CN111108143B - 阻燃聚酰胺组合物 - Google Patents

阻燃聚酰胺组合物 Download PDF

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Publication number
CN111108143B
CN111108143B CN201880061373.6A CN201880061373A CN111108143B CN 111108143 B CN111108143 B CN 111108143B CN 201880061373 A CN201880061373 A CN 201880061373A CN 111108143 B CN111108143 B CN 111108143B
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ion
weight percent
polyamide composition
polyamide
group
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CN201880061373.6A
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Chinese (zh)
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CN111108143A (zh
Inventor
A.马修
M.诺扎齐
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Celanese Polymers Holding Inc
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DuPont Polymers Inc
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C08G69/265—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from at least two different diamines or at least two different dicarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C08K3/105—Compounds containing metals of Groups 1 to 3 or of Groups 11 to 13 of the Periodic Table
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/20—Carboxylic acid amides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5313—Phosphinic compounds, e.g. R2=P(:O)OR'
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2231—Oxides; Hydroxides of metals of tin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/387—Borates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/346—Clay
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0066—Flame-proofing or flame-retarding additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN201880061373.6A 2017-09-21 2018-08-30 阻燃聚酰胺组合物 Active CN111108143B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201762561337P 2017-09-21 2017-09-21
US62/561337 2017-09-21
PCT/US2018/048692 WO2019060117A1 (en) 2017-09-21 2018-08-30 FLAME RETARDANT POLYAMIDE COMPOSITIONS

Publications (2)

Publication Number Publication Date
CN111108143A CN111108143A (zh) 2020-05-05
CN111108143B true CN111108143B (zh) 2023-05-30

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CN201880061373.6A Active CN111108143B (zh) 2017-09-21 2018-08-30 阻燃聚酰胺组合物

Country Status (5)

Country Link
US (1) US12152108B2 (OSRAM)
EP (2) EP4219594A3 (OSRAM)
JP (1) JP7353595B2 (OSRAM)
CN (1) CN111108143B (OSRAM)
WO (1) WO2019060117A1 (OSRAM)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020172580A (ja) * 2019-04-09 2020-10-22 三菱エンジニアリングプラスチックス株式会社 樹脂組成物および成形品
JP7310080B2 (ja) * 2019-04-09 2023-07-19 グローバルポリアセタール株式会社 樹脂組成物および成形品
JP2023524403A (ja) 2020-04-29 2023-06-12 デュポン ポリマーズ インコーポレイテッド ポリアミド組成物
MX2024004464A (es) * 2021-10-15 2024-05-09 Ningbo Institute Of Materials Tech & Engineering Chinese Academy Of Sciences Sal de fosfinato de dialquilo hibridizado, metodo de preparacion y su uso.
WO2024061681A1 (en) * 2022-09-23 2024-03-28 Basf Se Insulation film
US20250304789A1 (en) * 2024-04-01 2025-10-02 Celanese Polymers Holding, Inc. Polymer Composition for Contact with Cooling Fluids

Citations (1)

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US6140459A (en) * 1996-08-29 2000-10-31 E. I. Du Pont De Nemours And Company Semi-crystalline, semi-aromatic copolymers with superior post-molding shrinkage and balance of mechanical performance

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GB2170593B (en) 1985-02-01 1988-09-14 Central Electr Generat Board Temperature measurement
DE3667779D1 (de) 1985-03-23 1990-02-01 Nitto Boseki Co Ltd Glasspinnfaden und verfahren zu seiner herstellung.
US4749736A (en) * 1986-10-20 1988-06-07 Allied Corporation Nucleating system for polyamides
JP3707584B2 (ja) * 1997-06-26 2005-10-19 三菱エンジニアリングプラスチックス株式会社 ポリアミド樹脂組成物
US7294661B2 (en) 2003-10-03 2007-11-13 E.I. Du Pont De Nemours And Company Flame resistant aromatic polyamide resin composition and articles therefrom
JP2007254613A (ja) * 2006-03-23 2007-10-04 Toray Ind Inc ポリアミド樹脂組成物およびそれからなる成形品
WO2008126381A1 (ja) * 2007-03-30 2008-10-23 Mitsui Chemicals, Inc. 難燃性ポリアミド組成物
EP2163574B1 (en) * 2007-06-22 2015-08-12 Kaneka Corporation Polyolefin resin pre-foamed particle having antistatic property, and molded article produced from the particle
US20090030124A1 (en) 2007-07-06 2009-01-29 Yige Yin Flame resistant semiaromatic polyamide resin composition and articles therefrom
JP5319901B2 (ja) * 2007-09-07 2013-10-16 三菱樹脂株式会社 耐熱性樹脂組成物
US20100249292A1 (en) * 2009-03-30 2010-09-30 E. I. Du Pont De Nemours And Company Flame resistant semicaromatic polyamide resin composition and articles therefrom
CN106939125B (zh) * 2009-06-05 2020-12-29 Ems 专利股份公司 阻燃半芳族聚酰胺模塑组合物
US20110028628A1 (en) 2009-07-30 2011-02-03 E.I. Du Pont De Nemours And Company Heat resistant polyamide compositions having high amine ends
DE102010048025A1 (de) * 2010-10-09 2012-04-12 Clariant International Ltd. Flammschutzmittel- Stabilisator-Kombination für thermoplastische Polymere
US20130281589A1 (en) * 2012-04-23 2013-10-24 E I Du Pont De Nemours And Company Thermoplastic polyamide composition
EP2746341B2 (de) * 2012-12-21 2018-11-14 Ems-Patent Ag Schmutzabweisende Artikel und ihre Verwendung
JP6267786B2 (ja) * 2013-05-08 2018-01-24 エムス−パテント アクチエンゲゼルシャフト 水溶性ポリアミド製の表面コーティングを有する充填剤
WO2015057557A1 (en) 2013-10-16 2015-04-23 E. I. Du Pont De Nemours And Company Process for making semi-aromatic terpolyamide
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JP6420995B2 (ja) * 2014-08-29 2018-11-07 三井化学株式会社 難燃性ポリアミド樹脂組成物およびその成形体
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CN106751807B (zh) * 2017-01-09 2019-02-26 广东中塑新材料有限公司 高导热绝缘共聚酰胺6t复合材料及其制备方法

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Also Published As

Publication number Publication date
JP7353595B2 (ja) 2023-10-02
CN111108143A (zh) 2020-05-05
WO2019060117A1 (en) 2019-03-28
EP4219594A3 (en) 2023-08-30
EP3684839B1 (en) 2023-01-25
US20200247951A1 (en) 2020-08-06
US12152108B2 (en) 2024-11-26
JP2020535249A (ja) 2020-12-03
EP4219594A2 (en) 2023-08-02
EP3684839A1 (en) 2020-07-29

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