CN107454810B

CN107454810B - Communication equipment with a plurality of rear plug-in cards

Info

Publication number: CN107454810B
Application number: CN201710837759.9A
Authority: CN
Inventors: 熊平
Original assignee: Byzoro Networks Ltd
Current assignee: Byzoro Networks Ltd
Priority date: 2017-09-18
Filing date: 2017-09-18
Publication date: 2024-02-20
Anticipated expiration: 2037-09-18
Also published as: CN107454810A

Abstract

The invention provides a communication device with a plurality of rear plug-in cards, comprising: the device comprises a case, a middle card, a plurality of front plug-in cards and a plurality of rear plug-in cards, wherein the front plug-in cards are transversely inserted on the middle card, the rear plug-in cards are vertically inserted on the middle card, the air inlet side of a board card of the rear plug-in cards is positioned at the lower part of the rear plug-in cards, and a plurality of exhaust fans are arranged on the side edges of a rear panel of each rear plug-in card side by side; the top and the bottom of the rear side plate surface of the middle card are respectively provided with a guide rail component; the guide rail assembly is provided with a plurality of slide rails, and the two corresponding slide rails are equivalent to a slot space; the rear plug-in card is inserted onto the middle card through the sliding rail; at least 3 parallel slot spaces are arranged in the electronic device; wherein, two first type rear plug-in cards occupy a slot space respectively, and two second type rear plug-in cards occupy the same slot space together; at least two thermal devices are arranged on each first type of rear plug-in card, and one thermal device is arranged on each second type of rear plug-in card. The invention can effectively improve the heat dissipation efficiency and make the chassis more compact.

Description

Communication equipment with a plurality of rear plug-in cards

Technical Field

The present disclosure relates to the field of heat dissipation technologies for electronic devices, and in particular, to a communication device with multiple rear cards.

Background

In the prior art, some electronic devices include a chassis, a back plate positioned inside the chassis, and a card and a power supply arranged in an orthogonal architecture on the front and back sides of the back plate. In order to achieve heat dissipation, a fan is generally installed in the chassis of the electronic device, and accordingly, an air duct through which an air flow driven by the fan flows is also required to be formed in the chassis.

The orthogonal structure is generally composed of a back plate, a front plugboard, a rear plugboard and a heat dissipation air path special for the front plugboard and the rear plugboard. In the orthogonal structure, a single board arrangement mode of front plugboard transverse insertion and rear plugboard vertical insertion or front plugboard vertical insertion and rear plugboard transverse insertion can be adopted. For example, in chinese patent application No. 201110339954.1 entitled "heat dissipating system and electronic device having the same," such a heat dissipating system for electronic device is disclosed. Referring to fig. 1, the electronic device 200 has a back board 120, a front board 110 and a rear board 130, wherein the front board 110 is plugged onto a front board surface of the back board 120, and the rear board 130 is plugged onto a rear board surface of the back board 120. In order to dissipate heat from the rear board 130, a Z-type heat dissipation air path as indicated by a broken arrow in fig. 1 is employed in the electronic device. The inlet duct 210 of the Z-type cooling air duct is located at one side of the back plate (i.e. the bottom of the chassis), and the outlet duct 220 is located at the other side of the back plate (i.e. the top of the chassis); meanwhile, a fan assembly 310 is disposed at an outlet of the air outlet duct 220, and the fan assembly 310 is disposed on the cabinet. Because the air outlet duct 220 needs to be added to the top of the chassis, the height of the entire chassis needs to be increased to provide a space dedicated to the air outlet duct 220 in the chassis; also, if devices (e.g., devices 1301 and 1302 shown in fig. 1) are provided on the rear board 130, heat dissipation of the latter devices (e.g., device 1302 shown in fig. 1) will be adversely affected when wind flows through the devices because heat is conducted in cascade.

Disclosure of Invention

In view of the above, the present invention provides a communication device having a plurality of rear cards, so that the heat dissipation efficiency can be effectively improved and the chassis can be made more compact.

The technical scheme of the invention is realized specifically as follows:

a communication device having a plurality of rear cards, comprising: the device comprises a case, a middle card, a plurality of front plug-in cards and a plurality of rear plug-in cards, wherein the middle card is arranged in the middle of the case, the front plug-in cards are inserted on the front side plate surface of the middle card in a transverse insertion mode, and the rear plug-in cards are inserted on the rear side plate surface of the middle card in a vertical insertion mode;

the lower part of the front panel of the case is provided with a case air inlet, the board card air inlet side of the rear plug-in card is positioned at the lower part of the rear plug-in card, and a plurality of exhaust fans are arranged on the side edge of the rear panel of each rear plug-in card side by side; wherein, the air inlet side of the board card of the rear plug-in card and the side of the rear panel of the rear plug-in card are adjacent sides;

the top of the middle card is connected with the top of the case, and the top and the bottom of the rear side plate surface of the middle card are respectively provided with a guide rail component;

the upper guide rail component and the lower guide rail component are respectively provided with a plurality of guide rails which are arranged in parallel along the length direction of the chassis, and the two corresponding guide rails on the upper guide rail component and the lower guide rail component are equivalent to a slot space; the rear plug-in card is plugged into the rear side plate surface of the middle card through a sliding rail on the guide rail assembly;

at least 3 slot spaces which are arranged in parallel are arranged in the electronic device;

wherein two first type rear plug-in cards in the plurality of rear plug-in cards occupy a slot space respectively, and two second type rear plug-in cards in the plurality of rear plug-in cards occupy the same slot space together; at least two thermal devices are arranged on each first-type rear plug-in card, and one thermal device is arranged on each second-type rear plug-in card.

Preferably, the case air inlet is positioned in the middle of the lower side of the front plug-in card.

Preferably, the rear plug-in card is further provided with a first baffle plate positioned between the thermal device and the exhaust fan; the initial end of the first flow baffle is positioned at an included angle between the air inlet side of the board card and the side edge of the rear panel, and the tail end of the first flow baffle is positioned at one side of the thermal device.

Preferably, the exhaust fan is an exhaust fan supporting hot plug.

Preferably, the exhaust fan supporting hot plug includes: the fan body, the fixing piece, the structural member sliding rail and the PCB daughter card;

the rear plug-in card is provided with: fan slot, board edge connector;

the fan body is fixed on the structural member sliding rail through the fixing piece and is inserted into the fan slot of the rear plug-in card through the structural member sliding rail; the PCB daughter card is arranged at the front end of the fan body and is inserted into the board edge connector of the rear plug-in card.

Preferably, the exhaust fan supporting hot plug is further provided with a self-locking structure for locking the fan body in the fan groove; the self-locking state of the exhaust fan can be relieved by pressing the self-locking structure, and the exhaust fan supporting hot plug is pulled out from the fan groove of the rear plug-in card.

As can be seen from the above, in the communication device with multiple rear cards in the present invention, since the exhaust fan is not installed at the back of the chassis, but is directly installed on the side edge of the rear panel of the rear card, there is no need to provide an air outlet duct at the top of the chassis, and the air outlet duct does not occupy additional space, so that effective heat dissipation can be ensured without increasing the height of the chassis, and the heat dissipation efficiency is effectively improved, and the chassis is more compact; meanwhile, because the exhaust fans are directly arranged on each rear plug-in card, the wind flow entering the rear plug-in card through the wind inlet channel and the side S of the rear plug-in card can be dispersed and led out, so that the heat dissipation problem caused by heat conduction can be effectively reduced or eliminated, and independent fan frames are not required to be independently arranged at the rear part of the chassis, so that the plugging and unplugging of each rear plug-in card can not be influenced.

Drawings

Fig. 1 is a side view of a prior art heat dissipation system for an electronic device.

Fig. 2 is a schematic perspective view of an orthogonal structure in a communication device having a plurality of rear cards in an embodiment of the present invention.

Fig. 3 is a schematic perspective view of a chassis of a communication device with multiple rear cards according to an embodiment of the present invention, with a side of the chassis removed.

Fig. 4 is a rear view of a chassis of a communication device having a plurality of rear cards in one embodiment of the present invention.

Fig. 5 is a top view of a chassis of a communication device having a plurality of rear cards in an embodiment of the present invention with a top surface of the chassis removed.

Fig. 6 is a right side view of a chassis of a communication device having a plurality of rear cards according to a first embodiment of the present invention with a side of the chassis removed.

Fig. 7 is a right side view of a chassis of a communication device having a plurality of rear cards according to a second embodiment of the present invention, with a side of the chassis removed.

Fig. 8 is a side view of a rear card inserted in a second embodiment of the present invention after being turned 90 ° right.

Fig. 9 is a side view of a heat sink in a second embodiment of the invention.

Fig. 10 is a schematic perspective view of a rear card according to a second embodiment of the invention.

Fig. 11 is a right side view of a chassis of a communication device having a plurality of rear cards in accordance with a third embodiment of the present invention with a side of the chassis removed.

Detailed Description

In order to make the technical scheme and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.

The invention provides communication equipment with a plurality of rear plug-in cards, so that the heat dissipation efficiency can be effectively improved, and the chassis is more compact.

In the communication device with a plurality of rear plug-in cards of the invention, a case is provided, and a corresponding orthogonal structure is arranged in the case.

For example, fig. 2 is a schematic perspective view of an orthogonal structure in a communication device with multiple back cards in an embodiment of the present invention, and fig. 3 is a schematic perspective view of a chassis of the communication device with multiple back cards in an embodiment of the present invention with a side of the chassis removed. As shown in fig. 2 and 3, the orthogonal structure in the communication device having a plurality of rear cards in the embodiment of the present invention includes: a plurality of front cards 11, a plurality of middle cards 12, and a plurality of rear cards 13; the middle card 12 is arranged in the middle of the case 20 of the electronic device, and the front plug-in card 11 and the rear plug-in card 13 are respectively inserted at two sides of the middle card 12; the front card 11 is inserted into the front side surface of the middle card 12 in a horizontal insertion manner, and the rear card 13 is inserted into the rear side surface of the middle card 12 in a vertical insertion manner. For example, the front card 11 may be inserted horizontally on the front side surface of the middle card 12, and the rear card 13 may be inserted vertically on the rear side surface of the middle card 12.

In addition, in the embodiment of the present invention, a plurality of exhaust fans are arranged side by side on the side of the rear panel of the rear card 13.

In addition, in a preferred embodiment of the present invention, the top of the middle card 12 is connected to the top of the chassis 20, the top and the bottom of the rear side surface of the middle card 12 may also be respectively provided with a rail assembly, the rail assembly is provided with a plurality of sliding rails arranged in parallel along the length direction of the chassis, and two corresponding sliding rails on the upper and lower rail assemblies are equivalent to a slot (or referred to as a slot space); thus, the rear card 13 may be inserted onto the rear side panel of the middle card 12 through a slide rail on the rail assembly.

In the technical solution of the present invention, a plurality of slot spaces (i.e., slots) may be provided on the above-mentioned rail assembly, so that a plurality of rear cards 13 are mounted on the intermediate card 12.

For example, fig. 4 is a rear view of a chassis of a communication device having a plurality of rear cards in one embodiment of the present invention, and fig. 5 is a top view of the chassis of the communication device having a plurality of rear cards in one embodiment of the present invention with a top surface of the chassis removed. In this particular embodiment, as shown in fig. 4 and 5, at least 3 slot spaces arranged in parallel are provided in the communication device having a plurality of rear cards. On the chassis 20, 4 rear cards 13, 14, 15 and 16 are installed in parallel, occupying 3 slot spaces. Wherein the rear cards 13 and 14 occupy a slot space respectively, and the rear cards 15 and 16 occupy a slot space together. In addition, in fig. 4, the rear card 14 inserted in the slot space 17 is intentionally pulled out so as to clearly see the medium card-side signal connector; in other embodiments, 1 rear card or 2 rear cards may be mounted in the slot space 17 and other slot spaces.

In one embodiment of the present invention, a plurality of exhaust fans (e.g., exhaust fans 31 and 32, etc., provided on the rear card 13) are provided side by side on the rear panel side of the rear cards 13, 14, 15, and 16.

Preferably, in a specific embodiment of the present invention, the number of exhaust fans set on each rear card may be the same or different, and the number of exhaust fans on each rear card may be preset according to the needs of practical application situations. For example, the number of the exhaust fans may be 8, 7, 6, 5, 4, 3 or 2, or more.

In addition, in one embodiment of the present invention, ventilation windows 28 are preferably provided on the left and right sides of the middle card 12.

Fig. 5 is a top view of a chassis of a communication device having a plurality of rear cards in an embodiment of the present invention, where the top surface of the chassis is removed, as shown in fig. 5, a front card 11 (which may be a plurality of front cards arranged in parallel) is located on the front side of a middle card 12, and is horizontally inserted on the front side surface of the middle card 12, rear cards 13, 14, 15 and 16 are located on the rear side of the middle card 12, and are vertically inserted on the rear side surface of the middle card 12, and the rear cards 13 and 14 occupy a slot space (where the slot space 17 shown in fig. 4 is occupied by the rear card 14), and the rear cards 15 and 16 together occupy a slot space.

In this embodiment, the front card may use front and rear air channels, that is, the air flow entering from the front panel of the front card 11 passes through the ventilation window 28 on the middle card 12 to reach the air outlet air channel 29, and is blown out by the exhaust fan 30 installed on the rear panel of the chassis outside the slot space where the 4 rear cards are located, so that a better heat dissipation effect can be achieved.

Since the rear cards 13, 14, 15, 16 are located at the rear side of the chassis 20 and are vertically inserted on the rear side surface of the middle card 12, if the rear cards also use front and rear air ducts similar to the front card 11, there is a possibility that the following problems will occur, taking the rear card 13 as an example:

1) The rear card 13 has a limited aperture ratio in the corresponding area of the middle card 12, so that it may be difficult to ensure a sufficient amount of wind-in air;

2) The rear card 13 is located at the rear stage of the front card 11, so that heat generated by the front card 11 is conducted to the rear card 13 through wind flow, which may increase difficulty in heat dissipation of the rear card 13.

Therefore, in order to solve the above-mentioned technical problems, further improving the heat dissipation efficiency, another specific embodiment is also provided in the technical scheme of the present invention.

First embodiment:

for example, fig. 6 is a right side view of a chassis of a communication device having a plurality of rear cards in accordance with a first embodiment of the present invention with a side of the chassis removed. In the first embodiment, as shown in fig. 6, a Z-type air duct is used, that is, a chassis air inlet is provided at the lower part of the front panel of the chassis, and the chassis air inlet is located at the middle of the lower side of the front card, so that the air inlet channel 21 corresponding to the chassis air inlet is located at the middle position of the bottom of the front card 11, the board card air inlet side of the rear card 13 is located at the lower part of the rear card 13, that is, one side S (side of the bottom) of the rear card 13, and the exhaust fans 31 to 38 are mounted on the other side D (side of the rear) of the rear card 13, and the side D is adjacent to the side S.

In the Z-shaped air duct, the exhaust fans 31 to 38 blow air outwards, so that air is driven to enter the chassis 20 from the air duct 21, flows in the direction indicated by the dotted arrow 10 shown in fig. 6, passes through the side S of the rear card and the high-power consumption chips 131, 132 and 133 on the rear card 13, and is blown out by the exhaust fans 31 to 38 on the panel side D of the rear card 13.

Preferably, in an embodiment of the present invention, the high power chips 131, 132, 133 may be provided with heat sinks 51, 52, 53, respectively.

In the technical solution of the first embodiment, the exhaust fan is not installed at the back of the chassis, but is directly installed on the side edge of the rear panel of the rear card (the rear card is in a rectangular structure, and the vertical height of the rear card is greater than the width, i.e. the side edge of the rear panel is greater than the air inlet edge of the rear card, so that the exhaust fan is installed on a long edge of the rear card), and therefore, the air outlet duct 220 as shown in fig. 1 is not required to be arranged at the top of the chassis, so that effective heat dissipation can be ensured without increasing the height of the chassis; meanwhile, since the exhaust fans are directly installed on each rear card, the wind flow entering the rear card through the wind channel 21 and through the side S of the rear card can be dispersed and led out, thereby effectively reducing or eliminating the heat dissipation problem caused by heat conduction.

In the first embodiment of the present invention, the hot air passing through the chip 131 on the rear card 13 is blown away by the exhaust fans 37 and 38 arranged downward, so that the heat dissipation effect is better; however, most of the cool air from the air inlet passage 21 may not pass through the chips 132 and 133 in sequence, but may be directly blown away by the exhaust fans 37 and 38 disposed below, so that heat dissipation of the chips 132 and 133 disposed above may be problematic. In addition, the air flow passing through the chips 131 and 132 on the lower side of the rear card 13 can be blown away by a plurality of air exhaust fans, and the chip 133 on the uppermost side only has the air exhaust fan 31 on the uppermost side capable of taking away the heat, and the chip 133 is close to the top end of the chassis 20, so that the problem of heat air collection is easily caused, and the heat dissipation of the chip 133 is also adversely affected.

In order to solve the above technical problems, further improve the heat dissipation efficiency, another specific embodiment is provided in the technical scheme of the present invention.

Specific embodiment II:

for example, fig. 7 is a right side view of a chassis of a communication device having a plurality of rear cards according to a second embodiment of the present invention, in which the chassis is removed, fig. 8 is a side view of the rear card according to the second embodiment of the present invention after being turned 90 ° right, and fig. 10 is a schematic perspective view of the rear card according to the second embodiment of the present invention. As shown in fig. 7, 8 and 10, the second embodiment differs from the first embodiment at least in that: a first baffle 61 is disposed on the rear card to prevent cold air from the air inlet channel 21 from being directly blown away by the lower air exhaust fans 37 and 38, so that as much air flow as possible passes through the chip 132 and the chip 133 and is then blown away by the air exhaust fans, thereby effectively improving the heat dissipation effect on the chip 132 and the chip 133.

Preferably, in the second embodiment of the present invention, the first baffle 61 is located between the chip 131 and the exhaust fans 37 and 38, the start end of the first baffle 61 is located at an included angle between the air inlet side S of the board card and the side D of the rear panel, and the end of the first baffle 61 is located between the chip 132 and the exhaust fans 37 and 38, i.e. on one side of the chip 132.

In addition, in order to better improve the heat dissipation efficiency, in a preferred embodiment of the present invention, the method may further include: a second baffle 62 is provided on the rear plug-in card, which second baffle 62 is located between the chip 133 and the exhaust fans 31, 32. After the second flow baffle 62 is provided, the exhaust fan 31 disposed at the uppermost end of the rear card 13 can be dedicated to heat dissipation of the chip 133, so that as much air flow as possible passes through the chip 133 and is blown away by the exhaust fan 31, thereby effectively improving the heat dissipation effect of the chip 133.

After the first flow blocking plate 61 and the second flow blocking plate 62 described above are provided on the rear card, three main air ducts as shown in fig. 7 and 8 can be formed after the air flow through the air duct 21 enters the rear card through the side S of the rear card: 22. 23, 24, wherein the air duct 24 is located between the radiator 52 and the first baffle 61, and is used for timely discharging the hot air passing through the lowest chip 131 of the rear card 13; the air duct 23 is mainly used for radiating heat for the chip 132 arranged in the middle of the rear plug-in card 13; the air duct 22 is located between the heat sink 52 and the middle card 12, and is used for providing part of cold air for the chip 133 located at the uppermost side of the rear card 13, and timely discharging the hot air passing through the chip 133.

By using the air duct, the three high-power consumption chips 131, 132 and 133 on the rear plug-in card 13 can receive the cold air of the inlet air duct 21, so that the heat dissipation effect is better; furthermore, the hot-pluggable exhaust fans 31 to 38 on the panel side D of the rear card 13 can be allocated to different devices (e.g., three high-power chips 131, 132, 133), thereby effectively improving the heat dissipation efficiency.

As shown in fig. 7 and 8, the chips 131, 132, 133 on the rear card 13 correspond to the heat sinks 51, 52, 53, respectively. For ease of description, the thermal device 511 may be used to represent an aggregate of the chip 131 and its corresponding heat spreader 51; similarly, thermal device 522 may be used to represent the aggregate of chip 132 and its corresponding heat spreader 52, and thermal device 533 may be used to represent the aggregate of chip 133 and its corresponding heat spreader 53.

In addition, in order to better improve the heat dissipation efficiency, in a preferred embodiment of the present invention, the method may further include: the side edge of the radiator of the chip arranged on the upper part of the rear plug-in card forms an angle of 45 degrees with the side edge of the rear plug-in card.

For example, in a preferred embodiment of the present invention, the heat sinks of the chips disposed on the upper portion of the rear card are fin-shaped heat sinks, and the fins on the fin-shaped heat sinks are installed along the airflow direction.

For example, in one embodiment of the present invention, the fins on the fin-shaped heat sink preferably extend at an angle of 45 degrees to the side of the rear card.

For example, fig. 9 is a side view of a heat sink in a second embodiment of the invention. As shown in fig. 9, the heat sink 53 of the chip 133 at the upper portion of the rear card 13 adopts a fin-shaped heat sink in which the fins 531 extend at an angle of 45 degrees to the side D of the rear card 13, i.e., the fins 531 of the fin-shaped heat sink 53 are mounted on the chip 133 along the air flow direction, as shown in fig. 7 and 8.

At this time, as shown in fig. 8, when the cool air of the air duct 22 reaches the heat sink 53, the air flow will flow from the upper left side of the chip 133 to the lower right side of the chip 133, and the air flow direction is consistent with the direction of the heat sink fins 531, so that the air flow is easier to pass; moreover, since the lower left side of the heat sink 53, together with the second baffle 62, provides a smoother air path for the air flow of the heat device 522 after the heat sink 53 is rotated 45 degrees, it is easier for the heat on the heat device 522 to be blown away by the exhaust fan 32 or the like.

In addition, in the technical solution of the present invention, the heat sink 53 may include a heat sink frame and heat sink fins 531. Therefore, the entire direction of the heat sink 53 may be set at an angle of 45 degrees to the side D of the rear card 13, or only the direction of the heat sink fins 531 on the heat sink 53 may be set at an angle of 45 degrees to the side D of the rear card 13, and the direction of the heat sink box may still be parallel to the side D of the rear card 13, and at this time, the direction of the heat sink fins 531 is set at an angle of 45 degrees to the direction of the heat sink box. Of course, the latter may add some difficulty to the technical implementation, which may increase development cycle and design costs.

In the technical scheme of the invention, at least two thermal devices are arranged on the rear plug-in card. For example, as shown in fig. 8, the rear card is provided with 3 thermal devices 511, 522, and 533. Accordingly, the above-described 3 thermal devices 511, 522, and 533 may be referred to as a first thermal device 511, a second thermal device 522, and a third thermal device 533, respectively, in order of positions from bottom to top.

According to the service requirements, the thermal devices 522 and 533 need to have PCB connections with 12 identical mid-card side signal connectors 134, so to reduce the trace length, the thermal devices 522 and 533 need to be close to the mid-card 12 and centered as much as possible, and the thermal devices 522 have higher signal rate and more signals and need to be preferentially satisfied.

Accordingly, the power consumption of the three thermal devices 511, 522, 532 on the rear card 13 has the following magnitude relation: thermal device 522 is largest and thermal device 533 is smallest. In addition, as shown in fig. 8, the power inlet connector 135 is located on the left side of the rear card 13, and the placement of the peripheral small system circuit 533 including the thermal device storing particles on the power path is not suitable, so that in a preferred embodiment of the present invention, a final layout of the thermal devices 511, 522, 533 horizontally aligned along the rear card panel side D is eventually presented.

As shown in fig. 8, in the second embodiment, the air inlet duct 21 is located at the side S of the rear card 13, and the air flow is divided into three directions, namely, the duct 22, the duct 23, and the duct 24. Wherein the air chute 22 is located between the mid-card side signal connector 134 and the thermal device 522; the air duct 23 is a main air duct from left to right, and sequentially passes through the thermal devices 511, 522 and 533; the air duct 24 is located between the thermal devices 511, 522 and the first baffle 61.

The duct outlet 71 is located on the panel side D of the rear card 13, and the heat of each of the heat devices 511, 522, 533 is blown out through the duct outlet 71 by 8 exhaust fans 31 to 38 (a greater or lesser number of exhaust fans may be provided).

The rear card 13 is further provided with a first flow blocking plate 61 and a second flow blocking plate 62. Preferably, in one embodiment of the present invention, the first baffle 61 is located between the heat devices 511 and 522 and the fans 37 and 38 on the left side, and the left end of the first baffle 61 extends to the angle between the side S of the rear card and the side D of the panel, and the right end is adjacent to the heat device 522 and exceeds the left side of the heat device 522 by a distance so that the wind flow from the wind inlet duct 21 can pass through the heat device 522 more than the left fans 37 and 38 directly.

Preferably, in an embodiment of the present invention, a gap with a preset width may be formed between the first baffle 61 and the heat device 522, so that a part of the hot air passing through the heat device 511 may be blown away by the exhaust fans 37 and 38 disposed on the left side, and another part of the hot air passes through the heat device 522 and is blown away by the exhaust fans.

In addition, in one embodiment of the present invention, one end of the second baffle 62 abuts against one corner P of the heat device 533, and the other end thereof extends into a gap between two exhaust fans (i.e., the exhaust fan 31 and the exhaust fan 32) disposed at the uppermost side (i.e., the uppermost side in fig. 7, the rightmost side in fig. 8) of the rear card 13, so that the uppermost (i.e., the rightmost side in fig. 8) exhaust fan 31 can be dedicated to the hot air discharge of the heat device 533, and the other exhaust fans 32 to 38 at the left of the exhaust fan 31 can be used for the hot air discharge of the heat devices 511, 522.

In addition, in a preferred embodiment of the present invention, the first flow blocking plate 61 and the second flow blocking plate 62 may be fixed to the rear card 13 by screws, or may be fixed to the rear card 13 by welding or other fixing methods such as a mortise and tenon structure fixing method.

In addition, in a preferred embodiment of the present invention, the exhaust fan disposed on the side of the rear panel of the rear card is an exhaust fan supporting hot plug.

Furthermore, the exhaust fan supporting hot plug can be installed on the side edge of the rear panel of the rear plug-in card by adopting an easy plug-in structure.

For example, in a preferred embodiment of the present invention, the hot plug supporting exhaust fan may include: the fan body, the fixing piece, the structural member sliding rail and the PCB daughter card;

the rear plug-in card is provided with: fan slot, board edge connector;

the fan body is fixed on the structural member sliding rail through the fixing piece and is inserted into the fan slot of the rear plug-in card through the structural member sliding rail; the PCB daughter card is arranged at the front end of the fan body and is inserted into a board edge connector of the rear plug-in card, so that power supply for the exhaust fan and signal interaction are realized.

In a further preferred embodiment of the present invention, the hot plug supporting exhaust fan is further provided with a self-locking structure for locking the fan body in the fan slot, and the self-locking state of the exhaust fan can be released by pressing the self-locking structure K, and the hot plug supporting exhaust fan is pulled out from the fan slot of the rear plug card.

For example, as shown in fig. 10, taking the exhaust fan 34 of the exhaust fans 31 to 38 as an example, the implementation of the insertion and removal is as follows: the outsourcing fan body (namely the fan body 341) is fixed on the structural member sliding rail 343 through the fixing piece, the fan body 341 is inserted into the fan groove 344 of the rear plug-in card 13 through the structural member sliding rail 343, and the PCB sub-card 342 at the front end of the fan body 341 is inserted into the board edge connector 136 of the rear plug-in card 13 to realize connection, so that the air exhaust fan 34 is powered and the signal interaction is realized. In order to facilitate the insertion and extraction of the exhaust fan 34, the exhaust fan 34 further has a self-locking structure K for locking the exhaust fan 34 in the fan slot 344, and the self-locking state of the exhaust fan 34 can be released by pressing the self-locking structure K, so that the exhaust fan 34 is extracted from the fan slot 344 of the rear plug-in card 13.

The exhaust fan supporting hot plug has at least the following advantages:

1) The device can be replaced on line, does not need to be powered down, is convenient for equipment maintenance, and does not influence the service;

2) Can be replaced independently, thus reducing the use risk;

3) The single board can be packaged separately during transportation, thereby reducing the weight of the single board.

Further, in a preferred embodiment of the present invention, the exhaust fan is an adjustable speed fan. Specifically, the speed regulation scheme can be designed according to the requirements of actual application conditions and/or actual measurement results, and the speed of each speed-adjustable fan is preset.

Of course, in the above-described first embodiment and second embodiment of the present invention, each exhaust fan may be the exhaust fan supporting hot plug, or may be a fixed fan having a structure not capable of hot plug.

In addition, in a specific embodiment of the present invention, one or more air supply fans may be further disposed in the air inlet 21, so that the air flow may be better delivered to the rear card.

In addition, in a specific embodiment of the present invention, one or more air ducts with a closed cover may be disposed on the rear card, so that the heat dissipation effect may be greatly enhanced. For example, the air ducts 22, 23, 24 as shown in fig. 7 and 8 may each be provided as a corresponding enclosure air duct to enhance the heat dissipation effect.

In addition, in an embodiment of the present invention, one or more fans may be disposed above the second baffle plate 62 (i.e., on the right side of the second baffle plate 62 as shown in fig. 8), so as to enhance the heat dissipation effect.

As is clear from the above, if the front and rear air ducts similar to the front card in fig. 5 are also used for the rear card in the present embodiment, it may be difficult to ensure a sufficient amount of air intake because the aperture ratio of the rear card in the corresponding area of the middle card is limited; and the rear plug-in card is positioned at the rear stage of the front plug-in card, so that heat generated by the front plug-in card is conducted to the rear plug-in card through wind flow, and the heat dissipation difficulty of the rear plug-in card is possibly increased. Therefore, in the technical solution of the second embodiment, the exhaust fan is not installed at the back of the chassis, but is directly installed on the side edge of the rear panel of the rear card, and a Z-type air duct is adopted, so that the air outlet duct 220 shown in fig. 1 is not required to be arranged at the top of the chassis, and effective heat dissipation can be ensured without increasing the height of the chassis; meanwhile, because the exhaust fans are directly arranged on each rear plug-in card, the wind flow entering the rear plug-in card through the wind channel 21 and the side S of the rear plug-in card can be dispersed and led out, thereby effectively reducing or eliminating the heat dissipation problem caused by heat conduction; in addition, the air channel belongs to a Z-shaped air channel, so that the air inlet quantity can be increased; furthermore, since the first baffle 61 and/or the second baffle 62 are/is further provided, not only the different heat devices 511, 522, 533 on the rear card can receive cold air, but also the heat generated by the different heat devices 511, 522, 533 can be blown away by different exhaust fans respectively, so that cascade connection can not be conducted; in addition, the fins on the fin-shaped radiator at the tail end of the air duct can be further arranged on the chip along the air flow direction (for example, the extending direction of the fins on the fin-shaped radiator and the side edge of the rear plug-in card form an angle of 45 degrees), so that the air flow of the radiator 53 at the last stage is smooth, and the special exhaust fan 31 can be used for blowing away the heat generated by the radiator 53, thereby effectively improving the heat dissipation efficiency.

In the technical scheme of the invention, another specific embodiment is also provided.

Third embodiment:

for example, fig. 11 is a right side view of a chassis of a communication device having a plurality of rear cards in accordance with a third embodiment of the present invention, with a side of the chassis removed. In this third embodiment, as shown in fig. 11, the rear cards 15 and 16 share the same slot space (i.e., are in the same slot). The rear card 15 has 3 exhaust fans 39, 40 and 41, and the rear card 16 has 3 exhaust fans 42, 43 and 44.

The wind flow of the wind inlet air duct 21 reaches the rear plug-in card 15 through the wind inlet side F of the rear plug-in card 16, the air duct 26 and the wind inlet side H of the rear plug-in card 15 respectively; the wind flow of the wind inlet air duct 21 also reaches the rear plug-in card 16 through the wind inlet side F of the rear plug-in card 16 and the air duct 27. The heat generated by the rear card 16 is blown out by the exhaust fans 42 to 44 from the panel side G of the rear card 16 to the duct outlet 72 without being conducted to the rear card 15. The heat generated by the rear card 15 is blown out to the duct outlet 71 by the exhaust fans 39 to 41 from the panel side B of the rear card 15.

In the third embodiment of the present invention, in order to better ensure that the heat is dissipated, a third flow baffle 63 may be provided on the rear card 15, and a fourth flow baffle 64 may be provided on the rear card 16.

The fourth baffle plate 64 can effectively prevent the cold air in the air inlet duct 21 from being directly pumped away by the exhaust fans 42-44 without passing through a chip needing heat dissipation; the third flow baffle 63 divides the air channels of the two rear cards 15 and 16, so that the exhaust fans 39 to 41 are only used for heat dissipation of the rear card 15, and the exhaust fans 42 to 44 are only used for heat dissipation of the rear card 16.

In addition, in one embodiment of the present invention, the exhaust fans 39-41 on the rear card 15 may be high speed exhaust fans so that sufficient airflow reaches the rear card 15 and is blown out by the exhaust fans 39-41 to the duct outlet 71.

In the third embodiment, the rear cards 15 and 16 are respectively provided with a heat device Y1 and Y2 composed of a heat sink and a chip.

On the rear card 15, one end of the third flow blocking plate 63 is adjacent to the thermal device Y1, and the other end extends to an angle between the side H of the rear card 15 and the side B of the panel, dividing the air channels of the two rear cards 15, 16, and making the exhaust fans 39 to 41 only used for heat dissipation of the rear card 15.

On the rear card 16, one end of the fourth flow baffle 64 is adjacent to the thermal device Y2, and the other end extends to an included angle between the side F of the rear card 16 and the side G of the panel, so that cold air entering the air channel 21 can be effectively prevented from being directly pumped away by the fans 42 to 44 without passing through the thermal device Y2.

In addition, in a specific embodiment of the present invention, the third flow blocking plate 63 and the fourth flow blocking plate 64 may be fixed to the rear plug-in cards 15 and 16 by a screw fixing method, or may be fixed to the rear plug-in cards 15 and 16 by other fixing methods such as a welding fixing method or a mortise and tenon fixing method.

Furthermore, in one embodiment of the present invention, the exhaust fans 39 to 41 and the exhaust fans 42 to 44 may employ fin-shaped heat sinks whose fins 531 are installed along the wind flow direction as shown in fig. 9.

The exhaust fans 39 to 41 and 42 to 44 may be the exhaust fans supporting hot plug, or may be fixed fans having a structure not hot plug.

In summary, in the technical scheme of the invention, because the exhaust fan is not installed at the back of the chassis, but is directly installed on the side edge of the rear panel of the rear plug-in card, the air outlet duct is not required to be arranged at the top of the chassis, and the used duct does not occupy extra space, so that effective heat dissipation can be ensured on the premise of not increasing the height of the chassis, and the chassis is more compact; meanwhile, because the exhaust fans are directly arranged on each rear plug-in card, the wind flow entering the rear plug-in card through the wind inlet channel and the side S of the rear plug-in card can be dispersed and led out, so that the heat dissipation problem caused by heat conduction can be effectively reduced or eliminated, and an independent fan frame is not required to be arranged at the rear part of the chassis independently, so that the plugging and unplugging of each rear plug-in card can not be influenced; in addition, the air channel belongs to a Z-shaped air channel, so that the air inlet quantity can be increased; furthermore, as the first flow baffle and/or the second flow baffle are/is also arranged, not only can different heat devices on the rear plug-in card receive cold air, but also the heat generated by different heat devices can be blown away through different exhaust fans, and the heat of each device is blown out by each exhaust fan in a dispersed manner, so that the heat cannot be conducted and cascaded, and the heat dissipation effect is better; in addition, the fins on the fin-shaped radiator at the tail end of the air duct can be further arranged on the chip along the air flow direction (for example, the extending direction of the fins on the fin-shaped radiator and the side edge of the rear plug-in card form an angle of 45 degrees), so that the air flow of the radiator at the last stage is smooth, and the heat generated by the radiator at the last stage can be blown away by using a special exhaust fan, so that the heat dissipation efficiency is effectively improved. In addition, when each exhaust fan is an exhaust fan supporting hot plug, each exhaust fan can be independently hot plug-in replaced, so that the risk of overheating of the rear plug-in card can be greatly reduced.

The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather to enable any modification, equivalent replacement, improvement or the like to be made within the spirit and principles of the invention.

Claims

1. A communication device having a plurality of rear cards, comprising: the novel multifunctional portable computer comprises a case, a middle card, a plurality of front plug-in cards and a plurality of rear plug-in cards, wherein the middle card is arranged in the middle of the case, the front plug-in cards are inserted on the front side plate surface of the middle card in a transverse insertion mode, and the rear plug-in cards are inserted on the rear side plate surface of the middle card in a vertical insertion mode, and the novel multifunctional portable computer is characterized in that:

at least 3 slot spaces which are arranged in parallel are arranged in the communication equipment with the plurality of rear plug-in cards;

wherein two first type rear plug-in cards in the plurality of rear plug-in cards occupy a slot space respectively, and two second type rear plug-in cards in the plurality of rear plug-in cards occupy the same slot space together; at least two thermal devices are arranged on each first type rear plug-in card, and one thermal device is arranged on each second type rear plug-in card;

three heat devices which are parallel to the side surface of the rear panel and are arranged up and down are arranged on the first type rear plug-in card, and the three heat devices are respectively a first heat device, a second heat device and a third heat device according to the position sequence from bottom to top; the first rear plug-in card is also provided with a first flow baffle plate positioned between the first heat device and the exhaust fan and a second flow baffle plate positioned between the third heat device and the exhaust fan; the initial end of the first flow baffle is positioned at an included angle between the air inlet side of the board card and the side edge of the rear panel, and the tail end of the first flow baffle is positioned between the second heat device and the exhaust fan; one end of the second flow baffle is abutted with one corner point of the third heat device, and the other end of the second flow baffle extends into a gap between two exhaust fans arranged at the uppermost side of the first rear plug-in card.

2. The communication device having a plurality of rear cards of claim 1, wherein:

the chassis air inlet is positioned in the middle of the lower side of the front plug-in card.

3. The communication device having a plurality of rear cards of claim 1, wherein:

the exhaust fan is an exhaust fan supporting hot plug.

4. A communication device having a plurality of rear plug-in cards as defined in claim 3, wherein said hot plug supporting exhaust fan comprises: the fan body, the fixing piece, the structural member sliding rail and the PCB daughter card;

the rear plug-in card is provided with: fan slot, board edge connector;

5. The communication device having a plurality of rear cards of claim 4, wherein:

the exhaust fan supporting hot plug is also provided with a self-locking structure for locking the fan body in the fan groove; the self-locking state of the exhaust fan can be relieved by pressing the self-locking structure, and the exhaust fan supporting hot plug is pulled out from the fan groove of the rear plug-in card.