air intake passage 35 of electronic equipment 33 and electronic equipment 34 belows, the electronic equipment 33,34 of flowing through, the heat that electronic equipment 33,34 produces is taken away, after fan 371,372, air-out passage 36, air outlet 361 be discharged from outside the subrack 30.
In this optional embodiment, fan 371,372 can all can be the aerofoil fan of horizontal positioned as shown in Figure 6.
As shown in Figure 7, in the variation of this optional embodiment, fan 371,372 also can be the centrifugal fan of horizontal positioned.Air-out is perpendicular to the characteristics of rotation axis because centrifugal fan has that air intake is parallel to rotation axis, as shown in Figure 7, fan 371 for electronic equipment 33 tops, flow through the air-flow of electronic equipment 33 behind fan 371, can discharge through air-out passage 36 and air outlet 361 along the horizontal direction of fan 371, thereby need above fan 371, not reserve the space that air communication is crossed, compare with the aerofoil fan of employing horizontal positioned shown in Figure 6, adopt the centrifugal fan of horizontal positioned can further reduce the height or the volume of subrack 30.
In this optional embodiment, can certainly be fan 371 and one of them of fan 372 is aerofoil fan, and another fan is the centrifugal fan (not shown), similar with Fig. 6, example shown in Figure 7, can reach the effect that when guaranteeing heat-sinking capability, reduces subrack 30 volumes or height equally, be not described in detail at this.
As shown in Figure 8, in another optional embodiment of this present invention, can be provided with fan 371,372 in the position corresponding to electronic equipment 33 and electronic equipment 34 of air intake passage 35 respectively, thereby under the driving of this fan 371 and fan 372, air is entered from air inlet 351, and behind the air intake passage 35 of electronic equipment 33,34 belows, fan 371, fan 372, the electronic equipment 33,34 of flowing through, the torrid zone that electronic equipment 33,34 produces is walked, after air-out passage 36, air outlet 361 be discharged from outside the subrack 30.
In this optional embodiment, described fan 371,372 can be the aerofoil fan of horizontal positioned as shown in Figure 8.Certainly, this fan 371,372 also can be the centrifugal fan of horizontal positioned or one of them is the centrifugal fan of horizontal positioned, and another fan is the aerofoil fan (not shown) of horizontal positioned, those examples can reach the effect that reduces subrack 30 volumes or height when guaranteeing heat-sinking capability equally, are not described in detail at this.
The foregoing description only is several embodiment of the present invention, for those skilled in the art, can make various deformation or combination on this basis, describes in detail no longer one by one at this.For example, fan in the above embodiment of the present invention 371 and fan 372 can be separately positioned on the below of electronic equipment 33 and the top of electronic equipment 34; Perhaps fan 371 and fan 372 are separately positioned on the top of electronic equipment 33 and the below of electronic equipment 34; Perhaps as required also can be simultaneously above electronic equipment 33 and the electronic equipment 34, below be provided with fan; Those fans can be aerofoil fans, also can be centrifugal fans; Can also on the basis of above-mentioned example, at air inlet 351 and/or air outlet 361 positions fan or the like be set simultaneously in addition.
The embodiment of the invention also provides a kind of heat dissipating method of subrack, wherein, under the effect of fan, air-flow outside the subrack is from backboard one side, the air inlet of offering at the subrack housing flows into, the flow through air intake passage of an end of the electronic equipment that is formed on backboard and described backboard both sides, be formed on the air-out air channel of the other end of the electronic equipment of described backboard and described backboard both sides, through the backboard opposite side, the air outlet of offering at the subrack housing flows out, wherein, the electronic equipment of described backboard one side and the electronic equipment of backboard opposite side shift to install along the backboard short transverse, along the direction of airflow passes electronic equipment, the electronic equipment of described backboard one side protrudes in the electronic equipment of described backboard opposite side.
Wherein, at the air intake passage of an end of the electronic equipment of backboard and described backboard both sides, can be air intake passage below the electronic equipment of backboard and described backboard both sides; In the air-out air channel of the other end of the electronic equipment of described backboard and described backboard both sides, can be air-out air channel above the electronic equipment of described backboard and described backboard both sides.
Be understandable that:, also can be air intake passage above the electronic equipment of backboard and described backboard both sides at the air intake passage of an end of the electronic equipment of backboard and described backboard both sides; In the air-out air channel of the other end of the electronic equipment of described backboard and described backboard both sides, can be air-out air channel below the electronic equipment of described backboard and described backboard both sides.
Wherein, the dislocation size of the electronic equipment of described backboard one side and the electronic equipment of described backboard opposite side is more than or equal to 5mm, and less than 1/2nd of electronic equipment height.
Wherein, the structure of the subrack of setting forth in the structure of subrack and the foregoing description in the heat dissipating method of subrack is consistent, at this, no longer repeats.
The subrack of the embodiment of the invention is when work, see also shown in Figure 3, the outer air-flow of fans drive subrack enters in the air intake passage from air inlet, behind the electronic equipment of these airflow passes backboard both sides, air-out passage above the electronic equipment of backboard both sides, discharge outside the subrack by air outlet at last, thereby the torrid zone that produces during with electronic device works goes out outside the subrack, realizes the heat radiation of this electronic equipment.Because the electronic equipment of the backboard both sides in this subrack shifts to install up and down, thereby, efficiently solve the contradiction that reduces volume or height in the prior art and guarantee radiating effect in the compactedness that guarantees to have improved on the basis of dispelling the heat equipment.
The above only is several embodiments of the present invention, and those skilled in the art can carry out various changes or modification to the present invention and do not break away from the spirit and scope of the present invention according to application documents are disclosed.
Claims (11)
1. subrack comprises:
The subrack housing;
Backboard is installed in the described subrack housing, and is connected with electronic equipment respectively in the both sides of described backboard;
Fan is used to drive air current flow;
Air intake passage be formed on an end of the electronic equipment of described backboard and described backboard both sides, and in backboard one side, the subrack housing offers air inlet;
The air-out passage be formed on the other end of the electronic equipment of described backboard and described backboard both sides, and at the backboard opposite side, the subrack housing offers air outlet;
It is characterized in that, the electronic equipment of described backboard one side and the electronic equipment of backboard opposite side shift to install along the backboard short transverse, and be arranged to, along the direction of airflow passes electronic equipment, the electronic equipment of described backboard one side protrudes in the electronic equipment of described backboard opposite side.
2. subrack as claimed in claim 1 is characterized in that, the dislocation size of the electronic equipment of described backboard one side and the electronic equipment of described backboard opposite side is more than or equal to 5mm, and less than 1/2nd of electronic equipment height.
3. subrack as claimed in claim 1 or 2 is characterized in that, the electronic equipment of described backboard one side and the electronic equipment of described backboard opposite side are veneer.
4. subrack as claimed in claim 1 is characterized in that, in described air inlet position or described air outlet position described fan is set.
5. subrack as claimed in claim 1 is characterized in that, is formed on the air intake passage of an end of the electronic equipment of described backboard and described backboard both sides, for: the air intake passage of below that is formed on the electronic equipment of described backboard and described backboard both sides;
Be formed on the air-out passage of the other end of the electronic equipment of described backboard and described backboard both sides, for: the air-out air channel of top that is formed on the electronic equipment of described backboard and described backboard both sides.
6. subrack as claimed in claim 5 is characterized in that, is respectively arranged with described fan in the top position of the electronic equipment of the top position of the electronic equipment of corresponding backboard one side of described air-out passage and corresponding backboard opposite side.
7. subrack as claimed in claim 5 is characterized in that, is provided with described fan respectively below the electronic equipment of the lower position of the electronic equipment of corresponding backboard one side of air intake passage and backboard opposite side.
8. subrack as claimed in claim 5 is characterized in that, respectively below the electronic equipment of backboard one side and the electronic equipment of backboard opposite side above be provided with described fan.
9. subrack as claimed in claim 5 is characterized in that, respectively above the electronic equipment of backboard one side and the electronic equipment of backboard opposite side below be provided with described fan.
10. the heat dissipating method of a subrack, it is characterized in that, under the effect of fan, air-flow outside the subrack is from backboard one side, the air inlet that the subrack housing is offered flows into, the flow through air intake passage of an end of the electronic equipment that is formed on backboard and described backboard both sides, be formed on the air-out air channel of the other end of the electronic equipment of described backboard and described backboard both sides, through the backboard opposite side, the air outlet that the subrack housing is offered flows out, wherein, the electronic equipment of described backboard one side and the electronic equipment of described backboard opposite side shift to install along the backboard short transverse, along the direction of airflow passes electronic equipment, the electronic equipment of described backboard one side protrudes in the electronic equipment of described backboard opposite side.
11. the heat dissipating method of subrack as claimed in claim 10 is characterized in that, the dislocation size of the electronic equipment of described backboard one side and the electronic equipment of described backboard opposite side is more than or equal to 5mm, and less than 1/2nd of electronic equipment height.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100048936A CN101795546B (en) | 2009-02-04 | 2009-02-04 | Subrack and heat radiating method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100048936A CN101795546B (en) | 2009-02-04 | 2009-02-04 | Subrack and heat radiating method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101795546A true CN101795546A (en) | 2010-08-04 |
| CN101795546B CN101795546B (en) | 2012-07-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009100048936A Expired - Fee Related CN101795546B (en) | 2009-02-04 | 2009-02-04 | Subrack and heat radiating method thereof |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102270027A (en) * | 2011-07-28 | 2011-12-07 | 浪潮电子信息产业股份有限公司 | Multi-path radiating system for large-power server |
| WO2012126240A1 (en) * | 2011-03-18 | 2012-09-27 | 中兴通讯股份有限公司 | Communication apparatus |
| CN103687449A (en) * | 2013-12-11 | 2014-03-26 | 华为技术有限公司 | Electronic equipment and data center |
| WO2016015513A1 (en) * | 2014-07-30 | 2016-02-04 | 中兴通讯股份有限公司 | Cabinet |
| WO2016192497A1 (en) * | 2015-06-03 | 2016-12-08 | 中兴通讯股份有限公司 | Subrack and subrack assembly structure |
| CN109757085A (en) * | 2019-01-25 | 2019-05-14 | 西南石油大学 | Tapered gradual-enlargement type forced air cooling system |
| CN112543571A (en) * | 2019-09-20 | 2021-03-23 | 中兴通讯股份有限公司 | Backplate subassembly and subrack |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN100379332C (en) * | 2004-12-22 | 2008-04-02 | 艾默生网络能源有限公司 | An outdoor cabinet |
| CN201115064Y (en) * | 2007-09-21 | 2008-09-10 | 中兴通讯股份有限公司 | A machine cabinet |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012126240A1 (en) * | 2011-03-18 | 2012-09-27 | 中兴通讯股份有限公司 | Communication apparatus |
| CN102270027A (en) * | 2011-07-28 | 2011-12-07 | 浪潮电子信息产业股份有限公司 | Multi-path radiating system for large-power server |
| CN103687449A (en) * | 2013-12-11 | 2014-03-26 | 华为技术有限公司 | Electronic equipment and data center |
| WO2016015513A1 (en) * | 2014-07-30 | 2016-02-04 | 中兴通讯股份有限公司 | Cabinet |
| WO2016192497A1 (en) * | 2015-06-03 | 2016-12-08 | 中兴通讯股份有限公司 | Subrack and subrack assembly structure |
| CN106304770A (en) * | 2015-06-03 | 2017-01-04 | 中兴通讯股份有限公司 | Subrack and subrack modular construction |
| CN109757085A (en) * | 2019-01-25 | 2019-05-14 | 西南石油大学 | Tapered gradual-enlargement type forced air cooling system |
| CN109757085B (en) * | 2019-01-25 | 2024-04-02 | 西南石油大学 | Gradually-reducing gradually-expanding forced air cooling system |
| CN112543571A (en) * | 2019-09-20 | 2021-03-23 | 中兴通讯股份有限公司 | Backplate subassembly and subrack |
| CN112543571B (en) * | 2019-09-20 | 2023-04-28 | 中兴通讯股份有限公司 | Backboard component and insertion box |
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| Publication number | Publication date |
|---|---|
| CN101795546B (en) | 2012-07-04 |
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