CN112846542A - Wafer laser cutting equipment and method based on linkage of galvanometer and platform - Google Patents
Wafer laser cutting equipment and method based on linkage of galvanometer and platform Download PDFInfo
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- CN112846542A CN112846542A CN202110105962.3A CN202110105962A CN112846542A CN 112846542 A CN112846542 A CN 112846542A CN 202110105962 A CN202110105962 A CN 202110105962A CN 112846542 A CN112846542 A CN 112846542A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
- B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
Abstract
The invention relates to a wafer laser cutting device based on the linkage of a galvanometer and a platform, which comprises a laser, a beam expander, a polarization element, a first reflector, a second reflector, a third reflector, a fourth reflector, a beam shaper, a two-dimensional scanning galvanometer, a telecentric field lens, an X-axis motion platform, a Z-direction motion mechanism, a wafer carrying platform, a Y-axis motion platform, a wafer pre-alignment and transmission system, a camera system and a computer. The laser, the polarization element, the beam shaper, the two-dimensional scanning galvanometer, the X-axis motion platform, the Y-axis motion platform, the Z-direction motion mechanism, the wafer carrying platform and the wafer transmission and pre-alignment system are controlled by a computer. The invention also relates to a cutting method of the cutting equipment, which comprises 8 steps. The invention can adjust the laser polarization state and the light beam energy distribution form of the surface of the wafer according to different wafer cutting processes, thereby improving the adaptability and the cutting quality of the wafer cutting.
Description
Technical Field
The invention relates to a wafer cutting device and a cutting method, in particular to a wafer laser cutting device and a method based on the linkage of a galvanometer and a platform, and belongs to the technical field of semiconductor chip manufacturing.
Background
With the development of semiconductor technology, the demand of high-performance and high-integration semiconductor chips is increasing, and the difficulty of manufacturing the chips is also increasing. Semiconductor chips are usually fabricated by depositing integrated circuit device structures on an entire substrate wafer, then dicing the wafer, and finally packaging the dice. Therefore, the wafer dicing effect has a great influence on the performance and economic efficiency of the chip package.
Due to the advantages of laser, the laser is widely used in the field of wafer cutting. Such as laser stealth dicing and laser grooving dicing. The laser invisible cutting technology has good splinter quality and high processing efficiency, and is mainly used for processing MEMS silicon substrate wafers or silicon carbide power devices. Generally, when a wafer is cut by laser, two modes of splicing cutting by a galvanometer and cutting by an XY moving platform are available. In the process of splicing and cutting the galvanometers, after the laser finishes cutting the machined breadth of one galvanometer, when the XY platform is moved to cut the next breadth, a dislocation between different breadths due to the precision of the XY platform and the galvanometer is caused, and the cutting quality of the wafer is seriously influenced; when the XY motion platform is used for cutting, the wafer is placed on a carrying platform with a rotation function, a camera is used for grabbing a special point of the wafer, and then a wafer cutting track line is parallel to the X or Y platform when the carrying platform is rotated. When a 12-inch large wafer is cut, the requirement on the linear parallelism of the moving platform is high, usually, due to the platform precision and the beam quality uniformity, the wafer is rotated by 90 degrees after the X or Y cutting is finished, and then the cutting in the other direction is carried out, so that the wafer cutting efficiency is reduced.
Disclosure of Invention
The invention aims to provide wafer laser cutting equipment based on the linkage of a galvanometer and a platform, which can solve the problems of poor splicing and cutting precision of the galvanometer, low cutting efficiency of X, Y to a motion platform and high requirement on the straightness of the motion platform in the prior art.
In order to solve the problems, the technical scheme adopted by the invention is as follows:
a wafer laser cutting device based on the linkage of a galvanometer and a platform comprises a laser, a beam expander, a polarization element, a first reflector, a second reflector, a third reflector, a fourth reflector, a beam shaper, a two-dimensional scanning galvanometer, a telecentric field lens, an X-axis motion platform, a Z-direction motion mechanism, a wafer carrying platform, a Y-axis motion platform, a wafer pre-alignment and transmission system, a camera system and a computer,
the X-axis motion platform is erected above the base, the Y-axis motion platform is arranged on the base, the Z-direction motion mechanism is arranged at the front end of the X-axis motion platform and is positioned above the Y-axis motion platform, the light beam shaper, the two-dimensional scanning galvanometer, the telecentric field lens, the fourth reflector and the camera system are arranged on the Z-direction motion mechanism, the wafer carrier is arranged on the Y-axis motion platform,
the linearly polarized Gaussian beam emitted by the laser is incident into a beam expander for beam expansion, then is changed into a circularly polarized Gaussian beam or a linearly polarized Gaussian beam with a set polarization direction after passing through a polarization element, then is incident into a beam shaper for shaping after passing through a first reflector, a second reflector, a third reflector and a fourth reflector in sequence, the shaped beam is subjected to X, Y-direction deviation through a two-dimensional scanning vibrating mirror, then is incident onto the surface of a wafer through a telecentric field lens,
the laser, the polarization element, the beam shaper, the two-dimensional scanning galvanometer, the X-axis motion platform, the Y-axis motion platform, the Z-direction motion mechanism, the wafer carrying platform and the wafer transmission and pre-alignment system are controlled by a computer.
Further, the laser wavelength emitted by the laser is 100 nm-11000 nm, and the pulse width is
1 ms-10 fs, pulse frequency of 1-10000 KHz, polarization type of linearly polarized light and energy distribution of light beams of Gaussian distribution.
Further, the polarization element is a lambda/2 wave plate and is used for adjusting the polarization state of the laser, so that the polarization direction of the laser incident to the surface of the wafer and the cutting direction form an included angle of 0 degree, 45 degrees, 90 degrees or any angle; or the polarization element is a lambda/4 wave plate and is used for adjusting the polarization state of the laser, so that the polarization state of the laser incident to the surface of the wafer is circular polarization.
Further, the beam shaper is a Gaussian spot shaper or a circular spot shaper or a square spot shaper.
Further, the two-dimensional scanning galvanometer shifts the light beam in the direction of X, Y by a distance of 1nm-100 mm.
Furthermore, the telecentric field lens is a single lens or a multi-lens combined lens, and the focal length of the telecentric field lens is 10mm-300 mm.
Further, the flatness of the wafer carrying platform is less than 50 μm.
The invention also provides a cutting method of the wafer laser cutting equipment based on the linkage of the galvanometer and the platform, which comprises the following steps:
s1, the wafer transmission and pre-alignment system places the wafer to be cut on the wafer carrying platform according to the preset angle and the position in the X, Y direction;
s2, shooting the characteristic pattern of the wafer surface by a camera system, and determining the laser cutting track on the wafer;
s3, setting laser cutting technological parameters such as laser power, laser frequency, focal height, laser polarization state and direction, beam shaping size and direction, cutting speed and the like by a calculator;
s4, adjusting the polarization element to enable the laser beam to be incident on the surface of the wafer according to the designed polarization state and polarization direction;
s5, adjusting a beam shaper to enable the laser beam to be incident on the surface of the wafer according to the set energy distribution form and the rotation direction;
s6, cutting the wafer in the X direction, moving the X-axis motion platform, shifting the two-dimensional scanning galvanometer in the Y direction to enable the laser cutting direction to be matched with the cutting track of the surface of the wafer, moving the Y-axis motion platform after each row of X-direction cutting tasks is completed, and cutting the wafer in the next row of X directions until all the X-direction cutting tasks are completed;
s7, cutting the wafer in the Y direction, moving the Y-axis motion platform, shifting the two-dimensional scanning galvanometer in the X direction to enable the laser cutting direction to be matched with the cutting track of the surface of the wafer, moving the X-axis motion platform after each row of Y-direction cutting tasks is completed, and cutting the wafer in the next row of Y directions until all the Y-direction cutting tasks are completed;
s8, after all X, Y direction cutting tracks are finished, the wafer transmission and pre-alignment system moves the wafer which is finished cutting out of the wafer carrier according to the preset angle and the X, Y direction position
Further, the sequence of the steps S6 and S7 may be changed, or alternate cutting in X, Y direction may be performed.
Further, in steps S6 and S7, when the wafer of 12 inches or more is cut, the computer controls the two-dimensional scanning galvanometer to compensate the straightness of the moving platform when the deviation of the straightness of the moving platform is large.
Compared with the prior art, the invention has the beneficial effects that:
1. the wafer laser cutting equipment based on the linkage of the galvanometer and the platform comprises the polarizing element and the beam shaping device, can adjust the laser polarization state and the beam energy distribution form of the incident laser on the surface of the wafer according to different wafer cutting processes, can adjust in real time, and can improve the adaptability and the cutting quality of wafer cutting.
2. The wafer laser cutting equipment based on the linkage of the galvanometer and the platform comprises the two-dimensional scanning galvanometer arranged on a Z-direction moving mechanism, and the X-axis moving platform, the Y-axis moving platform and the Z-direction moving mechanism are all controlled by a computer in a unified way to realize linkage, so that X, Y-direction cutting of the whole wafer can be finished at one time, the splicing error of the galvanometer is reduced, and the wafer rotating step is avoided.
3. The laser cutting method of the wafer with the linkage of the galvanometer and the platform can adjust the polarization state and the laser energy distribution, and is matched with the laser cutting direction, so that the consistency of the cutting effect in the X direction and the Y direction is improved.
4. According to the laser cutting method for the wafer with the linkage of the galvanometer and the platform, when a large wafer with the size of 12 inches or more is cut and the straightness of the moving platform does not meet the requirement, the straightness of the platform can be compensated through the two-dimensional scanning galvanometer, so that the straightness requirement of the moving platform is reduced.
Drawings
Fig. 1 is a schematic structural diagram of a wafer laser cutting apparatus based on linkage of a galvanometer and a platform according to the present invention.
Fig. 2 is a control schematic diagram of a computer according to the present invention.
Fig. 3 is a schematic cutting diagram of the linkage of the two-dimensional scanning galvanometer and the X, Y shaft moving platform according to the invention.
Fig. 4 is a schematic diagram of laser energy including a gaussian spot a, a circular flat-top spot b, and a square flat-top spot c according to the present invention.
Detailed Description
The invention is described in further detail below with reference to the figures and specific examples. The objects, aspects and advantages of the present invention will become more apparent from the following description. It should be understood that the described embodiments are preferred embodiments of the invention, and not all embodiments.
Referring to fig. 1, a wafer laser cutting device based on the linkage of a galvanometer and a platform is characterized in that:
the device comprises a laser 1, a beam expander 3, a polarizing element 4, a first reflector 5, a second reflector 6, a third reflector 7, a fourth reflector 8, a beam shaper 9, a two-dimensional scanning galvanometer 10, a telecentric field lens 11, an X-axis motion platform 12, a Z-direction motion mechanism 13, a wafer carrying platform 15, a Y-axis motion platform 16, a wafer pre-alignment and transmission system 17, a camera system 18 and a computer 19.
The X-axis motion platform 12 is arranged above the base A, the Y-axis motion platform 16 is arranged on the base A, the Z-direction motion mechanism 13 is arranged at the front end of the X-axis motion platform 12 and is positioned above the Y-axis motion platform 16, the beam shaper 9, the two-dimensional scanning galvanometer 10, the telecentric field lens 11, the fourth reflector 8 and the camera system 18 are arranged on the Z-direction motion mechanism 13, the wafer carrier 15 is arranged on the Y-axis motion platform 16, and the wafer 14 is placed on the wafer carrier 15.
The linear polarization Gaussian beam 2 emitted by the laser 1 is incident into a beam expander 3 to be expanded, then is changed into a circular polarization Gaussian beam or a linear polarization Gaussian beam with a set polarization direction after passing through a polarization element 4, then sequentially passes through a first reflector 5, a second reflector 6, a third reflector 7 and a fourth reflector 8 and then is incident into a beam shaper 9 to be shaped, and the shaped beam is subjected to X, Y-direction deviation through a two-dimensional scanning galvanometer 10 and then is incident into the surface of a wafer 14 through a telecentric field lens 11. If the light beam shaper adopts a square light beam shaper, the energy distribution of the light spot is a circular polarized light spot with a square flat top when the light beam is incident.
Referring to fig. 2, the laser 1, the polarization element 4, the beam shaper 9, the two-dimensional scanning galvanometer 10, the X-axis motion platform 12, the Y-axis motion platform 16, the Z-direction motion mechanism 13, the wafer stage 15, and the wafer transferring and pre-aligning system 17 are controlled by a computer 19.
The laser 1 can adopt a picosecond laser produced by EdgeWave company, the laser wavelength is 532nm, the pulse width is 12ps, the pulse frequency is 1-2000 KHz, the emergent light spot is 3mm, and the polarization type is horizontally polarized linear polarization. The multiplying power of the beam expanding lens 3 is 3 times. The beam shaper 9 is a DOE shaping device produced by HOLOOR. The two-dimensional scanning galvanometer 10 is a high-precision galvanometer of SCANLAB. The focal length of the telecentric field lens 11 is 50 mm. The laser light finally incident on the wafer surface is changed from the initial gaussian distribution to a circularly polarized light spot with a flat-top distribution of 20 μm × 20 μm, as shown in fig. 4.
The polarization element is a lambda/2 wave plate and is used for adjusting the polarization state of the laser, so that the polarization direction of the laser incident to the surface of the wafer and the cutting direction form an included angle of 0 degree, 45 degrees, 90 degrees or any angle; or the polarization element is a lambda/4 wave plate and is used for adjusting the polarization state of the laser, so that the polarization state of the laser incident to the surface of the wafer is circular polarization.
The invention also provides a wafer laser cutting method based on the linkage of the galvanometer and the platform, which comprises the following steps:
s1, the wafer transferring and pre-aligning system 17 places the wafer 14 to be cut on the wafer carrier 15 according to the preset angle and the position X, Y direction;
s2, shooting the characteristic pattern of the wafer surface by the camera system 18, and generating a laser cutting track on the wafer by the calculator 19;
s3, the calculator 19 sets laser cutting technological parameters, such as laser power, laser frequency, focal height, laser polarization state and direction, beam shaping size and direction, cutting speed and the like;
s4, adjusting the polarization element 4 to enable the laser beam to be incident on the surface of the wafer according to the designed polarization state and polarization direction;
and S5, adjusting the beam shaper 9 to enable the laser beam to be incident on the surface of the wafer according to the set energy distribution form and the rotation direction. If the beam shaper 9 is a square beam shaper, adjusting the side length direction of a square spot of the shaped beam to be consistent with the cutting direction of the wafer;
s6, the Z-direction movement mechanism 13 drives the fourth reflector 8, the square spot shaper 9, the two-dimensional scanning galvanometer 10 and the telecentric field lens 11 to move to the set Z-axis focal height for cutting the wafer in the X direction, the X-axis movement platform 12 moves to drive the Z-direction movement mechanism 13, the third reflector 7, the fourth reflector 8, the square spot shaper 9, the two-dimensional scanning galvanometer 10 and the telecentric field lens 11 to move,
the two-dimensional scanning galvanometer 10 shifts in the Y direction to enable the laser cutting direction to be matched with the cutting track of the surface of the wafer, as shown in fig. 3, the cutting line is 20, after each row of X-direction cutting tasks is completed, the Y-axis motion platform moves to perform the next row of X-direction cutting until all the X-direction cutting tasks are completed;
s7, cutting the wafer in the Y direction, moving the Y-axis motion platform to drive the wafer 14 and the wafer carrier 15 to move, keeping the X-axis motion platform 12, the Z-axis motion mechanism 13, the third reflector 7, the fourth reflector 8, the square spot shaper 9, the two-dimensional scanning galvanometer 10 and the telecentric field lens 11 still, shifting the two-dimensional scanning galvanometer in the X direction to enable the laser cutting direction to be matched with the cutting track of the surface of the wafer, moving the X-axis motion platform after each row of Y-direction cutting tasks is completed, and cutting the next row of Y directions until all the Y-direction cutting tasks are completed;
s8, after all X, Y cutting tracks are completed, the wafer transferring and pre-aligning system 17 moves the wafer 14, which has been cut, out of the wafer carrier 15 according to the preset angle and X, Y position.
In steps S6 and S7, when the deviation of the straightness of the moving platform is large, for example, the deviation of the straightness is larger than 3 μm, the two-dimensional scanning galvanometer is used for compensating the straightness of the moving platform when the wafer with 12 inches or more is cut.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not intended to limit the scope of the present invention, and it is obvious that any person skilled in the art can easily conceive of alternative or modified embodiments based on the above embodiments and these should be covered by the present invention.
Claims (10)
1. The utility model provides a wafer laser cutting equipment based on mirror that shakes and platform linkage which characterized in that:
comprises a laser, a beam expander, a polarization element, a first reflector, a second reflector, a third reflector, a fourth reflector, a beam shaper, a two-dimensional scanning galvanometer, a telecentric field lens, an X-axis motion platform, a Z-direction motion mechanism, a wafer carrier, a Y-axis motion platform, a wafer pre-alignment and transmission system, a camera system and a computer,
the X-axis motion platform is erected above the base, the Y-axis motion platform is arranged on the base, the Z-direction motion mechanism is arranged at the front end of the X-axis motion platform and is positioned above the Y-axis motion platform, the light beam shaper, the two-dimensional scanning galvanometer, the telecentric field lens, the fourth reflector and the camera system are arranged on the Z-direction motion mechanism, the wafer carrier is arranged on the Y-axis motion platform,
the linearly polarized Gaussian beam emitted by the laser is incident into a beam expander for beam expansion, then is changed into a circularly polarized Gaussian beam or a linearly polarized Gaussian beam with a set polarization direction after passing through a polarization element, then is incident into a beam shaper for shaping after passing through a first reflector, a second reflector, a third reflector and a fourth reflector in sequence, the shaped beam is subjected to X, Y-direction deviation through a two-dimensional scanning vibrating mirror, then is incident onto the surface of a wafer through a telecentric field lens,
the laser, the polarization element, the beam shaper, the two-dimensional scanning galvanometer, the X-axis motion platform, the Y-axis motion platform, the Z-direction motion mechanism, the wafer carrying platform and the wafer transmission and pre-alignment system are controlled by a computer.
2. The wafer laser cutting equipment based on galvanometer and platform linkage of claim 1, wherein:
the laser wavelength emitted by the laser is 100 nm-11000 nm, the pulse width is 1 ms-10 fs, the pulse frequency is 1-10000 KHz, the polarization type is linearly polarized light, and the energy distribution of light beams is Gaussian distribution.
3. The wafer laser cutting equipment based on galvanometer and platform linkage of claim 1, wherein:
the polarization element is a lambda/2 wave plate and is used for adjusting the polarization state of the laser, so that the polarization direction of the laser incident to the surface of the wafer and the cutting direction form an included angle of 0 degree, 45 degrees, 90 degrees or any angle; or the polarization element is a lambda/4 wave plate and is used for adjusting the polarization state of the laser, so that the polarization state of the laser incident to the surface of the wafer is circularly polarized.
4. The wafer laser cutting equipment based on galvanometer and platform linkage of claim 1, wherein:
the light beam shaper is a Gaussian light spot shaper or a circular light spot shaper or a square light spot shaper.
5. The wafer laser cutting equipment based on galvanometer and platform linkage of claim 1, wherein:
the two-dimensional scanning galvanometer shifts the light beam in the direction of X, Y by a distance of 1nm-100 mm.
6. The wafer laser cutting equipment based on galvanometer and platform linkage of claim 1, wherein:
the telecentric field lens is a single lens or a multi-lens combination lens, and the focal length of the telecentric field lens is 10mm-300 mm.
7. The wafer laser cutting equipment based on galvanometer and platform linkage of claim 1, wherein:
the flatness of the wafer carrying platform is less than 50 mu m.
8. A wafer laser cutting method based on linkage of a galvanometer and a platform is characterized by comprising the following steps:
s1, the wafer transmission and pre-alignment system places the wafer to be cut on the wafer carrying platform according to the preset angle and the position in the X, Y direction;
s2, shooting the characteristic pattern of the wafer surface by a camera system, and determining the laser cutting track on the wafer;
s3, setting laser cutting technological parameters such as laser power, laser frequency, focal height, laser polarization state and direction, beam shaping size and direction, cutting speed and the like by a calculator;
s4, adjusting the polarization element to enable the laser beam to be incident on the surface of the wafer according to the designed polarization state and polarization direction;
s5, adjusting a beam shaper to enable the laser beam to be incident on the surface of the wafer according to the set energy distribution form and the rotation direction;
s6, cutting the wafer in the X direction, moving the X-axis motion platform, shifting the two-dimensional scanning galvanometer in the Y direction to enable the laser cutting direction to be matched with the cutting track of the surface of the wafer, moving the Y-axis motion platform after each row of X-direction cutting tasks is completed, and cutting the wafer in the next row of X directions until all the X-direction cutting tasks are completed;
s7, cutting the wafer in the Y direction, moving the Y-axis motion platform, shifting the two-dimensional scanning galvanometer in the X direction to enable the laser cutting direction to be matched with the cutting track of the surface of the wafer, moving the X-axis motion platform after each row of Y-direction cutting tasks is completed, and cutting the wafer in the next row of Y directions until all the Y-direction cutting tasks are completed;
and S8, after all X, Y direction cutting tracks are finished, the wafer transmission and pre-alignment system moves the wafer which is finished cutting out of the wafer carrier according to the preset angle and the position of X, Y direction.
9. The wafer laser cutting method based on the galvanometer and platform linkage as set forth in claim 8, comprising the steps of:
the sequence of the steps S6 and S7 may be changed, or alternate cutting in X, Y direction may be performed.
10. The wafer laser cutting method based on the galvanometer and platform linkage as set forth in claim 8, comprising the steps of:
in steps S6 and S7, when a wafer of 12 inches or more is cut, the computer controls the two-dimensional scanning galvanometer to compensate the straightness of the moving platform when the deviation of the straightness of the moving platform is large.
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20200324374A1 (en) * | 2019-04-12 | 2020-10-15 | Skyworks Solutions, Inc. | Method of optimizing laser cutting of wafers for producing integrated circuit dies |
| CN113500052A (en) * | 2021-07-28 | 2021-10-15 | 深圳市汇泽激光科技有限公司 | Laser cleaning method, device, computer readable medium and laser cleaning equipment |
| CN114453773A (en) * | 2022-04-12 | 2022-05-10 | 广州志橙半导体有限公司 | Laser cutting equipment for silicon carbide wafer |
| CN114888429A (en) * | 2022-06-10 | 2022-08-12 | 星控激光科技(上海)有限公司 | Device for laser processing of engine flame tube air film hole based on five-axis numerical control machine tool |
| CN117428350A (en) * | 2023-12-19 | 2024-01-23 | 珠海市申科谱工业科技有限公司 | Single-head double-platform film sheet laser cutting machine |
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2021
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| US20200324374A1 (en) * | 2019-04-12 | 2020-10-15 | Skyworks Solutions, Inc. | Method of optimizing laser cutting of wafers for producing integrated circuit dies |
| US11701739B2 (en) * | 2019-04-12 | 2023-07-18 | Skyworks Solutions, Inc. | Method of optimizing laser cutting of wafers for producing integrated circuit dies |
| CN113500052A (en) * | 2021-07-28 | 2021-10-15 | 深圳市汇泽激光科技有限公司 | Laser cleaning method, device, computer readable medium and laser cleaning equipment |
| CN114453773A (en) * | 2022-04-12 | 2022-05-10 | 广州志橙半导体有限公司 | Laser cutting equipment for silicon carbide wafer |
| CN114453773B (en) * | 2022-04-12 | 2022-06-24 | 广州志橙半导体有限公司 | Laser cutting equipment for silicon carbide wafer |
| CN114888429A (en) * | 2022-06-10 | 2022-08-12 | 星控激光科技(上海)有限公司 | Device for laser processing of engine flame tube air film hole based on five-axis numerical control machine tool |
| CN114888429B (en) * | 2022-06-10 | 2023-07-14 | 星控激光科技(上海)有限公司 | Device for processing flame tube air film hole of engine based on five-axis numerical control machine tool |
| CN117428350A (en) * | 2023-12-19 | 2024-01-23 | 珠海市申科谱工业科技有限公司 | Single-head double-platform film sheet laser cutting machine |
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