CN212257355U - Mass transfer head and mass transfer system - Google Patents

Abstract

The utility model provides a huge transfer head and huge transfer system. The huge transfer head comprises an elastic adhesion layer, a temporary storage substrate, a central magnetic pole, side magnetic poles, a coil and a magnetic conduction structure, wherein the elastic adhesion layer and the temporary storage substrate are arranged oppositely, the side magnetic poles are arranged on one side of the central magnetic pole, the central magnetic pole and the side magnetic poles are arranged between the elastic adhesion layer and the temporary storage substrate, the two opposite ends of the side magnetic poles are fixedly connected with the elastic adhesion layer and the temporary storage substrate respectively, one end of the central magnetic pole is fixedly connected with the temporary storage substrate, the coil is sleeved on the central magnetic pole, the coil is fixed on the elastic adhesion layer, the magnetic conduction structure is arranged on the central magnetic pole and the side magnetic poles, and the magnetic induction line between the central magnetic pole and the side magnetic poles is adjusted to point to. The utility model provides a huge transfer the unable used repeatedly of head, huge transfer the higher technical problem of cost.

Description

Mass transfer head and mass transfer system

Technical Field

The utility model relates to a huge transfer technical field, in particular to huge transfer head and huge transfer system.

Background

Compared with the conventional display technology, the Micro-LED display technology has the characteristics of good wide color gamut performance, high contrast, high dynamic range, local dimming function, long service life and the like.

In the Micro-LED industry technology, a mass transfer technology is a key technology, and a large number of Micro LED dies are transferred to a target substrate or a circuit through a mass transfer head. However, the current bulk transfer heads cannot be reused, and the bulk transfer cost is high.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a huge transfer head and huge transfer system to solve the huge unable used repeatedly of transfer head, the huge technical problem who shifts the cost higher.

The utility model provides a mass transfer head, which comprises an elastic adhesion layer, a temporary storage substrate, a central magnetic pole, a side magnetic pole, a coil and a magnetic conduction structure, the elastic adhesion layer is arranged opposite to the temporary storage substrate, the side magnetic pole is arranged on one side of the central magnetic pole, the central magnetic pole and the side magnetic poles are arranged between the elastic adhesion layer and the temporary storage substrate, the two opposite ends of the side magnetic poles are respectively fixedly connected with the elastic adhesion layer and the temporary storage substrate, one end of the central magnetic pole is fixedly connected with the temporary storage substrate, the coil is sleeved on the central magnetic pole, the coil is fixed on the elastic adhesion layer, the magnetic conduction structure is arranged on the central magnetic pole and the side magnetic poles, for adjusting the lines of magnetic induction between the center pole and the side poles to point from one to the other. Therefore, when the bulk transfer head is used for transferring a chip on a growth substrate to a back plate, the magnetic induction lines between the central magnetic pole and the side magnetic poles of the bulk transfer head point to one another from one of the magnetic induction lines, and the transfer of the chip from the growth substrate to the back plate can be completed by turning two currents in opposite directions into the coil. And the huge transfer head can carry out the next chip transfer after finishing the chip transfer once, and the huge transfer head can be reused, thereby saving the cost. The technical problems that the existing mass transfer head cannot be reused and the mass transfer cost is high are solved.

Wherein, the limit magnetic pole includes first limit magnetic pole and second limit magnetic pole, first limit magnetic pole with second limit magnetic pole is located respectively the both sides of central magnetic pole, the relative both ends of first limit magnetic pole respectively with elasticity adhesion layer and keep in base plate fixed connection, the relative both ends of second limit magnetic pole respectively with elasticity adhesion layer and keep in base plate fixed connection, magnetic conduction structure includes first magnetic pole, second magnetic pole and third magnetic pole, first magnetic pole is located on the first limit magnetic pole, second magnetic pole is located on the second magnetic pole, third magnetic pole is located on the central magnetic pole, first magnetic pole and third magnetic pole be used for jointly with first limit magnetic pole with the line of magnetic induction between the central magnetic pole adjusts to from one of them directional another, second magnetic pole with third magnetic pole be used for jointly with second limit magnetic pole with central magnetic pole The lines of magnetic induction between the poles are aligned to point from one to the other. Thereby, when circular telegram in the coil, the circular telegram wire between first limit magnetic pole and the central magnetic pole will receive the effect of ampere force, and the circular telegram wire between second limit magnetic pole and the central magnetic pole will also receive the effect of ampere force, and the effort on the coil is accumulated, and the effort on the coil is bigger, and the coil will move faster, and the elasticity adhesion layer is also with the crooked faster of elasticity, and the transfer rate of chip is just faster, practices thrift the transfer time, practices thrift the cost. Moreover, because the wires of the acting force are positioned on two sides of the central magnetic pole, the stress of the coil is more uniform, the stress of the elastic adhesion layer is more uniform, and the moving process of the chip driven by the elastic adhesion layer is more stable.

Wherein, the relative both ends of first limit magnetic pole include the orientation the first end of elasticity adhesion layer with the orientation the second end of base plate keeps in, the relative both ends of second limit magnetic pole include the orientation the third end of elasticity adhesion layer with the orientation the fourth end of base plate keeps in, the center magnetic pole include the orientation the fifth end of elasticity adhesion layer with the orientation the sixth end of base plate keeps in, the sixth end with keep in base plate fixed connection, the first end with the interface of second end, the third end with the interface of fourth end and the fifth end with the interface of sixth end is located same reference plane, the coil is located the reference plane with between the elasticity adhesion layer. Therefore, when the coil is positioned between the reference plane and the elastic adhesion layer and current is conducted in the coil, all the leads in the coil are subjected to acting force in the same direction, the acting force in the same direction has a synergistic effect, the moving speed of the coil can be higher, the transferring speed of the chip is higher, and the cost is saved.

The first magnetic pole is fixed on the first end and arranged between the first end and the elastic adhesion layer, and the first end is fixed on the elastic adhesion layer through the first magnetic pole; the second magnetic pole is fixed on the third end and arranged between the third end and the elastic adhesion layer, and the third end is fixed on the elastic adhesion layer through the second magnetic pole; the third magnetic pole is fixed on the fifth end and is arranged between the fifth end and the elastic adhesion layer. The first magnetic pole fixed at the first end and the third magnetic pole fixed at the fifth end can realize that the magnetic induction line between the first side magnetic pole and the central magnetic pole is adjusted to point to the other from one of the first side magnetic pole and the central magnetic pole, and the second magnetic pole fixed at the third end and the third magnetic pole fixed at the fifth end can realize that the magnetic induction line between the second side magnetic pole and the central magnetic pole is adjusted to point to the other from one of the second side magnetic pole and the central magnetic pole.

The first end is an N pole, and the second end is an S pole; the third end is an N pole, and the fourth end is an S pole; the fifth end is an S pole, and the sixth end is an N pole; the magnetic induction line between the first end and the fifth end points to the fifth end from the first end, and the magnetic induction line between the third end and the fifth end points to the fifth end from the third end. This transfer head has realized that the coil drives elasticity adhesion layer and keeps in the base plate elastic bending dorsad through the electric current of leading to opposite direction in the coil, perhaps resets towards the base plate of keeping in, and then makes the chip transfer to on the backplate.

Wherein the first end is an S pole, and the second end is an N pole; the third end is an S pole, and the fourth end is an N pole; the fifth end is an N pole, and the sixth end is an S pole; the magnetic induction line between the first end and the fifth end points to the first end from the fifth end, and the magnetic induction line between the third end and the fifth end points to the third end from the fifth end. This transfer head has realized that the coil drives elasticity adhesion layer and keeps in the base plate elastic bending dorsad through the electric current of leading to opposite direction in the coil, perhaps resets towards the base plate of keeping in, and then makes the chip transfer to on the backplate.

The first side magnetic pole comprises a first inner side facing the central magnetic pole and a first outer side facing away from the central magnetic pole, the second side magnetic pole comprises a second inner side facing the central magnetic pole and a second outer side facing away from the central magnetic pole, the first inner side and the second inner side are oppositely arranged, and two opposite ends of the elastic adhesion layer are respectively connected with the first outer side and the second outer side. Therefore, in the process of elastic bending of the elastic adhesion layer, because the two opposite ends of the elastic adhesion layer are respectively connected with the first outer side and the second outer side, the elastic bending length of the elastic adhesion layer is longer, when the central part of the elastic adhesion layer moves a preset distance, the radian of the elastic adhesion layer is smaller, the bending degree of the elastic adhesion layer is smaller, and the service life of the elastic adhesion layer can be prolonged.

The temporary storage substrate is made of at least one of sapphire and quartz glass; the center magnetic pole, the first side magnetic pole and the second side magnetic pole are made of neodymium iron boron magnetic materials.

Wherein the coil is a helical multilayer.

The utility model provides a huge transfer system, including growth substrate, backplate and foretell transfer head, it has the chip to grow on the growth substrate, huge transfer head be used for with chip on the growth substrate adsorbs the elasticity adhesion layer dorsad keep in the substrate on the surface, and will the chip shifts on the backplate. Therefore, the magnetic induction lines between the central magnetic poles and the side magnetic poles of the mass transfer head in the mass transfer system of the application point to one another, and the transfer of the chip from the growth substrate to the back plate can be completed by turning two currents in opposite directions into the coil. And the huge transfer head can carry out the next chip transfer after finishing the chip transfer once, and the huge transfer head can be reused, thereby saving the cost. The technical problems that the existing mass transfer head cannot be reused and the mass transfer cost is high are solved.

The transfer heads are multiple, the growth substrate is provided with multiple chips, and the massive transfer head is used for selectively adsorbing the chips on the growth substrate onto the surface of the elastic adhesion layer, which is back to the temporary storage substrate, and transferring the chips onto the back plate. Therefore, the point selection can be carried out, and chip stripping and transferring can be selectively carried out.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of the bulk transfer head provided by the present invention.

FIG. 2 is a schematic diagram of the structure of the bulk transfer head of FIG. 1 aligned to a growth substrate chip.

FIG. 3 is a schematic diagram of the structure of the bulk transfer head of FIG. 2 sucking the chip.

FIG. 4 is a schematic diagram of the bulk transfer head of FIG. 3 aligned to a backplane.

Fig. 5 is a schematic view of the bulk transfer tape of fig. 4 driving the chip to move toward the back plate.

Fig. 6 is a schematic structural diagram of the bulk transfer head in fig. 5 transferring a chip to a backplane.

FIG. 7 is a schematic top view of the bulk transfer head of FIG. 1.

FIG. 8 is another schematic top view of the bulk transfer head of FIG. 1.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

Referring to fig. 1-6, the present invention provides a bulk transfer system, which includes a growth substrate 50, a back plate 60, and a bulk transfer head 100. The growth substrate 50 has chips 501 grown thereon, and the bulk transfer head 100 is used to transfer the chips 501 on the growth substrate 50 onto the backplane 60. In this application, the chip 501 is a Micro LED chip 501. The bulk transfer head 100 will be described as follows.

Referring to fig. 1, the bulk transfer head 100 includes an elastic adhesion layer 10, a temporary storage substrate 20, a central magnetic pole 30, side magnetic poles, a coil 40, and a magnetic conductive structure, wherein the elastic adhesion layer 10 is disposed opposite to the temporary storage substrate 20, the side magnetic poles are disposed at one side of the central magnetic pole 30, the central magnetic pole 30 and the side magnetic poles are disposed between the elastic adhesion layer 10 and the temporary storage substrate 20, opposite ends of the side magnetic poles are respectively fixedly connected to the elastic adhesion layer 10 and the temporary storage substrate 20, one end of the central magnetic pole 30 is fixedly connected to the temporary storage substrate 20, the coil 40 is sleeved on the central magnetic pole 30, the coil 40 is fixed on the elastic adhesion layer 10, and the magnetic conductive structure is disposed on the central magnetic pole 30 and the side magnetic poles for adjusting a magnetic induction line between the central magnetic pole 30 and the side magnetic poles to point. It will be appreciated that the magnetic conducting structure can adjust the magnetic induction line between the central pole 30 and the side poles to be: from the center pole 30 to the side poles, or from the side poles to the center pole 30. Besides the direction of the magnetic induction lines can be adjusted by the magnetic conduction structure, the density arrangement of the magnetic induction lines can be adjusted by the magnetic conduction pole. The coil 40 is made of a conductive ultrafine metal enameled wire through a winding process to form a rectangular or circular multi-layered structure, such as a spiral multi-layer. External circuits are connected at two wire ends of an incoming wire and an outgoing wire of the coil 40, and direct current passes through the circuits under the condition that the circuits are electrified, so that the circuits can be electrified in different directions. The elastic adhesive layer 10 has a highly elastic adhesive film, and the coil 40 is adhered to the elastic adhesive layer 10 with glue. The material of the temporary storage substrate 20 includes a low deformation material, such as at least one of sapphire and quartz glass. The magnetic conduction structure can be washer.

Referring to fig. 2-3, specifically, when the coil 40 is located in the magnetic field between the central magnetic pole 30 and the side magnetic pole to peel off the chip 501 on the growth substrate 50, the bulk transfer head 100 may be aligned with the chip 501 on the growth substrate 50 (as shown in fig. 1), a current in a specific direction is applied to the coil 40, the applied coil 40 is acted by an ampere force, and the coil 40 moves in a direction away from the temporary storage substrate 20 and toward the chip 501 under the action of the ampere force, so as to drive the elastic adhesion layer 10 to elastically bend to move in a direction away from the temporary storage substrate 20 and toward the chip 501, when the elastic adhesion layer 10 is in contact with and adhered to the chip 501, the separation between the growth substrate 50 and the chip 501 is completed through the peeling process of the chip 501, and the chip 501 is transferred to the bulk transfer head 100. When a current in the opposite direction is applied to the coil 40, the coil 40 will be subjected to an ampere force in the opposite direction, and the ampere force in the opposite direction and the elastic restoring force of the elastic adhesive layer 10 act together, so that the elastic adhesive layer 10 moves to a direction close to the temporary storage substrate 20 and restores to the original position (as shown in fig. 2). Thus, by passing a current in the opposite direction twice into the coil 40, the chip 501 can be transferred from the growth substrate 50 onto the surface of the elastic adhesive layer 10 of the bulk transfer head 100 facing away from the temporary storage substrate 20.

Referring to fig. 4-6, similarly, when the chip 501 is transferred from the bulk transfer head 100 to the backplane 60, the bulk transfer head 100 may be aligned with the backplane 60 (as shown in fig. 3), and a current in a specific direction is applied to the coil 40 again, the coil 40 is acted by an ampere force, and the coil 40 moves away from the temporary storage substrate 20 and toward the backplane 60 under the action of the ampere force, so as to drive the elastic adhesion layer 10 to elastically bend to move away from the temporary storage substrate 20 and toward the backplane 60, and when the elastic adhesion layer 10 is in contact with and adhered to the backplane 60, the chip 501 and the backplane 60 are welded and bound (as shown in fig. 4) through a welding process. When current in the coil 40 is applied in the opposite direction, the coil 40 will be subjected to an ampere force in the opposite direction, and the ampere force in the opposite direction and the elastic restoring force of the elastic adhesive layer 10 are combined, so that the elastic adhesive layer 10 is separated from the chip 501, and the elastic adhesive layer 10 moves to the direction close to the temporary storage substrate 20 and restores to the original position (as shown in fig. 5). This completes the transfer of the chip 501 from the growth substrate 50 to the backplane 60. Thus, by passing a current in the opposite direction twice through the coil 40, the chip 501 can be transferred from the bulk transfer head 100 to the backplane 60. It is understood that the solder bonding of the chip 501 and the backplane 60 includes: after the electrode 501a of the chip 501 is aligned and attached to the electrode 601 of the backplate 60, the electrode of the chip 501 is welded and bonded to the electrode of the backplate 60. The degree of bending of the elastic adhesive layer 10 is determined by the energization time and the energization current intensity, and the upper limit of the bending depends on the deformation length of the elastic adhesive layer 10. When the elastic adhesive layer 10 returns to the initial position, the energization is stopped and the chip 501 is ready for the next transfer.

Therefore, when the magnetic induction lines between the center pole 30 and the side poles of the mass transfer head 100 of the present application are directed from one to the other, the transfer of the chip 501 from the growth substrate 50 to the back plate 60 can be completed by passing currents in opposite directions through the coil 40 in two rounds. And after the bulk transfer head 100 finishes the chip 501 transfer once, the next chip 501 transfer can be carried out, and the bulk transfer head 100 can be reused, so that the cost is saved. The technical problems that the existing bulk transfer head 100 cannot be reused and the bulk transfer cost is high are solved.

In some embodiments, the transfer head is multiple, the growth substrate 50 has multiple chips 501 grown thereon, and the bulk transfer head 100 is used to selectively adsorb the chips 501 on the growth substrate 50 onto the surface of the elastic adhesive layer 10 facing away from the temporary storage substrate 20 and transfer the chips 501 to the back plate 60.

Specifically, before transfer, a plurality of transfer heads may be aligned with a plurality of chips 501 of the growth substrate 50, so that one transfer head is aligned with one chip 501. At the time of transfer, the chip 501 to be transferred is determined, and electricity is applied to the coil 40 of the transfer head with which the chip 501 is aligned, the elastic adhesive layer 10 of the transfer head is elastically bent toward the chip 501 to be transferred and adsorbs the chip 501, after the chip 501 is peeled off, the chip 501 is transferred to the transfer head, and then the chip 501 is transferred to the rear plate 60. Therefore, the point selection can be performed, and the chip 501 can be selectively peeled and transferred.

With reference to fig. 1-6, the side magnetic poles include a first side magnetic pole 70 and a second side magnetic pole 80, the first side magnetic pole 70 and the second side magnetic pole 80 are respectively disposed at two sides of the central magnetic pole 30, two opposite ends of the first side magnetic pole 70 are respectively fixedly connected to the elastic adhesive layer 10 and the temporary storage substrate 20, two opposite ends of the second side magnetic pole 80 are respectively fixedly connected to the elastic adhesive layer 10 and the temporary storage substrate 20, the magnetic conductive structure includes a first magnetic conductive pole 210, a second magnetic conductive pole 220 and a third magnetic conductive pole 230, the first magnetic conductive pole 210 is disposed on the first side magnetic pole 70, the second magnetic conductive pole 220 is disposed on the second side magnetic pole 80, the third magnetic conductive pole 230 is disposed on the central magnetic pole 30, the first magnetic conductive pole 210 and the third magnetic conductive pole 230 are commonly used for adjusting the magnetic induction line between the first side magnetic pole 70 and the central magnetic pole 30 to point to one from the other, the second magnetic conductive pole 220 and the third magnetic pole 230 are commonly used for adjusting the magnetic induction line between the second side magnetic pole 80 and the central magnetic pole 30 One pointing towards the other. It is understood that the first and third magnetically permeable poles 210 and 230 can adjust the magnetic induction line between the central pole 30 and the first side pole 70 to: from the central pole 30 to the first side pole 70 or from the first side pole 70 to the central pole 30. The second and third magnetically permeable poles 220 and 230 can adjust the magnetic induction line between the central magnetic pole 30 and the second side magnetic pole 80 to: from the central pole 30 to the second side pole 80 or from the second side pole 80 to the central pole 30.

Specifically, when current is passed through the coil 40, the conducting wire between the first side magnetic pole 70 and the central magnetic pole 30 is acted by ampere force, the conducting wire between the second side magnetic pole 80 and the central magnetic pole 30 is also acted by ampere force, the acting force on the coil 40 is accumulated, the acting force on the coil 40 is larger, the coil 40 moves faster, the elastic adhesion layer 10 is bent elastically faster, the transfer speed of the chip 501 is faster, the transfer time is saved, and the cost is saved. Moreover, since the wires receiving the acting force are located at two sides of the central magnetic pole 30, the force applied to the coil 40 will be more uniform, the force applied to the elastic adhesion layer 10 will be more uniform, and the moving process of the chip 501 driven by the elastic adhesion layer 10 will be more stable. It can be understood that, since the first side magnetic pole 70 and the second side magnetic pole 80 are both fixedly connected to the elastic adhesive layer 10, and the first side magnetic pole 70 and the second side magnetic pole 80 are respectively disposed at two sides of the central magnetic pole 30, when the elastic adhesive layer 10 is elastically bent, the middle portion of the elastic adhesive layer 10 drives the edge portion to be bent, and the bending degree of the middle portion is maximum. The material of the center pole 30, the first side pole 70, and the second side pole 80 includes a strong permanent magnet, such as neodymium iron boron magnetic material.

The opposite ends of the first side magnetic pole 70 include a first end 701 facing the elastic adhesive layer 10 and a second end 702 facing the temporary storage substrate 20, the opposite ends of the second side magnetic pole 80 include a third end 801 facing the elastic adhesive layer 10 and a fourth end 802 facing the temporary storage substrate 20, the center magnetic pole 30 includes a fifth end 301 facing the elastic adhesive layer 10 and a sixth end 302 facing the temporary storage substrate 20, the sixth end 302 is fixedly connected with the temporary storage substrate 20, an interface of the first end 701 and the second end 702, an interface of the third end 801 and the fourth end 802, and an interface of the fifth end 301 and the sixth end 302 are located on the same reference plane 120, and the coil 40 is located between the reference plane 120 and the elastic adhesive layer 10. It is understood that the first terminal 701 and the second terminal 702 on both sides of the reference plane 120 have different polarities, the third terminal 801 and the fourth terminal 802 on both sides of the reference plane 120 have different polarities, and the fifth terminal 301 and the sixth terminal 302 on both sides of the reference plane 120 have different polarities. On the same side of the reference plane 120, the direction of the magnetic induction line between the first end 701 and the fifth end 301 is unchanged, and the direction of the magnetic induction line between the third end 801 and the fifth end 301 is unchanged. Therefore, when the coil 40 is located between the reference plane 120 and the elastic adhesive layer 10 and current is applied to the coil 40, all wires in the coil 40 will be subjected to the acting force in the same direction, and the acting force in the same direction has a synergistic effect, so that the moving speed of the coil 40 is faster, the transferring speed of the chip 501 is faster, and the cost is saved.

In some embodiments, the first magnetic pole 210 is fixed on the first end 701 and disposed between the first end 701 and the elastic adhesion layer 10, and the first end 701 is fixed on the elastic adhesion layer 10 through the first magnetic pole 210; the second magnetic pole 220 is fixed on the third end 801 and is arranged between the third end 801 and the elastic adhesion layer 10, and the third end 801 is fixed on the elastic adhesion layer 10 through the second magnetic pole 220; the third magnetic pole 230 is fixed on the fifth end 301 and disposed between the fifth end 301 and the elastic adhesion layer 10. The first magnetically permeable pole 201 fixed at the first end 701 and the third magnetically permeable pole 230 fixed at the fifth end 301 may enable the line of magnetic induction between the first side magnetic pole 70 and the central magnetic pole 30 to be adjusted to point from one to the other, and the second magnetically permeable pole 220 fixed at the third end 801 and the third magnetically permeable pole 230 fixed at the fifth end 301 may enable the line of magnetic induction between the second side magnetic pole 80 and the central magnetic pole 30 to be adjusted to point from one to the other.

Referring to fig. 7, in some embodiments, the first terminal 701 is an N-pole and the second terminal 702 is an S-pole; the third end 801 is an N pole, and the fourth end 802 is an S pole; the fifth terminal 301 is an S pole, and the sixth terminal 302 is an N pole; the magnetic induction line between the first end 701 and the fifth end 301 is from the first end 701 to the fifth end 301, and the magnetic induction line between the third end 801 and the fifth end 301 is from the third end 801 to the fifth end 301. Specifically, when the elastic adhesion layer 10 needs to be elastically bent in a direction away from the temporary storage substrate 20, a current in a counterclockwise direction may be applied to the coil 40, so that the coil 40 is subjected to an acting force in a direction away from the temporary storage substrate 20, and the coil 40 drives the elastic adhesion layer 10 to be elastically bent in a direction away from the temporary storage substrate 20; when the elastic adhesive layer 10 needs to be reset toward the temporary storage substrate 20, a clockwise current may be applied to the coil 40, so that the coil 40 is acted by a force toward the temporary storage substrate 20, and the coil 40 drives the elastic adhesive layer 10 to be reset toward the temporary storage substrate 20. Therefore, the transfer head realizes that the coil 40 drives the elastic adhesion layer 10 to elastically bend back to the temporary storage substrate 20 or reset towards the temporary storage substrate 20 by passing current in the coil 40 in the opposite direction, so that the chip 501 is transferred to the back plate 60.

Referring to fig. 8, in some embodiments, the first terminal 701 is an S-pole and the second terminal 702 is an N-pole; the third end 801 is an S pole, and the fourth end 802 is an N pole; the fifth terminal 301 is an N pole, and the sixth terminal 302 is an S pole; the magnetic induction line between the first end 701 and the fifth end 301 is from the fifth end 301 to the first end 701, and the magnetic induction line between the third end 801 and the fifth end 301 is from the fifth end 301 to the third end 801. Specifically, when the elastic adhesive layer 10 needs to be elastically bent in a direction away from the temporary storage substrate 20, a current in a clockwise direction may be applied to the coil 40, so that the coil 40 is subjected to an acting force in a direction away from the temporary storage substrate 20, and the coil 40 drives the elastic adhesive layer 10 to be elastically bent in a direction away from the temporary storage substrate 20; when the elastic adhesive layer 10 needs to be reset toward the temporary storage substrate 20, a counter-clockwise current may be applied to the coil 40, so that the coil 40 is acted by a force toward the temporary storage substrate 20, and the coil 40 drives the elastic adhesive layer 10 to be reset toward the temporary storage substrate 20. Therefore, the transfer head realizes that the coil 40 drives the elastic adhesion layer 10 to elastically bend back to the temporary storage substrate 20 or reset towards the temporary storage substrate 20 by passing current in the coil 40 in the opposite direction, so that the chip 501 is transferred to the back plate 60.

With reference to fig. 5, the first side magnetic pole 70 includes a first inner side 703 facing the central magnetic pole 30 and a first outer side 704 facing away from the central magnetic pole 30, the second side magnetic pole 80 includes a second inner side 803 facing the central magnetic pole 30 and a second outer side 804 facing away from the central magnetic pole 30, the first inner side 703 and the second inner side 803 are disposed opposite to each other, and opposite ends of the elastic adhesive layer 10 are respectively connected to the first outer side 704 and the second outer side 804. Specifically, in the process of elastically bending the elastic adhesive layer 10, since the opposite ends of the elastic adhesive layer 10 are respectively connected to the first outer side 704 and the second outer side 804, the elastically bendable length of the elastic adhesive layer 10 is long, when the central portion of the elastic adhesive layer 10 moves a preset distance, the radian of the elastic adhesive layer 10 is small, the degree of bending of the elastic adhesive layer 10 is small, and the service life of the elastic adhesive layer 10 can be prolonged.

While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention.

Claims (10)

1. A bulk transfer head is characterized in that the bulk transfer head comprises an elastic adhesion layer, a temporary storage substrate, a central magnetic pole, side magnetic poles, a coil and a magnetic conduction structure, the elastic adhesion layer is arranged opposite to the temporary storage substrate, the side magnetic pole is arranged on one side of the central magnetic pole, the central magnetic pole and the side magnetic poles are arranged between the elastic adhesion layer and the temporary storage substrate, the two opposite ends of the side magnetic poles are respectively fixedly connected with the elastic adhesion layer and the temporary storage substrate, one end of the central magnetic pole is fixedly connected with the temporary storage substrate, the coil is sleeved on the central magnetic pole, the coil is fixed on the elastic adhesion layer, the magnetic conduction structure is arranged on the central magnetic pole and the side magnetic poles, for adjusting the lines of magnetic induction between the center pole and the side poles to point from one to the other.

2. The bulk transfer head of claim 1, wherein the edge poles comprise first and second edge poles respectively disposed on opposite sides of the central pole, opposite ends of the first edge pole are fixedly connected to the elastic adhesive layer and the temporary storage substrate, opposite ends of the second edge pole are fixedly connected to the elastic adhesive layer and the temporary storage substrate, respectively, the magnetic conductive structure comprises first, second, and third magnetic conductive poles, the first magnetic conductive pole is disposed on the first edge pole, the second magnetic conductive pole is disposed on the second edge pole, the third magnetic conductive pole is disposed on the central pole, the first and third magnetic conductive poles are commonly used for adjusting a magnetic induction line between the first edge pole and the central pole to point from one to the other, the second magnetic conductive pole and the third magnetic conductive pole are used together for adjusting the magnetic induction line between the second side magnetic pole and the central magnetic pole to point from one of the second side magnetic pole to the other.

3. The mass transfer head of claim 2, wherein the opposing ends of the first side pole include a first end facing the elastic adhesive layer and a second end facing the temporary storage substrate, the opposing ends of the second side pole include a third end facing the elastic adhesive layer and a fourth end facing the temporary storage substrate, the center pole includes a fifth end facing the elastic adhesive layer and a sixth end facing the temporary storage substrate, the sixth end is fixedly connected to the temporary storage substrate, an interface of the first end and the second end, an interface of the third end and the fourth end, and an interface of the fifth end and the sixth end are located on a same reference plane, and the coil is located between the reference plane and the elastic adhesive layer.

4. The mass transfer head of claim 3, wherein said first magnetically permeable pole is fixed to said first end and is disposed between said first end and said elastic adhesive layer, said first end being fixed to said elastic adhesive layer by said first magnetically permeable pole; the second magnetic pole is fixed on the third end and arranged between the third end and the elastic adhesion layer, and the third end is fixed on the elastic adhesion layer through the second magnetic pole; the third magnetic pole is fixed on the fifth end and is arranged between the fifth end and the elastic adhesion layer.

5. The bulk transfer head according to claim 3, wherein said first end is an N-pole and said second end is an S-pole; the third end is an N pole, and the fourth end is an S pole; the fifth end is an S pole, and the sixth end is an N pole; the magnetic induction line between the first end and the fifth end points to the fifth end from the first end, and the magnetic induction line between the third end and the fifth end points to the fifth end from the third end.

6. The bulk transfer head according to claim 3, wherein said first end is an S-pole and said second end is an N-pole; the third end is an S pole, and the fourth end is an N pole; the fifth end is an N pole, and the sixth end is an S pole; the magnetic induction line between the first end and the fifth end points to the first end from the fifth end, and the magnetic induction line between the third end and the fifth end points to the third end from the fifth end.

7. The bulk transfer head of claim 2, wherein the first side pole comprises a first inner side facing the center pole and a first outer side facing away from the center pole, the second side pole comprises a second inner side facing the center pole and a second outer side facing away from the center pole, the first inner side is disposed opposite the second inner side, and opposite ends of the elastic adhesive layer connect the first outer side and the second outer side, respectively.

8. The bulk transfer head of claim 2, wherein the temporary storage substrate comprises at least one of sapphire and quartz glass; the center magnetic pole, the first side magnetic pole and the second side magnetic pole are made of neodymium iron boron magnetic materials.

9. A bulk transfer system comprising a growth substrate on which chips are grown and a transfer head according to any of claims 1 to 8 for attracting the chips on the growth substrate to a surface of the elastic adhesive layer facing away from the temporary storage substrate and transferring the chips to a backing plate.

10. The bulk transfer system according to claim 9, wherein the transfer head is plural, the growth substrate has plural chips grown thereon, and the bulk transfer head is configured to selectively adsorb the chips on the growth substrate onto a surface of the elastic adhesive layer facing away from the temporary storage substrate, and transfer the chips onto the back plate.

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