CN116475589A - Swing type cutting-measuring integrated method based on optical rotation system - Google Patents
Swing type cutting-measuring integrated method based on optical rotation system Download PDFInfo
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- CN116475589A CN116475589A CN202310510146.XA CN202310510146A CN116475589A CN 116475589 A CN116475589 A CN 116475589A CN 202310510146 A CN202310510146 A CN 202310510146A CN 116475589 A CN116475589 A CN 116475589A
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- 238000005520 cutting process Methods 0.000 claims abstract description 112
- 238000012545 processing Methods 0.000 claims abstract description 26
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- 238000009827 uniform distribution Methods 0.000 claims abstract description 3
- 239000010410 layer Substances 0.000 claims description 15
- 230000008569 process Effects 0.000 claims description 10
- 238000003698 laser cutting Methods 0.000 claims description 9
- 239000002356 single layer Substances 0.000 claims description 8
- 238000004458 analytical method Methods 0.000 claims description 7
- 238000009966 trimming Methods 0.000 claims description 7
- 238000003754 machining Methods 0.000 claims description 6
- 238000005259 measurement Methods 0.000 claims description 5
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
The invention discloses an oscillating type cutting-measuring integrated method based on an optical rotation system, aiming at the problems of small cutting depth, large cutting taper, more deposition and recasting at a cut, poor quality of a cutting surface, low cutting efficiency and the like in cutting and processing of difficult-to-process materials. According to the method, the translation and deflection of an incident light beam are realized by controlling a translation module and an offset module of an optical rotation system, the shape and the size of a circular ring light spot are controlled, the real-time dynamic uniform distribution of energy in a cutting track and the effective elimination of laser products are realized by combining the variable-speed reciprocating motion of a moving platform, the low-energy linear scanning finishing cutting surface is carried out after the layer-by-layer removal, and the shape of the cutting surface with zero taper, positive taper and reverse taper can be realized by combining the circular ring light spot generated by a multi-optical wedge system in a swinging mode so as to meet different processing requirements. The invention is based on a multi-optical wedge system, combines the variable speed swing of a moving platform, and can realize the cutting of difficult-to-process materials with large depth-to-diameter ratio, zero taper, high quality and high efficiency.
Description
Technical Field
The invention belongs to the field of special processing, and particularly relates to a swing type cutting-measuring integrated method based on an optical rotation system.
Background
At present, the main cutting modes of difficult-to-process materials (ceramic matrix composite materials and resin matrix composite materials) comprise traditional laser, high-pressure water jet, linear cutting, ultrashort pulse laser and the like. The traditional laser cutting processing utilizes the high temperature generated by the focused high-energy laser beam to melt or vaporize the material, but the cutting surface of the material can generate defects such as a heat affected zone, layering, fiber pulling, fiber end expansion and the like; although the high-pressure water jet is a cold processing method, the problems of layering, cracking and the like exist, and the processing quality is unstable; the diamond wire cutting has the defects of low efficiency, layering burrs at the inlet and the outlet of the composite material, quick abrasion of a wire saw and the like when the composite material is processed, and the composite material is easy to generate defects of a heat affected zone, layering, fiber pulling, cracking and the like. With the development of modern technology, ultra-short pulse laser cutting is used as a non-contact processing mode, has the advantages of high peak power, short interaction time with materials, small heat accumulation effect and the like, and is an important cutting processing method of composite materials, and is widely used for precise cutting processing of various composite materials.
However, the output power and the laser spot of the ultra-short pulse laser are smaller, so that the problems of small cutting depth, included angle of a cutting surface and the like exist in cutting processing, and the problems of deposition, recasting, poor quality of a hole wall and the like can occur at a cutting entrance. In the patent with publication number CN 115351439A, a laser cutting device and a rapid cutting method based on laser angle control are proposed, that is, by swing cutting, under the condition of not improving power and not changing the proportion of a focusing mirror, the absorptivity of a material to laser light is improved, and the minimum focal position is placed on the surface of a workpiece material to be processed to realize the minimum slit, so that the cutting speed is improved. In the method, the cutting speed is increased, and meanwhile, the cutting depth cannot be greatly influenced, because the smaller cutting seam can influence the transmission quality of laser in the deeper cutting thickness, and the cutting of materials with large thickness cannot be realized; patent CN 115673569A and patent CN 108568597A disclose a medium plate swinging laser cutting method and a laser beam reciprocating swinging type processing device and method, which utilize a laser head to swing, and realize deeper cutting depth on the premise of ensuring processing quality. However, only considering the problem of cutting depth, the processing efficiency is not further improved, the laser spot diameter is very small, and is usually only 10-20 mu m, the processing method greatly reduces the cutting efficiency, the laser energy density is larger than that of the center position of a cutting seam when swinging to an end point, a convex structure is formed at the bottom of the cutting seam when the thick plate is processed, and the quality and the dimensional accuracy of a cutting surface are very easy to be reduced under the action of laser reflection.
The above problems greatly limit the practical application of the ultrashort pulse laser cutting technology. Therefore, a swing type cutting-measuring integrated method based on an optical rotation system is needed at present, which can ensure that the dimension precision of an access opening is ensured in the laser cutting process of ultra-short pulse, the quality of a hole wall is improved, and the cutting efficiency is improved on the premise of high processing quality.
Disclosure of Invention
According to the technical problems, the swing type cutting-measuring integrated method based on the optical rotation system can realize high-quality and high-efficiency cutting on different difficult-to-process materials, form circular ring light spots through the action of the optical rotation system, perform layer-by-layer scanning cutting, combine variable-speed swing and ultrasonic vibration of a moving platform, solve the problems of shallow cutting depth, large kerf taper and the like caused by accumulation of laser products, and improve the processing quality and cutting efficiency of cutting.
The invention adopts the following technical means:
an integrated swing type cutting-measuring method based on an optical rotation system comprises the following steps:
step S1: acquiring dimension data of a workpiece to be processed, wherein the dimension data comprise thickness, cutting length and section shape;
step S2: setting a machining track according to the type of laser and the size of a workpiece to be machined, writing a speed changing program executed in the machining track, positioning and mounting the workpiece to be machined on a moving platform, starting a laser to emit a laser beam to the surface of the workpiece, completing laser focusing by adjusting a laser system, and setting the amplitude and the frequency of ultrasonic vibration of the moving platform;
step S3: starting a rotary cutting system to form a circular ring light spot, starting ultrasonic vibration of auxiliary gas and a platform to perform single-layer scanning cutting, wherein the method comprises the following steps of S31: high energy density swing scan cut, S32: the image sensing module performs real-time morphology measurement analysis and uploads computer calculation analysis in the cutting process, and S33: the computer controls the laser to carry out single-beam straight line trimming on the cutting surface with low energy density according to the shape. Repeating the steps after the single-layer cutting is finished, and scanning and cutting layer by layer until the cutting is finished;
step S4: after the processing is finished, the image sensing module detects whether the cutting quality is qualified or not, and if the cutting quality is not qualified, the single beam straight line trimming with low energy density is carried out on the cutting quality until the detection quality is qualified;
step S5: and closing the starting laser, auxiliary gas and ultrasonic vibration, and taking down the workpiece.
Further, the circular ring light spot of the swing type cutting-measuring integrated method based on the optical rotation system is formed by laser emitted by a laser under the optical rotation system, the optical rotation system comprises a translation module and an offset module, wherein the translation module is used for realizing translation of an incident light beam, and the offset module is used for realizing angle deflection of the incident light beam, so that adjustment of different cutting section shapes and circular ring light spot sizes can be realized.
Further, the reciprocating motion can enlarge the cutting width, large-thickness cutting is achieved, the variable-speed reciprocating motion is used for adjusting the even distribution of energy in the cutting groove, the energy density of the circular ring light spots at the cutting end points is higher due to the direction change of the moving platform, and uniform high-quality cutting is achieved by adjusting the processing of the small feeding speed of the circular ring light spots at the central position in the cutting groove.
The ultrasonic vibration of the movable platform is that the ultrasonic vibration amplitude of the platform along the Z-axis direction is 2-10 mu m, the frequency is 20-50kHz, and laser ablation products can be effectively removed to form a high-quality cutting section.
Further, after the number of cutting layers is large, the offset module and the translation module of the optical rotation system are adjusted, the light beam is set to be an inverted cone circular ring light spot, the focusing lens sets the focusing position to be the surface to be processed, the laser ablation cutting entrance can be effectively avoided, and high-quality large-thickness workpiece cutting is realized.
Furthermore, the different cutting section shapes can realize the parallel section, the front cone section and the back cone section by controlling the translation module and the offset module, thereby meeting different processing requirements.
Further, the image sensing module is used for detecting the surface morphology after laser cutting in real time, transmitting data to a computer, and carrying out single-beam straight line finishing by controlling the optical rotation system after the computer processes and analyzes the data.
Further, the laser selection includes ultra-short pulse lasers such as picosecond lasers and femtosecond lasers.
Compared with the prior art, the invention has the following advantages:
1. the method is based on an optical wedge rotating system, realizes laser circular ring faculae by controlling the translation module and the offset module, can avoid the influence of uneven energy distribution caused by laser Gaussian beams under high energy density, realizes consistency of processing depth, further ensures processing quality, can process parallel cross sections, forward taper cross sections and reverse taper cross section shapes by controlling the translation module and the offset module, realizes different cutting requirements, and provides a solution for splicing and assembling of plates;
2. in the method, the cutting step of single-beam straight line trimming with low energy density is carried out by the steps of high energy density swing scanning cutting in layer-by-layer scanning cutting, real-time morphology measurement by an image sensing module, uploading computer analysis and computer control of a laser, thus realizing cutting and measurement integration, carrying out real-time dynamic adjustment of beam shape and finally realizing high-quality cutting surface;
3. according to the platform swing feeding method, under the combination of ultrasonic vibration and auxiliary gas, the laser irradiation area can be increased, the accumulation of slit products is reduced, the workpiece with large thickness is cut, the problem of small laser cutting depth is solved, the variable speed feeding of the platform ensures the consistent laser removal amount, and the cutting quality and the cutting efficiency are further improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings may be obtained according to the drawings without inventive effort to a person skilled in the art.
FIG. 1 is a flow chart of a swing type layer-by-layer cutting method based on an optical wedge rotation system;
FIG. 2 is a schematic diagram of a wobble cut process of the optical wedge rotation system of the present invention;
FIG. 3 is a schematic diagram of a different wedge combination in the wedge rotation system of the present invention;
FIG. 4 is a schematic diagram of a wobble layer-by-layer cutting and single beam finishing process of the present invention;
FIG. 5 is a schematic illustration of the variable speed feed of the mobile platform of the present invention;
FIG. 6 is a schematic diagram showing a comparison of variable and constant ablation according to the present invention
Fig. 7 is a schematic view of various cut cross-sectional shapes of the present invention.
Detailed Description
It should be noted that, without conflict, the embodiments of the present invention and features of the embodiments may be combined with each other. The invention will be described in detail below with reference to the drawings in connection with embodiments.
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. The following description of at least one exemplary embodiment is merely exemplary in nature and is in no way intended to limit the invention, its application, or uses. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the present invention. As used herein, the singular is also intended to include the plural unless the context clearly indicates otherwise, and furthermore, it is to be understood that the terms "comprises" and/or "comprising" when used in this specification are taken to specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof.
The relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless it is specifically stated otherwise. Meanwhile, it should be clear that the dimensions of the respective parts shown in the drawings are not drawn in actual scale for convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail, but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further discussion thereof is necessary in subsequent figures.
In the description of the present invention, it should be understood that the azimuth or positional relationships indicated by the azimuth terms such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal", and "top, bottom", etc., are generally based on the azimuth or positional relationships shown in the drawings, merely to facilitate description of the present invention and simplify the description, and these azimuth terms do not indicate and imply that the apparatus or elements referred to must have a specific azimuth or be constructed and operated in a specific azimuth, and thus should not be construed as limiting the scope of protection of the present invention: the orientation word "inner and outer" refers to inner and outer relative to the contour of the respective component itself.
Spatially relative terms, such as "above … …," "above … …," "upper surface at … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial location relative to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "over" other devices or structures would then be oriented "below" or "beneath" the other devices or structures. Thus, the exemplary term "above … …" may include both orientations of "above … …" and "below … …". The device may also be positioned in other different ways (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
In addition, the terms "first", "second", etc. are used to define the components, and are only for convenience of distinguishing the corresponding components, and the terms have no special meaning unless otherwise stated, and therefore should not be construed as limiting the scope of the present invention.
As shown in fig. 1, the embodiment of the invention discloses a swing type cutting-measuring integrated method based on an optical rotation system, which comprises the following steps:
step S1: acquiring dimension data of a workpiece to be processed, wherein the dimension data comprise thickness, cutting length and section shape;
step S2: setting a machining track according to the type of laser and the size of a workpiece to be machined, writing a speed changing program executed in the machining track, positioning and mounting the workpiece to be machined on a moving platform, starting a laser to emit a laser beam to the surface of the workpiece, completing laser focusing by adjusting a laser system, and setting the amplitude and the frequency of ultrasonic vibration of the moving platform; the processing track is the track of the mobile platform;
step S3: starting a rotary cutting system, forming a circular ring light spot by laser, starting ultrasonic vibration of auxiliary gas and a platform, and performing single-layer scanning cutting, wherein the method comprises the following steps of S31: high energy density swing scan cut, S32: the image sensing module performs real-time morphology measurement analysis and uploads computer calculation analysis in the cutting process, and S33: the computer controls the laser to carry out single-beam straight line trimming on the cutting surface with low energy density according to the shape. Repeating the steps after the single-layer cutting is finished, and carrying out multi-layer scanning cutting until the cutting is finished; in this embodiment, the high energy density involved: 200J/cm 2 Above, low energy density: 10-200J/cm 2 . In the step, after the rotary cutting system is started, the shape of the cutting surface can be selected according to the actual application condition, such as parallel, positive cone and reverse cone;
step S4: after the processing is finished, the image sensing module detects whether the cutting quality is qualified or not, and if the cutting quality is not qualified, the single beam straight line finishing with low energy density is carried out until the detection quality is qualified;
step S5: and closing the starting laser, auxiliary gas and ultrasonic vibration, and taking down the workpiece.
As shown in fig. 2 and 3, the swinging type layer-by-layer cutting method based on the optical wedge rotating system is composed of a laser 1, a beam expander 2, a reflecting mirror 3, a workpiece 4, an image sensing module 5, an optical wedge rotating system 6 and a computer 7, wherein the optical wedge rotating system 6 comprises a translation module and a deflection module, the translation module can translate an incident beam, the deflection module can realize the angle deflection of the incident beam, and after the laser emitted by the laser 1 is collimated by the beam expander 2, circular ring light spots can be realized by controlling the optical wedge rotating system 6, so that adjustment of different cutting section shapes and circular ring light spot sizes can be realized. The workpiece 4 is arranged on a moving platform, and under the irradiation of laser circular light spots, the platform performs swing feeding, namely swing (expanding cutting width) in a cutting groove in the Y direction and micro feeding in the X direction, meanwhile, in the cutting processing process, ultrasonic vibration in the Z direction is also generated, the amplitude is 2-10 mu m, and the frequency is 20-50kHz, so that laser ablation products can be effectively removed. At least one mirror 3 may also be provided to accomplish the angular adjustment of the collimated laser light. Specifically, the translation module may be composed of two opposite optical wedges with smaller wedge angles, or may be composed of a single or multiple parallel plates. The deflection module can be composed of two opposite optical wedges with smaller wedge angles, or can be composed of a single optical wedge with larger wedge angle. The two modules exist in the system as independent modules, and different optical wedge combinations can be selected according to different processing requirements so as to meet the requirements.
As shown in fig. 4, after each layer is scanned and cut, the image sensing module 5 measures the morphology of the cut groove, and then transmits the measured morphology to the computer 7 for analysis, and then performs single-beam straight line trimming of the cut surface with low energy density. When the number of layers is small, the single-layer scanning adopts forward cone circular ring light spot high-energy density swing scanning cutting, and when the number of layers is large, the single-layer scanning adopts reverse cone circular ring light spot high-energy density swing scanning cutting;
as shown in fig. 5 and 6, the energy density of the circular ring light spot at the cutting end point (zone I) is higher due to the reversing problem of the moving platform in the swinging process, so that the laser energy density of the zone I is larger than that of the zone II, the swinging feeding of the moving platform is controlled to be variable-speed, the uniform distribution of energy in the cutting groove can be adjusted, the small feeding speed of the circular ring light spot at the central position (zone II) in the groove is adjusted to process, and the large feeding speed at the cutting end point (zone I) is adjusted, so that uniform high-quality cutting is realized.
As shown in fig. 7, the parallel section (a), the back taper section (B) and the front taper section (C) can be realized by controlling the translation module and the offset module, so that laser ablation of a cutting inlet can be effectively avoided, high-quality large-thickness workpiece cutting can be realized, and different processing requirements can be met by different section shapes.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the invention.
Claims (8)
1. An integrated swing type cutting-measuring method based on an optical rotation system is characterized by comprising the following steps:
step S1: acquiring dimension data of a workpiece to be processed, wherein the dimension data comprise thickness, cutting length and section shape;
step S2: setting a machining track according to the type of laser and the size of a workpiece to be machined, writing a speed changing program executed in the machining track, positioning and mounting the workpiece to be machined on a moving platform, starting a laser to emit a laser beam to the surface of the workpiece, completing laser focusing by adjusting a laser system, and setting the amplitude and the frequency of ultrasonic vibration of the moving platform;
step S3: starting a rotary cutting system to form a circular ring light spot, starting ultrasonic vibration of auxiliary gas and a platform to perform single-layer scanning cutting, wherein the method comprises the following steps of S31: high energy density swing scan cut, S32: the image sensing module performs real-time morphology measurement in the cutting process and uploads the image sensing module to a computer for analysis, and S33: the computer controls the laser to carry out single-beam straight line trimming cutting surface with low energy density according to the shape; repeating the steps after the single-layer cutting is finished, and scanning and cutting layer by layer until the cutting is finished;
step S4: after the processing is finished, the image sensing module detects whether the cutting quality is qualified or not, and if the cutting quality is not qualified, the single beam straight line trimming with low energy density is carried out on the cutting quality until the detection quality is qualified;
step S5: and closing the starting laser, auxiliary gas and ultrasonic vibration, and taking down the workpiece.
2. The swing type cutting-measuring integrated method based on the optical rotation system according to claim 1, wherein: the circular ring light spot is formed by laser emitted by the laser after being collimated by the beam expander and under the action of the optical rotation system, the optical rotation system comprises a translation module and an offset module, wherein the translation module is used for realizing translation of an incident light beam, and the offset module is used for realizing angle deflection of the incident light beam, so that adjustment of different cutting section shapes and circular ring light spot sizes is realized.
3. The swing type cutting-measuring integrated method based on the optical rotation system according to claim 1, wherein: the movable platform is used for carrying out swing feeding, and the cutting width is enlarged through the reciprocating motion of the movable platform in the swing process, so that the large-thickness cutting is realized; the reciprocating motion is variable-speed reciprocating motion, and the uniform distribution of energy in the cutting groove is regulated through the variable-speed reciprocating motion.
4. The swing type cutting-measuring integrated method based on the optical rotation system according to claim 1, wherein: the moving platform carries out ultrasonic vibration along the Z-axis direction, the amplitude of the ultrasonic vibration is 2-10 mu m, and the frequency is 20-50kHz.
5. The swing type cutting-measuring integrated method based on the optical rotation system according to claim 1, wherein: after a certain number of layers are cut, an offset module and a translation module of the optical rotation system are adjusted, the light beam is set to be a reverse cone circular ring light spot, and a focusing lens sets a focusing position to be a surface to be processed.
6. The swing type cutting-measuring integrated method based on the optical rotation system according to claim 2, wherein: the parallel section, the front cone section and the back cone section are realized by controlling the translation module and the offset module, so that different processing requirements are met.
7. The swing type cutting-measuring integrated method based on the optical rotation system according to claim 1, wherein: in the processing process, the image sensing module detects the surface morphology after laser cutting in real time, transmits data to a computer, and carries out single-beam straight line finishing by controlling the optical rotation system after the computer processes and analyzes.
8. The swing type cutting-measuring integrated method based on the optical rotation system according to claim 1, wherein: in step S2, the selection of the laser includes ultrashort pulse laser, specifically including picosecond laser and femtosecond laser.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117921213A (en) * | 2024-03-24 | 2024-04-26 | 成都沃特塞恩电子技术有限公司 | Laser cutting method and device for controlling kerf width and computer equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117921213A (en) * | 2024-03-24 | 2024-04-26 | 成都沃特塞恩电子技术有限公司 | Laser cutting method and device for controlling kerf width and computer equipment |
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