CN210956632U - Transfer device of microelement - Google Patents
Transfer device of microelement Download PDFInfo
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- CN210956632U CN210956632U CN201921620940.5U CN201921620940U CN210956632U CN 210956632 U CN210956632 U CN 210956632U CN 201921620940 U CN201921620940 U CN 201921620940U CN 210956632 U CN210956632 U CN 210956632U
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Abstract
The application discloses transfer device of microelement, transfer device includes: transferring the substrate; a plurality of transfer heads fixed in an array on a surface of at least one side of the transfer substrate, each transfer head including a negative thermal expansion member to contract toward the side of the transfer substrate when the corresponding transfer head is heated; and a control module which is respectively connected with the plurality of transfer heads and selects part of the plurality of transfer heads to perform heating operation, wherein the negative thermal expansion member in the selected transfer head contracts towards the side of the transfer substrate to protrude the unselected transfer heads, so that the micro-components are transferred by the unselected transfer heads. By the mode, the micro-component picking device can selectively pick micro-components in batches.
Description
Technical Field
The application relates to the technical field of display, in particular to a transfer device of a micro-element.
Background
Micro-components, such as LED chips, have the characteristics of high brightness, low power consumption, ultra-high resolution and color saturation, and thus become a research hotspot for pursuing a new generation of display technology.
The inventor of the present application finds that batch transfer is an important process in the preparation process of the LED display panel in the long-term research process. At present, when batch transfer is carried out by using a transfer head, the problems of low transfer rate and low yield rate exist because the batch transfer technology is limited by equipment and processes.
SUMMERY OF THE UTILITY MODEL
The technical problem that this application mainly solved provides a transfer device of micro-component, can carry out selectivity batch pickup to micro-component.
In order to solve the technical problem, the application adopts a technical scheme that: providing a transfer device for a micro-component, the transfer device comprising: transferring the substrate; a plurality of transfer heads fixed in an array on a surface of at least one side of the transfer substrate, each transfer head including a negative thermal expansion member to contract toward the side of the transfer substrate when the corresponding transfer head is heated; and a control module which is respectively connected with the plurality of transfer heads and selects part of the plurality of transfer heads to perform heating operation, wherein the negative thermal expansion member in the selected transfer head contracts towards the side of the transfer substrate to protrude the unselected transfer heads, so that the micro-components are transferred by the unselected transfer heads.
The beneficial effect of this application is: in contrast to the prior art, the present application provides a transfer apparatus in which a plurality of transfer heads are fixedly disposed in an array on a surface of at least one side of a transfer substrate, and each transfer head includes a negative thermal expansion member; when a plurality of micro-components are transferred, the control component in the transfer device can select to perform heating operation on part of the transfer heads, wherein the negative thermal expansion member in the selected transfer head contracts towards one side of the transfer substrate to protrude out of the unselected transfer heads, and then the unselected transfer heads are used for transferring the micro-components. The transfer device provided by the application can selectively transfer the micro-elements in batches, and the transfer efficiency is high; and because the micro-component is transferred by the transfer head which is not shrunk, the precision is higher when the micro-component is transferred.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts. Wherein:
FIG. 1 is a schematic structural diagram of an embodiment of a transfer device for micro-components according to the present application;
FIG. 2 is a schematic structural view of a portion of the transfer head of FIG. 1 after performing a shrinking heat operation;
FIG. 3 is a schematic structural view of another embodiment of a transfer device for micro-components according to the present application;
FIG. 4 is a schematic structural view of a portion of the transfer head of FIG. 3 after performing a shrinking heat operation;
FIG. 5 is a schematic view of the structure of one embodiment of the connection between the control unit and the heating body in FIG. 1;
FIG. 6 is a schematic flow chart diagram illustrating an embodiment of a method for transferring a micro-component according to the present application;
fig. 7 is a schematic structural diagram of an embodiment corresponding to steps S101-S108 in fig. 6.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1-2, fig. 1 is a schematic structural diagram of an embodiment of a transfer apparatus for micro-devices according to the present application, and fig. 2 is a schematic structural diagram of an embodiment of a transfer apparatus 10 according to fig. 1 after a portion of transfer heads perform a thermal contraction operation, the transfer apparatus including a transfer substrate 100, a plurality of transfer heads 102, and a control assembly 104.
Specifically, a plurality of transfer heads 102 are fixed in an array on a surface 1000 of at least one side of a transfer substrate 100; for example, the plurality of transfer heads 102 are fixed in an array on only one surface 1000 of the transfer substrate 100; for another example, a plurality of transfer heads 102 are fixed in an array on two oppositely disposed surfaces 1000 of a transfer substrate 100. Each transfer head 102 includes a negative thermal expansion member 1020 to contract toward the transfer substrate 100 side when the corresponding transfer head 102 is heated. The negative thermal expansion member 1020 is a shape memory material, and when the external temperature reaches its transition temperature, the negative thermal expansion member 1020 contracts, and when the external temperature drops, the negative thermal expansion member 1020 expands and returns to the original state; that is, the negative thermal expansion member 1020 has one shape when heated and the negative thermal expansion member 1020 has another shape when cooled, and the negative thermal expansion member 1020 can be changed between the two shapes by expansion and contraction under temperature control. The control module 104 is connected to the plurality of transfer heads 102 respectively, and selects a portion of the plurality of transfer heads 102 to perform a heating operation, wherein the negative thermal expansion member 1020 of the selected transfer heads 102 is contracted toward the transfer substrate 100 side (as shown in fig. 2) to protrude the unselected transfer heads 102, thereby transferring the micro-components using the unselected transfer heads 102.
Namely, the transfer device 10 provided by the application can selectively transfer micro elements in batches, and the transfer efficiency is high; and because the transfer head 102 which does not shrink is used for transferring the micro-components, the precision is higher when transferring the micro-components.
In one embodiment, negative thermal expansion member 1020 is made of lanthanide iron silicon La (Fe, Si)13Compound, anti-perovskite compound Mn3AN (a ═ Zn, Ga, Cu), zirconium ZrW2O8Hafnium tungsten octaoxide HfW2O8At least one of them. The negative thermal expansion member 1020 made of the above material is sensitive to temperature change, and the material is easily available and easy to form. Of course, in other embodiments, the negative thermal expansion member 1020 may be formed by an elastic body and a negative thermal expansion material doped in the elastic body, the doped negative thermal expansion material may be in the form of particles, strips, or the like, and the elastic body may be easily deformable rubber or the like.
In another embodiment, with continued reference to fig. 1, each transfer head 102 further includes a heating body 1022, the heating body 1022 is located inside the negative thermal expansion element 1020, and each heating body 1022 is electrically connected to the control assembly 104. The heating body 1022 may be disposed inside the negative thermal expansion member 1020 in such a manner that the negative thermal expansion member 1020 is heated more uniformly. Of course, in other embodiments, the heating body 1022 may also be located outside the negative thermal expansion member 1020, for example, between the negative thermal expansion member 1020 and the transfer substrate 100.
Further, the heating body 1022 is a metal coil. The design mode can increase the contact area between the heating body 1022 and the negative thermal expansion piece 1020 as much as possible, reduce the time required by the contraction of the negative thermal expansion piece 1020 and improve the transfer efficiency of the transfer device 10. Of course, in other embodiments, the shape of the heating body 1022 may be other, such as an elongated shape.
Further, referring to fig. 1 again, each of the transfer heads 102 further includes an insulating post 1024 fixed on at least one side surface 1000 of the transfer substrate 100, and a metal coil (i.e., a heating body 1022) surrounds the insulating post 1024, and a negative thermal expansion member 1020 wraps the corresponding metal coil and the insulating post 1024. The arrangement mode of the insulating convex columns 1024 can better fix the position of the metal coil (namely the heating body 1022), reduce the probability that the position of the metal coil changes relative to the transfer substrate 100 in the contraction and expansion processes of the negative thermal expansion member 1020, and improve the service life of the transfer head 102. Preferably, the insulating posts 1024 include an insulating body and heat conductive particles doped in the insulating body. For example, the insulating body may be made of a silicon rubber substrate, and the heat conductive particles may be made of boron nitride, aluminum oxide, or the like, so that the heat emitted from the heating body 1022 can be better transferred to the negative thermal expansion member 1020.
Further, referring to fig. 1 and fig. 2 again, each transfer head 102 further includes an adhesive member 1026 disposed on a side of the negative thermal expansion member 1020 away from the transfer substrate 100; when the control assembly 104 selects a portion of the transfer head 102 to perform a heating operation and a portion of the transfer head 102 to not perform a heating operation, the transfer head 102 that does not perform a heating operation protrudes, and the adhesive member 1026 on the transfer head 102 that does not perform a heating operation can adhere to the micro-component at the corresponding location. The adhesive member 1026 may be designed in a manner that can relatively easily adhere the micro-component at the corresponding position, and the adhesive member 1026 may be polydimethylsiloxane PDMS or the like, and the principle of adhering the micro-component is adhesion by van der waals force. Of course, in other embodiments, the adhesive member 1026 can also be a double-sided tape or the like, and the principle of adhering the micro-component is to adhere the micro-component by the adhesion of the double-sided tape.
Preferably, as shown in fig. 2, after the selected transfer head 102 performs the heating operation, the shrunk negative thermal expansion member 1020 still wraps the insulating cylinder 1024 and the metal coil surrounding the insulating cylinder 1024. The design is not only more beautiful, but also when the transfer head 102 is provided with the viscous member 1026, the probability of damage of the viscous member 1026 can be reduced, and the service life of the transfer head 102 can be prolonged.
Of course, in other embodiments, the transfer device may not be provided with the adhesive member 1026, and the micro-component may be adsorbed by other manners; for example, as shown in fig. 3-4, fig. 3 is a schematic structural diagram of another embodiment of a transfer device for micro-components of the present application, and fig. 4 is a schematic structural diagram of an embodiment of a transfer head in fig. 3 after a portion of the transfer head performs a heating operation to shrink, wherein the control components in fig. 3 and 4 are not illustrated. The transfer device 10a further includes a vacuum generating assembly 106, the vacuum generating assembly 106 may include a vacuum pump, a power source, etc.; a first channel 10240 is arranged in the insulating convex column 1024a, a second channel 10200 is arranged in the negative thermal expansion member 1020a, two ends of the first channel 10240 are respectively connected with the vacuum generation assembly 106 and the second channel 10200, and one end of the second channel 10200 is positioned on one side surface of the negative thermal expansion member 1020a far away from the transfer substrate 100 a. When the control assembly (not shown) controls a part of the transfer head 102a to perform the heating operation and a part of the transfer head 102a does not perform the heating operation, as shown in fig. 4, the part of the transfer head 102a that performs the heating operation is contracted, the transfer head 102a that does not perform the heating operation is protruded, and the transfer head 102a that does not perform the heating operation adsorbs the micro-component at the corresponding position through the first channel 10240 and the second channel 10200 by the vacuum generating assembly 106. It should be noted that, in order to avoid the contracted transfer head 102a from adsorbing the micro-components, the vacuum suction force provided by the vacuum generating assembly 106 can be controlled. In addition, the insulation posts 1024a in the heated transfer head 102a can be exposed along with the shrinkage of the negative thermal expansion member 1020a, which can make the height difference between the heated transfer head 102a and the transfer head 102a that is not heated larger, thereby reducing the probability that the heated transfer head 102a adsorbs the micro-component.
In another embodiment, referring to fig. 5, fig. 5 is a schematic structural view of an embodiment of connection between the control assembly and the heating body in fig. 1. The control assembly 104 includes a current generating circuit 1040, a plurality of switches 1042, and a switch control circuit 1044.
Specifically, the current generating circuit 1040 is configured to supply current to the plurality of heating bodies 1022, and one end of the current generating circuit 1040 is connected to the first end a of the heating body 1022. The current generating circuit 1040 may include a power supply, a resistor, and the like, and the magnitude of the current flowing through the heating body 1022 may be adjusted by changing the power supply voltage, the magnitude of the resistor, and the like, so as to control the temperature rise rate of the heating body 1022. A switch 1042 is correspondingly connected with a heating body 1022, the switch 1042 comprises a control end K1, a third end K2 and a fourth end K3, the third end K2 is electrically connected with the other end of the current generating circuit 1040, and the fourth end K3 is connected with the second end B of the heating body 1022; the switch 1042 may be various types of switches, such as an N-type transistor switch, a P-type transistor switch, and so on. The switch control circuit 1044 is configured to connect the control terminals K1 of the switches 1042, respectively, and the switch control circuit 1044 controls the connection and disconnection between the third terminal K2 and the fourth terminal K3 through the control terminal K1. The control assembly 104 has a simple structural design, and can conveniently control each transfer head respectively.
In yet another embodiment, the transfer device 10 provided herein may further include an air cooling assembly, which may accelerate cooling of the shrunk negative thermal expansion member 1020, so that the shrunk negative thermal expansion member 1020 is restored to the original state as soon as possible, thereby improving the transfer efficiency of the transfer device 10.
The operation of the transfer device 10 provided in the present application is further described below in a specific application scenario. Referring to fig. 6, fig. 6 is a schematic flowchart illustrating an embodiment of a method for transferring micro devices according to the present application, and fig. 7 is a schematic structural diagram illustrating an embodiment corresponding to steps S101-S108 in fig. 6. The transfer method comprises the following steps:
s101: a growth substrate 20 and a temporary substrate 22 are provided.
Specifically, as shown in fig. 7a, the growth substrate 20 includes a transparent substrate 200, and a plurality of LED chips 202 grown on the transparent substrate 200, the LED chips 202 may be lateral type LED chips or vertical type LED chips (as shown in fig. 7 a), and the transparent substrate 200 may be a sapphire substrate, an alumina substrate, or the like. The temporary substrate 22 includes a temporary substrate 220 and a temporary bonding glue 222 disposed on one side of the temporary substrate 220.
S102: the side, provided with the LED chip 202, of the growth substrate 20 faces the temporary bonding glue 222, the LED chip 202 is pressed into the temporary bonding glue 222, and the surface of the temporary bonding glue 222 is flush with the surface of the side, provided with the LED chip 202, of the transparent substrate 200. In particular, as shown in fig. 7 b.
S103: the laser irradiates the side of the transparent substrate 200 facing away from the LED chip 202 to detach the LED chip 202 from the transparent substrate 200. In particular, as shown in fig. 7 c.
S104: the transparent substrate 200 is removed. In particular, as shown in fig. 7 d.
S105: the side of the transfer device 10 provided with the transfer heads 102 in any of the above embodiments is directed toward the LED chips 202 and aligned so that one transfer head 102 corresponds to one LED chip 202. Specifically, as shown in fig. 7e, and the control components in the transfer device 10 are not illustrated in fig. 7 e.
S106: a control assembly (not shown) controls a portion of the transfer head 102 to perform a heating operation, and the portion of the transfer head 102 that performs the heating operation contracts, and causes the portion of the transfer head 102 that does not perform the heating operation to protrude. In particular, as shown in fig. 7 f.
S107: the transfer device 10 in step S106 is brought close to the LED chip 202, and the adhesive member 1026 on the protruding portion of the transfer head 102 adheres to the LED chip 202 in contact therewith. Specifically, as shown in fig. 7 g.
S108: the transfer device 10 transfers the plurality of LED chips 202 selectively picked up onto the target substrate 24.
It should be noted that all the transfer heads 102 in the step S106 may be provided with the adhesive member 1026; alternatively, the adhesive member 1026 may not be provided on all the transfer heads 102 in the above step S106, and the adhesive member 1026 may be provided on the transfer head 102 on which the heating operation is not performed in the above step S107.
The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.
Claims (8)
1. A transfer device for microcomponents, characterized in that it comprises:
transferring the substrate;
a plurality of transfer heads fixed in an array on a surface of at least one side of the transfer substrate, each transfer head including a negative thermal expansion member to contract toward the side of the transfer substrate when the corresponding transfer head is heated;
and a control module which is respectively connected with the plurality of transfer heads and selects part of the plurality of transfer heads to perform heating operation, wherein the negative thermal expansion member in the selected transfer head contracts towards the side of the transfer substrate to protrude the unselected transfer heads, so that the micro-components are transferred by the unselected transfer heads.
2. The transfer device of claim 1,
each transfer head further comprises a heating body, the heating bodies are located inside the negative thermal expansion pieces, and each heating body is electrically connected with the control assembly.
3. The transfer device of claim 2,
the heating body is a metal coil.
4. The transfer device of claim 3, wherein each transfer head further comprises:
and the insulating convex column is fixed on the surface of at least one side of the transfer substrate, the metal coil surrounds the insulating convex column, and the negative thermal expansion piece wraps the corresponding metal coil and the insulating convex column.
5. The transfer device of claim 4, wherein each transfer head further comprises:
and the adhesive member is arranged on one side of the negative thermal expansion member, which is far away from the transfer substrate.
6. The transfer device of claim 5,
after the transfer head performs heating operation, the shrunk negative thermal expansion piece still wraps the insulating convex column and the metal coil surrounding the insulating convex column.
7. The transfer device of claim 4,
the transfer device further comprises a vacuum generating assembly, a first through channel is arranged inside the insulating convex column, a second through channel is arranged inside the negative thermal expansion piece, two ends of the first through channel are respectively connected with the vacuum generating assembly and the second through channel, and one end of the second through channel is located on one side surface, far away from the transfer substrate, of the negative thermal expansion piece.
8. The transfer device of claim 2, wherein the control assembly comprises:
the current generating circuit is used for supplying current to the heating bodies, and one end of the current generating circuit is connected with the first ends of the heating bodies;
the switch is correspondingly connected with the heating body and comprises a control end, a third end and a fourth end, the third end is electrically connected with the other end of the current generation circuit, and the fourth end is connected with the second end of the heating body;
and the switch control circuit is used for respectively connecting the control ends of the plurality of switches, and controls the connection and disconnection of the third end and the fourth end through the control ends.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921620940.5U CN210956632U (en) | 2019-09-26 | 2019-09-26 | Transfer device of microelement |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201921620940.5U CN210956632U (en) | 2019-09-26 | 2019-09-26 | Transfer device of microelement |
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| CN210956632U true CN210956632U (en) | 2020-07-07 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112786520A (en) * | 2021-04-12 | 2021-05-11 | 武汉大学 | Transfer head, transfer head array and micro LED (light emitting diode) mass transfer method |
| CN116387237A (en) * | 2023-06-05 | 2023-07-04 | 惠科股份有限公司 | Mass transfer apparatus and mass transfer method |
-
2019
- 2019-09-26 CN CN201921620940.5U patent/CN210956632U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112786520A (en) * | 2021-04-12 | 2021-05-11 | 武汉大学 | Transfer head, transfer head array and micro LED (light emitting diode) mass transfer method |
| CN116387237A (en) * | 2023-06-05 | 2023-07-04 | 惠科股份有限公司 | Mass transfer apparatus and mass transfer method |
| CN116387237B (en) * | 2023-06-05 | 2023-09-19 | 惠科股份有限公司 | Mass transfer apparatus and mass transfer method |
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Effective date of registration: 20201221 Address after: No.146 Tianying Road, Chengdu hi tech Zone, Chengdu, Sichuan Province Patentee after: Chengdu CHENXIAN photoelectric Co.,Ltd. Address before: 065500 new industrial demonstration area of Guan County, Langfang, Hebei Patentee before: Yungu (Gu'an) Technology Co.,Ltd. |