CN220829698U - Radiating fin for main board - Google Patents
Radiating fin for main board Download PDFInfo
- Publication number
- CN220829698U CN220829698U CN202322541991.1U CN202322541991U CN220829698U CN 220829698 U CN220829698 U CN 220829698U CN 202322541991 U CN202322541991 U CN 202322541991U CN 220829698 U CN220829698 U CN 220829698U
- Authority
- CN
- China
- Prior art keywords
- heat
- radiating
- heat dissipation
- heat conducting
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 230000017525 heat dissipation Effects 0.000 claims description 44
- 230000005855 radiation Effects 0.000 claims description 23
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000000741 silica gel Substances 0.000 claims description 6
- 229910002027 silica gel Inorganic materials 0.000 claims description 6
- 230000013011 mating Effects 0.000 claims description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a radiating fin for a main board in the field of radiating fins, which comprises a radiating substrate and a plurality of radiating fins arranged at the top of the radiating substrate, wherein a plurality of radiating through grooves are formed in the side faces of the radiating fins, a heat conducting component is arranged at the bottom of the radiating substrate and comprises a heat conducting plate and a plurality of heat conducting strips, a mounting groove for matching the heat conducting plate and a strip-shaped fixing groove for matching the heat conducting strips are formed in the bottom of the radiating substrate, a plurality of radiating bulges extending outwards are formed in the bottom of the radiating substrate in an extruding mode, the radiating substrate and the radiating fins are integrally formed, and the radiating through grooves are formed in the side faces of the radiating fins, so that the radiating area of the radiating fins is enlarged, the contact between the radiating fins and air is facilitated, the heat conducting plate and the heat conducting strips are arranged, the heat conducting efficiency is enhanced, the heat residues of the main board are reduced, the heat conducting efficiency is improved, and the radiating efficiency is further improved.
Description
Technical Field
The utility model relates to the field of radiating fins, in particular to a radiating fin for a main board.
Background
When the server main board works, a large amount of heat is often generated, and the heat cannot be rapidly dissipated and is gathered to easily generate high temperature, so that faults or damages of working components are caused, therefore, the heat is generally dissipated through a fan and a passive radiator, and is limited by the space structural characteristics of the chassis, and the existing heat dissipation mode is to cool components by matching the passive radiator on the main board.
The radiating fins on the radiating fins of the main board in the prior art are generally arranged in a plane, the radiating area of the radiating fins is not large enough, the radiating effect of the radiating fins is poor, the quick and effective heat dissipation is not facilitated, and the existing radiating fins are lack of quick heat conduction materials when being abutted to the main board, so that the heat conduction efficiency of the radiating fins is not facilitated, the radiating efficiency of the main board is influenced, heat is still easy to remain on the main board, the heat conduction is uneven, and the heat dissipation of the main board is influenced.
Disclosure of utility model
The utility model aims to solve the defects and provide a radiating fin for a main board, so as to solve the technical problems of poor radiating efficiency and low heat conduction efficiency of the radiating fin in the prior art, which cause heat to be easy to remain.
The object of the utility model is achieved by:
The utility model provides a fin that mainboard was used, includes radiating basal plate and sets up in a plurality of heat radiation fins at radiating basal plate top, radiating fins's side is equipped with a plurality of heat dissipation logical grooves, radiating basal plate's surface is equipped with a plurality of mounting holes, radiating basal plate's bottom is equipped with heat conduction subassembly, heat conduction subassembly includes heat conduction plate and a plurality of heat conduction strip, radiating basal plate's bottom is equipped with the mounting groove that is used for mating heat conduction plate and is used for mating heat conduction strip's bar fixed slot, bar fixed slot extends along radiating basal plate's length direction, radiating basal plate's bottom is provided with a plurality of heat dissipation archs that extend to outside, the heat dissipation arch uses the heat conduction plate to set up as the axis symmetry, the heat dissipation arch extends along radiating basal plate's length direction.
In the above description, the heat dissipation through grooves are arranged on the side surfaces of the heat dissipation fins in an arc-shaped groove, and are distributed in an equidistant array along the direction that the heat dissipation fins extend to the top, and the heat dissipation through grooves distributed in an array increase the heat dissipation area, so that the heat dissipation efficiency of the heat dissipation fins is enhanced.
In the above description, one end of the heat conducting plate is embedded in the mounting groove and is abutted against the surface of the heat conducting strip, and the heat conducting plate is abutted against the main board, so that the heat conducting plate conducts heat and then is transferred onto the heat radiating substrate through the heat conducting strip with one end connected with the heat conducting strip in a low mode, the heat conducting effect can be achieved rapidly, and the heat residue of the main board is reduced.
In the above description, the mounting holes are distributed on the edge of the heat dissipation substrate, and the surface of the heat dissipation substrate is provided with conductive fixing holes.
In the above description, further, the bottom of radiating base plate is provided with the holding tank, and the holding tank intussuseption is filled with heat conduction silica gel, through the heat conduction silica gel reinforcing heat conduction efficiency who sets up.
In the above description, further, one side of the heat dissipation substrate is provided with a clamping protrusion, and the other side of the heat dissipation protrusion is provided with a positioning notch matched with the clamping protrusion, so that the two heat dissipation substrates can be conveniently spliced and installed, and the heat dissipation area of the heat dissipation substrate is enhanced.
The utility model has the beneficial effects that: the heat radiating substrate and the heat radiating fins are integrally extruded and formed, the heat radiating through grooves are formed in the side faces of the heat radiating fins, so that the heat radiating area of the heat radiating fins is enlarged, the heat radiating fins are in contact with air, heat is quickly radiated, the heat conducting efficiency is improved through the heat conducting plate and the heat conducting strip arranged at the bottom of the heat radiating substrate, heat is reduced, the heat is transferred to the heat radiating substrate through the heat conducting strip, the heat resistance between an electronic device and the heat radiating substrate is reduced, the heat conducting efficiency is improved, the heat radiating efficiency is further improved, the number of heat radiating elements can be increased through the heat radiating protrusions, and the heat radiating efficiency is further improved.
Drawings
FIG. 1 is a first perspective view of a heat sink for a motherboard according to the present utility model;
FIG. 2 is a second perspective view of a heat sink for a motherboard according to the present utility model;
FIG. 3 is a front view of a heat sink for a motherboard according to the present utility model;
The reference numerals in the drawings are respectively: the heat-dissipating structure comprises a 1-heat-dissipating substrate, 2-heat-dissipating fins, 3-heat-dissipating through grooves, 4-mounting holes, 5-heat-conducting plates, 6-heat-conducting strips, 7-strip-shaped fixing grooves, 8-heat-dissipating bulges, 9-fixing holes, 10-containing grooves, 11-clamping bulges, 12-positioning notches and 13-mounting grooves.
Detailed Description
The utility model is described in further detail below with reference to the drawings and the detailed description.
Referring to fig. 1-3, a heat sink for a motherboard specifically implemented by the present embodiment includes a heat dissipating substrate 1 and a plurality of heat dissipating fins 2 disposed at the top of the heat dissipating substrate 1, a plurality of heat dissipating through slots 3 are disposed on the side surfaces of the heat dissipating fins 2, a plurality of mounting holes 4 are disposed on the surface of the heat dissipating substrate 1, a heat conducting component is disposed at the bottom of the heat dissipating substrate 1, the heat conducting component includes a heat conducting plate 5 and a plurality of heat conducting strips 6, a mounting slot 13 for matching the heat conducting plate 5 and a strip-shaped fixing slot 7 for matching the heat conducting strips 6 are disposed at the bottom of the heat dissipating substrate 1, the strip-shaped fixing slot 7 extends along the length direction of the heat dissipating substrate 1, a plurality of heat dissipating protrusions 8 extending outwards are disposed at the bottom of the heat dissipating substrate 1, the heat dissipating protrusions 8 are symmetrically disposed with the heat conducting plate 5 as a central axis, and the heat dissipating protrusions 8 extend along the length direction of the heat dissipating substrate 1.
The heat dissipation through grooves 3 are arc grooves and are arranged on the side surfaces of the heat dissipation fins 2, the heat dissipation through grooves 3 are distributed in an equidistant array along the direction that the heat dissipation fins extend to the top, and the heat dissipation through grooves 3 distributed in an array increase the heat dissipation area, so that the heat dissipation efficiency of the heat dissipation fins 2 is enhanced. One end of the heat conducting plate 5 is embedded in the mounting groove 13 and is abutted with the surface of the heat conducting strip 6, and after heat conduction, the heat conducting plate 5 is abutted with the main board, and then is transferred onto the heat radiating substrate 1 through the heat conducting strip 6 with one end being connected with the lower part, so that the heat conducting effect can be rapidly achieved, and the heat residue of the main board is reduced. The mounting holes 4 are distributed at the edge of the heat dissipation substrate 1, and the surface of the heat dissipation substrate 1 is provided with conductive fixing holes 9. The bottom of radiating base plate 1 is provided with holding tank 10, and the holding tank 10 intussuseption is filled with heat conduction silica gel, strengthens heat conduction efficiency through the heat conduction silica gel that sets up. One side of the heat dissipation substrate 1 is provided with a clamping protrusion 11, and the other side of the heat dissipation protrusion 8 is provided with a positioning notch 12 matched with the clamping protrusion 11, so that the two heat dissipation substrates 1 can be conveniently spliced and installed, and the heat dissipation area of the heat dissipation substrate 1 is enhanced.
The heat radiation substrate 1 and the heat radiation fins 2 are integrally extruded and formed, the heat radiation through grooves 3 communicated along the length direction of the heat radiation fins 2 are arranged on the side surfaces of the heat radiation fins 2, so that the heat radiation area of the heat radiation fins 2 is enlarged, the heat radiation fins 2 are beneficial to contact with air, and heat is quickly radiated, the heat conduction plate 5 and the heat conduction strips 6 in the mounting grooves 13 and the strip-shaped fixing grooves 7 are embedded and mounted at the bottom of the heat radiation substrate 1, the heat conduction plate 5 and the heat conduction strips 6 are formed by heat conduction silica gel, the heat conduction efficiency is beneficial to being enhanced, the heat is reduced, the heat is transferred to the heat radiation substrate 1 through the heat conduction strips 6, the heat resistance between an electronic device and the heat radiation substrate 1 is reduced, the heat conduction efficiency is improved, the heat radiation efficiency is further increased, and the heat radiation protrusions 8 are arranged to increase the number of heat radiation elements, so that the heat radiation efficiency is enhanced.
The present utility model is not limited to the preferred embodiments, but is intended to be limited to the following description, and any modifications, equivalent changes and variations in light of the above-described embodiments will be apparent to those skilled in the art without departing from the scope of the present utility model.
Claims (6)
1. The utility model provides a fin that mainboard was used, includes radiating basal plate and sets up a plurality of fin at radiating basal plate top, its characterized in that: the side of heat radiation fin is equipped with a plurality of heat dissipation through grooves, the surface of heat radiation base plate is equipped with a plurality of mounting holes, the bottom of heat radiation base plate is equipped with heat conduction subassembly, heat conduction subassembly includes heat conduction board and a plurality of heat conduction strip, the bottom of heat radiation base plate is equipped with the mounting groove that is used for mating the heat conduction board and is used for mating the bar fixed slot of heat conduction strip, the bar fixed slot extends along the length direction of heat radiation base plate, the bottom of heat radiation base plate is provided with a plurality of heat dissipation archs that extend to outside, the heat dissipation arch uses the heat conduction board to set up as the axis symmetry, the heat dissipation arch extends along the length direction of heat radiation base plate.
2. A heat sink for a motherboard as recited in claim 1, wherein: the radiating through grooves are arranged on the side surfaces of the radiating fins in an arc-shaped groove mode, and are distributed in an equidistant array mode along the extending direction of the radiating fins to the top.
3. A heat sink for a motherboard as recited in claim 1, wherein: one end of the heat conducting plate is embedded in the mounting groove and is abutted against the surface of the heat conducting strip.
4. A heat sink for a motherboard according to any one of claims 1-3, characterized in that: the mounting holes are distributed at the edge of the heat dissipation substrate, and the surface of the heat dissipation substrate is provided with conducting fixing holes.
5. A heat sink for a motherboard according to any one of claims 1-3, characterized in that: the bottom of radiating base plate is provided with the holding tank, and the holding tank intussuseption is filled with heat conduction silica gel.
6. A heat sink for a motherboard according to any one of claims 1-3, characterized in that: one side of the heat dissipation substrate is provided with a clamping protrusion, and the other side of the heat dissipation protrusion is provided with a positioning notch matched with the clamping protrusion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322541991.1U CN220829698U (en) | 2023-09-18 | 2023-09-18 | Radiating fin for main board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322541991.1U CN220829698U (en) | 2023-09-18 | 2023-09-18 | Radiating fin for main board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220829698U true CN220829698U (en) | 2024-04-23 |
Family
ID=90727995
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322541991.1U Active CN220829698U (en) | 2023-09-18 | 2023-09-18 | Radiating fin for main board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220829698U (en) |
-
2023
- 2023-09-18 CN CN202322541991.1U patent/CN220829698U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |