CN111320870A - 一种耐磨聚酰亚胺薄膜及其制备方法 - Google Patents

一种耐磨聚酰亚胺薄膜及其制备方法 Download PDF

Info

Publication number
CN111320870A
CN111320870A CN202010220308.2A CN202010220308A CN111320870A CN 111320870 A CN111320870 A CN 111320870A CN 202010220308 A CN202010220308 A CN 202010220308A CN 111320870 A CN111320870 A CN 111320870A
Authority
CN
China
Prior art keywords
polyimide film
resistant polyimide
wear
film according
abrasion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010220308.2A
Other languages
English (en)
Inventor
方晓栋
宋丽英
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taihu Fangzhou New Material Technology Co ltd
Original Assignee
Taihu Fangzhou New Material Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taihu Fangzhou New Material Technology Co ltd filed Critical Taihu Fangzhou New Material Technology Co ltd
Priority to CN202010220308.2A priority Critical patent/CN111320870A/zh
Publication of CN111320870A publication Critical patent/CN111320870A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2427/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers
    • C08J2427/02—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment
    • C08J2427/12—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C08J2427/18—Homopolymers or copolymers of tetrafluoroethylene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/06—Pretreated ingredients and ingredients covered by the main groups C08K3/00 - C08K7/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
    • C08K2003/3009—Sulfides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/041—Carbon nanotubes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Abstract

本发明公开了一种耐磨聚酰亚胺薄膜的制备方法，包括如下步骤：在惰性气体氛围中，向芳香型二胺溶液中加入混合填料混匀，然后加入芳香型二酐，进行反应得到中间物料；取中间物料脱泡并涂布于基板表面，亚胺化，脱膜得到耐磨聚酰亚胺薄膜；其中，混合填料为二硫化钼、纳米聚四氟乙烯、改性碳纳米管、硅烷偶联剂。本发明还公开了一种耐磨聚酰亚胺薄膜，按照上述耐磨聚酰亚胺薄膜的制备方法制得。本发明具有良好的耐磨性能，且机械性能良好。

Description

一种耐磨聚酰亚胺薄膜及其制备方法
技术领域
本发明涉及聚酰亚胺薄膜技术领域，尤其涉及一种耐磨聚酰亚胺薄膜及其制备方法。
背景技术
聚酰亚胺是一类具有较高的热稳定性、良好的机械性能以及优异的电子性能的工程聚合物，这些优异的性能归因于聚酰亚胺基团和芳香族结构。同时，再特定的环境中，聚酰亚胺也具有良好的摩擦学特性。但是，随着时代的发展，聚酰亚胺的性能已不能满足人们的需求，且纯聚酰亚胺材料在摩擦磨损过程中具有摩擦系数大，磨损率高的缺点，这些缺点限制了聚酰亚胺在摩擦材料中的应用。
发明内容
基于背景技术存在的技术问题，本发明提出了一种耐磨聚酰亚胺薄膜及其制备方法，本发明具有良好的耐磨性能，且机械性能良好。
本发明提出的一种耐磨聚酰亚胺薄膜的制备方法，包括如下步骤：在惰性气体氛围中，向芳香型二胺溶液中加入混合填料混匀，然后加入芳香型二酐，进行反应得到中间物料；取中间物料脱泡并涂布于基板表面，亚胺化，脱膜得到耐磨聚酰亚胺薄膜；其中，混合填料为二硫化钼、纳米聚四氟乙烯、改性碳纳米管、硅烷偶联剂。
优选地，二硫化钼、纳米聚四氟乙烯、改性碳纳米管、硅烷偶联剂的重量比为2-4:0.4-0.6:1-2:0.05-0.07。
优选地，在耐磨聚酰亚胺薄膜中，混合填料的含量为10-15wt％。
优选地，改性碳纳米管为γ-氨丙基三乙氧基硅烷改性碳纳米管。
优选地，二硫化钼的粒径为1000-2000目。
优选地，芳香型二胺为4,4'-二氨基二苯醚、对苯二胺和4,4’-二氨基-2,2’-双三氟甲基苯。
优选地，4,4'-二氨基二苯醚、对苯二胺和4,4’-二氨基-2,2’-双三氟甲基苯的摩尔比为5-6:2.5-3.5:0.5-2.5。
优选地，芳香型二酐为3,3',4,4'-联苯四甲酸二酐和六氟二酐。
优选地，3,3',4,4'-联苯四甲酸二酐和六氟二酐的摩尔比为8-9:1-2。
优选地，反应温度为50-70℃，反应时间为5-6h。
优选地，亚胺化的程序为：分别于130-150℃、190-210℃、250-300℃保温30-40min，再于380-400℃保温1-2min。
优选地，中间物料的固含量为20-30wt％。
优选地，芳香型二胺溶液的溶剂为N,N-二甲基乙酰胺。
优选地，芳香型二胺和芳香型二酐的摩尔比为1:0.95-1.05。
本发明还提出了一种耐磨聚酰亚胺薄膜，按照上述耐磨聚酰亚胺薄膜的制备方法制得。
本发明通过选用合适的填料以适宜比例相互配合，使得本发明具有良好的耐磨性，并通过硅烷偶联剂均匀分散在中间物料中，避免了聚酰亚胺薄膜机械性能的降低；选用对苯二胺、4,4’-二氨基-2,2’-双三氟甲基苯与4,4'-二氨基二苯醚以适宜比例相互配合，可以调节聚酰亚胺的机械性能和耐磨性；并与适宜种类芳香型二酐进行反应，可以进一步增加本发明的机械性能和耐磨性；选用合适的亚胺化工艺可以进一步提高本发明的机械性能。
具体实施方式
下面，通过具体实施例对本发明的技术方案进行详细说明。
实施例1
一种耐磨聚酰亚胺薄膜的制备方法，包括如下步骤：在氮气气体氛围中，向芳香型二胺的N,N-二甲基乙酰胺溶液中加入混合填料混匀，然后加入芳香型二酐，于50℃反应6h，用N,N-二甲基乙酰胺溶液调节固含量为20wt％得到中间物料；取中间物料脱泡并涂布于基板表面，分别于150℃、210℃、300℃保温30min，再于400℃保温1min，脱膜得到耐磨聚酰亚胺薄膜；其中，混合填料为粒径为2000目的二硫化钼、纳米聚四氟乙烯、γ-氨丙基三乙氧基硅烷改性碳纳米管、硅烷偶联剂；
二硫化钼、纳米聚四氟乙烯、γ-氨丙基三乙氧基硅烷改性碳纳米管、硅烷偶联剂的重量比为2:0.6:1:0.07；
芳香型二胺为4,4'-二氨基二苯醚、对苯二胺和4,4’-二氨基-2,2’-双三氟甲基苯，其中，4,4'-二氨基二苯醚、对苯二胺和4,4’-二氨基-2,2’-双三氟甲基苯的摩尔比为6:3.5:0.5；
芳香型二酐为3,3',4,4'-联苯四甲酸二酐和六氟二酐，其中，3,3',4,4'-联苯四甲酸二酐和六氟二酐的摩尔比为8:2；
芳香型二胺和芳香型二酐的摩尔比为1:0.95。
实施例2
一种耐磨聚酰亚胺薄膜的制备方法，包括如下步骤：在氮气气体氛围中，向芳香型二胺的N,N-二甲基乙酰胺溶液中加入混合填料混匀，然后加入芳香型二酐，于70℃反应5h，用N,N-二甲基乙酰胺溶液调节固含量为30wt％得到中间物料；取中间物料脱泡并涂布于基板表面，分别于130℃、190℃、250℃保温40min，再于380℃保温2min，脱膜得到耐磨聚酰亚胺薄膜；其中，混合填料为粒径为1000目的二硫化钼、纳米聚四氟乙烯、γ-氨丙基三乙氧基硅烷改性碳纳米管、硅烷偶联剂；
二硫化钼、纳米聚四氟乙烯、γ-氨丙基三乙氧基硅烷改性碳纳米管、硅烷偶联剂的重量比为4:0.4:2:0.05；
芳香型二胺为4,4'-二氨基二苯醚、对苯二胺和4,4’-二氨基-2,2’-双三氟甲基苯，其中，4,4'-二氨基二苯醚、对苯二胺和4,4’-二氨基-2,2’-双三氟甲基苯的摩尔比为5:2.5:2.5；
芳香型二酐为3,3',4,4'-联苯四甲酸二酐和六氟二酐，其中，3,3',4,4'-联苯四甲酸二酐和六氟二酐的摩尔比为9:1；
芳香型二胺和芳香型二酐的摩尔比为1:1.05。
实施例3
一种耐磨聚酰亚胺薄膜的制备方法，包括如下步骤：在氮气气体氛围中，向芳香型二胺的N,N-二甲基乙酰胺溶液中加入混合填料混匀，然后加入芳香型二酐，于60℃反应5.5h，用N,N-二甲基乙酰胺溶液调节固含量为25wt％得到中间物料；取中间物料脱泡并涂布于基板表面，分别于140℃、200℃、275℃保温35min，再于390℃保温1min，脱膜得到耐磨聚酰亚胺薄膜；其中，混合填料为粒径为2000目的二硫化钼、纳米聚四氟乙烯、γ-氨丙基三乙氧基硅烷改性碳纳米管、硅烷偶联剂；
二硫化钼、纳米聚四氟乙烯、γ-氨丙基三乙氧基硅烷改性碳纳米管、硅烷偶联剂的重量比为3:0.5:1.5:0.06；
芳香型二胺为4,4'-二氨基二苯醚、对苯二胺和4,4’-二氨基-2,2’-双三氟甲基苯，其中，4,4'-二氨基二苯醚、对苯二胺和4,4’-二氨基-2,2’-双三氟甲基苯的摩尔比为6:3:1；
芳香型二酐为3,3',4,4'-联苯四甲酸二酐和六氟二酐，其中，3,3',4,4'-联苯四甲酸二酐和六氟二酐的摩尔比为8.5:1.5；
芳香型二胺和芳香型二酐的摩尔比为1:1。
对比例1
无混合填料，其他同实施例3。
对比例2
无混合填料，芳香型二胺为4,4'-二氨基二苯醚，芳香型二酐为3,3',4,4'-联苯四甲酸二酐，其他同实施例3。
检测实施例1-3和对比例1-2制得的聚酰亚胺薄膜的性能，结果如下表所示：
性能 拉伸强度MPa 模量GPa 摩擦系数
实施例1 211 2.9 0.225
实施例2 203 2.8 0.231
实施例3 230 3.0 0.220
对比例1 232 3.0 0.391
对比例2 142 2.1 0.405
由上表可以看出，本发明具有良好的耐磨性，且同时具有良好的机械性能。
以上所述，仅为本发明较佳的具体实施方式，但本发明的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本发明揭露的技术范围内，根据本发明的技术方案及其发明构思加以等同替换或改变，都应涵盖在本发明的保护范围之内。

Claims (10)

1.一种耐磨聚酰亚胺薄膜的制备方法，其特征在于，包括如下步骤：在惰性气体氛围中，向芳香型二胺溶液中加入混合填料混匀，然后加入芳香型二酐，进行反应得到中间物料；取中间物料脱泡并涂布于基板表面，亚胺化，脱膜得到耐磨聚酰亚胺薄膜；其中，混合填料为二硫化钼、纳米聚四氟乙烯、改性碳纳米管、硅烷偶联剂。
2.根据权利要求1所述耐磨聚酰亚胺薄膜的制备方法，其特征在于，二硫化钼、纳米聚四氟乙烯、改性碳纳米管、硅烷偶联剂的重量比为2-4:0.4-0.6:1-2:0.05-0.07。
3.根据权利要求1或2所述耐磨聚酰亚胺薄膜的制备方法，其特征在于，在耐磨聚酰亚胺薄膜中，混合填料的含量为10-15wt％。
4.根据权利要求1-3任一项所述耐磨聚酰亚胺薄膜的制备方法，其特征在于，改性碳纳米管为γ-氨丙基三乙氧基硅烷改性碳纳米管；优选地，二硫化钼的粒径为1000-2000目。
5.根据权利要求1-4任一项所述耐磨聚酰亚胺薄膜的制备方法，其特征在于，芳香型二胺为4,4'-二氨基二苯醚、对苯二胺和4,4’-二氨基-2,2’-双三氟甲基苯；优选地，4,4'-二氨基二苯醚、对苯二胺和4,4’-二氨基-2,2’-双三氟甲基苯的摩尔比为5-6:2.5-3.5:0.5-2.5。
6.根据权利要求1-5任一项所述耐磨聚酰亚胺薄膜的制备方法，其特征在于，芳香型二酐为3,3',4,4'-联苯四甲酸二酐和六氟二酐；优选地，3,3',4,4'-联苯四甲酸二酐和六氟二酐的摩尔比为8-9:1-2。
7.根据权利要求1-6任一项所述耐磨聚酰亚胺薄膜的制备方法，其特征在于，反应温度为50-70℃，反应时间为5-6h。
8.根据权利要求1-7任一项所述耐磨聚酰亚胺薄膜的制备方法，其特征在于，亚胺化的程序为：分别于130-150℃、190-210℃、250-300℃保温30-40min，再于380-400℃保温1-2min。
9.根据权利要求1-8任一项所述耐磨聚酰亚胺薄膜的制备方法，其特征在于，中间物料的固含量为20-30wt％；优选地，芳香型二胺溶液的溶剂为N,N-二甲基乙酰胺；优选地，芳香型二胺和芳香型二酐的摩尔比为1:0.95-1.05。
10.一种耐磨聚酰亚胺薄膜，其特征在于，按照权利要求1-9任一项所述耐磨聚酰亚胺薄膜的制备方法制得。
CN202010220308.2A 2020-03-25 2020-03-25 一种耐磨聚酰亚胺薄膜及其制备方法 Pending CN111320870A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010220308.2A CN111320870A (zh) 2020-03-25 2020-03-25 一种耐磨聚酰亚胺薄膜及其制备方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010220308.2A CN111320870A (zh) 2020-03-25 2020-03-25 一种耐磨聚酰亚胺薄膜及其制备方法

Publications (1)

Publication Number Publication Date
CN111320870A true CN111320870A (zh) 2020-06-23

Family

ID=71171767

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010220308.2A Pending CN111320870A (zh) 2020-03-25 2020-03-25 一种耐磨聚酰亚胺薄膜及其制备方法

Country Status (1)

Country Link
CN (1) CN111320870A (zh)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4338426A (en) * 1980-08-27 1982-07-06 Hitachi Chemical Company, Ltd. Intermediate, copolymer resin and production thereof
JP2003012885A (ja) * 2001-04-24 2003-01-15 Ntn Corp 耐摩耗性フッ素樹脂組成物およびコーティング膜、ならびに定着装置用シームレスパイプ
CN1772812A (zh) * 2005-11-17 2006-05-17 复旦大学 一种增强增韧耐磨的聚酰亚胺复合材料
CN101768500A (zh) * 2009-12-30 2010-07-07 山东久隆高分子材料有限公司 一种水性固体润滑剂
CN109722025A (zh) * 2018-12-28 2019-05-07 珠海万通特种工程塑料有限公司 一种聚芳醚砜复合材料及其应用
CN109897376A (zh) * 2019-03-01 2019-06-18 中国科学院兰州化学物理研究所 一种聚酰亚胺复合材料及其制备方法
CN110423466A (zh) * 2019-09-03 2019-11-08 西南科技大学 一种多壁碳纳米管/聚酰亚胺高润滑复合材料及其制备方法
CN110894292A (zh) * 2019-10-31 2020-03-20 安徽国风塑业股份有限公司 一种荧光型聚酰亚胺薄膜及其制备方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4338426A (en) * 1980-08-27 1982-07-06 Hitachi Chemical Company, Ltd. Intermediate, copolymer resin and production thereof
JP2003012885A (ja) * 2001-04-24 2003-01-15 Ntn Corp 耐摩耗性フッ素樹脂組成物およびコーティング膜、ならびに定着装置用シームレスパイプ
CN1772812A (zh) * 2005-11-17 2006-05-17 复旦大学 一种增强增韧耐磨的聚酰亚胺复合材料
CN101768500A (zh) * 2009-12-30 2010-07-07 山东久隆高分子材料有限公司 一种水性固体润滑剂
CN109722025A (zh) * 2018-12-28 2019-05-07 珠海万通特种工程塑料有限公司 一种聚芳醚砜复合材料及其应用
CN109897376A (zh) * 2019-03-01 2019-06-18 中国科学院兰州化学物理研究所 一种聚酰亚胺复合材料及其制备方法
CN110423466A (zh) * 2019-09-03 2019-11-08 西南科技大学 一种多壁碳纳米管/聚酰亚胺高润滑复合材料及其制备方法
CN110894292A (zh) * 2019-10-31 2020-03-20 安徽国风塑业股份有限公司 一种荧光型聚酰亚胺薄膜及其制备方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
周先辉著: "《自润滑复合材料与高效重载滑动螺旋副》", 31 December 2015, 华中科技大学出版社 *

Similar Documents

Publication Publication Date Title
US4759987A (en) Polyimide powder and process for producing the same
CN107189436B (zh) 一种聚酰亚胺纳米泡沫及其制备方法
US20070155949A1 (en) Thermally stable composite material
US20050164002A1 (en) Polymeric particles
CN111333839B (zh) 一种含呋喃环的聚酰亚胺树脂及其制备方法
CN111748113A (zh) 一种耐热低介电常数聚酰亚胺薄膜及其制备方法
US20070154717A1 (en) Thermally stable composite material
CN115058037A (zh) 一种纳米蒙脱土/聚酰亚胺复合膜及制备方法
CN111635525A (zh) 一种低介电常数疏水聚酰亚胺薄膜及其制备方法
CN114854083A (zh) 一种超轻、疏水聚酰亚胺气凝胶及其制备方法和应用
CN114479076A (zh) 一种低介电聚酰亚胺薄膜及其制备方法、应用
JPH0267320A (ja) ２，２―ビス（アミノフェニル）ヘキサフルオロプロパンから誘導したコポリイミド
CN111320870A (zh) 一种耐磨聚酰亚胺薄膜及其制备方法
CN112646179B (zh) 一种低介电聚酰亚胺薄膜及其制备方法
CN113845674A (zh) 一种具有低膨胀系数的聚酰亚胺薄膜及制备方法
CN115044204B (zh) 一种低介电全有机交联聚酰亚胺薄膜的制备方法
CN111423583A (zh) 一种引入呋喃结构的聚酰亚胺树脂及其制备方法
CN114015090B (zh) 一种低热膨胀系数聚酰亚胺薄膜的制备方法
CN114230791B (zh) 本征型低介电含氟聚酰亚胺薄膜及其制备方法
CN114479074B (zh) 一种耐高温透明聚酰亚胺薄膜及其制备方法、应用
TW202330725A (zh) 聚醯亞胺膜
CN113121857A (zh) 一种低介电性聚酰亚胺薄膜及其制备方法
KR101912459B1 (ko) 폴리이미드 나노복합체, 그 제조방법 및 이를 포함하는 복합막
US5025089A (en) Copolyimides derived from 2,2-bis (amino phenyl) hexafluoropropane
CN110252160A (zh) 含3d花状碳材料的混合基质气体分离膜材料及制备方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20200623

RJ01 Rejection of invention patent application after publication