CN213340306U

CN213340306U - Quartz boat and silicon wafer deposition device

Info

Publication number: CN213340306U
Application number: CN202022644709.9U
Authority: CN
Inventors: 沈雯; 张临安; 杨慧; 邓伟伟
Original assignee: CSI Cells Co Ltd; Atlas Sunshine Power Group Co Ltd
Current assignee: Canadian Solar Inc; CSI Cells Co Ltd
Priority date: 2020-11-16
Filing date: 2020-11-16
Publication date: 2021-06-01
Anticipated expiration: 2030-11-16

Abstract

The utility model relates to a silicon chip deposition technology field discloses a quartz boat and silicon chip deposition apparatus. The quartz boat comprises a first end plate, a second end plate, at least two support rods, a first boat rod and a second boat rod, wherein the first end plate and the second end plate are arranged at intervals along the X direction; the second boat rod is connected with the supporting rod at the lower part and is abutted against the bottom edge of the silicon wafer. The utility model realizes the bearing of the silicon wafer by arranging the first boat rod and the second boat rod, and the silicon wafers placed on the first boat rod and the second boat rod are parallel to the X direction, the airflow can uniformly flow to each silicon wafer, and the deposition uniformity and the yield of the silicon wafers are ensured; meanwhile, silicon wafers can be placed at the positions of the furnace mouth and the furnace tail, so that the mass production capacity is greatly improved.

Description

Quartz boat and silicon wafer deposition device

Technical Field

The utility model relates to a silicon chip deposition technology field especially relates to a quartz boat and silicon chip deposition apparatus.

Background

The deposition of polysilicon is a critical step in a PASCON cell and is critical to the contact and passivation of the back side of the cell and the current density of the cell as a whole. At present, silicon wafers are generally placed in a quartz boat, and then the quartz boat is placed in a deposition furnace for deposition.

As shown in fig. 1 and 2, a quartz boat used in the prior art is provided, wherein a boat rod 110 is arranged along an X direction and is arranged between two end plates 120, and since an airflow in a deposition furnace flows along the X direction, a silicon wafer placed on the boat rod 110 arranged along the X direction is perpendicular to the airflow flowing direction, so that the deposition uniformity of the silicon wafer at the positions of a furnace mouth and a furnace tail is poor, and the silicon wafer has obvious chromatic aberration, and in order to ensure the yield, the silicon wafer cannot be placed on the boat rod 110 at the positions of the furnace mouth and the furnace tail, which seriously affects the mass production capacity; in addition, the silicon wafers vertically arranged in the direction of the airflow are easily affected by the airflow, the phenomenon of chip attachment occurs, and the yield is affected.

Therefore, a quartz boat is needed to solve the above-mentioned problems of low mass production yield and low yield.

SUMMERY OF THE UTILITY MODEL

Based on above, an object of the utility model is to provide a quartz boat and silicon chip deposition apparatus, the deposit is effectual, and the volume production productivity is high, the yields is high.

In order to achieve the purpose, the utility model adopts the following technical proposal:

a quartz boat, comprising:

the first end plate and the second end plate are arranged at intervals along the X direction;

at least two support rods, one end of each support rod is connected with the first end plate, and the other end of each support rod is connected with the second end plate;

the silicon wafer lifting mechanism comprises a pair of first boat rods arranged oppositely at intervals along the X direction, the first boat rods are connected with the supporting rod at the upper part, a silicon wafer can be vertically arranged between the pair of first boat rods along the X direction, and the pair of first boat rods can be respectively abutted against two side edges of the silicon wafer;

the second boat rod is connected with the supporting rod at the lower part, at least one second boat rod is arranged between the pair of first boat rods, and the second boat rod can be abutted to the bottom edge of the silicon wafer.

As a preferable mode of the quartz boat, a plurality of pairs of the first boat rods are arranged in the X direction.

In a preferred embodiment of the quartz boat, two adjacent first canoes of two adjacent pairs of the first canoes are of an integrated structure.

As a preferable scheme of the quartz boat, a placing groove is arranged at intervals along the Y direction on the side of the first boat bar, and the side of the silicon wafer can be placed in the placing groove.

As a preferable scheme of the quartz boat, the top of the second boat bar is provided with receiving grooves at intervals along the Y direction, and the bottom edges of the silicon wafers can be placed in the receiving grooves.

As a preferable scheme of the quartz boat, two second boat levers are arranged corresponding to the pair of first boat levers, the pair of first boat levers are arranged near the top edge of the silicon wafer, and the two second boat levers are respectively arranged near two side edges of the silicon wafer.

Preferably, the first end plate and/or the second end plate is provided with a vent hole.

As a preferred scheme of the quartz boat, the lower edges of the first end plate and the second end plate are provided with positioning bulges.

As a preferable scheme of the quartz boat, a first carrying column is arranged on one surface, away from the second end plate, of the first end plate, a second carrying column is arranged on one surface, away from the first end plate, of the second end plate, and the second carrying column is arranged corresponding to the first carrying column.

A silicon wafer deposition device comprises the quartz boat in any scheme.

The utility model has the advantages that:

the silicon wafer is supported by the first boat rod and the second boat rod; the first end plate and the second end plate are arranged at intervals along the X direction, one end of the supporting rod is connected with the first end plate, the other end of the supporting rod is connected with the second end plate, so that silicon wafers placed on the first boat rod and the second boat rod are parallel to the X direction, when the quartz boat is placed in the deposition furnace, and airflow flows along the X direction, on one hand, the blocking of the airflow by the silicon wafers is avoided, the airflow can flow to each silicon wafer more smoothly, the deposition uniformity and the yield of the silicon wafers are ensured, on the other hand, the silicon wafers are placed along the airflow flowing direction, the wafer lapping problem caused by the airflow can be effectively avoided, and the yield is improved; meanwhile, silicon wafers can be placed at the positions of the furnace mouth and the furnace tail, so that the mass production capacity is greatly improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required to be used in the description of the embodiments of the present invention will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the contents of the embodiments of the present invention and the drawings without creative efforts.

FIG. 1 is a top view of a prior art quartz boat;

FIG. 2 is a front view of a prior art quartz boat;

FIG. 3 is a top view of a quartz boat according to an embodiment of the present invention;

FIG. 4 is a front view of a quartz boat according to an embodiment of the present invention;

fig. 5 is a left side view of the quartz boat according to the embodiment of the present invention.

In the figure:

110. a boat lever; 120. an end plate;

100. a silicon wafer;

11. a first end plate; 12. a second end plate; 13. a vent hole; 14. positioning the projection; 15. a first carrying column; 16. a second transfer column;

2. a support bar;

31. a first wippen; 32. a second wippen; 33. a placement groove; 34. a receiving groove.

Detailed Description

In order to make the technical problems, technical solutions and technical effects achieved by the present invention more clear, the embodiments of the present invention will be described in further detail with reference to the accompanying drawings, and obviously, the described embodiments are only some embodiments, not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention.

As shown in fig. 3 to 5, the present embodiment provides a quartz boat for a silicon wafer deposition apparatus, the quartz boat comprising a first end plate 11, a second end plate 12, at least two support rods 2, a pair of first boat rods 31 and second boat rods 32, wherein the first end plate 11 and the second end plate 12 are arranged at intervals along an X direction, one end of each support rod 2 is connected with the first end plate 11, the other end of each support rod is connected with the second end plate 12, the first boat rods 31 are connected with the upper support rod 2, the pair of first boat rods 31 are arranged at intervals and oppositely, a silicon wafer 100 can be vertically arranged between the pair of first boat rods 31 along the X direction, and the pair of first boat rods 31 are respectively abutted against two side edges of the silicon wafer 100; the second boat 32 is connected to the lower support bar 2, at least one second boat 32 is disposed between the pair of first boats 31, and the second boat 32 can be abutted against the bottom edge of the silicon wafer 100.

The first boat rod 31 and the second boat rod 32 are arranged to bear the silicon wafer 100; because the first end plate 11 and the second end plate 12 are arranged at intervals along the X direction, one end of the support rod 2 is connected with the first end plate 11, and the other end is connected with the second end plate 12, so that the silicon wafers 100 placed on the first boat rod 31 and the second boat rod 32 are parallel to the X direction; meanwhile, the silicon chip 100 can be placed at the position of the furnace mouth and the position of the furnace tail, so that the mass production capacity is greatly improved.

Specifically, in order to make the gas flow in the X direction flow more smoothly toward the silicon wafers 100 on the first and

second boats

31 and 32, as shown in fig. 5, the first end plate 11 and/or the second end plate 12 are provided with vent holes 13. First end plate 11 and/or second end plate 12 with air vent 13 can play the effect of even flow, do not be provided with the end plate 120 of air vent 13 among the prior art, first end plate 11 and/or second end plate 12 in the utility model are favorable to further solving the inhomogeneous problem of stove mouthful and stove tail silicon chip 100 deposits, improve volume production output. Preferably, the vent holes 13 are provided in plurality, and the plurality of vent holes 13 are spaced apart, so that the gas passing through the vent holes 13 is more and more uniform.

Further, in order to further improve the mass production yield, the quartz boat is provided with a plurality of pairs of first boat rods 31 which are oppositely arranged along the X direction, each pair of first boat rods 31 can be used for bearing the silicon wafers 100, the number of the silicon wafers 100 deposited at one time by the quartz boat is improved, and the mass production yield is further improved. It will be appreciated that one second boat 32 is disposed under each pair of oppositely disposed first boats 31 to carry the wafers 100. The pair of first boats 31 may include two, four, or six first boats 31 symmetrically disposed at both sides of the wafer 100, but in consideration of simplification and weight reduction of the quartz boat structure, the pair of first boats 31 is two first boats 31 in the embodiment, and the two first boats 31 are symmetrically disposed at both sides of the wafer 100.

Alternatively, as shown in fig. 3 to 5, the side portions of the first boat 31 are each provided with a placing groove 33 in sequence along the Y direction, and the side of the silicon wafer 100 can be placed in the placing groove 33; the top of the second boat bar 32 is sequentially provided with a bearing groove 34 along the Y direction, and the bottom edge of the silicon wafer 100 can be placed in the bearing groove 34, wherein the Y direction is perpendicular to the X direction. The placing grooves 33 of the pair of first boats 31 and the bearing grooves 34 of the second boats 32 which are arranged oppositely are all correspondingly arranged and are used for placing the same silicon wafer 100; the placing grooves 33 and the bearing grooves 34 are beneficial to separating two adjacent silicon wafers 100, so that the problem of wafer lapping is avoided.

It is worth to be noted that, in two adjacent pairs of first boat rods 31, the two first boat rods 31 close to each other form an integrated structure, which is beneficial to reasonably utilizing and saving the space in the quartz boat.

In this embodiment, in order to make the placement of the silicon wafer 100 more stable, the pair of first boat levers 31 corresponds to the two second boat levers 32, and the two second boat levers 32 are arranged at intervals, so that the silicon wafer 100 is more stable on the one hand, and on the other hand, the stress concentration on the silicon wafer 100 is reduced, thereby ensuring the yield of the silicon wafer 100.

In the prior art, the boat handle 110 is respectively positioned at two thirds of the height of the silicon wafer 100 and one third of the width of the bottom of the silicon wafer, after the silicon wafer 100 deposits polysilicon, the edge of the silicon wafer 100 can be warped due to the stress problem, so that the yield is reduced, meanwhile, the warped silicon wafer 100 is more easily subjected to lapping, and the contact resistance after lapping can reach 10mohm²Further reducing the yield. Therefore, in the present embodiment, it is preferable that the pair of first boat levers 31 are disposed near the top edge of the silicon wafer 100, and the two second boat levers 32 are disposed near the two sides of the silicon wafer 100, respectively, so as to protect four corners of the silicon wafer 100 while supporting the silicon wafer 100, thereby effectively preventing the silicon wafer 100 from warping and preventing the silicon wafer from being picked up due to warping, and improving the yield.

Specifically, as shown in fig. 3 to 5, in order to implement the installation of the first wippen 31 and the second wippen 32, four support rods 2 are provided, the four support rods 2 are arranged in parallel, the first wippen 31 is connected to two upper support rods 2, and the second wippen 32 is connected to two lower support rods 2. Further, the support bar 2 is vertically disposed with both the first end plate 11 and the second end plate 12, and the first wippen 31 and the second wippen 32 are also vertically disposed with the support bar 2.

Preferably, a first carrying column 15 is disposed on a surface of the first end plate 11 away from the second end plate 12, a second carrying column 16 is disposed on a surface of the second end plate 12 away from the first end plate 11, and the second carrying column 16 is disposed corresponding to the first carrying column 15. When the quartz boat needs to be transported, the transporting mechanism can act on the first transporting column 15 and the second transporting column 16 to reduce the damage to the first end plate 11 or the second end plate 12. Alternatively, two first transfer columns 15 and two second transfer columns 16 are provided for more stability during the transfer.

Further, in this embodiment, the lower level of first end plate 11 and second end plate 12 all has to set up location arch 14, is used for direction and location when placing the quartz boat, and the quartz boat when making to place is more stable, avoids placing the problem that the improper silicon chip 100 that causes in position took the piece effectively, guarantees the yields of silicon chip 100.

This embodiment still discloses a silicon chip deposition apparatus, including the quartz boat, still include transport mechanism and deposition furnace, and transport mechanism can carry the quartz boat into or carry out the deposition furnace in, and the gas flow direction is followed the X direction in the deposition furnace, and the deposit is kept away from and the deposition process is prior art, and no longer repeated here.

It should be noted that the foregoing is only a preferred embodiment of the present invention and the technical principles applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail with reference to the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Wherein the terms "first position" and "second position" are two different positions.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Claims

1. A quartz boat, comprising:

a first end plate (11) and a second end plate (12) which are arranged at intervals along the X direction;

at least two support rods (2), one end of each support rod is connected with the first end plate (11), and the other end of each support rod is connected with the second end plate (12);

a pair of first boat rods (31) which are oppositely arranged along the X direction at intervals, wherein the first boat rods (31) are connected with the supporting rod (2) at the upper part, a silicon wafer (100) can be vertically arranged between the pair of first boat rods (31) along the X direction, and the pair of first boat rods (31) can be respectively abutted against two side edges of the silicon wafer (100);

the second boat rod (32), the second boat rod (32) is connected with the support rod (2) at the lower part, at least one second boat rod (32) is arranged between the pair of first boat rods (31), and the second boat rod (32) can be abutted against the bottom edge of the silicon wafer (100).

2. The quartz boat according to claim 1, wherein a plurality of pairs of the first wippens (31) are provided along the X direction.

3. The quartz boat according to claim 2, wherein, of two adjacent pairs of the first boats (31), the adjacent two first boats (31) are of a unitary structure.

4. The quartz boat according to claim 1, wherein the side of the first boat lever (31) is provided with placing grooves (33) at intervals in the Y direction, and the side of the silicon wafer (100) can be placed in the placing grooves (33).

5. The quartz boat as claimed in claim 1, wherein the second boat lever (32) has receiving grooves (34) formed at intervals in the Y direction at the top thereof, and the silicon wafers (100) are received in the receiving grooves (34) at the bottom thereof.

6. The quartz boat according to claim 1, wherein there are two second boat levers (32) corresponding to a pair of the first boat levers (31), a pair of the first boat levers (31) being disposed near the top edge of the silicon wafer (100), and two second boat levers (32) being disposed near both side edges of the silicon wafer (100), respectively.

7. Quartz boat according to claim 1, characterized in that the first end plate (11) and/or the second end plate (12) are provided with vent holes (13).

8. The quartz boat according to any of claims 1 to 7, characterized in that the lower edges of the first end plate (11) and the second end plate (12) are provided with positioning projections (14).

9. The quartz boat according to any of claims 1 to 7, characterized in that the side of the first end plate (11) remote from the second end plate (12) is provided with first handling columns (15), the side of the second end plate (12) remote from the first end plate (11) is provided with second handling columns (16), and the second handling columns (16) are arranged corresponding to the first handling columns (15).

10. A silicon wafer deposition apparatus comprising the quartz boat according to any one of claims 1 to 9.