CN111157304B - 芯片封装装置及其对位压合方法 - Google Patents

芯片封装装置及其对位压合方法 Download PDF

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CN111157304B
CN111157304B CN201811406414.9A CN201811406414A CN111157304B CN 111157304 B CN111157304 B CN 111157304B CN 201811406414 A CN201811406414 A CN 201811406414A CN 111157304 B CN111157304 B CN 111157304B
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detector
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liquid sample
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谢伯宗
杨佳明
陈引干
曾湜雯
蔡雅雯
庄雅雯
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Abstract

本发明提供了一种芯片封装装置，包含一主体单元、一封装单元，及一对位单元。所述主体单元包括一载物座、一支撑架，及一旋转台，所述封装单元包括一上、下压合件、一上、下芯片，及一屏蔽，一垂直轴线位于所述上、下压合件的中间位置，而一水平轴线位于所述下压合件的上方，所述对位单元包括一对位侦测器，及一第一对焦侦测器，当所述下压合件上设置所述下芯片与所述屏蔽，将所述液态样品承装于所述屏蔽中，且将一封装胶涂覆于所述液态样品外围，再移除所述屏蔽，所述对位侦测器与所述第一对焦侦测器分别对所述下芯片进行位置侦测，使所述上、下芯片对位压合在一起。

Description

芯片封装装置及其对位压合方法
技术领域
本发明是有关一种芯片封装装置，特别是指一种适用于对一液态样品进行封装的芯片封装装置及其对位压合方法。
背景技术
电子显微镜被广泛应用于各领域的样品检测上，当进行液态的样品检测时，由于其具有流动性，或是操作过程衍生的腔体污染等问题，因此在进行检测前需先对液态样品进行封装，举以结合半导体硅制程与微机电技术进行液态样品封装的方法来说，因电子束具有穿透性差且于电子显微镜下成相困难等缺点，上述方法仅能用于流动性较高的液态样品，对于流动性相对较低或是黏稠度较高的样品，则无法利用上述方法进行封装。
再者，上述结合半导体硅制程与微机电技术的样品承载装置，于封装过程中该承载装置需置于光学显微镜下，并以人工目视配合光学显微镜的方式对准上下两个承载装置进行黏合，除了耗费工时外，熟练度与稳定性等人为因素都将降低良率。若为了降低液态样品的流动性而对液态样品进行干燥，将衍生液态样品变形或其他形态改变的问题。此外，传统使用气喷或压喷等喷胶系统在100厘泊(centi-poise，cp)以上就有喷胶困难。
上述缺点都显现现有技术进行液态样品检测封装过程所衍生的种种问题，因此，目前亟需提出一种简易、快速且精准的样品承载装置与对位方法，以直接封装液态样品，特别是流动性较低的高黏度胶体涂布，以维持液态样品的原有形态。
发明内容
有鉴于此，本发明的目的，是提供一种芯片封装装置，适用于对一液态样品进行封装，其特征在于，包括一主体单元、一封装单元，及一对位单元。
主体单元包括一载物座、一设置于所述载物座上的支撑架，及一与所述支撑架连接的旋转台，所述载物座定义有一水平轴线，及一正交所述水平轴线的垂直轴线，所述封装单元包括一与所述旋转台连接的上压合件、一与所述上压合件对向间隔设置且位于所述载物座上的下压合件、一可分离地设置于所述上压合件的一端上的上芯片、一可分离地设置于所述下压合件的一端上的下芯片，及一可分离地设置于所述上、下芯片间的屏蔽，所述垂直轴线位于所述上、下压合件的中间位置，而所述水平轴线位于所述下压合件的上方，所述对位单元包括一设置于所述上压合件中心与所述垂直轴线上的对位侦测器，及一设置于所述载物座与所述水平轴线上的第一对焦侦测器。
本发明的另一技术手段，是在于上述的对位单元还包括一设置于所述载物座与所述水平轴线上的第二对焦侦测器，且所述第一、二对焦侦测器呈90度角设置。
本发明的又一技术手段，是在于上述的主体单元还包括一设置于所述旋转台上以与所述上压合件连接的滑动台，所述滑动台的作动会连动所述上压合件沿X轴或Y轴方向滑移，而所述对位单元还包括一处理器，其与所述对位侦测器、所述第一、二对焦侦测器及所述滑动台电连接，当所述对位侦测器与所述第一、二对焦侦测器分别对所述下芯片进行位置侦测，所述对位侦测器会传送一位置讯号至所述处理器中，所述处理器针对所述位置讯号控制所述滑动台移动，而所述第一、二对焦侦测器会分别传送一影像讯号至所述处理器中进行对焦处理，所述处理器利用对焦处理所得的结果控制所述滑动台移动，使所述上、下芯片对位压合。
本发明的再一技术手段，是在于上述的屏蔽具有一本体、至少一开设于所述本体上的承放口、一将所述承放口框围于其中并与其间隔设置的涂布通道，及至少一连接所述涂布通道与所述本体的连接肋，当所述下压合件上设置所述下芯片与所述屏蔽，所述液态样品位于所述承放口中，所述封装胶涂覆于所述涂布通道中，之后移除所述屏蔽并转动所述旋转台，所述上压合件上设置所述上芯片，并使所述上压合件位于所述下压合件上方，以进行所述上、下芯片的对位压合。
本发明的另一技术手段，是在于上述的封装单元还包括一与所述旋转台连接且位于所述上压合件一侧的涂胶罐，所述涂胶罐内承装有封装所述上、下芯片的封装胶。
本发明的又一目的，即在提供一种芯片封装装置的对位压合方法，其包括下列步骤。
首先，在一下压合件上设置一下芯片与一屏蔽，接着，转动一旋转台使一涂胶罐位于一下压合件上方，将所述液态样品置于所述屏蔽的承放口中，且将一封装胶涂覆于所述屏蔽的涂布通道，最后，移除所述屏蔽并转动所述旋转台，一上压合件上设置一上芯片，并使所述上压合件位于所述下压合件上方，以进行所述上、下芯片的对位压合，所述对位压合包括一对位侦测器对所述下芯片进行位置侦测，并传送一位置讯号至一处理器中，所述处理器针对所述位置讯号控制一滑动台移动，而第一、二对焦侦测器分别朝两方向对所述下芯片进行位置侦测，并分别传送一影像讯号至所述处理器中进行对焦处理，所述处理器利用对焦处理所得的结果控制所述滑动台移动。
本发明的再一技术手段，是在于上述的上、下芯片的压合压力小于1KPA，压合时间小于10分钟，压合温度小于100度。
本发明的另一技术手段，是在于上述位于所述上、下芯片间的封装胶呈现高度介于1000～1微米(Micrometer，μm)间，直径介于1000～10微米的图案，平均厚度差小于50％。
本发明的又一技术手段，是在于上述的液态样品的黏度介于100～1,000,000厘泊(centi-poise，cp)间。
本发明的再一技术手段，是在于上述是先将所述液态样品置于所述屏蔽的承放口中，再将所述封装胶涂覆于所述屏蔽的涂布通道。
本发明的有益功效在于，当所述下压合件上设置所述下芯片与所述屏蔽，将所述液态样品承装于所述屏蔽中，且将所述封装胶涂覆于所述液态样品外围，再移除所述屏蔽，所述对位侦测器与所述第一对焦侦测器分别对所述下芯片进行位置侦测，使所述上、下芯片对位压合在一起，过程中借由所述对位侦测器与所述第一对焦侦测器，取得位置侦测与多维视角影像，以达精准对位的功效。
附图说明
图1是一侧视示意图，说明本发明芯片封装装置的较佳实施例；
图2是一剖面示意图，说明本较佳实施例中一封装胶涂覆于一屏蔽的涂布通道中的态样；
图3是一剖面示意图，说明本较佳实施例中一上、下芯片对位压合的态样；
图4是一上视示意图，说明本较佳实施例中所述屏蔽的态样；
图5是一方块示意图，说明本较佳实施例中一对位单元的连接态样；及
图6是一流程示意图，说明本发明芯片封装装置的对位压合方法的步骤。
符号说明：
1 液态样品
3 主体单元
31 载物座
311 水平轴线
312 垂直轴线
32 支撑架
33 旋转台
34 滑动台
5 封装单元
51 上压合件
52 下压合件
53 上芯片
54 下芯片
55 屏蔽
551 本体
552 承放口
553 涂布通道
554 连接肋
56 涂胶罐
561 封装胶
7 对位单元
71 对位侦测器
72 第一对焦侦测器
73 第二对焦侦测器
74 处理器
91～93 步骤
具体实施方式
有关本发明的相关申请专利特色与技术内容，在以下配合参考图式的较佳实施例的详细说明中，将可清楚的呈现。
参阅图1、2，及3，为本发明芯片封装装置，适用于对一液态样品1进行封装，其包括一主体单元3、一封装单元5，及一对位单元7。
所述主体单元3包括一载物座31、一设置于所述载物座31上的支撑架32、一与所述支撑架32连接的旋转台33，及一设置于所述旋转台33上以与所述封装单元5连接的滑动台34，其中，所述载物座31定义有一水平轴线311，及一正交所述水平轴线311的垂直轴线312。
所述封装单元5包括一与所述旋转台33连接的上压合件51、一与所述上压合件51对向间隔设置且位于所述载物座31上的下压合件52、一可分离地设置于所述上压合件51的一端上的上芯片53、一可分离地设置于所述下压合件52的一端上的下芯片54、一可分离地设置于所述上、下芯片53、54间的屏蔽55，及一与所述旋转台33连接且位于所述上压合件51一侧的涂胶罐56，其中，所述涂胶罐56内承装有封装所述上、下芯片53、54的封装胶561。
另外，所述垂直轴线312位于所述上、下压合件51、52的中间位置，而所述水平轴线511位于所述下压合件52的上方。
所述上芯片53设置于所述上压合件51上，或所述下芯片54设置于所述下压合件52上的结合构造可以是卡榫或凹槽等，非本案的技术重点，在此不加以赘述。
较佳地，所述上、下芯片53、54为可透光的材质所制成，所述上芯片53的面积大于或等于所述下芯片54。而所述上、下芯片53、54的种类不限，于此为长宽小于3cm的尺寸。实际实施时，可将所述屏蔽55以1000-10μm的薄膜型态附加于所述下芯片54表面，待完成涂覆所述封装胶561后，再将薄膜型态的屏蔽55自所述下芯片54表面撕离，以提升分离的便利性。
其中，所述主体单元3的滑动台34设置于所述旋转台33上，以与所述上压合件51连接，所述滑动台34的作动会连动所述上压合件51沿X轴或Y轴方向滑移。
配合参阅图4、5，所述屏蔽55具有一本体551、至少一开设于所述本体551上的承放口552、一将所述承放口552框围于其中并与其间隔设置的涂布通道553，及至少一连接所述涂布通道553与所述本体551的连接肋554。当所述下压合件52上设置所述下芯片54与所述屏蔽55，所述液态样品1位于所述承放口552中，而所述封装胶561涂覆于所述涂布通道553中，当移除所述屏蔽55后，所述上芯片53则压合于所述下芯片54上方。
本发明运用于高黏度胶体的样品涂布，所述屏蔽55可进行图案化(pattern)造型，且材质可以是高分子、金属、陶瓷片、陶瓷膜等，以控制图案、线宽，并可进行单次或多次涂布使用。而所述液态样品1的图案化内容，可配合所述上压合件51设计。
透过所述屏蔽55的设置，可提升涂覆所述封装胶561的精度。实际实施时，也可省略所述连接肋554的设置，将所述涂布通道553改为由多个孔洞所组成，也可供流体的封装胶561自多个孔洞流出，以达到涂覆所述封装胶561的目的。于此所述屏蔽55为双环状设计，实际实施时，也可依需求将其设计为中央单点，或分散多点，不应以此为限。
所述对位单元7包括一设置于所述上压合件51中心与所述垂直轴线312上的对位侦测器71、一设置于所述载物座31与所述水平轴线311上的第一对焦侦测器72、一设置于所述载物座31与所述水平轴线311上的第二对焦侦测器73，及一处理器74，其中，所述处理器74与所述对位侦测器71、所述第一、二对焦侦测器72、73及所述滑动台34电连接。
于此，所述对位侦测器71为一红外线雷射光，其所发射的光线面积可与所述涂布通道553的大小相同，若当所述上、下芯片53、54的面积相同，所述对位侦测器71所发射的光线面积与所述上、下芯片53、54的周缘等距，以提升后续位置侦测的便利性。而所述第一、二对焦侦测器72、73为一摄影机，用以对所述上、下芯片53、54的边缘进行位置侦测，再由所述处理器74进行焦距的位置计算，以及所述上芯片53向下移动的水平度。较佳地，所述第一、二对焦侦测器72、73呈90度角设置，以取得多维视角影像。实际实施时，可设置所述第一、二对焦侦测器72、73的其中之一，以满足不同使用需求。
当所述下压合件52上设置所述下芯片54与所述屏蔽55，将所述液态样品1承装于所述屏蔽55的承放口552中，且将所述封装胶561涂覆于所述液态样品1外围，再移除所述屏蔽55，所述对位侦测器71与所述第一、二对焦侦测器72、73分别对所述下芯片54进行位置侦测，使所述上、下芯片53、54对位压合在一起，以达到封装芯片的目的。
举以图1的图面视角来说，所述对位侦测器71可提供上下的视角侦测，所述第一对焦侦测器72可提供前后的视角侦测，而所述第二对焦侦测器73则可提供左右的视角侦测，以提升芯片对位的准确性。
当所述对位侦测器71与所述第一、二对焦侦测器72、73分别对所述下芯片54进行位置侦测，且为持续侦测直至所述上、下芯片53、54对位压合，所述对位侦测器71会传送一位置讯号至所述处理器74中，所述处理器74针对所述位置讯号控制所述滑动台34移动，而所述第一、二对焦侦测器72、73会分别传送一影像讯号至所述处理器74中进行对焦处理，所述处理器74利用对焦处理所得的结果控制所述滑动台34移动，使所述上、下芯片53、54对位压合。进一步地，所述处理器74利用对焦处理所得的结果控制所述滑动台34移动，可以是所述处理器74纪录所述第一、二对焦侦测器72、73的影像讯号，以进行焦距的交叉比对。过程中，利用所述处理器74或所述第一、二对焦侦测器72、73的其中之一或其组合，在锁定焦距后记录焦距距离，借此回馈该液态样品1的距离位置。
配合参阅图6，依据上述的芯片封装装置，本发明芯片封装装置的对位压合方法，包含下列步骤。
首先，进行步骤91，在所述下压合件52上设置所述下芯片54与所述屏蔽55。
接着，进行步骤92，转动所述旋转台33使所述涂胶罐56位于所述下压合件52上方，将所述液态样品1置于所述屏蔽55的承放口552中，且将所述封装胶561涂覆于所述屏蔽55的涂布通道553。
其中，在所述步骤92中，所述液态样品1的黏度介于100～1,000,000厘泊(centi-poise，cp)间，以解决传统使用气喷或压喷等喷胶系统在100厘泊(centi-poise，cp)以上的喷胶困难。进一步地，所述液态样品1内含0～80wt％的固体含量，例如particle、fiber、nanowire、flake等，并适用于0.78pL～4ml的少量液态样品转移，且不限定样品颜色、导电性、纯度、副产物等。
另外，在所述步骤92中，是先将所述液态样品1置于所述屏蔽55的承放口552中，再将所述封装胶561涂覆于所述屏蔽55的涂布通道553。因此，所述屏蔽55上有位于内圈的液态样品1，以及外圈的封装胶561，过程中先涂覆内圈的液态样品1再涂覆外圈的封装胶561，可降低后涂覆的液态样品1沾黏到先涂覆的封装胶561，或是外圈的封装胶561干掉的困扰。
最后，进行步骤93，移除所述屏蔽55并转动所述旋转台33，于所述上压合件51上设置所述上芯片53，并使所述上压合件51位于所述下压合件52上方，以进行所述上、下芯片53、54的对位压合，所述对位压合包括所述对位侦测器71对所述下芯片54进行位置侦测，并传送所述位置讯号至所述处理器74中，所述处理器74针对所述位置讯号控制所述滑动台34移动，而所述第一、二对焦侦测器72、73分别朝两方向对所述下芯片54进行位置侦测，并分别传送所述影像讯号至所述处理器74中进行对焦处理，所述处理器74利用对焦处理所得的结果控制所述滑动台34移动。于此，所述对位侦测器71利用所述上、下芯片53、54为可透光的材质所制成，因此，所述上、下芯片53、54的中间透光，以达到对所述下芯片54进行位置侦测的目的。
其中，所述上、下芯片53、54的压合压力小于1KPA，压合时间小于10分钟，压合温度小于100度，实际实施时，可视情况给予压力，并回馈温度感测。
位于所述上、下芯片53、54间的封装胶561呈现高度介于1000～1微米(Micrometer，μm)间，直径介于1000～10微米的点状或环状图案，平均厚度差小于50％。
再者，进行密封之后处理时，封胶密封压力小于10MPA，密封时间小于30分钟，密封温度小于300度。
综上所述，本发明，借由所述主体单元3、所述封装单元5，及所述对位单元7间相互设置，运用于高黏度胶体的样品涂布，所述屏蔽55可进行图案化造型，所述对位侦测器71所发射的光线面积与所述上、下芯片53、54的周缘等距，以提升后续位置侦测的便利性，再者，透过所述对位侦测器71，以及所述第一、二对焦侦测器72、73呈90度角设置，可取得位置侦测与多维视角影像，进行所述上、下芯片53、54的对位压合封装，以达精准对位的功效，故确实可以达成本发明的目的。
以上所述，仅为本发明的较佳实施例而已，不能以此限定本发明实施的范围，即凡是依本发明申请专利范围及发明说明内容所作的简单的等效变化与修饰，皆仍属本发明专利涵盖的范围内。

Claims (10)

1.一种芯片封装装置，适用于对一液态样品进行封装，其特征在于，包括：
一主体单元，包括一载物座、一设置于所述载物座上的支撑架，及一与所述支撑架连接的旋转台，所述载物座定义有一水平轴线，及一正交所述水平轴线的垂直轴线；
一封装单元，包括一与所述旋转台连接的上压合件、一与所述上压合件对向间隔设置且位于所述载物座上的下压合件、一可分离地设置于所述上压合件的一端上的上芯片、一可分离地设置于所述下压合件的一端上的下芯片，及一可分离地设置于所述上、下芯片间的屏蔽，所述垂直轴线位于所述上、下压合件的中间位置，而所述水平轴线位于所述下压合件的上方；及
一对位单元，包括一设置于所述上压合件中心与所述垂直轴线上的对位侦测器，及一设置于所述载物座与所述水平轴线上的第一对焦侦测器，当所述下压合件上设置所述下芯片与所述屏蔽，将所述液态样品承装于所述屏蔽中，且将一封装胶涂覆于所述液态样品外围，再移除所述屏蔽，所述对位侦测器与所述第一对焦侦测器分别对所述下芯片进行位置侦测，使所述上、下芯片对位压合在一起。
2.如权利要求1所述的芯片封装装置，其特征在于，对位单元还包括一设置于所述载物座与所述水平轴线上的第二对焦侦测器，且所述第一、二对焦侦测器呈90度角设置。
3.如权利要求2所述的芯片封装装置，其特征在于，所述主体单元还包括一设置于所述旋转台上以与所述上压合件连接的滑动台，所述滑动台的作动会连动所述上压合件沿X轴或Y轴方向滑移，而所述对位单元还包括一处理器，其与所述对位侦测器、所述第一、二对焦侦测器及所述滑动台电连接，当所述对位侦测器与所述第一、二对焦侦测器分别对所述下芯片进行位置侦测，所述对位侦测器会传送一位置讯号至所述处理器中，所述处理器针对所述位置讯号控制所述滑动台移动，而所述第一、二对焦侦测器会分别传送一影像讯号至所述处理器中进行对焦处理，所述处理器利用对焦处理所得的结果控制所述滑动台移动，使所述上、下芯片对位压合。
4.如权利要求3所述的芯片封装装置，其特征在于，所述屏蔽具有一本体、至少一开设于所述本体上的承放口、一将所述承放口框围于其中并与其间隔设置的涂布通道，及至少一连接所述涂布通道与所述本体的连接肋，当所述下压合件上设置所述下芯片与所述屏蔽，所述液态样品位于所述承放口中，所述封装胶涂覆于所述涂布通道中，之后移除所述屏蔽并转动所述旋转台，所述上压合件上设置所述上芯片，并使所述上压合件位于所述下压合件上方，以进行所述上、下芯片的对位压合。
5.如权利要求4所述的芯片封装装置，其特征在于，所述封装单元还包括一与所述旋转台连接且位于所述上压合件一侧的涂胶罐，所述涂胶罐内承装有封装所述上、下芯片的封装胶。
6.一种芯片封装装置的对位压合方法，适用于对一液态样品进行封装，其特征在于，包括下列步骤：
(A)在一下压合件上设置一下芯片与一屏蔽；
(B)转动一旋转台使一涂胶罐位于一下压合件上方，将所述液态样品置于所述屏蔽的承放口中，且将一封装胶涂覆于所述屏蔽的涂布通道；及
(C)移除所述屏蔽并转动所述旋转台，一上压合件上设置一上芯片，并使所述上压合件位于所述下压合件上方，以进行所述上、下芯片的对位压合，所述对位压合包括一对位侦测器对所述下芯片进行位置侦测，并传送一位置讯号至一处理器中，所述处理器针对所述位置讯号控制一滑动台移动，而第一、二对焦侦测器分别朝两方向对所述下芯片进行位置侦测，并分别传送一影像讯号至所述处理器中进行对焦处理，所述处理器利用对焦处理所得的结果控制所述滑动台移动。
7.如权利要求6所述的芯片封装装置的对位压合方法，其特征在于，所述上、下芯片的压合压力小于1KPA，压合时间小于10分钟，压合温度小于100度。
8.如权利要求7所述的芯片封装装置的对位压合方法，其特征在于，在所述步骤(C)中，位于所述上、下芯片间的封装胶呈现高度介于1000～1微米(Micrometer，μm)间，直径介于1000～10微米的图案，平均厚度差小于50％。
9.如权利要求8所述的芯片封装装置的对位压合方法，其特征在于，在所述步骤(B)中，所述液态样品的黏度介于100～1,000,000厘泊cp间。
10.如权利要求9所述的芯片封装装置的对位压合方法，其特征在于，在所述步骤(B)中，是先将所述液态样品置于所述屏蔽的承放口中，再将所述封装胶涂覆于所述屏蔽的涂布通道。
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