CN117428350A - Single-head double-platform film sheet laser cutting machine - Google Patents
Single-head double-platform film sheet laser cutting machine Download PDFInfo
- Publication number
- CN117428350A CN117428350A CN202311746216.8A CN202311746216A CN117428350A CN 117428350 A CN117428350 A CN 117428350A CN 202311746216 A CN202311746216 A CN 202311746216A CN 117428350 A CN117428350 A CN 117428350A
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- laser
- reflecting mirror
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- mirror
- platform
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- 238000003698 laser cutting Methods 0.000 title claims abstract description 31
- 239000010408 film Substances 0.000 claims description 23
- 238000001179 sorption measurement Methods 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 11
- 239000000428 dust Substances 0.000 claims description 8
- 239000000969 carrier Substances 0.000 claims description 5
- 239000010409 thin film Substances 0.000 claims description 4
- 238000007599 discharging Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 208000026817 47,XYY syndrome Diseases 0.000 description 1
- 238000010009 beating Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004579 marble Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention aims to provide a single-head double-platform film sheet laser cutting machine which has a compact structure, can alternately feed and discharge left and right double-platform, can randomly set cutting patterns, has strong equipment compatibility and realizes high-precision laser cutting of film sheets. The laser cutting device comprises a mounting seat and a cutting carrier, wherein the cutting carrier is arranged below the mounting seat, the mounting seat is provided with a laser, a first horizontal reflecting mirror, a second horizontal reflecting mirror and an XZ axis moving mechanism, the action end of the XZ axis moving mechanism is provided with a laser vibrating mirror, a first vertical reflecting mirror and a second vertical reflecting mirror, and laser emitted by the laser, the first horizontal reflecting mirror and the laser sequentially passes through the first horizontal reflecting mirror, the second horizontal reflecting mirror, the first vertical reflecting mirror and the second vertical reflecting mirror to reflect and irradiate the laser vibrating mirror, and the laser vibrating mirror irradiates the laser beam to the surface of a workpiece of the cutting carrier. The invention is applied to the technical field of laser cutting machines.
Description
Technical Field
The invention is applied to the technical field of laser cutting machines, and particularly relates to a single-head double-platform film sheet laser cutting machine.
Background
The laser cutting technology is to utilize high power density light spot formed by focusing laser beam to heat material to vaporization temperature fast, so as to evaporate small holes and to make the focused beam and the processed material move relatively to realize continuous cutting. The laser cutting machine focuses laser emitted from the laser into laser beams with high power density through an optical path system. The laser beam irradiates the surface of the workpiece to make the workpiece reach the melting point or boiling point, and high-pressure gas coaxial with the laser beam blows away the molten or gasified metal. Along with the movement of the relative positions of the light beam and the workpiece, the final material forms a kerf so as to achieve the aim of cutting. Traditional flexible films such as FPC or PET are cut, usually adopt the mode of mechanical blanking, but mechanical blanking is to different cutting figures, need match different blanking moulds, and equipment compatibility is low. Therefore, the single-head double-platform film sheet laser cutting machine which has compact structure, alternate feeding and discharging of the left and right double platforms, arbitrary setting of cutting patterns, strong equipment compatibility and high-precision laser cutting of film sheets is necessary.
Disclosure of Invention
The invention aims to solve the technical problems of overcoming the defects of the prior art and providing the single-head double-platform film sheet laser cutting machine which has the advantages of compact structure, alternate feeding and discharging of the left and right double platforms, arbitrary setting of cutting patterns, strong equipment compatibility and realization of high-precision laser cutting of film sheets.
The technical scheme adopted by the invention is as follows: the laser vibration mirror is arranged below the first vertical reflecting mirror, the laser vibration mirror and the second vertical reflecting mirror are in the same horizontal plane, and laser emitted by the laser sequentially passes through the first horizontal reflecting mirror, the second horizontal reflecting mirror, the first vertical reflecting mirror and the second vertical reflecting mirror to be reflected and emitted into the laser vibration mirror, and the laser vibration mirror irradiates laser beams to the surface of a workpiece of the cutting carrying table.
According to the scheme, the laser emergent light spots are reflected by the four groups of reflectors, namely the first horizontal reflector, the second horizontal reflector, the first vertical reflector and the second vertical reflector and are shot into the laser vibrating mirror, and the XZ axis moving mechanism drives the laser vibrating mirror to realize the flight of the light path XZ in two directions; although the laser is fixedly arranged, the focusing vibration lens can move in the XZ direction and then is matched with the cutting carrier, so that laser cutting processing of any graph in an XY axis movement breadth is realized, on a control layer, the laser vibration lens and the cutting carrier perform multi-axis linkage cutting, complex continuous graph cutting with infinite laser visual field can be realized, and the problem of splicing gaps generated by continuous graph splicing cutting is avoided.
In a preferred scheme, an included angle between the laser and the axis of the first horizontal reflecting mirror is 45 degrees, an included angle between the axis of the first horizontal reflecting mirror and the axis of the second horizontal reflecting mirror is 90 degrees, a plane where the second horizontal reflecting mirror is located intersects with a plane where the first vertical reflecting mirror is located, an included angle between the two planes is 45 degrees, and an included angle between the axis of the first vertical reflecting mirror and the axis of the second vertical reflecting mirror is 90 degrees.
The single-head double-platform thin film sheet laser cutting machine further comprises a laser beam expander, wherein the laser beam expander is arranged between the first horizontal reflector and the second horizontal reflector, and laser sequentially passes through the first horizontal reflector, the laser beam expander and the second horizontal reflector.
The X-axis linear module is arranged at the side end of the mounting seat, the Z-axis linear module is arranged at the action end of the X-axis linear module, a bearing table is arranged at the action end of the Z-axis linear module, and the laser galvanometer is downwards arranged at the bearing table.
In one preferred scheme, the single-head double-platform film sheet laser cutting machine further comprises a positioning camera, and the positioning camera is connected to the side of the bearing table.
In one preferred scheme, the single-head double-platform film sheet laser cutting machine further comprises a laser focusing field lens, wherein the laser focusing field lens is arranged at a light outlet of the laser vibrating lens.
The laser vibrating mirror irradiates laser beams to the surface of a workpiece of the cutting carrier through the dust removing sheet metal.
The cutting carrier comprises a Y-axis linear module, an adsorption platform is arranged at the action end of the Y-axis linear module and connected with an external vacuum source, three groups of positioning blocks are arranged on the upper surface of the adsorption platform, the three groups of positioning blocks are respectively arranged on three sides of the upper surface of the adsorption platform, and the other side of the positioning blocks is used as a feeding part of a workpiece.
In one preferred scheme, the number of the cutting carriers is two, and the two cutting carriers are arranged in parallel and side by side.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic perspective view of the mounting base;
FIG. 3 is a schematic perspective view of the motion end of the X-axis linear module;
FIG. 4 is a schematic perspective view of the cutting stage;
FIG. 5 is a schematic perspective view of the dust removing sheet metal;
fig. 6 is a schematic perspective view of the frame.
Detailed Description
As shown in fig. 1, 2 and 6, in this embodiment, the present invention includes a mounting base 1 and a cutting stage 2, the cutting stage 2 is disposed below the mounting base 1, the mounting base 1 is provided with a laser 3, a first horizontal mirror 4, a second horizontal mirror 5 and an XZ axis moving mechanism, an action end of the XZ axis moving mechanism is provided with a laser vibrating mirror 6, a first vertical mirror 7 and a second vertical mirror 8, the laser 3, the first horizontal mirror 4, the second horizontal mirror 5 and the first vertical mirror 7 are in the same horizontal plane, the second vertical mirror 8 is disposed below the first vertical mirror 7, the laser vibrating mirror 6 and the second vertical mirror 8 are in the same horizontal plane, and laser emitted by the laser 3 sequentially passes through the first horizontal mirror 4, the second horizontal mirror 5, the first vertical mirror 7 and the second vertical mirror 8 and irradiates the laser vibrating mirror 6 to the cutting stage 2.
The manual work or manipulator will be placed the upper surface of cutting microscope carrier 2, the bottom of cutting microscope carrier 2 absorption product work piece, XZ axle moving mechanism drive laser galvanometer 6 reaches appointed position, laser that laser 3 sent out is in proper order through first horizontal mirror 4 second horizontal mirror 5 first perpendicular mirror 7 and second perpendicular mirror 8 reflection and penetrate laser galvanometer 6, laser galvanometer 6 will laser beam irradiation to the work piece surface of cutting microscope carrier 2, laser 3 goes out the light and passes through laser galvanometer 6 focus cutting, XZ axle moving mechanism complex motion fit cutting track.
As shown in fig. 1 and 2, in this embodiment, an included angle between the laser 3 and the axis of the first horizontal mirror 4 is 45 °, an included angle between the axis of the first horizontal mirror 4 and the axis of the second horizontal mirror 5 is 90 °, a plane where the second horizontal mirror 5 is located intersects a plane where the first vertical mirror 7 is located, an included angle between the first vertical mirror 7 and the axis of the second vertical mirror 8 is 45 °. The optical path system formed by the reflection of the multiple groups of reflectors is focused into a laser beam with high power density, and the laser beam irradiates the surface of the workpiece to enable the workpiece to reach the melting point or the boiling point.
As shown in fig. 2, in this embodiment, the single-head dual-platform thin film sheet laser cutting machine further includes a laser beam expander 9, where the laser beam expander 9 is disposed between the first horizontal mirror 4 and the second horizontal mirror 5, and laser sequentially passes through the first horizontal mirror 4, the laser beam expander 9, and the second horizontal mirror 5. All laser beams are conducted in a closed pipeline, and the laser beam expander 9 is used for expanding the diameter of the laser beam and reducing the divergence angle of the laser beam.
As shown in fig. 2, in this embodiment, the XZ-axis moving mechanism includes an X-axis linear module 10 and a Z-axis linear module 11, the X-axis linear module 10 is disposed at a side end of the mount 1, the Z-axis linear module 11 is disposed at an actuating end of the X-axis linear module 10, an actuating end of the Z-axis linear module 11 is provided with a carrying table 12, and the laser galvanometer 6 is disposed downward at the carrying table 12.
As shown in fig. 1 to 3, in the present embodiment, the single-head dual-stage film sheet laser cutter further includes a positioning camera 13, and the positioning camera 13 is connected to an edge side of the carrying table 12. The positioning camera 13 is used for scanning the measuring position of a workpiece, the XZ axis moving mechanism moves in a combined mode to realize visual focusing and grabbing product characteristic points for positioning, the laser 3 is matched with the laser to emit light to cut through the laser vibrating mirror 6 in a focusing mode, the XZ axis moving mechanism moves in a combined mode to fit a cutting track, and therefore complex continuous graph cutting of an infinite laser visual field can be achieved.
As shown in fig. 4, in this embodiment, the cutting carrier 2 includes a Y-axis linear module 16, an adsorption platform 17 is disposed at an action end of the Y-axis linear module 16, the adsorption platform 17 is connected with an external vacuum source, three sets of positioning blocks 18 are disposed on an upper surface of the adsorption platform 17, the three sets of positioning blocks 18 are disposed on three sides of the upper surface of the adsorption platform 17, and the other side is a feeding position of a workpiece. The feed opening adopts a side push-pull structure, and three groups of positioning blocks 18 are used for positioning workpiece products. The Y-axis linear module 16 drives the adsorption platform 17 to linearly move along the Y axis, drives workpiece products of the adsorption platform 17 to linearly move, and cooperates with the Y-axis linear module 16 to realize fitting and cutting of any track by compound movement.
As shown in fig. 3, in this embodiment, the single-head dual-stage film laser cutting machine further includes a laser focusing field lens 14, where the laser focusing field lens 14 is disposed at the light outlet of the laser galvanometer 6. Although the laser galvanometer 6 is fixed on the bearing table 12, the laser focusing field lens 14 can move in the XZ direction, and then the laser focusing field lens is matched with the Y-axis linear module 16 to realize laser cutting processing of any graph in the XY-axis moving breadth.
As shown in fig. 3 and 5, in this embodiment, the single-head dual-platform thin film laser cutting machine further includes a dust-removing metal plate 15, the dust-removing metal plate 15 is disposed directly under the carrying table 12, a plurality of air holes are formed in an inner side of the dust-removing metal plate 15, a plurality of air outlets are connected with an external vacuum source in a conducting manner through the air pipes, and the laser galvanometer 6 irradiates a laser beam to a workpiece surface of the cutting carrier 2 through the dust-removing metal plate 15. The dust removal panel beating 15 adopts the vacuum adsorption mode, adsorbs the dust between the laser galvanometer 6 to the work piece, guarantees that the laser beam that laser galvanometer 6 sent is accessible, plays the effect of absorption dust removal.
As shown in fig. 1 and 4, in the present embodiment, the number of the cutting stages 2 is two, and the two sets of cutting stages 2 are arranged in parallel and side by side. The device adopts a left-right double-platform table tennis mechanism, can realize synchronous feeding and discharging of manual work and laser cutting, improves the efficiency of the device, and two groups of cutting carriers 2 alternately circulate feeding and discharging and laser cutting.
In this embodiment, the double Y-axis linear motor and the X-axis linear motor are directly fixed to the marble platform; the repeated positioning precision of the platform can be within 3 micrometers; ensuring the cutting precision of the product; the whole equipment housing adopts a sheet metal structure, the feeding port adopts a left-right sliding door structure, and the left-right double platforms alternately feed and discharge; the main operation interface is arranged at the right front of the outer cover of the laser cutting machine and adopts an externally hung keyboard display; the left side and the right side of the outer cover are provided with a maintenance side-by-side door and a window, and equipment maintenance operation is realized.
Claims (9)
1. A single-end double-platform film sheet laser cutting machine is characterized in that: the laser cutting device comprises a mounting seat (1) and a cutting carrying table (2), wherein the cutting carrying table (2) is arranged below the mounting seat (1), the mounting seat (1) is provided with a laser (3), a first horizontal reflecting mirror (4), a second horizontal reflecting mirror (5) and an XZ axis moving mechanism, the action end of the XZ axis moving mechanism is provided with a laser vibrating mirror (6), a first vertical reflecting mirror (7) and a second vertical reflecting mirror (8), the laser (3) is in the same horizontal plane with the first horizontal reflecting mirror (4), the second horizontal reflecting mirror (5) is in the same horizontal plane with the first vertical reflecting mirror (7), the laser vibrating mirror (6) is in the same horizontal plane with the second vertical reflecting mirror (8), and laser emitted by the laser (3) sequentially passes through the horizontal reflecting mirror (5), the first vertical reflecting mirror (7) and the laser vibrating mirror (6) is in the same horizontal plane with the second vertical reflecting mirror (8) and irradiates the laser vibrating mirror (6) to the surface of a workpiece.
2. A single-head double-platform film sheet laser cutter as defined in claim 1, wherein: the included angle between the laser (3) and the axis of the first horizontal reflecting mirror (4) is 45 degrees, the included angle between the axis of the first horizontal reflecting mirror (4) and the axis of the second horizontal reflecting mirror (5) is 90 degrees, the plane where the second horizontal reflecting mirror (5) is located intersects with the plane where the first vertical reflecting mirror (7) is located, the included angle between the two planes is 45 degrees, and the included angle between the axis of the first vertical reflecting mirror (7) and the axis of the second vertical reflecting mirror (8) is 90 degrees.
3. A single-head double-platform film sheet laser cutter as defined in claim 1, wherein: the single-head double-platform thin film sheet laser cutting machine further comprises a laser beam expander (9), wherein the laser beam expander (9) is arranged between the first horizontal reflecting mirrors (4) and the second horizontal reflecting mirrors (5), and laser sequentially passes through the first horizontal reflecting mirrors (4), the laser beam expander (9) and the second horizontal reflecting mirrors (5).
4. A single-head double-platform film sheet laser cutter as defined in claim 1, wherein: the X Z axis moving mechanism comprises an X axis linear module (10) and a Z axis linear module (11), the X axis linear module (10) is arranged at the side end of the mounting seat (1), the Z axis linear module (11) is arranged at the action end of the X axis linear module (10), a bearing table (12) is arranged at the action end of the Z axis linear module (11), and the laser galvanometer (6) is downwards arranged at the position of the bearing table (12).
5. A single-head dual-platform film sheet laser cutter as described in claim 4 and further wherein: the single-head double-platform film sheet laser cutting machine further comprises a positioning camera (13), and the positioning camera (13) is connected to the side of the bearing table (12).
6. A single-head dual-platform film sheet laser cutter as described in claim 4 and further wherein: the single-head double-platform film sheet laser cutting machine further comprises a dust removal metal plate (15), the dust removal metal plate (15) is arranged right below the bearing table (12), and the laser vibrating mirror (6) irradiates laser beams to the surface of a workpiece of the cutting carrier (2) through the dust removal metal plate (15).
7. A single-head double-platform film sheet laser cutter as defined in claim 1, wherein: the cutting carrier (2) comprises a Y-axis linear module (16), an adsorption platform (17) is arranged at the action end of the Y-axis linear module (16), the adsorption platform (17) is connected with an external vacuum source, three groups of positioning blocks (18) are arranged on the upper surface of the adsorption platform (17), the three groups of positioning blocks (18) are respectively arranged on the three sides of the upper surface of the adsorption platform (17), and the other side of the positioning blocks is used as a feeding position of a workpiece.
8. A single-head double-platform film sheet laser cutter as defined in claim 1, wherein: the single-head double-platform film sheet laser cutting machine further comprises a laser focusing field lens (14), wherein the laser focusing field lens (14) is arranged at a light outlet of the laser vibrating mirror (6).
9. A single-head double-platform film sheet laser cutter as defined in claim 1, wherein: the number of the cutting carriers (2) is two, and the two cutting carriers (2) are arranged in parallel and side by side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311746216.8A CN117428350A (en) | 2023-12-19 | 2023-12-19 | Single-head double-platform film sheet laser cutting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311746216.8A CN117428350A (en) | 2023-12-19 | 2023-12-19 | Single-head double-platform film sheet laser cutting machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117428350A true CN117428350A (en) | 2024-01-23 |
Family
ID=89555622
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311746216.8A Pending CN117428350A (en) | 2023-12-19 | 2023-12-19 | Single-head double-platform film sheet laser cutting machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117428350A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200988131Y (en) * | 2006-12-31 | 2007-12-12 | 江苏金方圆数控机床有限公司 | Constant light path compensating mechanism for laser cutter |
| US20170057018A1 (en) * | 2015-08-28 | 2017-03-02 | Chun-hao Li | Double-directional machining laser machine tool |
| CN207971570U (en) * | 2018-01-15 | 2018-10-16 | 深圳锦帛方激光科技有限公司 | A kind of Double tabletop FPC ultraviolet laser cutting machine tools |
| CN112846542A (en) * | 2021-01-26 | 2021-05-28 | 上海市激光技术研究所 | Wafer laser cutting equipment and method based on linkage of galvanometer and platform |
| CN114535788A (en) * | 2021-12-23 | 2022-05-27 | 华中科技大学 | Statically focused glass nanosecond laser hole cutting system and hole cutting method |
-
2023
- 2023-12-19 CN CN202311746216.8A patent/CN117428350A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200988131Y (en) * | 2006-12-31 | 2007-12-12 | 江苏金方圆数控机床有限公司 | Constant light path compensating mechanism for laser cutter |
| US20170057018A1 (en) * | 2015-08-28 | 2017-03-02 | Chun-hao Li | Double-directional machining laser machine tool |
| CN207971570U (en) * | 2018-01-15 | 2018-10-16 | 深圳锦帛方激光科技有限公司 | A kind of Double tabletop FPC ultraviolet laser cutting machine tools |
| CN112846542A (en) * | 2021-01-26 | 2021-05-28 | 上海市激光技术研究所 | Wafer laser cutting equipment and method based on linkage of galvanometer and platform |
| CN114535788A (en) * | 2021-12-23 | 2022-05-27 | 华中科技大学 | Statically focused glass nanosecond laser hole cutting system and hole cutting method |
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