CN111250878A - Four-axis laser cutting and punching machine for machining wire-drawing die and punching method - Google Patents
Four-axis laser cutting and punching machine for machining wire-drawing die and punching method Download PDFInfo
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- CN111250878A CN111250878A CN202010236259.1A CN202010236259A CN111250878A CN 111250878 A CN111250878 A CN 111250878A CN 202010236259 A CN202010236259 A CN 202010236259A CN 111250878 A CN111250878 A CN 111250878A
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
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Abstract
The invention discloses a punching method of a four-axis laser cutting and punching machine for machining a wire-drawing die, which comprises a frame, a motion system, an imaging focusing system, a laser and a control driving system, wherein the frame is provided with a plurality of guide rails; a four-axis offset rotary table is arranged on the X-axis translation table and is fixedly provided with a rotary table; the rotating table is used for fixing the self-centering chuck machining clamp along the direction of the rotating shaft; measuring the thickness d and the height h of the die to be processed; installing and positioning a die to be processed; setting parameters of a workpiece to be processed, wherein the parameters comprise thickness, sizing, segmented processing proportion and angle; processing the die to be processed by adopting an angle-section processing mode; the invention has the advantages of improving the angle accuracy of the die to be processed and the straightness and smoothness of the inner wall and improving the processing efficiency of the large-hole wire drawing die.
Description
Technical Field
The invention relates to the field of punching of a laser wire-drawing die, in particular to a four-axis laser cutting punching machine and a punching method for machining the wire-drawing die.
Background
Laser machining of wire drawing dies generally employs a high frequency, narrow pulse width laser beam. Each pulse has a higher energy density, but the total energy is not large. This allows the material of the micro-area to be reliably vaporized in a moment, leaving a micro-pit on the mold. In the laser processing process, a numerical control scanning method is often adopted, a large number of micro pits are connected into one piece, and finally, a three-dimensional hole pattern is obtained.
For a wire drawing die, the hole pattern generally comprises an inlet area, a lubricating area, a compressing area, a sizing area, an inverted cone area and an outlet area, laser is generally used for machining the hole pattern of the die, the traditional laser punching mode is a profile forming method, the laser punching method is a laser punching method which is frequently adopted at present, a workpiece is focused on the surface of the die through a laser beam, a translation table rotates along a Z axis at a certain rotating speed, the laser beam scans from the center to the edge of the die along the radial direction, the scanning track is an Archimedes spiral line, after one layer of material is removed, the focal distance of the laser is reduced by a certain distance, the scanning radius is reduced to a corresponding length, and the laser removes the other layer of material until the whole thickness of the material.
Due to the influence of factors such as laser frequency, rotary speed of the rotary table, X horizontal moving speed and the like, ideal uniform removal is difficult to achieve by laser removal. Especially if a mode of fixing the laser frequency is adopted, the machining shape of the central concave is inevitably caused by the change factor of the linear velocity along with the radius. Finally, the inner wall angle of the wire-drawing die to be synthesized often has larger deviation with a set value, the straightness of the inner wall is poorer, convex and concave conditions occur, and because the inner wall angle is removed layer by layer, the edge of the wire-drawing die is inevitably provided with step traces, so that great influence is brought to the finish degree.
Disclosure of Invention
The invention aims to: aiming at the existing problems, the four-axis laser cutting and punching machine and the punching method for machining the wire-drawing die are provided, so that the ablation condition and the machining of each layer can be avoided in the laser machining process, the irregular shape can be avoided, the condition that the center of the die to be machined is excessively removed can not be caused, and the angle accuracy of the die to be machined and the straightness and smoothness of the inner wall can be improved.
The technical scheme adopted by the invention is as follows:
a four-axis laser cutting and punching machine for machining a wire-drawing die comprises a frame, a moving system, an imaging focusing system, a laser and a control driving system; the motion system comprises an X-axis translation stage, a Y-axis translation stage and a Z-axis translation stage; the Y-axis translation table is fixedly arranged on the surface of the rack; an X-axis translation table is fixedly arranged on the Y-axis translation table; the Z-axis translation stage is arranged above the X-axis translation stage and is fixed on a side frame of the rack; the imaging focusing system is fixed on the Z-axis translation stage and is characterized in that: a four-axis offset rotary table is arranged on the X-axis translation table and is fixedly provided with a rotary table; and the rotating table is used for fixing the self-centering chuck machining clamp along the direction of the rotating shaft.
Further, the inclination angle of the imaging focusing system is 0-10 degrees.
Furthermore, the deflection angle of the deflection platform is 0-70 degrees.
The invention also provides a punching method of the four-axis laser cutting punching machine for machining the wire-drawing die, wherein the punching method of the four-axis laser cutting punching machine comprises the following steps:
A. measuring the thickness d and the height h of the die to be processed;
B. installing and positioning a die to be processed;
C. setting parameters of a workpiece to be processed, wherein the parameters comprise thickness, sizing, three-section processing proportion and angle;
D. processing the die to be processed by adopting an angle-section processing mode;
E. and polishing the processed die to be processed by adopting low-power laser, wherein the power range of the low-power laser is less than 50W.
Further, the specific operation method of the processing mode corresponding to each angle in the angle-segmented processing modes in step D includes:
(1) the four-axis deflection table deflects a half angle along a vertical axis according to a set angle;
(2) the imaging focusing system is lifted to the height required to process the die to be processed through the Z-axis translation table;
(3) the rotating table rotates, and meanwhile, the X-axis moving table axially moves along the width direction;
(4) and the Z-axis motion table drives the imaging focusing system to cut the die to be processed.
Still further, it is characterized in that: the specific operation method in the step B includes:
(1) putting the front side of a die to be processed into a machine chuck upwards and locking the die;
(2) and (4) enabling the rotation center of the die to be processed and the upper surface of the die to be processed to coincide with the laser focus of the machine.
The invention also provides a punching method of the four-axis laser cutting punching machine for machining the wire-drawing die, wherein the punching method of the four-axis laser cutting punching machine comprises the following steps:
A. measuring the thickness d and the height h of the die to be processed;
B. installing and positioning a die to be processed;
C. cutting and reserving the column in an eccentric processing mode;
D. cutting the die to be processed by adopting an angle-section processing mode;
E. and polishing the processed die to be processed by adopting low-power laser, wherein the power range of the low-power laser is less than 50W.
Furthermore, the specific operation method of the eccentric processing mode in the step C includes:
(1) setting an eccentric distance through the diameter of the sizing area, wherein the eccentric distance refers to the radius of a post cut after the post is cut;
(2) and the laser beam emitted by the imaging focusing system processes the die to be processed according to the set eccentric distance.
Furthermore, the included angle of the laser beams is 3-10 degrees.
Furthermore, in the method for cutting the remained column in the step C, the angle of the remained column is 3-10 degrees.
The post angle refers to the angle of the extended angle of the two oblique sides of the section of the cut post in the method for cutting the post.
Further, the specific operation method in step B includes:
(1) putting the front side of a die to be processed into a machine chuck upwards and locking the die;
(2) and (4) enabling the rotation center of the die to be processed and the upper surface of the die to be processed to coincide with the laser focus of the machine.
Further, the specific operation method of the processing mode corresponding to each angle in the angle-segmented processing modes in step D includes:
(1) the four-axis deflection table deflects a half angle along a vertical axis according to a set angle;
(2) the imaging focusing system is lifted to the height required to process the die to be processed through the Z-axis translation table;
(3) the rotating table rotates, and meanwhile, the X-axis moving table axially moves along the width direction;
(4) and the Z-axis motion table drives the imaging focusing system to cut the die to be processed.
In summary, due to the adoption of the technical scheme, the invention has the beneficial effects that:
1. by adopting the four-axis laser cutting and punching machine and the punching method for machining the wire-drawing die, provided by the invention, the accuracy of the angle of the die to be machined and the straightness of the inner wall are improved by adding the four-axis deflection table on the laser cutting and punching machine;
2. by adopting the four-axis laser cutting and punching machine and the punching method for machining the wire-drawing die, which are provided by the invention, the finish degree of the inner wall of the die to be machined is improved by performing secondary fine machining on the inner wall of the die to be machined by using low-power laser;
3. by adopting the four-axis laser cutting and punching machine and the punching method for machining the wire-drawing die, provided by the invention, the die to be machined is machined by adopting a post-remaining cutting method, so that the machining amount of a common machining method is effectively reduced, and meanwhile, the situation of repeatedly machining the machined area is avoided;
4. by adopting the four-axis laser cutting and punching machine and the punching method for machining the wire-drawing die, which are provided by the invention, the imaging focusing system is inclined by an angle of 0-10 degrees, so that the influence on laser machining due to the change of angles of different layer areas of a die to be machined is reduced, and the high verticality of a vertical hole pattern of the laser machining is realized;
5. by adopting the four-axis laser cutting and perforating machine and the perforating method for machining the wire-drawing die, which are provided by the invention, the machining efficiency of machining the large-hole wire-drawing die is improved by adding the four-axis deflection table and machining the die to be machined by adopting a method of cutting and retaining the post.
The invention will now be described, by way of example, with reference to the accompanying drawings, in which:
FIG. 1 is a main view of a four-axis laser cutting punch
FIG. 2 is a side view of a four-axis laser-cut punch
FIG. 3 is a schematic diagram of the mold to be processed after adjusting the position
FIG. 4 is a schematic view of a first angled section cut
FIG. 5 is a second angle segment cutting schematic
FIG. 6 is a schematic view of the final angular segment processing
FIG. 7 is a schematic diagram illustrating the variation of the hole pattern of the mold to be processed
Detailed Description
All of the features disclosed in this specification, or all of the steps in any method or process so disclosed, may be combined in any combination, except combinations of features and/or steps that are mutually exclusive.
Any feature disclosed in this specification (including any accompanying claims, abstract) may be replaced by alternative features serving equivalent or similar purposes, unless expressly stated otherwise. That is, unless expressly stated otherwise, each feature is only an example of a generic series of equivalent or similar features.
Implementation scheme one
The embodiment discloses a four-axis laser cutting and punching machine for machining a wire-drawing die, which comprises a frame 1, a moving system, an imaging focusing system 4, a laser 5 and a control driving system 6, as shown in fig. 1 and 2; the frame 1 is made of granite or marble; the motion system comprises an X-axis translation table 2.1, a Y-axis translation table 2.2 and a Z-axis translation table 2.3, and all the translation tables are ball screw translation tables or linear motor translation tables; the Y-axis translation table 2.2 is fixedly arranged on the surface of the rack 1; an X-axis translation table 2.1 is fixedly arranged on the Y-axis translation table 2.2; the Z-axis translation stage 2.3 is arranged above the X-axis translation stage 2.1 and is fixed on a side frame of the rack 1; the imaging focusing system 4 is fixed on the Z-axis translation stage 2.3, and the imaging focusing system 4 moves up and down along with the Z-axis translation stage 2.3 to drive the focal point of the laser to move in the Z direction; a four-axis deflection table 2.4 is arranged on the X-axis translation table 2.1, a rotating table 3.1 is fixedly arranged on the four-axis deflection table 2.4, and a rotating shaft of the rotating table 3.1 can pass through the deflection angle of the four-axis deflection table 2.4 and is used for coaxially inclining the workpiece; the rotary table 3 is fixed with a self-centering chuck 3.2 processing clamp 3.5 along the direction of a rotating shaft, the rotary table 3 drives a processing mould 3.5 to rotate at a high speed, the rotary table is one of core processing parts of a system, the highest rotating speed of the rotary table is 3000r/min, the radial run-out is less than 1 mu m, and the rotary table is a high-precision mechanical bearing rotary table 3 or an air floatation rotary table 3; the inclination angle of the imaging focusing system 4 is 0-10 degrees, the imaging focusing system is intentionally inclined by 0-70 degrees, the influence on laser processing caused by the angle change of different layer areas of a workpiece can be reduced, and the precision of the angle of the die to be processed and the straightness and smoothness of the inner wall are improved by matching with a laser frequency conversion technology and a laser power conversion technology.
Example II
The embodiment discloses a punching method of a four-axis laser cutting punching machine for machining a wire drawing die on the basis of an embodiment I, and the punching method of the four-axis laser cutting punching machine comprises the following steps:
A. measuring the thickness d and the height h of the die to be processed;
B. installing and positioning a die to be processed, wherein the specific operation steps comprise that the die to be processed is placed into a machine chuck in an upward mode from the front side and locked, the rotating center and the upper surface of the die to be processed are overlapped with a laser focus of a machine, the position where the die to be processed is placed is as shown in figure 3, and the position of the die to be processed is adjusted by controlling a driving system;
C. setting parameters of a workpiece to be machined, wherein the parameters comprise thickness, sizing, sectional machining proportion and angle, and setting the parameters required to be applied in the machining process, wherein the sectional machining proportion refers to different proportions for machining different areas of the same hole pattern, and the proportion parameters of each section are required to be set together;
D. the method comprises the steps that an angle-division section processing mode is adopted to process a die to be processed, because in the process of processing the die to be processed, the processing angles required by different regions corresponding to the same hole pattern are different, when each region is processed, different angles need to be adjusted to process, and the die to be processed can be processed into a wire drawing die with the required hole pattern;
E. and polishing the processed die to be processed by adopting low-power laser, wherein the power range of the low-power laser is less than 50W, and impurities generated in the process of cutting the die to be processed for the first time are mainly removed, so that the inner wall of the die to be processed is smoother and tidier under the action of the low-power laser.
Because the hole patterns after machining are divided into regions of entrance, lubrication, compression, sizing, back taper and exit for each machined wire-drawing die, the angles of the laser beams corresponding to the machining in each region are different, and the machined shapes are also different, different angle section machining needs to be carried out on each region, wherein the operation steps of the specific machining of the angle section comprise:
(1) the four-axis deflection table deflects a half angle along a vertical axis according to a set angle;
(2) the imaging focusing system is lifted to the height required to process the die to be processed through the Z-axis translation table;
(3) the rotating table rotates, and meanwhile, the X-axis moving table axially moves along the width direction; wherein, the width refers to the distance of the hole-shaped edge moving to the center and is controlled by controlling the driving system;
(4) and the Z-axis motion table drives the imaging focusing system to cut the die to be processed, and the hole pattern after cutting is an annular hole pattern.
As shown in fig. 4 to 6, the first angle section to the third angle section are schematic diagrams for processing the dies to be processed respectively, and it can be seen from the diagrams that for the processing of the hole patterns in different regions, the corresponding to the to-be-processed angle is different, so that the finally cut hole patterns are also different in each region.
Example III
The embodiment discloses a punching method of a four-axis laser cutting punching machine for machining a wire drawing die on the basis of an embodiment I, and the punching method of the four-axis laser cutting punching machine comprises the following steps:
A. measuring the thickness d and the height h of the die to be processed;
B. installing and positioning a die to be processed: putting the front side of the die to be processed into a machine chuck upwards and locking the die to be processed, and enabling the rotation center and the upper surface of the die to be processed to coincide with the laser focus of a machine;
C. through eccentric processing mode, carry out the cutting and stay the post, wherein the concrete operating procedure that the post was stayed in the cutting includes: the eccentric distance is set through the diameter of the sizing area, wherein the eccentric distance refers to the radius of a post cut by a cut stay post, the center of the cut circle is consistent with that of the sizing area of a machined hole pattern, a laser beam emitted by an imaging focusing system processes a die to be machined according to the set eccentric distance, the laser beam has a certain included angle when the stay post is cut, and the machining angle close to one side of the edge of the hole pattern is not used for shielding laser when the stay post is cut, wherein the included angle of the laser beam is 3-10 degrees, the step mainly comprises the step of cutting the stay post in the middle of the hole pattern to be machined of the die to be machined, most of the center of a material is removed in a cutting mode, and for a large hole, the machining time is saved in the processing mode; the angle of the stay is 3-10 degrees, and the stay angle refers to the angle of the extended included angle of the cut stay along two bevel edges of the section in the method for cutting the stay.
D. Adopting a sub-angle section processing mode to cut the to-be-processed die: the four-axis deflection table deflects a half angle along a vertical axis according to a set angle; the imaging focusing system is lifted to the height required to process the die to be processed through the Z-axis translation table; the rotating table rotates, and meanwhile, the X-axis moving table axially moves along the width direction; the Z-axis motion table drives the imaging focusing system to cut the die to be processed;
E. adopt miniwatt laser to polish the mould of treating after processing, the power scope of miniwatt laser is for being less than 50W, mainly gets rid of and cuts the produced impurity of processing mould at the first time, impels the inner wall of treating the processing mould under miniwatt laser's effect, and the inner wall becomes more smooth, clean and tidy.
As shown in fig. 7, the hole pattern structure is a cross-sectional view of an integral hole pattern structure processed by a post-remaining cutting method, and it can be seen from the figure that the post-remaining cutting method firstly cuts a central cylinder of a hole pattern to be processed, then processes the hole pattern in a divided angle section manner by a general method, and after the first cutting of the hole pattern is completed, processes the hole pattern of the die to be processed by a second low-power laser for the second time, and removes some impurities left after the first processing of the die.
In summary, the four-axis laser cutting and punching machine and the punching method for machining the wire-drawing die disclosed by the invention have the advantages that the angle of the die to be machined reaches the requirement of 0.1 degree by adding the four-axis inclined rotary table on the laser cutting and punching machine and combining the punching method of the cutting stay column and adding the four-axis inclined rotary table on the laser cutting and punching machine, so that the precision of the angle of the die to be machined and the straightness of the inner wall are improved; the finish degree of the inner wall of the die to be processed is improved by adopting low-power laser for secondary fine processing of the die to be processed; and the to-be-processed die is processed by adopting a reserved column cutting method, so that the processing amount of a common processing method is effectively reduced, the situation of repeatedly processing the processed region is avoided, the efficiency of processing the large hole is greatly improved, the imaging focusing system is inclined by an angle of 0-10 degrees, the influence on laser processing due to the change of angles of different regions of the to-be-processed die is reduced, and the high verticality of laser is realized.
The invention is not limited to the foregoing embodiments. The invention extends to any novel feature or any novel combination of features disclosed in this specification and any novel method or process steps or any novel combination of features disclosed.
Claims (12)
1. A four-axis laser cutting and punching machine for machining a wire-drawing die comprises a frame, a moving system, an imaging focusing system, a laser and a control driving system; the motion system comprises an X-axis translation stage, a Y-axis translation stage and a Z-axis translation stage; the Y-axis translation table is fixedly arranged on the surface of the rack; an X-axis translation table is fixedly arranged on the Y-axis translation table; the Z-axis translation stage is arranged above the X-axis translation stage and is fixed on a side frame of the rack; the imaging focusing system is fixed on the Z-axis translation stage and is characterized in that: a four-axis offset rotary table is arranged on the X-axis translation table and is fixedly provided with a rotary table; and the rotating table is used for fixing the self-centering chuck machining clamp along the direction of the rotating shaft.
2. The four-axis laser cutting punch for die processing according to claim 1, wherein: the inclination angle of the imaging focusing system is 0-10 degrees.
3. The four-axis laser-cutting punch for wire-drawing die machining according to claim 1 or 2, characterized in that: the deflection angle of the deflection platform is 0-70 degrees.
4. The punching method of the four-axis laser cutting punch for wire-drawing die processing according to claim 1 or 2, wherein: the punching method of the four-axis laser cutting punching machine comprises the following steps:
A. measuring the thickness d and the height h of the die to be processed;
B. installing and positioning a die to be processed;
C. setting parameters of a workpiece to be processed, wherein the parameters comprise thickness, sizing, sectional processing proportion and angle;
D. processing the die to be processed by adopting an angle-section processing mode;
E. and polishing the processed die to be processed by adopting low-power laser, wherein the power range of the low-power laser is less than 50W.
5. The punching method of the four-axis laser cutting punch for wire-drawing die processing according to claim 4, wherein: the specific operation method of the processing mode corresponding to each angle in the angle-segmented processing modes in the step D includes:
(1) the four-axis deflection table deflects a half angle along a vertical axis according to a set angle;
(2) the imaging focusing system is lifted to the height required to process the die to be processed through the Z-axis translation table;
(3) the rotating table rotates, and meanwhile, the X-axis moving table axially moves along the width direction;
(4) and the Z-axis motion table drives the imaging focusing system to cut the die to be processed.
6. The punching method of the four-axis laser cutting punch for wire-drawing die processing according to claim 5, wherein: the specific operation method in the step B includes:
(1) putting the front side of a die to be processed into a machine chuck upwards and locking the die;
(2) and (4) enabling the rotation center of the die to be processed and the upper surface of the die to be processed to coincide with the laser focus of the machine.
7. The punching method of the four-axis laser cutting punch for wire-drawing die processing according to claim 1 or 2, wherein: the punching method of the four-axis laser cutting punching machine comprises the following steps:
A. measuring the thickness d and the height h of the die to be processed;
B. installing and positioning a die to be processed;
C. cutting and reserving the column in an eccentric processing mode;
D. cutting the die to be processed by adopting an angle-section processing mode;
E. and polishing the processed die to be processed by adopting low-power laser, wherein the power range of the low-power laser is less than 50W.
8. The punching method of the four-axis laser cutting punch for wire-drawing die processing according to claim 7, wherein: the specific operation method in the step B includes:
(1) putting the front side of a die to be processed into a machine chuck upwards and locking the die;
(2) and (4) enabling the rotation center of the die to be processed and the upper surface of the die to be processed to coincide with the laser focus of the machine.
9. The punching method of the four-axis laser cutting punch for wire-drawing die processing according to claim 7, wherein: the specific operation method of the eccentric processing mode in the step C comprises the following steps:
(1) setting an eccentric distance by the diameter of the sizing zone;
(2) and the laser beam emitted by the imaging focusing system processes the die to be processed according to the set eccentric distance.
10. The punching method of the four-axis laser cutting punch for wire-drawing die processing according to claim 9, wherein: the included angle of the laser beams is 3-10 degrees.
11. The punching method of the four-axis laser cutting punch for wire-drawing die processing according to claim 7, wherein: in the method for cutting the remained column in the step C, the angle of the remained column is 3-10 degrees.
12. The punching method of the four-axis laser cutting punch for wire-drawing die processing according to claim 7, wherein: the specific operation method of the processing mode corresponding to each angle in the angle-segmented processing modes in the step D includes:
(1) the four-axis deflection table deflects a half angle along a vertical axis according to a set angle;
(2) the imaging focusing system is lifted to the height required to process the die to be processed through the Z-axis translation table;
(3) the rotating table rotates, and meanwhile, the X-axis moving table axially moves along the width direction;
(4) and the Z-axis motion table drives the imaging focusing system to cut the die to be processed.
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| CN113245386A (en) * | 2021-05-26 | 2021-08-13 | 安徽振兴拉丝模有限公司 | Automatic coaxial positioning method and device for ultramicropore wire-drawing die |
| CN114473189A (en) * | 2021-12-18 | 2022-05-13 | 太仓戴尔塔精密科技有限公司 | Production process of quick-response high-precision throttle valve filtering device for aircraft engine |
| CN115570286A (en) * | 2022-12-09 | 2023-01-06 | 西安晟光硅研半导体科技有限公司 | Device and method for bevel processing of crystal ingot or wafer |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1752846A1 (en) * | 1968-07-25 | 1971-12-09 | Zeiss Carl Fa | Method for producing the bore in a drawing die |
| JPH02241685A (en) * | 1989-03-14 | 1990-09-26 | Nippon Steel Corp | Laser beam machining method for fine ceramics wire drawing die |
| CN102615435A (en) * | 2012-04-13 | 2012-08-01 | 中国航空工业集团公司北京航空制造工程研究所 | Method for directly machining turbine blade air film irregular holes through laser |
| CN106001941A (en) * | 2016-05-05 | 2016-10-12 | 张玉峰 | Laser wire-drawing die perforating machine and linear frequency conversion control method thereof |
| KR20170058851A (en) * | 2015-11-19 | 2017-05-29 | 한국전기연구원 | System for machining of diamond dies hole using femtosecond laser and machining method thereof |
| CN107486640A (en) * | 2017-08-24 | 2017-12-19 | 江苏大学 | It is a kind of to improve hole taper and the laser drilling device and method of inwall quality |
| CN107538140A (en) * | 2017-09-14 | 2018-01-05 | 孙树峰 | A kind of laser rotary-cut processing inclined device |
| CN109365567A (en) * | 2018-09-28 | 2019-02-22 | 陕西科技大学 | A kind of wire drawing die inner hole parameter measuring apparatus and measurement method based on laser diffraction |
| CN109382590A (en) * | 2017-08-09 | 2019-02-26 | 株式会社沙迪克 | The manufacturing method of line mould |
| CN109692879A (en) * | 2018-12-24 | 2019-04-30 | 铜陵精远线模有限责任公司 | A kind of method of linear cutter diamond wire-drawing die |
-
2020
- 2020-03-30 CN CN202010236259.1A patent/CN111250878B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1752846A1 (en) * | 1968-07-25 | 1971-12-09 | Zeiss Carl Fa | Method for producing the bore in a drawing die |
| JPH02241685A (en) * | 1989-03-14 | 1990-09-26 | Nippon Steel Corp | Laser beam machining method for fine ceramics wire drawing die |
| CN102615435A (en) * | 2012-04-13 | 2012-08-01 | 中国航空工业集团公司北京航空制造工程研究所 | Method for directly machining turbine blade air film irregular holes through laser |
| KR20170058851A (en) * | 2015-11-19 | 2017-05-29 | 한국전기연구원 | System for machining of diamond dies hole using femtosecond laser and machining method thereof |
| CN106001941A (en) * | 2016-05-05 | 2016-10-12 | 张玉峰 | Laser wire-drawing die perforating machine and linear frequency conversion control method thereof |
| CN109382590A (en) * | 2017-08-09 | 2019-02-26 | 株式会社沙迪克 | The manufacturing method of line mould |
| CN107486640A (en) * | 2017-08-24 | 2017-12-19 | 江苏大学 | It is a kind of to improve hole taper and the laser drilling device and method of inwall quality |
| CN107538140A (en) * | 2017-09-14 | 2018-01-05 | 孙树峰 | A kind of laser rotary-cut processing inclined device |
| CN109365567A (en) * | 2018-09-28 | 2019-02-22 | 陕西科技大学 | A kind of wire drawing die inner hole parameter measuring apparatus and measurement method based on laser diffraction |
| CN109692879A (en) * | 2018-12-24 | 2019-04-30 | 铜陵精远线模有限责任公司 | A kind of method of linear cutter diamond wire-drawing die |
Non-Patent Citations (1)
| Title |
|---|
| 徐永红等: "《激光加工工艺 理实一体化教程》", 31 July 2017 * |
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