CN218657308U - Laser processing system - Google Patents
Laser processing system Download PDFInfo
- Publication number
- CN218657308U CN218657308U CN202223150364.7U CN202223150364U CN218657308U CN 218657308 U CN218657308 U CN 218657308U CN 202223150364 U CN202223150364 U CN 202223150364U CN 218657308 U CN218657308 U CN 218657308U
- Authority
- CN
- China
- Prior art keywords
- laser
- focusing
- laser beam
- focusing device
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The application discloses a laser processing system. The laser processing system comprises a laser, a focusing device, a vibrating mirror device and a focusing device, wherein the laser is suitable for emitting laser beams, the focusing device is arranged at the downstream of the laser and is suitable for adjusting the focal length of the laser processing system to process a workpiece along the Z direction, the vibrating mirror device is arranged at the downstream of the laser and is suitable for adjusting the motion track of the laser beams to process the workpiece along the X direction and the Y direction, and the focusing device is arranged at the downstream of the focusing device and the vibrating mirror device and is suitable for focusing the laser beams on the workpiece to form focusing spots. According to the technical scheme, the focusing device and the vibrating mirror device are arranged, the focusing device changes the focal length of a system to achieve processing of the Z direction of a workpiece, the vibrating mirror device achieves movement of the X direction and the Y direction of a laser beam, the laser beam moves in a two-dimensional plane, the focusing device is matched with the Z direction of the focusing device to achieve three-dimensional processing of the workpiece, and the processing speed is increased.
Description
Technical Field
The application relates to the technical field of laser processing, in particular to a laser processing system.
Background
Compared with the traditional mechanical processing technology, the laser processing technology has the effects of cleanness, no pollution and the like, but most of the existing laser processing technologies process workpieces with thinner thickness, and if the workpiece thickness is larger, the processing efficiency is lower.
SUMMERY OF THE UTILITY MODEL
The present application is directed to solving, at least to some extent, the technical problems in the related art. To this end, the present application proposes a laser processing system.
To achieve the above object, the present application discloses a laser processing system for processing a workpiece, the laser processing system comprising:
a laser adapted to emit a laser beam;
the focusing device is arranged at the downstream of the laser and is suitable for adjusting the focal length of the laser processing system so as to process the workpiece along the Z direction;
the galvanometer device is arranged at the downstream of the laser and is suitable for adjusting the motion track of the laser beam so as to process the workpiece along the X direction and the Y direction; and
and the focusing device is arranged at the downstream of the focusing device and the galvanometer device and is suitable for focusing the laser beam on the workpiece to form a focusing light spot.
In some embodiments of the present application, the focusing apparatus is disposed upstream of the galvanometer apparatus.
In some embodiments of the present application, the focusing apparatus includes a deformable mirror and/or a variable focus lens.
In some embodiments of the present application, the deformable mirror of the focusing apparatus has a planar state and an arcuate state; and/or the variable focus lens of the focusing apparatus has a planar state and an arcuate state.
In some embodiments of the present application, the galvanometer device includes an X-axis galvanometer adapted to change a displacement of the laser beam in an X direction and a Y-axis galvanometer adapted to change a displacement of the laser beam in a Y direction.
In some embodiments of the present application, the focusing device comprises a focusing lens.
In some embodiments of the present application, an optical path distance between the focusing apparatus and the focused light spot is a focal length f1,
the distance of an optical path between the focusing device and the focusing device is B,
the included angle formed by the laser beam passing through the focusing device is theta,
the diameter of a light spot formed by the laser beam striking the focusing device is D,
d =2 (f 1-B) tan (theta/2) is satisfied.
In some embodiments of the present application, the laser processing system further comprises a deflection device disposed between the laser and the focusing device, adapted to rotate the laser beam.
In some embodiments of the present application, the deflection device is disposed between the focusing device and the galvanometer device.
In some embodiments of the present application, the deflection device comprises at least one of an acousto-optic deflector, an electro-optic deflector, a wedge prism, and a deflection mirror.
In some embodiments of the present application, the laser processing system further comprises a shaping device disposed between the laser and the focusing device, adapted to shape the laser beam.
In some embodiments of the present application, the shaping device is disposed between the laser and the focusing device.
In some embodiments of the present application, the shaping device comprises a beam expander or the shaping device comprises a beam expander and a flat top shaper.
According to the technical scheme, the focusing device and the mirror vibration device are arranged, the focusing device changes the focal length of the system to process the Z direction of the workpiece, the mirror vibration device achieves movement of the X direction and the Y direction of the laser beam, the laser beam moves in a two-dimensional plane, three-dimensional processing of the workpiece is achieved by cooperation with processing of the Z direction of the focusing device, and processing speed is increased. In addition, through setting up deflection device, deflection device rotates laser beam, realizes the rotary-cut effect to the work piece, further improves the process velocity. The whole laser processing system is compact and stable in structural arrangement, and the processing quality is effectively improved.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic diagram of a laser machining system in some embodiments;
FIG. 2 is a schematic view of a laser machining system in some embodiments;
FIG. 3 is a schematic diagram of a state change of a focus mount in some embodiments;
FIG. 4 is a schematic diagram of a state change of a focus mount in some embodiments;
FIG. 5 is a schematic view of a focusing apparatus in an arcuate state according to some embodiments;
FIG. 6 is a schematic view of a focused spot circle scan machining in some embodiments (where the path of the left portion in FIG. 6 is scanned in the XY direction and the path of the right portion is zoomed in the Z direction);
FIG. 7 is a schematic view of a focused spot scanning along concentric circular paths for processing in some embodiments;
FIG. 8 is a schematic view of a focused spot processing along a line scan in some embodiments;
FIG. 9 is a schematic view of a focused spot spiral scan process in some embodiments;
FIG. 10 is a flow chart of a laser machining method in some embodiments;
fig. 11 is a flow chart of a laser machining method in some embodiments.
The reference numbers illustrate:
a laser 1000;
a shaping device 2000;
a focusing device 3000, a deformable mirror 3100;
a deflection device 4000;
a galvanometer device 5000, an X-axis galvanometer 5100, a Y-axis galvanometer 5200;
a focusing device 6000 to focus the light spot 6100;
and a workpiece 7000.
The implementation, functional features and advantages of the objectives of the present application will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that all the directional indicators (such as upper, lower, left, right, front, and rear … …) in the present embodiment are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.
In this application, unless expressly stated or limited otherwise, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In addition, descriptions in this application as to "first", "second", etc. are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present application.
The present application is directed to a laser processing system, as shown in fig. 1, which in some embodiments includes a laser 1000, a focusing device 3000, a galvanometer device 5000, and a focusing device 6000.
The laser 1000 is a device capable of generating a laser beam, the laser beam has a certain energy, the focusing device 3000, the mirror vibration device 5000 and the focusing device 6000 are arranged on a propagation path of the laser beam, the propagation path of the laser beam is a light path, and the laser beam is focused on a workpiece 7000 to form a focusing spot 6100 through the action of the focusing device 3000, the mirror vibration device 5000 and the focusing device 6000 on the laser beam, so that the workpiece 7000 is processed.
The focusing device 3000 is a device capable of adjusting the focal length of the laser processing system, the focusing device 3000 is disposed downstream of the laser 1000 and located on the optical path, and the laser beam emitted from the laser 1000 is processed by the focusing device 3000 so that the focal length can be adjusted. It can be understood that the focal length is the optical path distance between the focusing device 3000 and the focusing spot 6100 formed by the focusing device 6000, the focusing device 6000 can focus the laser beam to concentrate the energy to process the workpiece 7000, and the focusing device 3000 can change the focal length, when the focal length is changed, the focusing spot 6100 can move, and the movement is along the optical path, so that the workpiece 7000 can be processed in the thickness direction, which is defined as the Z direction. For example, a laser beam is irradiated to the workpiece 7000 from top to bottom, and when the focusing apparatus 3000 operates, the focal length is changed to move the focusing spot 6100, and at this time, the focusing spot 6100 moves along the Z direction, that is, the up-down direction, so as to machine the workpiece 7000 in the thickness direction.
The focusing device 6000 is a device for focusing the laser beam processed by the focusing device 3000 and the galvanometer device 5000 to form a focused light spot 6100, so that the energy of the laser beam is converged to realize the processing of the workpiece 7000, and the focusing device 6000 enables the laser beam to form the focused light spot 6100 with uniform size on the workpiece 7000, thereby effectively realizing the processing of the workpiece 7000. The focusing device 6000 may be a focusing lens, and the focusing lens may be of various types, for example, a telecentric flat-field lens may be used, and the telecentric flat-field lens has advantages of both a telecentric lens and a flat-field lens.
It can be understood that the focusing device 3000 and the mirror-vibrating device 5000 are disposed downstream of the laser 1000 and upstream of the focusing device 6000, and the laser beam after the processing of the focusing device 3000 and the mirror-vibrating device 5000 is emitted to the focusing device 6000 as long as it is ensured that the laser beam after the processing of the focusing device 3000 and the mirror-vibrating device 5000 is emitted to the focusing device 6000, so that various schemes can be selected for the relative positions of the focusing device 3000 and the mirror-vibrating device 5000.
In the first scheme, the galvanometer device 5000 is disposed upstream of the focusing device 3000, that is, the laser beam is processed by the galvanometer device 5000 and then by the focusing device 3000.
In the second scheme, the focusing device 3000 is disposed upstream of the galvanometer device 5000, that is, the laser beam is processed by the focusing device 3000 and then by the galvanometer device 5000.
Above two kinds of schemes all can realize processing work piece 7000 along XYZ direction to laser beam to the realization is to work piece 7000 three-dimensional processing, but in the first scheme, because mirror device 5000 needs control laser beam to realize that X direction and Y direction remove, when laser beam takes place X direction and Y direction removal, shine focusing device 3000 and will take place corresponding removal to the facula that forms, need synchronous control focusing device 3000 to follow the change at this moment and just can effectively handle laser beam. In the second scheme, since the galvanometer device 5000 is placed at the downstream of the focusing device 3000, the focal length of the focusing device 3000 is controlled to change, and the laser beam cannot move along the XY direction, so that the work of the galvanometer device 5000 is not affected by the work of the focusing device 3000, the system structure is simplified, the processing precision is improved, and the processing of the 7000 three-dimensional direction of the workpiece is more conveniently realized.
In some embodiments of the present application, as shown in fig. 3 and 4, the focusing apparatus 3000 includes a deformable mirror 3100, the deformable mirror 3100 reflects the incident laser beam, the deformable mirror 3100 may be driven by a piezoelectric ceramic, and has a mirror surface, and the mirror surface may be changed into various shapes, so that the reflected laser beam forms light spots with different sizes on the focusing apparatus 6000, thereby implementing the change of the focal length. For example, taking the case where the laser beam is incident on the workpiece 7000 from top to bottom, the deformable mirror 3100 has a flat state and an arc state, and the deformable mirror 3100 can be switched between the flat state and the arc state, and when the deformable mirror 3100 is in the flat state, the focused spot 6100 formed by the focusing device 6000 is located at an upper position, and when the deformable mirror 3100 is switched from the flat state to the arc state, the focused spot 6100 formed by the focusing device 6000 is moved from top to bottom, thereby achieving the Z-direction processing of the workpiece 7000.
The focusing apparatus 3000 may also include a variable focus lens, such as a liquid zoom lens, an acousto-optic ultrafast variable focus lens, and the like, where the variable focus lens is a lens whose shape can be changed to realize zooming. Like deformable mirror 3100, a variable focus lens also has a planar state and an arcuate state, and is switchable from the planar state to the arcuate state to achieve zooming for machining the Z-direction of workpiece 7000.
It will be appreciated that in some embodiments of the present application, the focusing apparatus 3000 may utilize the deformable mirror 3100 alone, may utilize the variable focus lens alone, or may utilize both the deformable mirror 3100 and the variable focus lens in combination.
In some embodiments of the present application, as shown in fig. 1, the galvanometer arrangement 5000 includes an X-axis galvanometer 5100 and a Y-axis galvanometer 5200, the X-axis galvanometer 5100 being adapted to vary the displacement of the laser beam in the X direction and the Y-axis galvanometer 5200 being adapted to vary the displacement of the laser beam in the Y direction. For example, X-axis galvanometer 5100 and Y-axis galvanometer 5200 are two-sided mirrors, and the angle of reflection is controlled by a computer system, and X-axis galvanometer 5100 and Y-axis galvanometer 5200 can scan along the X-axis and Y-axis, respectively, so that the laser beam moves in the XY two-dimensional plane to realize processing of workpiece 7000 in the XY direction.
By last, through setting up focusing device 3000 and mirror device 5000 that shakes, thereby focusing device 3000 changes the focus of system and realizes the processing to work piece 7000's Z direction, shakes mirror device 5000 and realizes the removal of laser beam X direction and Y direction to realize laser beam at two-dimensional plane internal motion, cooperation focusing device 3000Z direction's processing realizes the three-dimensional processing to work piece 7000, thereby improves the process velocity. The optical system has compact and stable structural arrangement and effectively improves the processing quality.
Optionally, referring to fig. 5, in some embodiments of the present application, an optical path distance between the focusing device 3000 and the focusing spot 6100 formed by the focusing device 6000 is defined as a focal length f1, taking the focusing device 3000 including the deformable mirror 3100 as an example, when a laser beam irradiates the deformable mirror 3100, a spot is formed, the laser beam passes through the focusing device 6000 to form the focused spot 6100, and an optical path distance between a center of the former spot and a center of the latter focused spot 6100 is defined as the focal length f 1. Taking the focusing device 3000 including a zoom lens as an example, the optical path distance between the optical center of the zoom lens and the center of the focusing spot 6100 is the focal length f 1. The optical path distances are similar hereinafter and will not be repeated. The light path distance between the focusing device 3000 and the focusing device 6000 is B, the included angle formed by the laser beam passing through the focusing device 6000 is theta, the diameter of a light spot formed by the laser beam irradiating on the focusing device 6000 is D, and D =2 (f 1-B) tan (theta/2) is met, so that the focal length f1 is rapidly changed by meeting the above condition, and the processing efficiency in the Z direction is greatly improved.
As shown in fig. 2, 6 and 9, in some embodiments of the present application, the laser processing system further includes a deflecting device 4000, the deflecting device 4000 is disposed between the laser 1000 and the focusing device 6000 and is adapted to rotate the laser beam, and the deflecting device 4000 may be at least one of an acousto-optic deflector, an electro-optic deflector, a wedge prism and a deflection mirror.
When the focused light spot 6100 is projected onto the workpiece 7000, the material of the workpiece 7000 is melted by the focusing of the laser, and at this time, the focused light spot 6100 and the workpiece 7000 are relatively stationary, and by providing the deflecting device 4000, the deflecting device 4000 can make the laser beam rapidly rotate, and the rapid rotation of the laser beam can make the focused light spot 6100 formed by the focusing device 6000 also rapidly rotate, that is, the focused light spot 6100 and the workpiece 7000 are not relatively stationary but relatively moving, and the relative movement of the focused light spot 6100 makes the energy more uniformly distributed, thereby achieving the rotary cutting effect on the workpiece 7000, and further improving the processing efficiency.
Optionally, in some embodiments of the present application, the deflecting device 4000 is disposed between the focusing device 3000 and the mirror-vibrating device 5000, the laser beam sequentially passes through the focusing device 3000, the deflecting device 4000 and the mirror-vibrating device 5000, and the deflecting device 4000 is disposed at the downstream of the focusing device 3000, so that when the focusing device 3000 rotates the laser beam, the focal length adjustment of the focusing device 3000 is not affected due to the change of the shape of the light spot, and the deflecting device 4000 is disposed at the upstream of the mirror-vibrating device 5000, and the position deviation of the deflecting device 4000 relative to the deflecting device 4000 due to the movement of the laser beam in the XY direction is avoided, and the disposition difficulty and the debugging difficulty of the laser processing system are greatly reduced.
Referring to fig. 1 and fig. 2, in some embodiments of the present application, the laser processing system further includes a shaping device 2000, where the shaping device 2000 is disposed between the laser 1000 and the focusing device 6000, and is adapted to shape the laser beam, that is, the shaping device 2000 is used to change the spatial property of the laser beam, for example, expand, collimate, or shape the laser beam into a flat-top beam, so as to improve the focusing effect of the laser beam and improve the processing quality of the laser beam. For example, the shaping device 2000 may include a beam expander, or a combination of a beam expander and a flat-top shaper, as may be practical.
Optionally, in some embodiments of the present application, the shaping device 2000 is disposed between the laser 1000 and the focusing device 3000, that is, the laser beam emitted from the laser 1000 is first shaped by the shaping device 2000 and then reaches other components for processing, so as to avoid waste of laser energy.
With reference to fig. 10 and fig. 11, the present application further discloses a laser processing method, which is based on the laser processing system disclosed in the above embodiment, and includes the following steps:
s10: the initial machining position of workpiece 7000 is set. The workpiece 7000 is placed on the table and the initial machining position is set according to the scheme to be machined.
S20: and setting working parameters of the laser processing system. During this step, the operating parameters can be set according to the characteristics of the workpiece 7000 and the recipe to be machined. For example, setting the operating power and frequency of the laser 1000; setting the operating parameters of the focusing device 3000 to adjust an appropriate focal length; setting the operating parameters of the deflector 4000 so that the focused light spot 6100 follows a specific trajectory on the workpiece 7000 to drill the desired hole; working parameters of the galvanometer device 5000 are set so as to control the movement track of the focusing light spot 6100 on a two-dimensional plane and the like
S30: the laser 1000 is controlled to generate a laser beam, the laser beam is focused on the workpiece 7000 through a shaping device 2000, a focusing device 3000, a deflecting device 4000, a vibrating mirror device 5000 and a focusing device 6000 of the laser processing system to form a focused light spot 6100, and in the process of laser beam emission, the laser beam finally forms the focused light spot 6100 on the workpiece 7000 through the actions of the shaping device 2000, the focusing device 3000, the deflecting device 4000, the vibrating mirror device 5000 and the focusing device 6000, so that materials at corresponding positions are taken away through laser energy to realize drilling processing of the workpiece 7000.
S40: after drilling of workpiece 7000 is completed, the laser machining system is shut down. Such as sequentially turning off the laser 1000, the focusing device 3000, the deflecting device 4000 and the galvanometer device 5000.
Optionally, step S30 includes the steps of:
s31: the focusing device 3000 is controlled to adjust the focal length in the Z direction. Focusing device 3000 works and realizes focusing light spot 6100 along Z direction fast moving, like the up-and-down direction fast moving of the direction shown in the right part of fig. 6, realizes the processing in the thickness direction of workpiece 7000, namely realizes the control of the drilling processing depth, thus realizing the processing of through holes or blind holes.
S32: the galvanometer device 5000 is controlled to move the laser beam so as to move the focused spot 6100 in the X direction and the Y direction. The galvanometer device 5000 works to realize that the focusing light spot 6100 moves along the X direction and the Y direction, and the focusing light spot 6100 can rapidly move to the next point to be drilled in the direction shown in the left part of fig. 6, for example, the circle scanning is realized to realize the drilling of the two-dimensional plane of the workpiece 7000, and the three-dimensional space is processed by matching with the action of the focusing device 3000. Workpiece 7000 can also be drilled in concentric circles as shown in fig. 7. The workpiece 7000 can also be drilled or cut in a straight line as shown in fig. 8. Step S31 and step S32 may be performed without interfering with each other, and are not in front-back order.
Step S33: the deflection device 4000 controlling the laser processing system rotates the laser beam to rotate the focused spot 6100. As shown in fig. 9, the laser beam rotates under the action of the deflecting device 4000, and the focusing light spot 6100 simultaneously moves along a small track (self-rotation track) and a large track (combined action in the X and Y directions) by matching with the galvanometer device 5000, so that the processing speed is greatly increased. Step S31, step S32, and step S33 may be performed without interfering with each other, and may be performed in the order of front and rear.
The above description is only a preferred embodiment of the present application, and not intended to limit the scope of the present application, and all modifications and equivalents of the subject matter of the present application, which is conceived to be equivalent to the above description and the accompanying drawings, or to be directly/indirectly applied to other related arts, are intended to be included within the scope of the present application.
Claims (11)
1. A laser machining system for machining a workpiece, the laser machining system comprising:
a laser adapted to emit a laser beam;
the focusing device is arranged at the downstream of the laser and is suitable for adjusting the focal length of the laser processing system so as to process the workpiece along the Z direction;
the galvanometer device is arranged at the downstream of the laser and is suitable for adjusting the motion track of the laser beam so as to process the workpiece along the X direction and the Y direction; and
and the focusing device is arranged at the downstream of the focusing device and the galvanometer device and is suitable for focusing the laser beam on the workpiece to form a focusing light spot.
2. The laser machining system of claim 1 wherein the focusing means is disposed upstream of the galvanometer means.
3. The laser machining system of claim 1, wherein the focusing means comprises a deformable mirror and/or a variable focus lens.
4. The laser machining system of claim 3, wherein the deformable mirror of the focusing assembly has a planar state and an arcuate state; and/or a variable focus lens of the focusing apparatus has a planar state and an arcuate state.
5. The laser machining system of claim 1 wherein the galvanometer arrangement includes an X-axis galvanometer adapted to vary displacement of the laser beam in an X direction and a Y-axis galvanometer adapted to vary displacement of the laser beam in a Y direction.
6. The laser machining system of claim 1 wherein the focusing device comprises a focusing lens.
7. The laser processing system of any of claims 1 to 6, wherein an optical path distance between the focusing means and the focused spot is a focal length f1,
the distance of an optical path between the focusing device and the focusing device is B,
the included angle formed by the laser beam passing through the focusing device is theta,
the diameter of a light spot formed by the laser beam which is irradiated on the focusing device is D,
d =2 (f 1-B) tan (theta/2) is satisfied.
8. The laser machining system of any one of claims 1 to 6, further comprising a deflection device disposed between the laser and the focusing device adapted to rotate the laser beam.
9. The laser machining system of claim 8 wherein said deflection means is disposed between said focusing means and said galvanometer means;
and/or the deflection device comprises at least one of an acousto-optic deflector, an electro-optic deflector, a wedge prism and a deflection mirror.
10. A laser machining system according to any one of claims 1 to 6 further comprising shaping means disposed between the laser and the focusing means adapted to shape the laser beam.
11. The laser machining system of claim 10 wherein the shaping means is disposed between the laser and the focusing means;
and/or the shaping device comprises a beam expander and a flat top shaper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223150364.7U CN218657308U (en) | 2022-11-25 | 2022-11-25 | Laser processing system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223150364.7U CN218657308U (en) | 2022-11-25 | 2022-11-25 | Laser processing system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218657308U true CN218657308U (en) | 2023-03-21 |
Family
ID=85541220
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223150364.7U Active CN218657308U (en) | 2022-11-25 | 2022-11-25 | Laser processing system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218657308U (en) |
-
2022
- 2022-11-25 CN CN202223150364.7U patent/CN218657308U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1981977B (en) | Laser beam processing machine | |
| JP2016516584A (en) | Linking beam angle and workpiece movement for taper control | |
| JP2002059286A (en) | Laser beam machining head and laser beam machining device provided with the same | |
| JP2003220484A (en) | Device and method for laser beam machining | |
| CN214867994U (en) | Laser processing device and wafer processing equipment | |
| JP3257157B2 (en) | CO2 laser drilling device and method | |
| KR101186245B1 (en) | Laser processing system and laser processing method using the same | |
| JPH11170072A (en) | Method and device for laser beam machining and for forming circuit of nonconductive transparent substrate | |
| CN218657308U (en) | Laser processing system | |
| CN101497149A (en) | Laser flying focus scanning system | |
| JP2023552942A (en) | Laser processing system and method | |
| JP2005254618A (en) | Resin welding apparatus | |
| JP2005262219A (en) | Laser beam machining apparatus and laser beam drawing method | |
| JP2003019585A (en) | Device and method for laser beam machining | |
| CN113579518B (en) | Six-vibrating-mirror group hole machining device and machining method | |
| CN215393264U (en) | Five-axis four-linkage punching device | |
| CN114273800A (en) | Ultrafast laser drilling method and system suitable for stainless steel workpiece | |
| JP2002346775A (en) | Device and method for laser beam machining | |
| CN113681154A (en) | Laser cutting head with variable light spot, cutting equipment and cutting method | |
| JP2021142546A (en) | Optical unit, laser beam machining apparatus and laser beam machining method | |
| JPS62168688A (en) | Laser beam machining device | |
| JP2002079393A (en) | Laser beam irradiation device and method for laser beam machining | |
| CN214641027U (en) | Dual-drive laser welding device | |
| CN220591880U (en) | Laser welding device | |
| JP2001239384A (en) | Laser cutting method and it's apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |