CN111244010A - LED chip, assembling device and assembling method of display panel - Google Patents
LED chip, assembling device and assembling method of display panel Download PDFInfo
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- CN111244010A CN111244010A CN201811446284.1A CN201811446284A CN111244010A CN 111244010 A CN111244010 A CN 111244010A CN 201811446284 A CN201811446284 A CN 201811446284A CN 111244010 A CN111244010 A CN 111244010A
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- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
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Abstract
The application discloses LED chip, display panel's equipment and method of assembling, LED chip includes the chip main part and sets up the magnetic part on the chip main part, wherein, the magnetic part is set up to allow to adsorb the LED chip under the effect of the produced magnetic attraction force of external transfer device. Through the mode, the efficiency of display panel equipment can be improved.
Description
Technical Field
The application relates to the technical field of display, in particular to an assembling device and an assembling method of an LED chip and a display panel.
Background
As technology develops, most display panels require multiple devices, e.g., multiple LED chips, to be placed during assembly. The conventional method for arranging a plurality of LED chips is: the LED chips are grabbed one by a mechanical device and placed at predetermined positions in the receiving substrate one by one.
The inventor of the present application finds, in a long-term research process, that a large amount of time is consumed by adopting the conventional scheme because the number of the LED chips to be arranged in the display panel is often large, and the conventional scheme has a problem of low efficiency.
Disclosure of Invention
The technical problem mainly solved by the application is to provide an LED chip, display panel assembling equipment and an assembling method, which can improve the assembling efficiency of a display panel.
In order to solve the technical problem, the application adopts a technical scheme that: there is provided an LED chip comprising a chip body and a magnetic member disposed on the chip body, wherein the magnetic member is configured to allow the LED chip to be adsorbed by a magnetic adsorption force generated by an external transfer device.
In order to solve the above technical problem, another technical solution adopted by the present application is: the assembling equipment of the display panel comprises a transfer device, a receiving substrate and a chip, wherein the transfer device is used for transferring an LED chip to the receiving substrate, the LED chip comprises a chip main body and a magnetic part arranged on the chip main body; the transfer device includes: transferring the substrate; a plurality of transfer heads fixed to at least one side surface of the transfer substrate in an array; and the control component is used for respectively controlling the plurality of transfer heads to generate magnetic adsorption force capable of acting on the magnetic pieces of the corresponding LED chips or release the magnetic adsorption force, so that each transfer head can respectively adsorb or release the LED chips.
In order to solve the above technical problem, another technical solution adopted by the present application is: provided is an assembling method of a display panel, the assembling method including: providing a donor substrate, wherein a plurality of LED chips are arranged on the donor substrate, and each LED chip comprises a chip main body and a magnetic piece arranged on the chip main body; controlling a plurality of transfer heads to generate magnetic adsorption force, wherein the magnetic adsorption force acts on the magnetic pieces of the corresponding LED chips, the magnetic adsorption force is larger than the bonding force between the LED chips and the donor substrate, so that the LED chips are adsorbed from the donor substrate, and the transfer heads are fixed on at least one side surface of the transfer substrate in an array manner; moving the transfer substrate over a receiving substrate; and controlling the plurality of transfer heads to remove the magnetic adsorption force so that the plurality of transfer heads release the plurality of LED chips to a receiving substrate.
The beneficial effect of this application is: different from the prior art, on one hand, the chip body of the LED chip provided by the application is provided with the magnetic part, and the magnetic part can be adsorbed under the action of the magnetic adsorption force generated by the external transfer device, so that the LED chip is adsorbed; compared with the traditional mechanical grabbing of the LED chips, the magnetic adsorption can reduce the damage to the LED chips, and the magnetic adsorption is more convenient, so that the efficiency of arranging the LED chips in the display panel can be improved.
On the other hand, the transfer device in the display panel's equipment that provides of this application includes a plurality of transfer heads and control assembly, and control assembly can control every transfer head alone and produce or remove the magnetic attraction that can act on the magnetic part of the LED chip that corresponds to make every transfer head can adsorb respectively or release the LED chip, thereby can realize carrying out the selectivity to a plurality of LED chips and shift, and then improve the efficiency that sets up a plurality of LED chips in display panel.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts. Wherein:
FIG. 1 is a schematic structural diagram of an embodiment of an LED chip according to the present application;
FIG. 2 is a schematic structural diagram of an embodiment of an assembling apparatus for a display panel according to the present application;
FIG. 3 is a schematic diagram of an embodiment of the control assembly of FIG. 2;
FIG. 4 is a schematic flow chart illustrating an embodiment of a method for assembling a display panel according to the present disclosure;
fig. 5 is a schematic structural diagram of an embodiment corresponding to steps S101 to S104 in fig. 4.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1, fig. 1 is a schematic structural diagram of an embodiment of an LED chip according to the present application. The LED chip 1 provided by the present application may be a common LED chip or a Micro-LED chip, and the LED chip 1 provided by the present application may be a vertical structure (i.e., the anode and the cathode of the LED chip 1 are respectively located at two opposite sides of the LED chip 1), or a horizontal structure (i.e., the anode and the cathode of the LED chip 1 are located at the same side of the LED chip 1).
Specifically, the LED chip 1 provided by the present application includes a chip body 10 and a magnetic member 12 disposed on the chip body 10, wherein the magnetic member 12 is configured to allow the LED chip 1 to be attracted by a magnetic attraction force generated by an external transfer device. In the present embodiment, the chip body 10 may be any one of the prior art, for example, the chip body 10 may include a substrate, an epitaxial layer structure grown on the substrate, and an electrode (e.g., an anode, or an anode and a cathode, etc.) located on the epitaxial layer structure, and the magnetic member 12 may cover the electrode by sputtering or deposition, etc. The material of the magnetic member 12 may be metal, and preferably, iron, cobalt, nickel, or iron-nickel alloy is used, and when the material is used for the magnetic member 12, it is more easily attracted by the magnetic attraction force by the external magnetic field. Of course, in other embodiments, the magnetic member 12 may be the electrode itself of the chip body 10.
In one embodiment, when the magnetic member 12 is the electrode itself, the subsequent step of peeling off the magnetic member 12 may be omitted. When the magnetic member 12 is not an electrode on the chip body 10, in order to facilitate subsequent removal of the magnetic member 12 to expose the electrode, a peeling device (e.g., a laser peeling device, etc.) may be used to directly peel off the magnetic member 12; in order to further reduce the damage to the LED chip 1 when the magnetic element 12 is subsequently removed, please refer to fig. 1 again, the LED chip 1 provided in the present application further includes a sacrificial element 14, wherein the sacrificial element 14 is disposed between the magnetic element 12 and the chip body 10, so as to allow the magnetic element 12 to be peeled off from the chip body 10 by a predetermined peeling means. In the present embodiment, the magnetic member 12 and the sacrificial member 14 are arranged in layers, and are arranged in a stacked manner on a surface of the chip body 10 on a side close to the magnetic member 12. The sacrificial member 14 may be made of photoresist or some material similar to the material of the chip body 10, such as a material containing silicon, and the sacrificial member 14 may be removed by a stripping means, such as laser stripping, so as to more easily separate the magnetic member 12 from the chip body 10. Of course, in other embodiments, the structures of the magnetic member 12 and the sacrificial member 14 may be other; for example, the sacrificial member 14 may be layered, and the magnetic member 12 may be a plurality of magnetic blocks located on the sacrificial member 14; alternatively, the magnetic member 14 may be magnetic particles or the like doped in the sacrificial member 14.
Referring to fig. 2, fig. 2 is a schematic structural diagram of an embodiment of an assembly apparatus for a display panel according to the present application, the assembly apparatus provided in the present application includes a transferring device 2 for transferring a plurality of LED chips 1 in any of the above embodiments to a receiving substrate, wherein each LED chip 1 includes a chip main body 10 and a magnetic member 12 disposed on the chip main body 10; the transfer device 2 includes: a transfer substrate 20, a plurality of transfer heads 22, and a control assembly 24.
Specifically, the plurality of transfer heads 22 are fixed to at least one side surface of the transfer substrate 20 in an array; the control assembly 24 is used for respectively controlling the plurality of transfer heads 22 to generate a magnetic attraction force capable of acting on the magnetic member 12 of the corresponding LED chip 1 or release the magnetic attraction force, so that each transfer head 22 can respectively attract or release the LED chip 1. In the present embodiment, the area of the orthographic projection of one transfer head 22 on the transfer substrate 20 is equivalent to the area of the orthographic projection of one LED chip 1 on the transfer substrate 20, and one LED chip 1 can be adsorbed or released by one transfer head 22; of course, in other embodiments, the area corresponding to at least two transfer heads 22 is equivalent to the area corresponding to one LED chip 1, and one LED chip 1 can be adsorbed or released by at least two transfer heads 22.
In one embodiment, transfer head 22 includes a coil 220, coil 220 includes first and second ends a, B that extend, and control assembly 24 is electrically coupled to first and second ends a, B such that control assembly 24 controls coil 220 to generate or remove a magnetic attraction force. The coil 220 may be a planar coil, a sheet coil, a film coil, etc., the coil 220 may be made of copper, silver, etc., and the number of turns of the coil 220 and the magnitude of the current passing through the coil 220 may be set according to actual conditions, which is not limited in the present application.
In another embodiment, the transfer head 22 further includes a plurality of pillars 222 fixed on at least one side surface of the transfer substrate 20, and a coil 220 is disposed around one of the pillars 222, for example, the coil 220 may be spirally wound around an outer surface of the pillar 222, and both the first end a and the second end B of the coil 220 protruding from each other may be disposed toward the transfer substrate 20. When the coil 220 passes through the current, the coil 220 induces an N-pole or S-pole magnetic field at a side of the coil 220 away from the transfer substrate 20, and the coil 220 further generates a magnetic attraction force on the magnetic member 12 because the magnetic member 12 on the LED chip 1 is made of metal. When no current flows through the coil 220, the coil 220 has no induced magnetic field, and the magnetic attraction of the coil 220 to the magnetic member 12 is released. At this time, in order to enhance the magnetic field intensity generated by the coil 220, in addition to increasing the number of turns of the coil 220 and increasing the current passing through the coil 220, the material of the convex pillar 220 may be designed to be metal, and preferably, the convex pillar 220 is iron. When the convex pillar 200 is made of iron, the magnetic field strength generated by the coil 220 can be enhanced to generate stronger magnetic attraction force on the magnetic member 12. Of course, in other embodiments, the coil 220 and the convex pillar 222 may be designed in other manners, for example, the coil 220 is fixed on the end surface of the convex pillar 222 away from the transfer substrate 20.
In yet another embodiment, the control assembly 24 may be located in whole or in part in the transfer substrate 20; to realize that the control assembly 24 independently controls each transfer head 22, referring to fig. 3, fig. 3 is a schematic structural diagram of an embodiment of the control assembly in fig. 2, the control assembly 24 provided in the present application includes:
a current generating circuit 240 for supplying current to the plurality of coils 220, one end of the current generating circuit 240 being connected to a first end a of the coils 220; the current generating circuit 240 may include a power supply, a resistor, and the like, and the magnitude of the current flowing through the coil 220 may be adjusted by changing the power supply voltage, the magnitude of the resistor, and the like.
A plurality of switches 242, one switch 242 is connected to one coil 220, and the switches 242 may be various types of switches, for example, MEMS switches, N-type transistor switches, P-type transistor switches, and the like. The MEMS switch has the advantage of small volume, so the MEMS switch is more suitable for the assembly equipment provided by the application. The switch 242 includes a control terminal K1, a third terminal K2 and a fourth terminal K3, the third terminal K2 is electrically connected to the other terminal of the current generating circuit 240, and the fourth terminal K3 is connected to the second terminal B of the coil 220;
the switch control circuit 244 is used for connecting the control terminals K1 of the switches 242, respectively, and the switch control circuit 244 controls the connection and disconnection between the third terminal K2 and the fourth terminal K3 through the control terminal K1.
In yet another embodiment, referring to fig. 1 again, the LED chip 1 further includes a sacrificial member 14, wherein the sacrificial member 14 is disposed between the magnetic member 12 and the chip body 10; the assembly apparatus provided herein further comprises a peeling means (not shown in fig. 2) for acting on the sacrificial member 14 between the chip body 10 and the magnetic member 12, thereby peeling the magnetic member 12 from the chip body 10. The peeling device may be a laser peeling device or the like. Of course, in other embodiments, the sacrificial member 14 may not be provided, and the peeling device may directly act on the magnetic member 12 to peel the magnetic member 12 from the chip body 10. Still alternatively, the chip body 10 of the LED chip 1 includes an electrode, and the magnetic member 12 is the electrode of the chip body 10, when the magnetic member 12 is the electrode of the chip body 10, the assembly apparatus provided in the present application may not need a peeling device, and a subsequent step of peeling the magnetic member 12 may be omitted.
Referring to fig. 4 to 5, fig. 4 is a schematic flow chart of an embodiment of an assembly method of a display panel of the present application, and fig. 5 is a schematic structural diagram of an embodiment corresponding to steps S101 to S104 in fig. 4, where the assembly method includes:
s101: providing a donor substrate 3, and arranging a plurality of LED chips 1 on the donor substrate 3, wherein the LED chips 1 comprise a chip main body 10 and a magnetic part 12 arranged on the chip main body 10.
In particular, as shown in fig. 5 a. In one embodiment, the chip body 10 may be formed on the donor substrate 3, and then the magnetic member 12 may be formed on the surface of the chip body 10.
In another embodiment, in order to reduce damage to the chip body 10 when the magnetic member 12 is removed at a later stage, before forming the magnetic member 12, a sacrificial member 14 may be formed on a surface of the chip body 10, and then the magnetic member 12 may be formed on the other side of the sacrificial member 14 away from the chip body 10.
S102: and controlling the plurality of transfer heads 22 to generate a magnetic attraction force, wherein the magnetic attraction force acts on the magnetic part 12 of the corresponding LED chip 1, the magnetic attraction force is larger than the bonding force between the LED chip 1 and the donor substrate 3, so as to attract the plurality of LED chips 1 from the donor substrate 3, and the plurality of transfer heads 22 are fixed on at least one side surface of the transfer substrate 20 in an array manner.
In particular, as shown in fig. 5 b. In one embodiment, the step S102 specifically includes: a switch control circuit 244 in the control unit 24 controls the plurality of switches 242 to be turned on, the coils 220 of the plurality of transfer heads 22 connected to the plurality of switches 242 flow the current output from the current generation circuit 240, and the coils 220 of the plurality of transfer heads 22 generate a magnetic attraction force to attract the plurality of LED chips 1 from the donor substrate 3; for example, as shown in fig. 5b, the control component 24 controls the two left switches 242 in fig. 5b to be turned on, and the transfer heads 22 (A, B labeled in fig. 5 b) corresponding to the two left switches 242 generate magnetic attraction force, so as to attract the two left LED chips 1 (a and b labeled in fig. 5 b) on the corresponding donor substrate 3.
S103: the transfer substrate 20 is moved above the receiving substrate 4.
Specifically, as shown in fig. 5c, the position of the transfer substrate 20 may be moved by a robot arm or the like, and the transfer head 22 with the LED chip 1 adsorbed on the transfer substrate 20 may be aligned with a predetermined position on the receiving substrate 4; the receiving substrate 4 may be an array substrate or an intermediate substrate.
S104: the plurality of transfer heads 22 are controlled to remove the magnetic attraction force, so that the plurality of transfer heads 22 release the plurality of LED chips 1 to the receiving substrate 4.
Specifically, as shown in fig. 5d, the switch control circuit 244 in the control assembly 24 controls the plurality of switches 242 to be turned off, no current flows through the coils 220 in the plurality of transfer heads 22 correspondingly connected to the plurality of switches 242, and the coils 220 in the plurality of transfer heads 22 remove the magnetic attraction force to release the plurality of LED chips 1 to the receiving substrate 4. For example, as shown in fig. 5d, the control component 24 controls the left switch 242 in fig. 5d to be turned off, and the transfer head 22 (as labeled a in fig. 5 d) corresponding to the left switch 242 releases the magnetic attraction force, so as to release the LED chip 1 (as labeled a in fig. 5 d) to the receiving substrate 4. For the LED chip 1 (B as labeled in fig. 5 d) on the other transfer head 22 (B as labeled in fig. 5 d), the control component 24 controls the transfer head 22 (B as labeled in fig. 5 d) not to release it due to the LED chip 1 (B as labeled in fig. 5 d) failing to detect the performance or the position not being aligned with the predetermined position on the receiving substrate 4.
In other embodiments, after step S104, the assembling method provided by the present application further includes: the magnetic member 12 on the LED chip 1 is removed to expose the chip body 10. Specifically, as shown in fig. 5e, in the present embodiment, a sacrificial member 14 is further disposed between the chip body 10 and the magnetic member 12 in the LED chip 1, and the sacrificial member 14 is peeled off by a peeling device such as laser peeling, so as to separate the magnetic member 12 from the chip body 10. In addition, in order to avoid the relative displacement between the LED chip 1 and the receiving substrate 4 in the process of removing the magnetic member 12, before removing the magnetic member 12, the relative position between the LED chip 1 and the receiving substrate 4 may be fixed, for example, a layer of solder may be coated on the receiving substrate 4, and the relative position between the LED chip 1 and the receiving substrate 4 may be fixed by means of thermal reflow; for example, an adhesive may be applied to the receiving substrate 4, and the LED chip 1 and the receiving substrate 4 may be fixed in position relative to each other by the adhesiveness of the adhesive.
In summary, different from the prior art, on one hand, the chip body of the LED chip provided in the present application is provided with a magnetic member, which can be attracted under the action of the magnetic attraction force generated by the external transfer device, so that the LED chip is attracted; compared with the traditional mechanical grabbing of the LED chips, the magnetic adsorption can reduce the damage to the LED chips, and the magnetic adsorption is more convenient, so that the efficiency of arranging the LED chips in the display panel can be improved.
On the other hand, the transfer device in the display panel's equipment that provides of this application includes a plurality of transfer heads and control assembly, and control assembly can control every transfer head alone and produce or remove the magnetic attraction that can act on the magnetic part of the LED chip that corresponds to make every transfer head can adsorb respectively or release the LED chip, thereby can realize carrying out the selectivity to a plurality of LED chips and shift, and then improve the efficiency that sets up a plurality of LED chips in display panel.
The above embodiments are merely examples and are not intended to limit the scope of the present disclosure, and all modifications, equivalents, and flow charts using the contents of the specification and drawings of the present disclosure or those directly or indirectly applied to other related technical fields are intended to be included in the scope of the present disclosure.
Claims (10)
1. An LED chip, comprising a chip body and a magnetic member disposed on the chip body, wherein the magnetic member is configured to allow the LED chip to be attracted by a magnetic attraction force generated by an external transfer device.
2. The LED chip of claim 1, further comprising a sacrificial member disposed between said magnetic member and said chip body to allow said magnetic member to be peeled from said chip body by a predetermined peeling means.
3. The LED chip of claim 2, wherein the magnetic member and the sacrificial member are layered, and the magnetic member and the sacrificial member are layered on a surface of the chip body near one side of the magnetic member.
4. The assembling equipment of the display panel is characterized by comprising a transferring device, a receiving substrate and a positioning device, wherein the transferring device is used for transferring an LED chip to the receiving substrate, and the LED chip comprises a chip main body and a magnetic part arranged on the chip main body; the transfer device includes:
transferring the substrate;
a plurality of transfer heads fixed to at least one side surface of the transfer substrate in an array;
and the control component is used for respectively controlling the plurality of transfer heads to generate magnetic adsorption force capable of acting on the magnetic pieces of the corresponding LED chips or release the magnetic adsorption force, so that each transfer head can respectively adsorb or release the LED chips.
5. The assembly apparatus of claim 4,
the transfer head comprises a coil, the coil comprises a first end and a second end, and the control component is electrically connected with the first end and the second end, so that the control component controls the coil to generate or remove the magnetic adsorption force.
6. The assembly apparatus of claim 5,
the transfer head further comprises a plurality of convex columns which are fixed on at least one side surface of the transfer substrate, and one coil is arranged around one convex column.
7. The assembly apparatus of claim 6,
the convex column is made of metal, and preferably, the convex column is made of iron.
8. The assembly apparatus of claim 5, wherein the control assembly comprises:
a current generating circuit for supplying a current to the plurality of coils, one end of the current generating circuit being connected to the first ends of the coils;
the switch comprises a control end, a third end and a fourth end, the third end is electrically connected with the other end of the current generation circuit, and the fourth end is connected with the second end of the coil;
and the switch control circuit is used for respectively connecting the control ends of the plurality of switches, and controls the connection and disconnection of the third end and the fourth end through the control ends.
9. The assembly apparatus of claim 4,
the chip body comprises an electrode, and the magnetic part is the electrode of the chip body; or, the assembling device further comprises a stripping device for stripping the magnetic member from the chip body; alternatively, the first and second electrodes may be,
the LED chip further comprises a sacrificial piece, and the sacrificial piece is arranged between the magnetic piece and the chip body; the assembling device further comprises a stripping device, wherein the stripping device is used for acting the sacrificial part between the chip body and the magnetic part so as to strip the magnetic part from the chip body.
10. An assembling method of a display panel, the assembling method comprising:
providing a donor substrate, wherein a plurality of LED chips are arranged on the donor substrate, and each LED chip comprises a chip main body and a magnetic piece arranged on the chip main body;
controlling a plurality of transfer heads to generate magnetic adsorption force, wherein the magnetic adsorption force acts on the magnetic pieces of the corresponding LED chips, the magnetic adsorption force is larger than the bonding force between the LED chips and the donor substrate, so that the LED chips are adsorbed from the donor substrate, and the transfer heads are fixed on at least one side surface of the transfer substrate in an array manner;
moving the transfer substrate over a receiving substrate;
and controlling the plurality of transfer heads to remove the magnetic adsorption force so that the plurality of transfer heads release the plurality of LED chips to a receiving substrate.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811446284.1A CN111244010A (en) | 2018-11-29 | 2018-11-29 | LED chip, assembling device and assembling method of display panel |
| PCT/CN2019/086058 WO2020107809A1 (en) | 2018-11-29 | 2019-05-08 | Led chip, and assembly apparatus and assembly method for display panel |
| KR1020217017862A KR102544587B1 (en) | 2018-11-29 | 2019-05-08 | LED chip, display panel assembly device and assembly method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811446284.1A CN111244010A (en) | 2018-11-29 | 2018-11-29 | LED chip, assembling device and assembling method of display panel |
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| CN111244010A true CN111244010A (en) | 2020-06-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811446284.1A Pending CN111244010A (en) | 2018-11-29 | 2018-11-29 | LED chip, assembling device and assembling method of display panel |
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| Country | Link |
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| KR (1) | KR102544587B1 (en) |
| CN (1) | CN111244010A (en) |
| WO (1) | WO2020107809A1 (en) |
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| CN111474981A (en) * | 2020-03-24 | 2020-07-31 | 宁波方太厨具有限公司 | Make things convenient for magnetic adsorption's house equipment and intelligent terminal |
| CN111863694A (en) * | 2020-07-17 | 2020-10-30 | 深圳市华星光电半导体显示技术有限公司 | Transfer device and transfer method |
| CN112601166A (en) * | 2020-12-14 | 2021-04-02 | 维沃移动通信有限公司 | Screen, electronic equipment and screen preparation method |
| CN112992765A (en) * | 2021-02-08 | 2021-06-18 | 厦门乾照半导体科技有限公司 | Transfer device and transfer method |
| CN114156374A (en) * | 2021-11-30 | 2022-03-08 | Tcl华星光电技术有限公司 | Chip transfer device and chip transfer method |
| WO2024031915A1 (en) * | 2022-08-12 | 2024-02-15 | 上海闻泰电子科技有限公司 | Chip transfer device and method |
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| KR102497332B1 (en) | 2021-07-19 | 2023-02-08 | 엘지전자 주식회사 | Mask apparatus |
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Also Published As
| Publication number | Publication date |
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| KR102544587B1 (en) | 2023-06-20 |
| WO2020107809A1 (en) | 2020-06-04 |
| KR20210093944A (en) | 2021-07-28 |
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Effective date of registration: 20201211 Address after: No.146 Tianying Road, Chengdu hi tech Zone, Chengdu, Sichuan Province Applicant after: Chengdu CHENXIAN photoelectric Co.,Ltd. Address before: No. 188, CHENFENG Road, Kunshan high tech Zone, Kunshan City, Suzhou City, Jiangsu Province Applicant before: Kunshan New Flat Panel Display Technology Center Co.,Ltd. Applicant before: KunShan Go-Visionox Opto-Electronics Co.,Ltd. |
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Application publication date: 20200605 |