CN111203807B - 一种化学机械抛光机 - Google Patents
一种化学机械抛光机 Download PDFInfo
- Publication number
- CN111203807B CN111203807B CN202010032450.4A CN202010032450A CN111203807B CN 111203807 B CN111203807 B CN 111203807B CN 202010032450 A CN202010032450 A CN 202010032450A CN 111203807 B CN111203807 B CN 111203807B
- Authority
- CN
- China
- Prior art keywords
- sealing
- plate
- connecting rod
- movable
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 49
- 239000000126 substance Substances 0.000 title claims abstract description 16
- 238000007789 sealing Methods 0.000 claims abstract description 91
- 238000005192 partition Methods 0.000 claims description 12
- 238000004891 communication Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims 1
- 239000000428 dust Substances 0.000 abstract description 31
- 238000009825 accumulation Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000007667 floating Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
Claims (4)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010032450.4A CN111203807B (zh) | 2020-01-13 | 2020-01-13 | 一种化学机械抛光机 |
CN202110165328.9A CN112959221A (zh) | 2020-01-13 | 2020-01-13 | 一种化学机械抛光机及其操作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010032450.4A CN111203807B (zh) | 2020-01-13 | 2020-01-13 | 一种化学机械抛光机 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202110165328.9A Division CN112959221A (zh) | 2020-01-13 | 2020-01-13 | 一种化学机械抛光机及其操作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN111203807A CN111203807A (zh) | 2020-05-29 |
CN111203807B true CN111203807B (zh) | 2021-05-11 |
Family
ID=70784301
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010032450.4A Active CN111203807B (zh) | 2020-01-13 | 2020-01-13 | 一种化学机械抛光机 |
CN202110165328.9A Withdrawn CN112959221A (zh) | 2020-01-13 | 2020-01-13 | 一种化学机械抛光机及其操作方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202110165328.9A Withdrawn CN112959221A (zh) | 2020-01-13 | 2020-01-13 | 一种化学机械抛光机及其操作方法 |
Country Status (1)
Country | Link |
---|---|
CN (2) | CN111203807B (zh) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4466852A (en) * | 1983-10-27 | 1984-08-21 | At&T Technologies, Inc. | Method and apparatus for demounting wafers |
CN1271306A (zh) * | 1997-09-26 | 2000-10-25 | Memc电子材料有限公司 | 晶片加工装置 |
CN1672873A (zh) * | 2004-03-23 | 2005-09-28 | 力晶半导体股份有限公司 | 化学机械研磨制作工艺的假制作工艺与研磨垫调节方法 |
CN205835001U (zh) * | 2016-07-20 | 2016-12-28 | 华侨大学 | 一种蓝宝石晶片腐蚀抛光复合加工机床 |
CN206509873U (zh) * | 2017-06-15 | 2017-09-22 | 印杰 | 圆盘式抛光机 |
CN108857863A (zh) * | 2018-07-02 | 2018-11-23 | 江苏纳沛斯半导体有限公司 | 一种防震型晶圆研磨机 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3898261B2 (ja) * | 1996-12-27 | 2007-03-28 | 信越半導体株式会社 | 半導体ウエーハの保持機構 |
-
2020
- 2020-01-13 CN CN202010032450.4A patent/CN111203807B/zh active Active
- 2020-01-13 CN CN202110165328.9A patent/CN112959221A/zh not_active Withdrawn
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4466852A (en) * | 1983-10-27 | 1984-08-21 | At&T Technologies, Inc. | Method and apparatus for demounting wafers |
CN1271306A (zh) * | 1997-09-26 | 2000-10-25 | Memc电子材料有限公司 | 晶片加工装置 |
CN1672873A (zh) * | 2004-03-23 | 2005-09-28 | 力晶半导体股份有限公司 | 化学机械研磨制作工艺的假制作工艺与研磨垫调节方法 |
CN205835001U (zh) * | 2016-07-20 | 2016-12-28 | 华侨大学 | 一种蓝宝石晶片腐蚀抛光复合加工机床 |
CN206509873U (zh) * | 2017-06-15 | 2017-09-22 | 印杰 | 圆盘式抛光机 |
CN108857863A (zh) * | 2018-07-02 | 2018-11-23 | 江苏纳沛斯半导体有限公司 | 一种防震型晶圆研磨机 |
Also Published As
Publication number | Publication date |
---|---|
CN112959221A (zh) | 2021-06-15 |
CN111203807A (zh) | 2020-05-29 |
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Legal Events
Date | Code | Title | Description |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20210425 Address after: 311800 No.1028, Mingzhuang, Baima new village, Ciwu Town, Zhuji City, Shaoxing City, Zhejiang Province Applicant after: Zhuji Yayan Technology Co.,Ltd. Address before: 100054 Beijing Electric Power depot, No.12, Station Road, South Beijing station, Fengtai District, Beijing Applicant before: Liu Heping |
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TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20230711 Address after: Building B, No. 133, Buyue Road, Pukou District, Nanjing, Jiangsu 210000 Patentee after: Nanjing Yushi Semiconductor Co.,Ltd. Address before: No. 1028, Mingzhuang, Baima new village, Ciwu Town, Zhuji City, Shaoxing City, Zhejiang Province, 311800 Patentee before: Zhuji Yayan Technology Co.,Ltd. |
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TR01 | Transfer of patent right |