CN111270232A - 一种双面多层单侧铝基板加工工艺 - Google Patents
一种双面多层单侧铝基板加工工艺 Download PDFInfo
- Publication number
- CN111270232A CN111270232A CN202010160958.2A CN202010160958A CN111270232A CN 111270232 A CN111270232 A CN 111270232A CN 202010160958 A CN202010160958 A CN 202010160958A CN 111270232 A CN111270232 A CN 111270232A
- Authority
- CN
- China
- Prior art keywords
- plate
- aluminum
- copper
- temperature
- oxidation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 80
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 80
- 239000000758 substrate Substances 0.000 title claims abstract description 20
- 238000003754 machining Methods 0.000 title description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 61
- 229910052802 copper Inorganic materials 0.000 claims abstract description 61
- 239000010949 copper Substances 0.000 claims abstract description 61
- 238000010438 heat treatment Methods 0.000 claims abstract description 36
- 230000003647 oxidation Effects 0.000 claims abstract description 35
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 35
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims abstract description 18
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims abstract description 18
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 18
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 18
- 239000011651 chromium Substances 0.000 claims abstract description 18
- 238000001816 cooling Methods 0.000 claims abstract description 18
- 229910052717 sulfur Inorganic materials 0.000 claims abstract description 18
- 239000011593 sulfur Substances 0.000 claims abstract description 18
- 239000011135 tin Substances 0.000 claims abstract description 18
- 229910052718 tin Inorganic materials 0.000 claims abstract description 18
- 239000011701 zinc Substances 0.000 claims abstract description 18
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 18
- 239000002131 composite material Substances 0.000 claims abstract description 17
- 238000001125 extrusion Methods 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 16
- 238000006087 Brown hydroboration reaction Methods 0.000 claims abstract description 15
- WPPDFTBPZNZZRP-UHFFFAOYSA-N aluminum copper Chemical compound [Al].[Cu] WPPDFTBPZNZZRP-UHFFFAOYSA-N 0.000 claims abstract description 15
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000005751 Copper oxide Substances 0.000 claims abstract description 10
- 229910000431 copper oxide Inorganic materials 0.000 claims abstract description 10
- 238000005516 engineering process Methods 0.000 claims abstract description 8
- 238000007781 pre-processing Methods 0.000 claims abstract description 3
- 238000007789 sealing Methods 0.000 claims abstract description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 57
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 46
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 33
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 30
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 20
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 20
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims description 18
- 239000008367 deionised water Substances 0.000 claims description 18
- 229910021641 deionized water Inorganic materials 0.000 claims description 18
- VWDWKYIASSYTQR-UHFFFAOYSA-N sodium nitrate Chemical compound [Na+].[O-][N+]([O-])=O VWDWKYIASSYTQR-UHFFFAOYSA-N 0.000 claims description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 18
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 16
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 13
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 claims description 12
- -1 ethylene glycol glucoside Chemical class 0.000 claims description 10
- 229930182478 glucoside Natural products 0.000 claims description 10
- 239000011780 sodium chloride Substances 0.000 claims description 9
- 239000004317 sodium nitrate Substances 0.000 claims description 9
- 235000010344 sodium nitrate Nutrition 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 8
- 229910052799 carbon Inorganic materials 0.000 claims description 8
- 238000002844 melting Methods 0.000 claims description 8
- 230000008018 melting Effects 0.000 claims description 8
- 238000005498 polishing Methods 0.000 claims description 8
- 238000002791 soaking Methods 0.000 claims description 8
- 238000005406 washing Methods 0.000 claims description 8
- 229910017053 inorganic salt Inorganic materials 0.000 claims description 6
- 150000001282 organosilanes Chemical class 0.000 claims description 6
- AQRLNPVMDITEJU-UHFFFAOYSA-N triethylsilane Chemical compound CC[SiH](CC)CC AQRLNPVMDITEJU-UHFFFAOYSA-N 0.000 claims description 6
- 239000003792 electrolyte Substances 0.000 claims description 4
- QGBMSFLTRRZTGI-UHFFFAOYSA-N ethyl(dimethyl)silane Chemical compound CC[SiH](C)C QGBMSFLTRRZTGI-UHFFFAOYSA-N 0.000 claims description 4
- PQDJYEQOELDLCP-UHFFFAOYSA-N trimethylsilane Chemical compound C[SiH](C)C PQDJYEQOELDLCP-UHFFFAOYSA-N 0.000 claims description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 230000007797 corrosion Effects 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 claims description 3
- JQZUMFHYRULBEN-UHFFFAOYSA-N diethyl(methyl)silicon Chemical compound CC[Si](C)CC JQZUMFHYRULBEN-UHFFFAOYSA-N 0.000 claims description 3
- IDGUHHHQCWSQLU-UHFFFAOYSA-N ethanol;hydrate Chemical compound O.CCO IDGUHHHQCWSQLU-UHFFFAOYSA-N 0.000 claims description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 2
- 229910002651 NO3 Inorganic materials 0.000 claims description 2
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 claims description 2
- 244000137852 Petrea volubilis Species 0.000 claims description 2
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims description 2
- 239000003112 inhibitor Substances 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims description 2
- 238000007743 anodising Methods 0.000 claims 1
- 239000002905 metal composite material Substances 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 30
- 230000000052 comparative effect Effects 0.000 description 8
- 239000008151 electrolyte solution Substances 0.000 description 6
- 238000009423 ventilation Methods 0.000 description 6
- 239000007864 aqueous solution Substances 0.000 description 5
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 description 2
- 229910018565 CuAl Inorganic materials 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000001103 potassium chloride Substances 0.000 description 1
- 235000011164 potassium chloride Nutrition 0.000 description 1
- 239000004323 potassium nitrate Substances 0.000 description 1
- 235000010333 potassium nitrate Nutrition 0.000 description 1
- OTYBMLCTZGSZBG-UHFFFAOYSA-L potassium sulfate Chemical compound [K+].[K+].[O-]S([O-])(=O)=O OTYBMLCTZGSZBG-UHFFFAOYSA-L 0.000 description 1
- 229910052939 potassium sulfate Inorganic materials 0.000 description 1
- 235000011151 potassium sulphates Nutrition 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
- C23C22/52—Treatment of copper or alloys based thereon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C29/00—Cooling or heating work or parts of the extrusion press; Gas treatment of work
- B21C29/003—Cooling or heating of work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C31/00—Control devices, e.g. for regulating the pressing speed or temperature of metal; Measuring devices, e.g. for temperature of metal, combined with or specially adapted for use in connection with extrusion presses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C37/00—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape
- B21C37/02—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape of sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D19/00—Casting in, on, or around objects which form part of the product
- B22D19/08—Casting in, on, or around objects which form part of the product for building-up linings or coverings, e.g. of anti-frictional metal
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/06—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used
- C25D11/08—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used containing inorganic acids
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/06—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used
- C25D11/10—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used containing organic acids
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/18—After-treatment, e.g. pore-sealing
- C25D11/24—Chemical after-treatment
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Cell Electrode Carriers And Collectors (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- ing And Chemical Polishing (AREA)
Abstract
本发明公开了一种双面多层单侧铝基板加工工艺,涉及金属复合板加工工艺,具体包括铜板和铝板预处理;棕氧化液配制和铜板的棕氧化、阳极氧化,氧化时间为50‑60min,氧化结束后扩孔,最后封孔;在铝层和铜层之间加入锡、锌、铬和硫制备出的辅助层压薄板;经过两步加热法进行加热,首先加热至450‑480℃,恒温30‑50min;再继续加热至520‑550℃,恒温30‑50min,冷却至400‑450℃,挤压速率为2mm/min进行挤压,挤压后再250‑270℃恒温12h,冷却至常温即可得到单侧铝基板的铝铜复合板材。本发明能够改善铜板和铝板交接层的力学性能以及铜氧化物层的均一性。
Description
技术领域
本发明涉及铝板加工技术领域,具体是一种双面多层单侧铝基板加工工艺。
背景技术
铝铜复合材料板是将铝板和铜板制备成一体板的复合材料。铝铜复合材料板因为有铜和铝两种金属,相比于单一铜板,具有密度小、成本低,来源广泛的优点,相比于单一铝板,导电性能更高、导热性能更高、耐腐蚀性能更强。目前铝铜复合材料板在电器、电力、电子、机械及能源等领域具有很大的应用潜力。
现有铝铜复合材料板中铝铜复合层氧含量较高,铝铜结合面结晶间隙大,晶体间间隙多且间隙空间较大,导致铝铜复合层力学性能较差;现有铜板棕氧化工艺中,随着氧化过程进行,溶液pH值提升幅度较大,容易导致铜板表面氧化物孔径和密度均一性较差;
发明内容
本发明的目的在于提供一种,以解决上述背景技术中提出的问题。
为实现上述目的,本发明提供如下技术方案:一种双面多层单侧铝基板加工工艺,所述铝基板加工工艺包括如下步骤:
步骤一、铜板和铝板预处理;
步骤二、棕氧化液配制:采用硫酸、醋酸、柠檬酸、过氧化氢、有机硅烷、乙二醇葡糖苷、可溶性无机盐、甲基苯磺酸、去离子水、复配缓蚀剂、甲基苯磺酸和乙醇中配置成棕氧化液;对铜片做棕氧化处理,在铜片表面覆盖上生成铜氧化层;
步骤三、采用质量分数为4-7%的浓硫酸溶液作为阳极氧化电解液,以铝板为阳极,以碳板为阴极进行阳极氧化,氧化时间为50-60min,氧化结束后扩孔,最后封孔;
步骤四、在铝层和铜层之间加入锡、锌、铬和硫制备出的辅助层压薄板;经过两步加热法进行加热,首先加热至450-480℃,恒温30-50min;再继续加热至520-550℃,恒温30-50min,冷却至400-450℃,挤压速率为2mm/min 进行挤压,挤压后再250-270℃恒温12h,冷却至常温即可得到单侧铝基板的铝铜复合板材。
作为本发明的一种优选技术方案,所述步骤一中预处理具体包括:
S1、砂纸打磨铝板去除氧化铝层;
S2、采用pH值为2-3的稀硫酸溶液浸泡铝板和铜板;
S3、采用去离子水冲洗铝板和铜板。
作为本发明的一种优选技术方案,所述步骤二中各质量分数组分依次为 3-7%硫酸、0.8-1.2%醋酸、0.2-0.4%柠檬酸、4-10%过氧化氢、0.2-0.4%有机硅烷、1.3-2.2%乙二醇葡糖苷、0.02-0.05%无机盐、0.02-0.04%甲基苯磺酸和40-50%乙醇,剩余为去离子水。
作为本发明的一种优选技术方案,所述有机硅烷为三甲基硅烷、三乙基硅烷、二甲基乙基硅烷、二乙基甲基硅烷中的一种。
作为本发明的一种优选技术方案,所述所述无机盐为可溶性氯化物、可溶性硝酸盐、可溶性硫酸盐中的一种。
作为本发明的一种优选技术方案,所述所述阳极氧化电解液中还包括质量分数为1.3-2.4%的氯化钠、质量分数为2.2-3.6%的硝酸钠、质量分数为 2.3-3.5%的柠檬酸。
作为本发明的一种优选技术方案,所述步骤三中电流密度为2.5-3.9A,扩孔溶液为采用pH值为3.5-4.5的磷酸溶液,温度为38-44℃,扩孔30-45min;闭孔操作为将扩孔后的阳极氧化铝板放入80-90℃的质量分数为30-40%的乙醇水溶液中。
作为本发明的一种优选技术方案,所述步骤四中辅助层压薄板由锡、锌、铬和硫按照质量比为10-14:1.5-2:2.4-4.6:0.4-0.8熔融制备成厚度为3-5mm 的薄板。
与现有技术相比,本发明的有益效果是:
本发明在铜板和铝板热压处理工艺中通过锡、锌、铬和硫按照质量比为 10-14:1.5-2:2.4-4.6:0.4-0.8熔融物,能够降低铜铝结晶承重CuAl晶粒粒径、晶粒间间隙以及晶粒的分散均匀性,进而提高铜板和铝板交接层的力学性能,本发明中通过在棕氧化液中添加醋酸和柠檬酸,对硫酸起到缓冲作用,使得棕氧化液的pH值变化较为缓慢,使得铜氧化物层孔径和密度均均匀。
具体实施方式
实施例一
砂纸打磨铝板去除氧化铝层;采用pH值为2-3的稀硫酸溶液浸泡铝板和铜板;采用去离子水冲洗铝板和铜板3-5次,然后将铜板和铝板于通风处晾干;配置质量分数组分依次为3%硫酸、0.8%醋酸、0.2%柠檬酸、4%过氧化氢、 0.2%三甲基硅烷、1.3%乙二醇葡糖苷、0.02%氯化钠、0.02-0.04%甲基苯磺酸和40-50%乙醇,剩余为去离子水;对铜片做棕氧化处理,在铜片表面覆盖上生成铜氧化层;配置采用质量分数组分依次为4%浓硫酸、1.3%氯化钠、2.2%硝酸钠、质量分数为2.3%柠檬酸溶液作为阳极氧化电解液,以铝板为阳极,以碳板为阴极进行阳极氧化,电流密度为2.5A,氧化时间为50min;扩孔溶液为采用pH值为3.5的磷酸溶液,温度为38℃,扩孔30min;闭孔操作为将扩孔后的阳极氧化铝板放入80℃的质量分数为30%的乙醇水溶液中氧化结束后扩孔,最后封孔;
由锡、锌、铬和硫按照质量比为10:1.5:2.4:0.4熔融制备成厚度为 3-5mm的薄板,在铝层和铜层之间加入锡、锌、铬和硫制备出的辅助层压薄板;经过两步加热法进行加热,首先加热至450℃,恒温30min;再继续加热至 520℃,恒温30min,冷却至400℃,挤压速率为2mm/min进行挤压,挤压后再250℃恒温12h,冷却至常温即可得到单侧铝基板的铝铜复合板材。
实施例二
砂纸打磨铝板去除氧化铝层;采用pH值为2-3的稀硫酸溶液浸泡铝板和铜板;采用去离子水冲洗铝板和铜板3-5次,然后将铜板和铝板于通风处晾干;配置质量分数组分依次为7%硫酸、1.2%醋酸、0.4%柠檬酸、10%过氧化氢、 0.4%三乙基硅烷、2.2%乙二醇葡糖苷、0.05%硝酸钠、0.04%甲基苯磺酸和50%乙醇,剩余为去离子水;对铜片做棕氧化处理,在铜片表面覆盖上生成铜氧化层;配置采用质量分数组分依次为7%浓硫酸、2.4%氯化钠、3.6%硝酸钠、质量分数为3.5%柠檬酸溶液作为阳极氧化电解液,以铝板为阳极,以碳板为阴极进行阳极氧化,电流密度为3.9A,氧化时间为60min;扩孔溶液为采用 pH值为3.5-4.5的磷酸溶液,温度为44℃,扩孔45min;闭孔操作为将扩孔后的阳极氧化铝板放入90℃的质量分数为40%的乙醇水溶液中氧化结束后扩孔,最后封孔;
由锡、锌、铬和硫按照质量比为14:2:4.6:0.8熔融制备成厚度为5mm 的薄板,在铝层和铜层之间加入锡、锌、铬和硫制备出的辅助层压薄板;经过两步加热法进行加热,首先加热至480℃,恒温50min;再继续加热至550℃,恒温50min,冷却至450℃,挤压速率为2mm/min进行挤压,挤压后再270℃恒温12h,冷却至常温即可得到单侧铝基板的铝铜复合板材。
实施例三
砂纸打磨铝板去除氧化铝层;采用pH值为2-3的稀硫酸溶液浸泡铝板和铜板;采用去离子水冲洗铝板和铜板3-5次,然后将铜板和铝板于通风处晾干;配置质量分数组分依次为4%硫酸、0.9%醋酸、0.3%柠檬酸、5%过氧化氢、 0.3%二甲基乙基硅烷、1.5%乙二醇葡糖苷、0.03%硫酸钠、0.025%甲基苯磺酸和42%乙醇,剩余为去离子水;对铜片做棕氧化处理,在铜片表面覆盖上生成铜氧化层;配置采用质量分数组分依次为6%浓硫酸、1.5%氯化钠、2.5%硝酸钠、质量分数为2.7%柠檬酸溶液作为阳极氧化电解液,以铝板为阳极,以碳板为阴极进行阳极氧化,电流密度为2.7A,氧化时间为55min;扩孔溶液为采用pH值为3.7的磷酸溶液,温度为40℃,扩孔43min;闭孔操作为将扩孔后的阳极氧化铝板放入82℃的质量分数为32%的乙醇水溶液中氧化结束后扩孔,最后封孔;
由锡、锌、铬和硫按照质量比为11:1.6:2.6:0.5熔融制备成厚度为 3-5mm的薄板,在铝层和铜层之间加入锡、锌、铬和硫制备出的辅助层压薄板;经过两步加热法进行加热,首先加热至460℃,恒温40min;再继续加热至 530℃,恒温40min,冷却至410℃,挤压速率为2mm/min进行挤压,挤压后再260℃恒温12h,冷却至常温即可得到单侧铝基板的铝铜复合板材。
实施例四
砂纸打磨铝板去除氧化铝层;采用pH值为2-3的稀硫酸溶液浸泡铝板和铜板;采用去离子水冲洗铝板和铜板3-5次,然后将铜板和铝板于通风处晾干;配置质量分数组分依次为5%硫酸、1.0%醋酸、0.3%柠檬酸、5%过氧化氢、0.3%二乙基甲基硅烷、1.4%乙二醇葡糖苷、0.03%氯化钾、0.025%甲基苯磺酸和42%乙醇,剩余为去离子水;对铜片做棕氧化处理,在铜片表面覆盖上生成铜氧化层;配置采用质量分数组分依次为6%浓硫酸、1.5%氯化钠、2.4%硝酸钠、质量分数为2.5%柠檬酸溶液作为阳极氧化电解液,以铝板为阳极,以碳板为阴极进行阳极氧化,电流密度为2.9A,氧化时间为55min;扩孔溶液为采用pH值为4.0的磷酸溶液,温度为40℃,扩孔33min;闭孔操作为将扩孔后的阳极氧化铝板放入86℃的质量分数为35%的乙醇水溶液中氧化结束后扩孔,最后封孔;
由锡、锌、铬和硫按照质量比为13:1.8:4.5:0.6熔融制备成厚度为 3-5mm的薄板,在铝层和铜层之间加入锡、锌、铬和硫制备出的辅助层压薄板;经过两步加热法进行加热,首先加热至470℃,恒温45min;再继续加热至 540℃,恒温45min,冷却至440℃,挤压速率为2mm/min进行挤压,挤压后再255℃恒温12h,冷却至常温即可得到单侧铝基板的铝铜复合板材。
实施例五
砂纸打磨铝板去除氧化铝层;采用pH值为2-3的稀硫酸溶液浸泡铝板和铜板;采用去离子水冲洗铝板和铜板3-5次,然后将铜板和铝板于通风处晾干;配置质量分数组分依次为6%硫酸、1.1%醋酸、0.3%柠檬酸、9%过氧化氢、 0.35%三甲基硅烷、1.7%乙二醇葡糖苷、0.04%硝酸钾、0.035%甲基苯磺酸和 48%乙醇,剩余为去离子水;对铜片做棕氧化处理,在铜片表面覆盖上生成铜氧化层;配置采用质量分数组分依次为6%浓硫酸、2.2%氯化钠、3.3%硝酸钠、质量分数为3.3%柠檬酸溶液作为阳极氧化电解液,以铝板为阳极,以碳板为阴极进行阳极氧化,电流密度为3.4A,氧化时间为58min;扩孔溶液为采用 pH值为4.3的磷酸溶液,温度为43℃,扩孔42min;闭孔操作为将扩孔后的阳极氧化铝板放入80-90℃的质量分数为38%的乙醇水溶液中氧化结束后扩孔,最后封孔;
由锡、锌、铬和硫按照质量比为13:1.8:4.5:0.7熔融制备成厚度为 3-5mm的薄板,在铝层和铜层之间加入锡、锌、铬和硫制备出的辅助层压薄板;经过两步加热法进行加热,首先加热至470℃,恒温35min;再继续加热至 540℃,恒温45min,冷却至440℃,挤压速率为2mm/min进行挤压,挤压后再260℃恒温12h,冷却至常温即可得到单侧铝基板的铝铜复合板材。
实施例六
砂纸打磨铝板去除氧化铝层;采用pH值为2-3的稀硫酸溶液浸泡铝板和铜板;采用去离子水冲洗铝板和铜板3-5次,然后将铜板和铝板于通风处晾干;配置质量分数组分依次为6%硫酸、1.1%醋酸、0.3%柠檬酸、9%过氧化氢、 0.3%二甲基乙基硅烷、2.1%乙二醇葡糖苷、0.04%硫酸钾、0.04%甲基苯磺酸和45%乙醇,剩余为去离子水;对铜片做棕氧化处理,在铜片表面覆盖上生成铜氧化层;配置采用质量分数组分依次为6%浓硫酸、2.2%氯化钠、3.5%硝酸钠、质量分数为3.4%柠檬酸溶液作为阳极氧化电解液,以铝板为阳极,以碳板为阴极进行阳极氧化,电流密度为3.5A,氧化时间为58min;扩孔溶液为采用pH值为4.4的磷酸溶液,温度为42℃,扩孔44min;闭孔操作为将扩孔后的阳极氧化铝板放入88℃的质量分数为38%的乙醇水溶液中氧化结束后扩孔,最后封孔;
由锡、锌、铬和硫按照质量比为14:1.8:4.4:0.7熔融制备成厚度为 3-5mm的薄板,在铝层和铜层之间加入锡、锌、铬和硫制备出的辅助层压薄板;经过两步加热法进行加热,首先加热至470℃,恒温45min;再继续加热至 540℃,恒温45min,冷却至440℃,挤压速率为2mm/min进行挤压,挤压后再260℃恒温12h,冷却至常温即可得到单侧铝基板的铝铜复合板材。
采用拉伸机拉伸实施例一、实施例二、实施例三、实施例四、实施例五和实施例六进行拉伸,拉伸速率为2mm/min,测量实施例一、实施例二、实施例三、实施例四、实施例五和实施例六的抗拉伸强度和伸长率;选用市面上现有的两款铜/铝复合板作为对比例一和对比例二,在同样的仪器和条件下测量对比例一和对比例二的抗拉伸强度和伸长率。观察实施例一、实施例二、实施例三、实施例四、实施例五、实施例六、对比例一和对比例二的膜的完整情况和厚度,结果如下表所示。由下表可知,实施例一、实施例二、实施例三、实施例四、实施例五和实施例六力学性能明显优于对比例一和对比例二,而且阳极氧化铝膜和氧化铜膜的厚度均一程度也优于对比例一和对比例二。
对于本领域技术人员而言,显然本发明不限于上述示范性实施例的细节,而且在不背离本发明的精神或基本特征的情况下,能够以其他的具体形式实现本发明。因此,无论从哪一点来看,均应将实施例看作是示范性的,而且是非限制性的,本发明的范围由所附权利要求而不是上述说明限定,因此旨在将落在权利要求的等同要件的含义和范围内的所有变化囊括在本发明内。
Claims (8)
1.一种双面多层单侧铝基板加工工艺,其特征在于,所述铝基板加工工艺包括如下步骤:
步骤一、铜板和铝板预处理;
步骤二、棕氧化液配制:采用硫酸、醋酸、柠檬酸、过氧化氢、有机硅烷、乙二醇葡糖苷、可溶性无机盐、甲基苯磺酸、去离子水、复配缓蚀剂、甲基苯磺酸和乙醇中配置成棕氧化液;对铜片做棕氧化处理,在铜片表面覆盖上生成铜氧化层;
步骤三、采用质量分数为4-7%的浓硫酸溶液作为阳极氧化电解液,以铝板为阳极,以碳板为阴极进行阳极氧化,氧化时间为50-60min,氧化结束后扩孔,最后封孔;
步骤四、在铝层和铜层之间加入锡、锌、铬和硫制备出的辅助层压薄板;经过两步加热法进行加热,首先加热至450-480℃,恒温30-50min;再继续加热至520-550℃,恒温30-50min,冷却至400-450℃,挤压速率为2mm/min进行挤压,挤压后再250-270℃恒温12h,冷却至常温即可得到单侧铝基板的铝铜复合板材。
2.根据权利要求1所述的一种双面多层单侧铝基板加工工艺,其特征在于,所述步骤一中预处理具体包括:
S1、砂纸打磨铝板去除氧化铝层;
S2、采用pH值为2-3的稀硫酸溶液浸泡铝板和铜板;
S3、采用去离子水冲洗铝板和铜板。
3.根据权利要求1所述的一种双面多层单侧铝基板加工工艺,其特征在于,所述步骤二中各质量分数组分依次为3-7%硫酸、0.8-1.2%醋酸、0.2-0.4%柠檬酸、4-10%过氧化氢、0.2-0.4%有机硅烷、1.3-2.2%乙二醇葡糖苷、0.02-0.05%无机盐、0.02-0.04%甲基苯磺酸、和40-50%乙醇,剩余为去离子水。
4.根据权利要求3所述的一种双面多层单侧铝基板加工工艺,其特征在于,所述有机硅烷为三甲基硅烷、三乙基硅烷、二甲基乙基硅烷、二乙基甲基硅烷中的一种。
5.根据权利要求3所述的一种双面多层单侧铝基板加工工艺,其特征在于,所述无机盐为可溶性氯化物、可溶性硝酸盐、可溶性硫酸盐中的一种。
6.根据权利要求1所述的一种双面多层单侧铝基板加工工艺,其特征在于,所述阳极氧化电解液中还包括质量分数为1.3-2.4%的氯化钠、质量分数为2.2-3.6%的硝酸钠、质量分数为2.3-3.5%的柠檬酸。
7.根据权利要求1所述的一种双面多层单侧铝基板加工工艺,其特征在于,所述步骤三中电流密度为2.5-3.9A,扩孔溶液为采用pH值为3.5-4.5的磷酸溶液,温度为38-44℃,扩孔30-45min;闭孔操作为将扩孔后的阳极氧化铝板放入80-90℃的质量分数为30-40%的乙醇水溶液中。
8.根据权利要求2所述的一种双面多层单侧铝基板加工工艺,其特征在于,所述步骤四中辅助层压薄板由锡、锌、铬和硫按照质量比为10-14:1.5-2:2.4-4.6:0.4-0.8熔融制备成厚度为3-5mm的薄板。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010160958.2A CN111270232B (zh) | 2020-03-10 | 2020-03-10 | 一种双面多层单侧铝基板加工工艺 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010160958.2A CN111270232B (zh) | 2020-03-10 | 2020-03-10 | 一种双面多层单侧铝基板加工工艺 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN111270232A true CN111270232A (zh) | 2020-06-12 |
CN111270232B CN111270232B (zh) | 2022-02-11 |
Family
ID=71004173
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010160958.2A Active CN111270232B (zh) | 2020-03-10 | 2020-03-10 | 一种双面多层单侧铝基板加工工艺 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN111270232B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114700479A (zh) * | 2022-04-24 | 2022-07-05 | 连云港中彩科技有限公司 | 一种连续铸造半熔态轧制的铜铝复合板带及其生产工艺 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007036102A (ja) * | 2005-07-29 | 2007-02-08 | Showa Denko Kk | 銅張積層板およびその製造方法 |
CN200980202Y (zh) * | 2006-12-05 | 2007-11-21 | 邵建良 | 金属基覆铜箔层压板 |
CN103009701A (zh) * | 2012-12-04 | 2013-04-03 | 湖南湘投金天钛金属有限公司 | 铝铜复合板及其制备方法 |
CN109290371A (zh) * | 2018-11-08 | 2019-02-01 | 瓯锟科技温州有限公司 | 一种铜铝复合板带的冷轧制造方法 |
CN110273148A (zh) * | 2019-07-25 | 2019-09-24 | 华侨大学 | 一种含离子液体的复配棕化液及其制备方法 |
CN110505770A (zh) * | 2019-09-26 | 2019-11-26 | 恩达电路(深圳)有限公司 | 多层夹芯金属基电路板生产方法 |
-
2020
- 2020-03-10 CN CN202010160958.2A patent/CN111270232B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007036102A (ja) * | 2005-07-29 | 2007-02-08 | Showa Denko Kk | 銅張積層板およびその製造方法 |
CN200980202Y (zh) * | 2006-12-05 | 2007-11-21 | 邵建良 | 金属基覆铜箔层压板 |
CN103009701A (zh) * | 2012-12-04 | 2013-04-03 | 湖南湘投金天钛金属有限公司 | 铝铜复合板及其制备方法 |
CN109290371A (zh) * | 2018-11-08 | 2019-02-01 | 瓯锟科技温州有限公司 | 一种铜铝复合板带的冷轧制造方法 |
CN110273148A (zh) * | 2019-07-25 | 2019-09-24 | 华侨大学 | 一种含离子液体的复配棕化液及其制备方法 |
CN110505770A (zh) * | 2019-09-26 | 2019-11-26 | 恩达电路(深圳)有限公司 | 多层夹芯金属基电路板生产方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114700479A (zh) * | 2022-04-24 | 2022-07-05 | 连云港中彩科技有限公司 | 一种连续铸造半熔态轧制的铜铝复合板带及其生产工艺 |
Also Published As
Publication number | Publication date |
---|---|
CN111270232B (zh) | 2022-02-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP7302046B2 (ja) | 超薄型銅箔とその作製方法 | |
CN106670235B (zh) | 一种铜铝复合板带的生产方法、铜铝复合板带 | |
CN106498467A (zh) | 一种可稳定剥离的超薄载体铜箔的制备方法 | |
JP6975782B2 (ja) | 二次電池用電解銅箔及びその製造方法 | |
JP2013108146A (ja) | 集電体用アルミニウム合金箔およびその製造方法 | |
CN111270232B (zh) | 一种双面多层单侧铝基板加工工艺 | |
JP5441945B2 (ja) | ベリーロープロファイル銅箔を担体とした極く薄い銅箔及びその製法。 | |
CN111826645A (zh) | 一种电路板内层铜箔棕化液 | |
CN103692165A (zh) | 太阳能用铝合金框架的制作方法 | |
CN110721999B (zh) | 一种添加镍栅层的铜铝复合板带及其连续生产方法 | |
JP2022008857A (ja) | 二次電池用電解銅箔及びその製造方法 | |
CN111349807A (zh) | 一种镀铜石墨膜增强铜基层压块体复合材料及其制备方法 | |
CN110656297B (zh) | 一种基于黄铜带制备高导电多孔铜箔的方法 | |
CN102168215A (zh) | 铝合金板及其制造方法 | |
CN107699930A (zh) | 一种复合多元纳米合金作为剥离层的载体超薄铜箔及其制备方法 | |
CN112853456B (zh) | 一种高压高比容腐蚀箔的制造方法 | |
CN110340174B (zh) | 一种电容器用钽铝复合板带的生产方法 | |
CN109234771A (zh) | 一种超薄热板吸液芯的制备方法 | |
CN106449890B (zh) | 一种太阳能光伏焊带的制备方法 | |
CN110014718B (zh) | 一种将镓基热界面材料应用于铝基底增强界面传热的方法 | |
CN112779574B (zh) | 一种增强电子铜箔导电性的电镀液、制备方法及电镀工艺 | |
CN106567110A (zh) | 一种低共熔溶剂电沉积铬锰合金镀层的方法 | |
CN116043287A (zh) | 一种生产高强度高耐热电解铜箔的添加剂及方法 | |
CN115029755B (zh) | 一种铝合金阳极氧化膜锂盐分级封孔处理方法 | |
CN111690963A (zh) | 一种制备高导热性能的铜/石墨/铜叠层复合材料的方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20220124 Address after: 215300 No. 31, middle private road, high tech Industrial Park, Kunshan Development Zone, Kunshan City, Suzhou City, Jiangsu Province Applicant after: Hongqiao metal products (Kunshan) Co.,Ltd. Address before: 611732 No. 18, Shuxin East Road, Pitong Town, Pixian County, Chengdu, Sichuan Applicant before: Zhang Zhuqiong |
|
GR01 | Patent grant | ||
GR01 | Patent grant |