CN111081606B - Silicon wafer coating equipment and paddle thereof - Google Patents
Silicon wafer coating equipment and paddle thereof Download PDFInfo
- Publication number
- CN111081606B CN111081606B CN201911275001.6A CN201911275001A CN111081606B CN 111081606 B CN111081606 B CN 111081606B CN 201911275001 A CN201911275001 A CN 201911275001A CN 111081606 B CN111081606 B CN 111081606B
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- China
- Prior art keywords
- paddle
- silicon wafer
- board
- quartz boat
- coating equipment
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 51
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 51
- 239000010703 silicon Substances 0.000 title claims abstract description 51
- 238000000576 coating method Methods 0.000 title claims abstract description 49
- 239000011248 coating agent Substances 0.000 title claims abstract description 48
- 239000010453 quartz Substances 0.000 claims abstract description 23
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 23
- 235000012431 wafers Nutrition 0.000 claims description 42
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 239000000463 material Substances 0.000 abstract description 5
- 230000003014 reinforcing effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 4
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000969 carrier Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Silicon Compounds (AREA)
Abstract
The application discloses a paddle of silicon wafer coating equipment, which comprises a paddle board for bearing a quartz boat, wherein the paddle board is a hollowed paddle board; the paddle is in contact with a furnace mouth of the silicon wafer coating equipment, and the upper surface of the paddle is higher than that of the paddle plate; and the inclined connecting plate is used for connecting the paddle plate and the paddle. It is thus clear that oar in this application includes paddle, paddle and oblique connection board, and the paddle that is used for bearing the weight of the quartz boat is the fretwork paddle, places back on the paddle when the quartz boat, reduces the area of paddle and quartz boat contact to but the fretwork air current direct circulation about the paddle, the homogeneity of reinforcing silicon chip coating film improves the EL of battery piece, can also reduce the quantity of paddle material, reduces the cost of manufacture of oar. In addition, the application also provides silicon wafer coating equipment with the advantages.
Description
Technical Field
The application relates to the technical field of photovoltaic cell manufacturing, in particular to silicon wafer coating equipment and a paddle thereof.
Background
In the process of manufacturing the silicon wafer, the surface of the silicon wafer is coated with a film to reduce the reflectivity of light on the surface of the silicon wafer, enhance the passivation effect of the surface of the silicon wafer and reduce the recombination of current carriers.
During film coating, the mechanical gripper conveys the quartz boat bearing the silicon wafers to the paddle of the furnace tube, and the paddle conveys the quartz boat bearing the silicon wafers into the furnace tube for diffusion. In the diffusion process, the paddle occupies a certain position in the furnace tube, the surface of the existing paddle in contact with the quartz boat is solid, the circulation of airflow is influenced, the distance between the paddle and the quartz boat is too small, the airflow near a silicon wafer is easily uneven, the coating of the silicon wafer is uneven, the existing paddle is more in materials, and the manufacturing cost is high.
Therefore, how to solve the above technical problems should be a great concern to those skilled in the art.
Disclosure of Invention
The application aims to provide silicon wafer coating equipment and a paddle thereof, so that the influence of the paddle on coating unevenness in a coating process is reduced, and the manufacturing cost of the paddle is reduced.
In order to solve the above technical problem, the present application provides a paddle of silicon wafer coating equipment, including:
the paddle board is used for bearing the quartz boat and is a hollowed paddle board;
the paddle is in contact with a furnace mouth of the silicon wafer coating equipment, and the upper surface of the paddle is higher than that of the paddle plate;
and the inclined connecting plate is used for connecting the paddle plate and the paddle.
Optionally, the paddle has at least one first through hole extending through the thickness of the paddle.
Optionally, the paddle has a plurality of the first through holes, and the plurality of the first through holes are arranged in an array.
Optionally, the inclined connecting plate has at least one second through hole penetrating the thickness of the inclined connecting plate.
Optionally, the inclined connecting plate has a plurality of second through holes, and the plurality of second through holes are arranged in an array.
Optionally, the first through hole and the second through hole are both circular through holes.
Optionally, the hollowed-out area of the paddle board is rectangular, and the length of the hollowed-out area is equal to the length of the paddle board.
Optionally, the paddle is a silicon carbide paddle.
Optionally, the paddle is structurally integrated.
The application also provides silicon wafer coating equipment which comprises any one of the paddles.
The paddle of the silicon wafer coating equipment comprises a paddle board used for bearing a quartz boat, wherein the paddle board is a hollowed paddle board; the paddle is in contact with a furnace mouth of the silicon wafer coating equipment, and the upper surface of the paddle is higher than that of the paddle plate; and the inclined connecting plate is used for connecting the paddle plate and the paddle. It is thus clear that the oar in this application includes paddle, paddle and oblique connecting plate, and the paddle that is used for bearing the weight of the quartz boat is the fretwork paddle, places the back on the paddle when the quartz boat, reduces the area of paddle and quartz boat contact to but the fretwork air current direct circulation about the paddle strengthens the homogeneity of silicon chip coating film, improves the EL of battery piece, can also reduce the quantity of paddle material, reduces the cost of manufacture of oar. In addition, the application also provides silicon wafer coating equipment with the advantages.
Drawings
In order to clearly illustrate the embodiments or technical solutions of the present application, the drawings used in the embodiments or technical solutions of the present application will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic top view of a paddle of a silicon wafer coating apparatus according to an embodiment of the present disclosure;
fig. 2 is a schematic front view of a paddle of a silicon wafer coating apparatus according to an embodiment of the present disclosure;
FIG. 3 is a schematic top view of another embodiment of a paddle of an apparatus for coating a silicon wafer according to the present disclosure;
fig. 4 is a schematic side view of a paddle of a silicon wafer coating apparatus according to an embodiment of the present disclosure;
in the figure, 1 is a paddle plate, 2 is a paddle, 3 is an inclined connecting plate, 4 is a furnace mouth base of silicon wafer coating equipment, 5 is a first through hole, and 6 is a second through hole.
Detailed Description
In order that those skilled in the art will better understand the disclosure, the following detailed description will be given with reference to the accompanying drawings. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced otherwise than as specifically described herein, and it will be appreciated by those skilled in the art that the present invention may be practiced without departing from the spirit and scope of the present invention and that the present invention is not limited by the specific embodiments disclosed below.
As described in the background section, the contact surface of the existing paddle and the quartz boat is solid, which affects the flow of the air flow, and the distance between the paddle and the quartz boat is too small, which easily causes the non-uniform air flow near the silicon wafer, thereby causing the non-uniform coating of the silicon wafer, and the existing paddle uses a large amount of materials and has a high manufacturing cost.
In view of this, the present application provides a paddle of a silicon wafer coating apparatus, please refer to fig. 1 and fig. 2, fig. 1 is a schematic top view structure diagram of a paddle of a silicon wafer coating apparatus provided in an embodiment of the present application, and fig. 2 is a schematic front view structure diagram of a paddle of a silicon wafer coating apparatus provided in an embodiment of the present application, where the paddle includes:
the paddle board 1 is used for bearing the quartz boat, and the paddle board 1 is a hollowed paddle board 1;
the paddle 2 is in contact with a furnace mouth of the silicon wafer coating equipment, and the upper surface of the paddle 2 is higher than the upper surface of the paddle board 1;
and the inclined connecting plate 3 is used for connecting the paddle board 1 and the paddle 2.
It should be noted that, in the present embodiment, the shape of the hollowed-out area of the paddle board 1 is not specifically limited, and may be set by itself. For example, the shape of the hollow area may be a grid-shaped hollow area, or a circular hollow area, and the like.
Preferably, in an embodiment of the present application, the hollowed-out area of the paddle board 1 is rectangular, and the length of the hollowed-out area is equal to the length of the paddle board 1, that is, the contact area between the quartz boat and the paddle of the silicon wafer coating equipment is two sides of the paddle board 1, and the area of the hollowed-out area reaches the maximum while the paddle board 1 plays a supporting role, so that the smoothness of air flow during circulation is ensured, and the uniformity of silicon wafer coating is further improved.
Preferably, the oar is the carborundum oar, and the carborundum oar has high temperature resistant, prevents the advantage of warping, long service life.
The oar in this embodiment includes paddle 1, paddle 2 and oblique connecting plate 3, and the paddle 1 that is used for bearing the weight of the quartz boat is fretwork paddle 1, places back on paddle 1 when the quartz boat, reduces the area of paddle 1 and quartz boat contact to but the fretwork air current direct circulation about paddle 1 strengthens the homogeneity of silicon chip coating film, improves the EL of battery piece, can also reduce the quantity of paddle 1 material, reduces the cost of manufacture of oar.
Referring to fig. 3 and 4, fig. 3 is a schematic top view of a paddle of another silicon wafer coating apparatus provided in an embodiment of the present application, and fig. 4 is a schematic side view of the paddle of the silicon wafer coating apparatus provided in the embodiment of the present application.
On the basis of the above embodiments, in one embodiment of the present application, the blade 2 has at least one first through hole 5 that extends through the thickness of the blade 2.
Preferably, the first through hole 5 is positioned in the area outside the furnace mouth of the silicon wafer coating equipment.
It should be noted that the blade 2 and the inclined connecting plate 3 are both hollow.
It is to be noted that the shape of the first through hole 5 is not particularly limited in the present embodiment, as the case may be. For example, the first through-hole 5 is circular, or rectangular, or triangular, etc.
The purpose of setting up of first through-hole 5 in this embodiment is, when guaranteeing the supporting role of the oar of silicon chip coating equipment, guarantee that the circulation is carried out through first through-hole 5 to the gas flow, be favorable to the even of whole amorphous silicon coating pipe internal gas flow distribution to realize the homogeneity of coating film in the stove pipe.
On the basis of the above embodiments, in an embodiment of the present application, the blade 2 has a plurality of the first through holes 5, and the plurality of the first through holes 5 are arranged in an array.
Optionally, in an embodiment of the present application, the plurality of first through holes 5 are uniformly distributed in a region of the paddle 2 located outside the furnace opening of the silicon wafer coating apparatus, so that the air flow has the same flow property in each part of the paddle 2, the uniformity of the air flow distribution is further enhanced, and the uniformity of the silicon wafer coating is further improved.
Preferably, in one embodiment of the present application, the inclined connection plate 3 has at least one second through hole 6 extending through the thickness of the inclined connection plate 3.
It should be noted that the shape of the second through hole 6 is not particularly limited in this embodiment, as the case may be. For example, the second through hole 6 has a circular shape, a rectangular shape, a triangular shape, or the like.
The second through holes 6 in this embodiment are provided to communicate the second through holes 6 with the first through holes 5, which is helpful for the flow of air flow, so as to enhance the uniformity of air flow distribution and further improve the uniformity of silicon wafer coating.
On the basis of the above embodiments, in an embodiment of the present application, the inclined connecting plate 3 has a plurality of second through holes 6, and the plurality of second through holes 6 are arranged in an array.
Optionally, in an embodiment of the present application, the plurality of second through holes 6 are uniformly distributed on the inclined connecting plate 3, so as to enhance the uniformity of the air flow flowing between the second through holes 6 and the first through holes 5, further improve the uniformity of the air flow distribution in the amorphous silicon coating tube, and further enhance the uniformity of the coating.
Preferably, in an embodiment of the present application, the first through hole 5 and the second through hole 6 are both circular through holes, so that a manufacturing process of the first through hole 5 and the second through hole 6 is simplified, and manufacturing efficiency is improved.
On the basis of any one of the above embodiments, in one embodiment of the present application, the structure of the paddle is integrated to simplify the manufacturing process of the paddle.
The application also provides silicon wafer coating equipment which comprises any one of the paddles.
The embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same or similar parts among the embodiments are referred to each other. The device disclosed in the embodiment corresponds to the method disclosed in the embodiment, so that the description is simple, and the relevant points can be referred to the description of the method part.
The silicon wafer coating equipment and the paddles thereof provided by the application are described in detail above. The principles and embodiments of the present application are explained herein using specific examples, which are provided only to help understand the method and the core idea of the present application. It should be noted that, for those skilled in the art, it is possible to make several improvements and modifications to the present application without departing from the principle of the present application, and such improvements and modifications also fall within the scope of the claims of the present application.
Claims (8)
1. The utility model provides a silicon chip coating equipment's oar which characterized in that includes:
the paddle board is used for bearing the quartz boat and is a hollowed paddle board; when the quartz boat is placed on the paddle board, the contact area of the quartz boat and the paddle board is reduced, and the hollowed-out airflow directly flows up and down the paddle board;
the paddle is in contact with a furnace mouth of the silicon wafer coating equipment, and the upper surface of the paddle is higher than that of the paddle plate;
the inclined connecting plate is used for connecting the paddle plate and the paddle;
the paddle has at least one first through hole that extends through a thickness of the paddle;
the inclined connecting plate is provided with at least one second through hole penetrating through the thickness of the inclined connecting plate.
2. The paddle of the silicon wafer coating equipment according to claim 1, wherein the paddle has a plurality of the first through holes, and the plurality of the first through holes are arranged in an array.
3. The paddle of claim 1, wherein the inclined connecting plate has a plurality of second through holes, and the plurality of second through holes are arranged in an array.
4. The paddle of claim 3, wherein the first through hole and the second through hole are circular through holes.
5. The paddle of claim 1, wherein the paddle plate has a rectangular hollowed-out area, and the length of the hollowed-out area is equal to the length of the paddle plate.
6. The paddle of claim 1, wherein the paddle is a silicon carbide paddle.
7. The paddle of the silicon wafer coating apparatus according to any one of claims 1 to 6, wherein the structure of the paddle is an integrated body.
8. An apparatus for coating silicon wafers, characterized in that it comprises a paddle according to any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911275001.6A CN111081606B (en) | 2019-12-12 | 2019-12-12 | Silicon wafer coating equipment and paddle thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911275001.6A CN111081606B (en) | 2019-12-12 | 2019-12-12 | Silicon wafer coating equipment and paddle thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111081606A CN111081606A (en) | 2020-04-28 |
| CN111081606B true CN111081606B (en) | 2022-11-18 |
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ID=70314147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911275001.6A Active CN111081606B (en) | 2019-12-12 | 2019-12-12 | Silicon wafer coating equipment and paddle thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111081606B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114455048B (en) * | 2022-03-02 | 2023-03-14 | 江苏微导纳米科技股份有限公司 | Paddle rod |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6423527A (en) * | 1987-07-20 | 1989-01-26 | Matsushita Electronics Corp | Cantilever paddle |
| US5765982A (en) * | 1995-07-10 | 1998-06-16 | Amtech Systems, Inc. | Automatic wafer boat loading system and method |
| CN101952951A (en) * | 2008-02-21 | 2011-01-19 | 圣戈本陶瓷及塑料股份有限公司 | The pottery blade |
| CN202030864U (en) * | 2011-01-28 | 2011-11-09 | 绿华能源科技（杭州）有限公司 | Silicon carbide paddle for diffusion furnace |
| CN110106481A (en) * | 2019-06-06 | 2019-08-09 | 京东方科技集团股份有限公司 | Coating apparatus and Pvd equipment |
-
2019
- 2019-12-12 CN CN201911275001.6A patent/CN111081606B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6423527A (en) * | 1987-07-20 | 1989-01-26 | Matsushita Electronics Corp | Cantilever paddle |
| US5765982A (en) * | 1995-07-10 | 1998-06-16 | Amtech Systems, Inc. | Automatic wafer boat loading system and method |
| CN101952951A (en) * | 2008-02-21 | 2011-01-19 | 圣戈本陶瓷及塑料股份有限公司 | The pottery blade |
| CN202030864U (en) * | 2011-01-28 | 2011-11-09 | 绿华能源科技（杭州）有限公司 | Silicon carbide paddle for diffusion furnace |
| CN110106481A (en) * | 2019-06-06 | 2019-08-09 | 京东方科技集团股份有限公司 | Coating apparatus and Pvd equipment |
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| Publication number | Publication date |
|---|---|
| CN111081606A (en) | 2020-04-28 |
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