WO2012126240A1

WO2012126240A1 - Communication apparatus

Info

Publication number: WO2012126240A1
Application number: PCT/CN2011/080766
Authority: WO
Inventors: 万钧; 刘建
Original assignee: 中兴通讯股份有限公司
Priority date: 2011-03-18
Filing date: 2011-10-13
Publication date: 2012-09-27
Also published as: CN202077156U

Abstract

A communication apparatus includes that: a case (1), which includes a containing space (11); a flashboard area for fixing at least one flashboard, which is set in the containing space (11); an air inlet panel (2), which is set on the case (1); an air outlet panel, which is set on the case; and at least one radiating device (4), which enables the outer air to be inhaled through the inlet panel (2), flowed via the flashboard area and flowed out through the outlet panel, set in the containing space (11). The present invention can effectively improve the radiating capability of the communication apparatus.

Description

Communication equipment

The utility model belongs to a communication device, in particular to a communication device with a heat dissipation device. Background technique

In the communication device, the plug-in box is a commonly used independent unit, which has a function of carrying a certain service, such as a load board, a power supply, a fan, and the like.

The conventional communication box is generally composed of a frame, a heat sink, a power module, and the like. The chassis carries all the modules; the power module supplies power to the subrack; the subrack uses forced air cooling to obtain the required air volume of the system. At present, the integration of communication products is getting higher and higher, and the power consumption per unit volume is getting larger and larger, so the requirements for the heat dissipation performance of the plug-in box are getting higher and higher.

At present, the conventional plug-in box structure often cannot meet the heat dissipation requirements of the system, so it is necessary to develop a new plug-in box structure to adapt to the development trend of high integration of communication products. Utility model content

In order to solve the above problems, the object of the present invention is to provide a communication device which can effectively improve the heat dissipation capability of a communication device.

In order to achieve the above object, the present invention provides a communication device, including:

a housing 1 includes an accommodation space 11;

a plug-in area 111 for mounting at least one card, disposed in the accommodating space 11; a wind inlet panel 2, disposed on the housing 1;

An air outlet panel 3 is disposed on the casing 1;

At least one heat sink 4 for drawing outside air through the air intake panel 2 and flowing the air through the board area 111 and then flowing out through the air outlet panel 3 The accommodating space 11 is inside.

Preferably, the heat sink 4 is disposed at the air inlet panel 2.

Preferably, the heat dissipating device 4 includes: a first group of fan modules 41 and a second group of fan modules 42 respectively disposed in the accommodating space 11.

Preferably, the first group of fan modules 41 and the second group of fan modules 42 are stacked above and below, respectively, in the accommodating space 11.

Pre-selected, the housing 1 includes: a first panel 12 and a second panel 13 , wherein the first panel 12 and the second panel 13 are oppositely disposed, and the air inlet panel 2 is disposed on the first panel 12 The air outlet panel 3 is disposed on the second panel 13 .

Preferably, the air inlet panel 2 is located below the air outlet panel 3.

Preferably, the inlet panel 2 has a convex shape, and a plurality of air inlet holes 21 are defined in the air inlet panel 2.

Preferably, the air outlet panel 3 comprises:

a first air outlet plate 31;

a second air outlet plate 32 is connected to the first air outlet plate 31 at a first predetermined angle; a third air outlet panel 33 is connected to the first air outlet plate 31 at a second predetermined angle; A plurality of air outlet holes 34 are defined in the first air outlet panel 31, the second air outlet panel 32, and the third air outlet panel 33.

Preferably, the communication device further includes: a dust-proof current sharing net 5 for dustproofing and current sharing, the dust-proof current sharing net 5 is disposed between the board area 111 and the heat sink 4 .

Preferably, the dust-proof current sharing network 5 includes:

a sponge filter 51;

A frame 52 for supporting and fixing the sponge screen 51.

It can be seen from the above technical solutions that the utility model has the following beneficial effects:

(1) by providing an air inlet panel, a heat sink, and an air outlet panel in the housing of the communication device, Therefore, a heat dissipating air passage is formed, so that sufficient cold air can be supplied to the interposer area to bring the heat of the plug board out of the casing, thereby effectively improving the heat dissipation capability of the communication device;

(2) According to the different total heat generated, one or two layers of heat dissipating devices can be selected to achieve the best cost performance of the whole machine;

(3) The air inlet panel installed in the front lower part of the casing is formed into a convex shape, and a plurality of air inlet holes are opened, which can increase the air intake amount of the system;

(4) The air outlet panel installed on the upper rear part of the casing is formed into a combination of a sloped surface and a vertical plane, and a plurality of air outlet holes are opened, which can effectively increase the air outlet area, and is favorable for smooth airflow. DRAWINGS

Figure 1 is a front elevational view of a communication device in an embodiment of the present invention;

Figure 2 is a left side view of the communication device in the embodiment of the present invention;

3 is a schematic view of a heat dissipation air passage in an embodiment of the present invention;

Figure 4 is a schematic view of the disassembly and assembly of the fan module in the embodiment of the present invention;

Figure 5 is a schematic view of the disassembly and assembly of the fan module in the embodiment of the present invention;

Figure 6 is a schematic view of the inserting plate installed in the housing in the embodiment of the present invention;

7 is a schematic structural view of an air inlet panel according to an embodiment of the present invention;

8 is a schematic structural view of an air outlet panel according to an embodiment of the present invention;

FIG. 9 is a schematic structural view of a dustproof flow sharing net according to an embodiment of the present invention. detailed description

In order to make the objects, the technical solutions and the advantages of the embodiments of the present invention more comprehensible, the embodiments of the present invention are further described in detail below with reference to the embodiments and drawings. The illustrative embodiments and the description of the present invention are intended to explain the present invention, but are not intended to limit the invention.

1 to 2, which are schematic structural diagrams of a communication device according to an embodiment of the present invention, the communication Equipment includes:

a housing 1 includes an accommodation space 11;

An air outlet panel 3 is disposed on the casing 1;

At least one heat dissipating device 4 is disposed in the accommodating space 11, and the heat dissipating device 4 can take in outside air through the air inlet panel 2, and pass the air through the interposer region 111, and then pass The air outlet panel 3 flows out.

In the present embodiment, other functional modules may be disposed in the accommodating space 11 of the housing 1. For example, the function module to be set can be selected according to the function of the communication device.

In the present embodiment, the card area 111 is used to mount a card board, and the board area 111 supports the front board and/or the rear board. The inserting plate can be fixed to the inserting plate area 111 by using an existing fixing method. Of course, the fixing manner and the number of the inserting plate are not limited in this embodiment.

In the present embodiment, the heat sink 4 can be implemented by a device having a heat dissipation function, such as a heat dissipation fan.

In the present embodiment, the heat dissipating device 4 can suck cold air into the accommodating space 11 of the casing 1 through the air inlet panel 2, and can cause the cold air to flow through the boarding area 111, and the cold air can be inserted The card in the board area 111 is subjected to heat exchange, and then hot air is sent out through the air outlet panel 3 to the accommodation space 11 of the casing 1.

Referring to Fig. 2, the heat sink 4 is disposed at the air inlet panel 2, for example, the heat sink 4 is disposed below the board area 111. Of course, the specific position of the heat sink 4 is not limited in this embodiment.

In this embodiment, the communication device further includes a power module 6 for supplying power to the communication device, as shown in FIG. The power module 6 can be connected to a 220V AC power source or a DC power source through a power line. 1 and 2, the housing 1 includes: a first panel 12 and a second panel 13, wherein the first panel 12 and the second panel 13 are oppositely disposed (as shown in FIG. 2), the first The inlet panel 2 is disposed on the panel 12, and the outlet panel 3 is disposed on the second panel 13.

In this embodiment, the air inlet panel 2 and the air outlet panel 3 can be respectively disposed on the first panel 12 and the second panel 13 by using an existing fixing manner, for example, the air inlet panel 2 is fixed by means of a buckle. And the outlet panel 3 are disposed on the first panel 12 and the second panel 13, respectively.

In this embodiment, the air inlet panel 2 is located below the air outlet panel 3, thereby forming a heat dissipation air passage through the air inlet panel 2, the heat dissipation device 4, and the air outlet panel 3.

3 is a schematic view of a heat dissipating air passage according to an embodiment of the present invention. The arrow indicates the direction of air flow, and the cold air outside the casing 1 is from the front lower side of the casing 1 (the first panel 12 is advanced). The wind panel 2 enters, and after being sucked by the heat sink 4, the cold air flows through the boarding area 111, and then flows out from the rear upper side of the casing 1 (at the air outlet panel 3 of the second panel 13) to the outside of the casing 1. Thereby bringing the heat of the board to the outside of the housing 1. Of course, the specific direction of air flow in the heat dissipating duct is not limited in this embodiment.

Continuing to refer to FIG. 2, the heat dissipating device 4 includes: a first group of fan modules 41 and a second group of fan modules 42 disposed in the accommodating space 11 respectively.

For example, a manner in which the first group of fan modules 41 and the second group of fan modules 42 overlap each other is disposed in the accommodating space 11.

In this embodiment, the upper and lower two-layer fan modules can improve the wind pressure of the heat dissipation system, overcome the resistance in the air passage, and thereby improve the effective air volume of the heat dissipation system. The first group of fan modules 41 and the second group of fan modules 42 are Installed in an up-and-down manner, independent of each other.

Of course, when the accommodating space 11 of the casing 1 is sufficiently large, the first group of fan modules 41 and the second group of fan modules 42 may be disposed on the same plane.

4 is a schematic view of the disassembly and assembly of the fan module in the embodiment of the present invention. The first group of fan modules 41 can be inserted into the accommodating space 11 of the housing 1 or from the housing in the direction indicated by the arrow. The accommodating space 11 of the body 1 is pulled out. Of course, the second group of fan modules 42 can also be inserted into or taken out from the accommodating space 11 of the housing 1 in the same manner.

Referring to FIG. 5, the first group of fan modules 41 have been removed from the accommodating space 11 of the housing 1. Only the second group of fan modules 42 are used in the accommodating space 11 of the housing 1. Can be occluded with a dummy panel.

In this embodiment, one or two layers of heat dissipating devices can be selected according to different heat generated by different configurations of the communication device, thereby achieving an optimal overall cost performance.

Referring to Fig. 6, a schematic view of the inserting plate mounted in the casing in the embodiment of the present invention, the front inserting plate 8 and the rear inserting plate 7 are disposed in the inserting plate region 111 of the casing 1 in a front-to-back manner. Of course, in the present embodiment, the card may be disposed in the card insertion area 111 in other manners.

As shown in FIG. 7 , it is a schematic structural view of an air inlet panel according to an embodiment of the present invention. The shape of the air inlet panel is a convex shape, and a plurality of air inlet holes are defined in the air inlet panel 2 . 21 , thereby increasing the windward area and increasing the air intake of the heat dissipation system.

Of course, the specific shape of the air inlet panel 2 is not limited in this embodiment, and the number and arrangement of the air inlet holes 21 on the air inlet panel 2 are not limited.

FIG. 8 is a schematic structural view of an air outlet panel according to an embodiment of the present invention, and the air outlet panel 3 includes:

a first air outlet 31;

In this embodiment, the first predetermined angle and the second predetermined angle may be obtuse angles, that is, the angle between the second air outlet panel 32 and the first air outlet panel 31 is greater than 90 degrees, and the third air outlet panel 33 and the first The angle between the air outlet panels 31 is greater than 90 degrees, and the second air outlet panel 32 and the second The angle between the three outlet panels 33 is set to 90 degrees.

As shown in FIG. 8 , the shape of the air outlet panel 3 is a combination of a sloped surface and a vertical plane, and a plurality of air outlet holes 34 are defined in the air outlet panel 3 , thereby increasing the air outlet area and facilitating the air outlet area. The airflow is smooth.

Of course, the specific shape of the air outlet panel 3 is not limited in this embodiment, and the number and arrangement of the air outlet holes 34 on the wind panel 3 are not limited.

Continuing to refer to FIG. 2, the communication device further includes: a dust-proof current-flow net 5 for dustproofing and uniformity of flowing airflow, the dust-proof current-sequence mesh 5 being disposed in the card-insertion area 111 and Between the heat sinks 4.

In this embodiment, the dust-proof current-smoothing net 5 can be fixed in the accommodating space 11 of the casing 1 by means of a snap-fastening.

As shown in FIG. 9 , it is a schematic structural view of a dust-proof flow-average net in the embodiment of the present invention. The dust-proof current-flow net 5 includes: a sponge filter 51 and a supporting and fixing the sponge filter. Frame 52 of 51.

In the present embodiment, the sponge screen 51 has a thickness of not less than 5 mm and has a dustproof effect, and the damping property of the sponge screen 51 to the air can function to make the passing wind flow uniform. Therefore, the dust-proof current-flowing net 5 has both dustproof and current-sharing effects, so that the wind blown by the heat-dissipating device 4 flows through the plug-in plate after being evenly flowed, so that different slots of the slots and different regions of the single plug-in board are formed. There is a wind flow, which improves the heat dissipation environment of the board.

(1) By providing an air inlet panel, a heat sink and an air outlet panel in the housing of the communication device, thereby forming a heat dissipation air passage, thereby providing sufficient cold air to the board area to bring the heat of the board to the shell In addition to the body, effectively improve the heat dissipation capability of the communication device;

(2) According to the different total heat generated, one or two layers of heat dissipating devices can be selected to achieve the best cost performance of the whole machine; (3) forming the air inlet panel installed in the front lower part of the casing into a convex shape, and opening a plurality of air inlet holes, thereby increasing the air intake amount of the system;

(4) The air outlet panel installed on the upper rear part of the casing is formed into a combination of a sloped surface and a vertical plane, and a plurality of air outlet holes are opened, thereby effectively increasing the air outlet area, which is advantageous for smooth airflow.

The above description is only a preferred embodiment of the present invention, and it should be noted that those skilled in the art can also make some improvements and retouching without departing from the principles of the present invention. It should also be considered as the scope of protection of the present invention.

Claims

Claim

A communication device, comprising:

a housing (1) comprising an accommodation space (11);

a card area (111) for mounting at least one card, disposed in the accommodating space (11);

An air inlet panel (2) disposed on the housing (1);

An air outlet panel (3) is disposed on the casing (1);

At least one heat sink for drawing outside air through the air intake panel (2) and flowing the air through the board area (111) and then flowing out through the air outlet panel (3) (4 ), is disposed in the accommodating space (11).

2. A communication device according to claim 1, characterized in that the heat sink (4) is arranged at the inlet panel (2).

The communication device according to claim 2, wherein the heat dissipation device (4) comprises: a first group of fan modules (41) and a second group of fan modules (42) respectively disposed on the receiving device Within space (11).

The communication device according to claim 3, wherein the manner in which the first group of fan modules (41) and the second group of fan modules (42) overlap each other is respectively disposed in the receiving Within space (11).

5. The communication device according to claim 1, wherein the housing (1) comprises: a first panel (12) and a second panel (13), wherein the first panel (12) and the The second panel (13) is oppositely disposed. The first panel (12) is provided with the air inlet panel (2), and the second panel (13) is provided with the air outlet panel (3).

6. The communication device according to claim 5, characterized in that the air inlet panel (2) is located below the air outlet panel (3).

7. The communication device according to claim 1, wherein the air inlet panel (2) The shape is a convex shape, and a plurality of air inlet holes (21) are opened in the air inlet panel (2).

8. The communication device according to claim 1, wherein the air outlet panel (3) comprises:

a first air outlet plate (31);

a second air outlet plate (32) connected to the first air outlet plate (31) at a first predetermined angle; a third air outlet panel (33), and the first air outlet plate (31) a second predetermined angle connection; a plurality of air outlet holes (34) are defined in the first air outlet panel (31), the second air outlet panel (32), and the third air outlet panel (33).

The communication device according to claim 1, wherein the communication device further comprises: a dust-proof and even flow network (5) for dustproofing and current sharing, and the dust-proof current sharing network (5) ) is disposed between the interposer region (111) and the heat sink (4).

10. The communication device according to claim 9, wherein the dust-proof current sharing network (5) comprises:

a sponge filter (51);

A frame (52) for supporting and fixing the sponge screen (51).