CN114535788A - Statically focused glass nanosecond laser hole cutting system and hole cutting method - Google Patents
Statically focused glass nanosecond laser hole cutting system and hole cutting method Download PDFInfo
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- 238000003698 laser cutting Methods 0.000 abstract description 3
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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Abstract
The invention belongs to the field of laser processing, and discloses a statically focused glass nanosecond laser hole cutting system which comprises a laser, and a collimation beam expander, a reflector, a 2D digital galvanometer, a focusing field lens and a dynamic focusing device which are sequentially arranged on a laser beam propagation path, wherein the laser is used for emitting laser pulses; the collimation beam expanding lens is used for adjusting the diameter of the laser beam and collimating the laser beam; the reflecting mirror is used for guiding the laser beam emitted by the laser into the digital galvanometer; the 2D digital galvanometer and the control board card are used for controlling the high-precision high-speed scanning of the laser beam in the xy plane; a focusing field lens for high-quality focusing and vertical incidence of the laser beam in a certain frame; and the dynamic focusing device is used for accurately positioning and moving the focusing plane in the thickness direction of the glass. The system can solve the problems of poor glass hole cutting quality, low cutting efficiency and difficulty in laser cutting of large-thickness glass with the thickness of 6-15 mm. The invention also provides a statically focused glass nanosecond laser hole cutting method.
Description
Technical Field
The invention belongs to the field of laser processing, and particularly relates to a static focusing glass nanosecond laser hole cutting system and a hole cutting method.
Background
The glass material has excellent physical, chemical and optical properties, and is widely applied to the industries of photovoltaics, buildings, automobiles, medical treatment and health, consumer electronics and the like. In order to meet the installation or structural design of glass products, hole cutting processing needs to be carried out on glass, and the glass hole cutting methods widely applied at present mainly comprise contact type and non-contact type, wherein the contact type mainly adopts traditional modes such as mechanical hole cutting and the like, and the non-contact type mainly adopts laser hole cutting.
The utility model discloses a glass piercing mill machinery gantry structure, glass piercing mill in chinese utility model patent specification CN201920240201.7, what this kind of hole cutting mode adopted is comparatively traditional mechanical drilling hole cutting scheme, the mode of adoption is processed for upper and lower double drill head, the course of working needs to place glass between upper and lower drill head, compress tightly glass through last swager mechanism, the operation of driling again, thereby the in-process of drilling need last the water spray and take away the processing piece, wherein the drill head part is gantry structure. Mechanical drilling has many shortcomings, and because the drill bit needs to contact glass, which is a brittle material, the contact easily generates internal stress and large brittle edge breakage, which causes great deviation of processing precision and influences the quality of the product, and in addition, the long-term abrasion of the drill bit can seriously influence the hole cutting effect.
Compared with the traditional mechanical hole cutting, the laser hole cutting has the advantages of rich hole cutting shapes, no cutter loss, high processing quality, larger aperture ratio and the like. The utility model discloses a cloth line glass nanosecond laser hole cutting device is disclosed in chinese utility model patent specification CN202020411113.1, can be used to the glass processing below 2.5mm, and this mode adopts 2.5D dynamic focusing galvanometer to scan the formation of accomplishing the joint-cutting layer by layer, and every one deck of scanning all needs to remove once dynamic focusing plane, and tens of times to hundreds of times dynamic focusing will seriously reduce the hole cutting efficiency, as shown in fig. 1. In addition, the nanosecond laser is matched with a 2.5D dynamic focusing galvanometer to solve the problems that the linear range of the Z axis is limited and the dynamic focusing depth depends on the focal length of a field lens seriously, so that the nanosecond laser cannot be suitable for the hole cutting of glass with various thicknesses, particularly the thickness exceeding 8 mm.
Disclosure of Invention
In order to solve the problems, the invention provides a statically focused glass nanosecond laser hole cutting system, which solves the problems of poor hole cutting quality, low cutting efficiency and difficulty in laser cutting of glass with large thickness of 6-15 mm. The invention also provides a statically focused glass nanosecond laser hole cutting method.
In order to achieve the purpose, the invention adopts the technical scheme that:
in a first technical scheme, the statically focused glass nanosecond laser hole cutting system comprises a laser, and a collimation beam expander, a reflector, a 2D digital galvanometer, a control board card, a focusing field lens and a dynamic focusing device which are sequentially arranged on a laser beam propagation path, wherein the focusing field lens and the dynamic focusing device are arranged on the laser beam propagation path
The laser is used for emitting laser pulses, and the laser pulse width is less than 10 ns;
the collimation beam expanding lens is used for adjusting the diameter of the laser beam and collimating the laser beam;
the reflecting mirror is used for guiding the laser beam emitted by the laser into the digital galvanometer;
the 2D digital galvanometer and the control board card are used for controlling the high-precision high-speed scanning of the laser beam in the xy plane;
a focusing field lens for high-quality focusing and vertical incidence of the laser beam in a certain frame;
and the dynamic focusing device is used for accurately positioning and moving the focusing plane in the thickness direction of the glass.
In the first technical solution, preferably, the laser emits a laser beam with a wavelength of 1064nm, a pulse width of less than 12ns, a maximum average power repetition frequency of more than 100kHz, and a power of not less than 70 w.
In the first technical solution, it is preferable that the incident beam of the focusing field lens is not less than 10mm, the effective focal length of the focusing field lens is not less than 80mm, and the limit diameter of the central focusing spot is not more than 20 μm.
In the first technical solution, preferably, the diameter of the laser beam emitted by the laser after beam expansion is matched with the entrance pupil of the focusing field lens, the diameter of the laser exit beam multiplied by the multiple of the collimating beam expander is the diameter of the entrance pupil of the focusing field lens, and the error range is less than 0.5 mm.
In the first technical solution, preferably, in the 2D digital galvanometer and the control board, an entrance pupil of a beam diameter of the digital galvanometer is 2-3mm larger than an entrance pupil diameter of the focusing field lens.
In a second technical scheme, a statically focused glass nanosecond laser hole cutting method is adopted, the statically focused glass nanosecond laser hole cutting system is adopted, laser beams emitted by a laser are collimated and expanded by a collimation and expansion lens and guided into a 2D digital galvanometer by a reflecting mirror, scanning is repeated according to a preset track under the control of a control board card and software, the scanning laser beams are focused on a glass workpiece through a field lens, a focusing plane is kept static in the scanning process, a glass material is etched and cut seams are generated in the scanning process of the focusing laser beams, and the cut seams penetrate through to form holes.
In the second technical scheme, preferably, when the glass nanosecond laser hole cutting system with static focusing is used for processing glass with the thickness of less than 2mm, the starting point of the focal plane of the focusing field lens is arranged at the position, close to the lower surface, of the bottom of the glass workpiece, the focusing field lens and the focusing plane do not move in the cutting process, the laser absorption efficiency is improved only by scanning damage generated by the focusing laser beam at the bottom of the glass, the absorption front continuously moves towards the upper surface, and hole cutting is completed through single static focusing.
In the second technical scheme, preferably, when the glass nanosecond laser hole cutting system with static focusing is used for processing glass with the thickness larger than 2mm, the starting point of the focusing plane is arranged at the bottom of the glass workpiece and close to the lower surface, the static focusing processing depth exceeds 2mm cutting seams, then the focusing plane is moved to the upper surface by 2mm through the dynamic focusing device to perform static focusing cutting again, the process is repeated for a plurality of times until the cutting seams penetrate and are stripped, and then the hole cutting of the glass is completed.
In the second technical scheme, after the static focusing processing depth is determined, the width direction is widened through filling scanning, and the width of a cutting seam is 0.24-0.4 mm; the filling mode is a plane equidistant spiral line or a concentric circle, and the path distance is 0.03-0.06 mm.
In the second technical solution, preferably, the parameter ranges of the repeated scanning process are: laser frequency: 100-.
The beneficial effects of the invention are as follows:
the statically focused glass nanosecond laser hole cutting system and the statically focused glass nanosecond laser hole cutting method are suitable for processing glass with the thickness of 0-15mm by adopting the mutual matching of the 2D digital galvanometer, the focusing plane and the focusing field lens. Specifically, for glass with the thickness of less than 2mm, a mode that a focusing field lens and a focusing plane do not move is adopted, only single static focusing is needed, and 40-45 times of scanning is repeated, so that compared with the traditional 65-90 times, the hole cutting efficiency is high, and the hole forming rate is high; aiming at 2-15mm glass, the hole cutting can be completed by only 2-7 times of static focusing through the mutual moving and matching of the digital galvanometer, the focusing field lens and the focusing plane, the hole cutting quality is good, the efficiency is high, and the problem of difficulty in laser hole cutting of 6-15mm thick glass can be effectively solved.
Drawings
Fig. 1 is a schematic diagram of laser cutting with a 2.5D galvanometer in the prior art.
FIG. 2 is a schematic diagram of the damage moving through to the upper surface when the statically focused glass nanosecond laser hole cutting system is in use.
FIG. 3 is a schematic diagram of static focusing cutting of glass below 2mm by a static focusing glass nanosecond laser hole cutting system according to the invention.
FIG. 4 is a practical diagram of static focusing cutting of 2-15mm glass by the static focusing glass nanosecond laser hole cutting system.
FIG. 5 is a schematic diagram of a statically focused glass nanosecond laser hole cutting system according to the invention with a statically focused scanning fill track.
FIG. 6 is a schematic diagram of a statically focused glass nanosecond laser hole cutting system according to the invention.
The reference numerals include:
10-laser, 20-collimation beam expander, 30-reflector, 40-2D digital vibrating mirror and control board card,
50-field lens of focus, 60-dynamic focusing means.
Detailed Description
In order to make the purpose, technical solution and advantages of the present technical solution more clear, the present technical solution is further described in detail below with reference to specific embodiments. It should be understood that the description is intended to be exemplary only, and is not intended to limit the scope of the present teachings.
Example 1
As shown in fig. 2-6, the present embodiment provides a statically focused glass nanosecond laser hole cutting system, which includes a laser 10, and a collimating beam expander 20, a reflector 30, a 2D digital galvanometer, a control board 40, a focusing field lens 50, and a dynamic focusing device 60, which are sequentially disposed on a laser beam propagation path, where the laser 10 is configured to emit laser pulses, and a laser pulse width is less than 10 ns; a collimation beam expander 20 for adjusting the diameter of the laser beam and the collimation of the beam; a mirror 30 for guiding the laser beam emitted from the laser 10 to the digital galvanometer; the 2D digital galvanometer and control board card 40 is used for controlling the high-precision high-speed scanning of the laser beam in the xy plane; a focusing field lens 50 for high quality focusing and vertical incidence of the laser beam within a certain frame; and a dynamic focusing device 60 for precisely positioning and moving the focusing plane in the thickness direction of the glass.
Preferably, the laser 10 emits a laser beam with a wavelength of 1064nm, a pulse width of less than 12ns, a maximum average power repetition frequency of more than 100kHz, and a power of the laser 10 of not less than 70 w.
The incident beam of the focusing field lens 50 is not less than 10mm, the effective focal length of the focusing field lens 50 is not less than 80mm, and the limit diameter of the central focusing light spot is not more than 20 μm.
The diameter of the laser beam emitted by the laser 10 is matched with the entrance pupil of the focusing field lens 50 after beam expansion, the diameter of the exit beam of the laser 10 multiplied by the collimation beam expander 20 is the diameter of the entrance pupil of the focusing field lens 50, and the error range is less than 0.5 mm.
In the 2D digital galvanometer and control board card 40, the diameter entrance pupil of the digital galvanometer beam is 2-3mm larger than the diameter of the entrance pupil of the focusing field lens 50.
Example 2
In this embodiment, a statically focused glass nanosecond laser hole cutting method is provided, where a statically focused glass nanosecond laser hole cutting system in embodiment 1 is used, a laser beam emitted by a laser 10 is collimated and expanded by a collimation and expansion lens 20 and guided into a 2D digital galvanometer and the 2D digital galvanometer in a control board 40 by a reflector 30, scanning is repeated according to a predetermined track under the control of the control board and software, the scanning laser beam is focused on a glass workpiece by a focusing field lens 50, a focusing plane remains static in a scanning process, a glass material is etched and a kerf is generated in the scanning process of the focusing laser beam, and a cut hole is formed after the kerf penetrates through the focusing.
As shown in fig. 2 and 3, when glass with a thickness of less than 2mm is processed by using a statically focused glass nanosecond laser hole cutting system, the starting point of the focal plane of the focusing field lens 50 is arranged at the position, close to the lower surface, of the bottom of the glass workpiece, the focusing field lens 50 and the focal plane do not move in the cutting process, the laser absorption efficiency is improved only by scanning the damage generated by the focused laser beam at the bottom of the glass, the absorption front continuously moves towards the upper surface, and hole cutting is completed by single static focusing.
As shown in fig. 4, when the glass nanosecond laser hole cutting system with static focusing is used for processing glass with the thickness of more than 2mm, the starting point of the focusing plane is arranged at the bottom of the glass workpiece close to the lower surface, the static focusing processing depth exceeds 2mm cutting joint, then the focusing plane is moved to the upper surface by 2mm through the dynamic focusing device 60 to perform static focusing cutting again, and the above processes are repeated for a plurality of times until the cutting joint penetrates and peels off, so that the hole cutting of the glass is completed.
As shown in fig. 5, after the static focusing processing depth is determined, the widening in the width direction is realized by filling and scanning, and the width of a cutting seam is 0.24-0.4 mm; the filling mode is a plane equidistant spiral line or a concentric circle, and the path distance is 0.03-0.06 mm.
The parameter ranges for the repeated scanning process are: laser 10 frequency: 100-.
The specific steps of the static focusing glass nanosecond laser hole cutting method for processing glass with the thickness of less than 2mm and processing glass with the thickness of more than 2mm are respectively described in detail through the structures of the embodiment 1 and the embodiment 2.
Example 3
When glass with the thickness of less than 2mm is processed by using a statically focused glass nanosecond laser hole cutting method, the method comprises the following specific steps:
first, glass having a thickness of 2mm or less is fixed to a processing table, and a laser 10 is started to emit a laser beam.
Then, the laser beam firstly adjusts the diameter and collimation of the beam through the collimation beam expander 20, then the beam is guided into the 2D digital galvanometer in the 2D digital galvanometer and the control board card 40 through the high-power reflector 30, and meanwhile, the control board card controls the beam to repeatedly scan in the xy plane according to a preset track; in this embodiment, the scanning parameters include the frequency of the laser 10 being 100-.
Finally, the focusing field lens 50 focuses the emitted laser beam with high quality and vertically irradiates the glass workpiece, the dynamic focusing device 60 can realize the accurate positioning and movement of the focusing plane in the thickness direction of the glass, and the focusing field lens 50 and the focusing plane are kept not to move in the cutting process so as to realize the hole cutting of the glass with the thickness less than 2 mm; in this embodiment, the focal plane starting point of the focusing field lens 50 is located at a position near the lower surface of the bottom of the glass workpiece, and the laser absorption efficiency is improved by scanning the damage generated by the focused laser beam at the bottom of the glass and making the absorption front continuously move to the upper surface; the width of the hole cutting kerf is widened in the width direction in a filling scanning mode, the width of the glass kerf with different thicknesses is 0.24-0.4mm, and the thicker the glass, the wider the kerf is, so that cutting scraps can be conveniently removed; the filling scanning mode is a plane equidistant spiral line or concentric circles, and the distance is 0.03-0.06 mm.
According to the method in the embodiment, the diameter, collimation, reflection angle, focusing and focusing of the light beam are adjusted, high-efficiency reflection, high-quality focusing scanning and accurate control of a focusing plane of the laser beam are achieved, static focusing machining depth exceeds 2mm of cutting seams, external focusing conditions are unchanged, only single static focusing is needed, cutting time of a round hole with the diameter of 2mm glass and the diameter of 12mm can be reduced to 2.3s, 4-5s is needed compared with traditional 2.5D dynamic focusing cutting of a same-scale hole, and efficiency is high. Specifically, the method is suitable for hole cutting of glass with the thickness of less than 2mm, and is high in hole cutting speed and good in hole cutting quality.
Example 3
When glass with the thickness of less than 2mm is processed by using the static focusing glass nanosecond laser hole cutting method, as shown in fig. 4, the same laser beam and processing parameters are adopted in this embodiment as those in embodiment 1, except that glass with the thickness of 2-15mm is placed in step S1, and the focusing field lens 50, the focusing plane and the digital galvanometer need to move in cooperation with each other in the cutting process in step S3, so as to realize hole cutting of the glass with the thickness of 2-15 mm. In this embodiment, the hole cutting can be completed only by several times of static focusing. And (3) statically focusing the cutting seam with the depth exceeding 2mm, moving the focusing plane to the upper surface by 2mm through the dynamic focusing device 60 after the static focusing is finished, then statically focusing and cutting the hole again, and repeating the process for 2-7 times until the cutting seam penetrates through the glass to finish the hole cutting of 2-15 mm.
The statically focused glass nanosecond laser hole cutting system and the statically focused glass nanosecond laser hole cutting method are suitable for processing glass with the thickness of 0-15mm by adopting the mutual matching of the 2D digital galvanometer, the control board card 40, the focusing plane and the focusing field lens 50. Specifically, for glass with the thickness of less than 2mm, a mode that the focusing field lens 50 and the focusing plane do not move is adopted, only single static focusing is needed, and 40-45 times of scanning is repeated, so that compared with the traditional 65-90 times, the hole cutting efficiency is high, and the hole forming rate is high; aiming at 2-15mm glass, the hole cutting can be completed only by 2-7 times of static focusing through the mutual moving and matching of the 2D digital galvanometer, the control board card 40, the focusing field lens 50 and the focusing plane, the hole cutting quality is good, the efficiency is high, and the problem that the laser hole cutting of 6-15mm thick glass is difficult can be effectively solved.
The foregoing is only a preferred embodiment of the present invention, and many variations in the specific embodiments and applications of the invention may be made by those skilled in the art without departing from the spirit of the invention, which falls within the scope of the claims of this patent.
Claims (10)
1. A statically focused glass nanosecond laser hole cutting system is characterized in that: comprises a laser, a collimation beam expander, a reflector, a 2D digital galvanometer, a control board card, a focusing field lens and a dynamic focusing device which are sequentially arranged on a laser beam propagation path, wherein
The laser is used for emitting laser pulses, and the laser pulse width is less than 10 ns;
the collimation beam expanding lens is used for adjusting the diameter of the laser beam and collimating the laser beam;
the reflecting mirror is used for guiding the laser beam emitted by the laser into the digital galvanometer;
the 2D digital galvanometer and the control board card are used for controlling the high-precision high-speed scanning of the laser beam in the xy plane;
a focusing field lens for high-quality focusing and vertical incidence of the laser beam in a certain frame;
and the dynamic focusing device is used for accurately positioning and moving the focusing plane in the thickness direction of the glass.
2. The statically focused glass nanosecond laser pinhole cutting system according to claim 1, wherein: the wavelength of a laser beam emitted by the laser is 1064nm, the pulse width is less than 12ns, the maximum average power repetition frequency is more than 100kHz, and the power of the laser is not less than 70 w.
3. The statically focused glass nanosecond laser pinhole cutting system according to claim 1, wherein: the incident beam of the focusing field lens is not less than 10mm, the effective focal length of the focusing field lens is not less than 80mm, and the limit diameter of the central focusing light spot is not more than 20 mu m.
4. The statically focused glass nanosecond laser pinhole cutting system according to claim 1, wherein: the diameter of a laser beam emitted by the laser is matched with the entrance pupil of the focusing field lens after beam expansion, the diameter of the laser exit beam multiplied by the multiple of the collimation beam expander is the diameter of the entrance pupil of the focusing field lens, and the error range is smaller than 0.5 mm.
5. The statically focused glass nanosecond laser notching system, as recited in claim 1, wherein: in the 2D digital galvanometer and the control board card, the diameter entrance pupil of the digital galvanometer beam is 2-3mm larger than the diameter of the entrance pupil of the focusing field lens.
6. A statically focused glass nanosecond laser hole cutting method using the statically focused glass nanosecond laser hole cutting system according to any one of claims 1 to 5, characterized in that: laser beams emitted by a laser are collimated and expanded by a collimating and expanding lens and guided into a 2D digital galvanometer by a reflector, the scanning is repeated according to a preset track under the control of a control board card and software, the scanning laser beams are focused on a glass workpiece through a field lens, a focusing plane is kept static in the scanning process, a glass material is etched and cut seams are generated in the scanning process of the focusing laser beams, and cut holes are formed after the cut seams penetrate through.
7. The statically focused glass nanosecond laser hole cutting method according to claim 6, wherein: when glass with the thickness smaller than 2mm is processed by using a static focusing glass nanosecond laser hole cutting system, the starting point position of the focal plane of the focusing field lens is arranged at the position, close to the lower surface, of the bottom of a glass workpiece, the focusing field lens and the focusing plane are not moved in the cutting process, the laser absorption efficiency is improved only by scanning damage generated by a focusing laser beam at the bottom of the glass, the absorption front edge continuously moves towards the upper surface, and hole cutting is completed through single static focusing.
8. The statically focused glass nanosecond laser hole cutting method according to claim 6, wherein: when the glass nanosecond laser hole cutting system with static focusing is used for processing glass with the thickness larger than 2mm, the starting point of the focusing plane is arranged at the bottom of the glass workpiece close to the lower surface, the static focusing processing depth exceeds 2mm cutting joints, then the focusing plane is moved to the upper surface by 2mm through the dynamic focusing device to perform static focusing cutting again, the process is repeated for a plurality of times until the cutting joints are penetrated and stripped, and then the hole cutting of the glass is completed.
9. The statically focused glass nanosecond laser hole-cutting method according to claim 7 or 8, wherein: after the static focusing processing depth is determined, widening in the width direction is realized through filling scanning, and the width of a cutting seam is 0.24-0.4 mm; the filling mode is a plane equidistant spiral line or concentric circles, and the distance is 0.03-0.06 mm.
10. The statically focused glass nanosecond laser hole cutting method according to claim 6, wherein: the parameter ranges for the repeated scanning process are: laser frequency: 100-.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111592306.7A CN114535788B (en) | 2021-12-23 | 2021-12-23 | Glass nanosecond laser hole cutting system and method with static focusing function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111592306.7A CN114535788B (en) | 2021-12-23 | 2021-12-23 | Glass nanosecond laser hole cutting system and method with static focusing function |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114535788A true CN114535788A (en) | 2022-05-27 |
| CN114535788B CN114535788B (en) | 2023-10-27 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117428350A (en) * | 2023-12-19 | 2024-01-23 | 珠海市申科谱工业科技有限公司 | Single-head double-platform film sheet laser cutting machine |
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