CN110964295A - 一种热固性低密度、高强度、高导热、v0阻燃的绝缘材料 - Google Patents
一种热固性低密度、高强度、高导热、v0阻燃的绝缘材料 Download PDFInfo
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Abstract
本发明提供了一种热固性低密度、高强度、高导热、V0阻燃的绝缘材料，由下列重量份比的原料组成：环氧树脂基材100份、固化剂80‑100份、绝缘材料80‑160份、高导热材料10‑45份、固体增韧粉6‑12份、阻燃剂15‑30份。现有高压电器设备中所采用的绝缘件主要为热固性聚合材料（环氧树脂填充单一组份聚合浇注成型的），如环氧树脂填充硅微粉、环氧树脂填充氧化铝、环氧树脂填充氧化镁等；但此类材料具有较大的局限性。本发明通过材料改进，具有密度低（重量相比前减轻40%‑50%）、强度高（相比前高30%‑40%）导热率好（提高了60%以上）、阻燃级别高的优点（达到V0级）、较高的电气绝缘性（介电强度≥30.KV/MM以上）的优点，固化时间更短、效率高、大大提高设备精度和老化寿命。
Description
技术领域
本发明涉及一种绝缘材料，特别是涉及一种热固性低密度、高强度、高导热、V0阻燃的绝缘材料，主要应用于电子与电力设备、特高压电器设备浇注绝缘件等电气领域。
背景技术
现有高压电器设备中所采用的绝缘件主要为热固性聚合材料（环氧树脂填充单一组份聚合浇注成型的），如环氧树脂填充硅微粉、环氧树脂填充氧化铝、环氧树脂填充氧化镁等；但此类材料具有较大的局限性：1、比重大：氧化铝、氧化镁、硅微粉的真实密度都≥2.9以上，单跟环氧树脂混合后堆积密度≥2.0以上，导致产品重量过大；2、强度差：环氧树脂本身抗拉、抗冲强度非常低，填充硅微粉、氧化铝、氧化镁聚合后抗拉≤120MPa、抗冲强度≤20KJ/m2；3、导热性差，环氧树脂本身导热系数在≤0.2W/MK左右较差,单填充硅微粉、氧化铝、氧化镁后导热系数≤2.2W/MK；无法满足电压等级较高、功率较大的要求，易因热量积聚应力增加开裂及老化的风险；4、介电强度较低：环氧树脂单添加硅微粉、氧化铝、氧化镁后介电强度24. KV/MM上下，较难满足高压电器设备的绝缘；5、耐化学腐蚀性：大部份绝缘材料耐化学腐蚀较差、特别是耐SF6分解气体腐蚀更差。
发明内容
本发明提供了一种热固性低密度、高强度、高导热、V0阻燃的绝缘材料，以至少解决现有技术所采用的绝缘材料重量大，且强度差的问题。
本发明提供了一种热固性低密度、高强度、高导热、V0阻燃的绝缘材料，由下列重量份比的原料组成：环氧树脂基材100份、固化剂80-100份、绝缘材料80-160份、高导热材料10-45份、固体增韧粉6-12份、阻燃剂15-30份。
进一步地，所述环氧树脂为绝缘材料的20%-40%。
进一步地，所述固化剂为绝缘材料的16-40%。
进一步地，所述绝缘材料由纳米陶瓷微珠、纳米玻璃空心微珠组成，所述纳米陶瓷微珠为绝缘材料的8%-35%、纳米玻璃空心微珠为绝缘材料的8%-35%。
进一步地，所述高导热材料由纳米氧化铝、纳米氮化铝、纳米氮化硼组成，所述纳米氧化铝为绝缘材料的2%-8%、纳米氮化铝为绝缘材料的1%-2%、纳米氮化硼为绝缘材料的1%-2%。
进一步地，所述纳米氧化铝的粒径为1-10um，所述纳米氮化铝粒径为5-50nm，所述纳米氮化硼粒径为5-25nm。
进一步地，所述固体增韧粉由纳米蒙脱土、纳米PET粉组成，所述纳米蒙脱土为绝缘材料的3%-6%，所述纳米PET粉为绝缘材料的3%-6%。
进一步地，所述绝缘材料还包括抗氧剂、表面活性剂，所述抗氧剂为绝缘材料的1%~4%，所述表面活性剂为绝缘材料的2‰~5‰。
进一步地，所述环氧树脂选自脂环族树脂、双酚A/F环氧树脂、双酚醛树脂中的一种或多种。
进一步地，所述固化剂选自甲基六氢苯酚、羧酸酐、丙二醇苯醚中的一种或多种。
本发明相对于现有技术，具有密度低（重量相比前减轻40%-50%）、强度高（相比前高30%-40%）导热率好（提高了60%以上）、阻燃级别高的优点（达到V0级）、较高的电气绝缘性（介电强度≥30. KV/MM以上）的优点，固化时间更短、效率高、大大提高设备精度和老化寿命。
具体实施方式
为了使本技术领域的人员更好地理解本发明方案，下面将对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分的实施例，而不是全部的实施例。
本发明实施例一、实施例二、对照例绝缘材料的制备方法为：环氧树脂基材加热至45-100oC，加入绝缘材料、高导热材料、固体增韧粉、阻燃剂，并剪切搅拌2-4小时，加入固化剂，并在45-100oC下搅拌得到。
实施例一
本发明实施例一的绝缘材料包括8.5%的脂环族树脂、8.5%的甲基六氢苯酚、19%的双酚醛树脂、17%的羧酸酐、16%的纳米陶瓷微珠、14%的纳米玻璃空心微珠、8%的粒径1um纳米氧化铝、0.6%的粒径50nm纳米氮化铝、0.6%的粒径25nm纳米氮化硼、1.2%的纳米蒙脱土、1.2%的纳米PET粉、0.2%的抗氧化剂1010，5%的阻燃剂FR-633，0.2%的硅烷偶联剂。
实施例二
本发明实施例二的绝缘材料包括32%的双酚醛树脂、25%的羧酸酐、20%的纳米陶瓷微珠、14%的纳米玻璃空心微珠、3%的粒径1um纳米氧化铝、0.6%的粒径50nm纳米氮化铝、0.6%的粒径25nm纳米氮化硼、0.2%的纳米蒙脱土、0.2%的纳米PET粉、0.2%的抗氧化剂1010，4%的阻燃剂FR-633，0.2%的硅烷偶联剂。
对照例
本发明对照例的绝缘材料包括8.5重量份的脂环族树脂、8.5重量份的甲基六氢苯酚、19重量份的双酚醛树脂、17重量份的羧酸酐、12重量份的氧化铝、30重量份的硅微粉、5重量份的阻燃剂FR-633。
对实施例一、实施例二、对照例绝缘材料进行性能检测，具体检测结果如下表所示。
| 检测项目 | 实施例一 | 实施例二 | 对照例 |
| 密度 | 0.8-1.18g/cm<sup>3</sup> | 0.6-0.96g/cm<sup>3</sup> | 2.8-3.5g/cm<sup>3</sup> |
| 抗压强度 | 106-120MPa | 106-120MPa | 70-80MPa |
| 导热率 | 3-7W/MK | 3-8W/MK | 0.2-1W/MK |
| 电气绝缘性 | 30.-35 KV/MM | 30-35. KV/MM | 20-24. KV/MM |
| 阻燃性 | V0 | V0 | 不阻燃/V2 |
本发明实施例一、实施例二的绝缘材料相比现有材料，具有密度低的优点，且抗压的强度高有效提高了绝缘材料的使用寿命。此外，本发明实施例一、实施例二的绝缘材料具有更好的导热性及绝缘性，同时只需要少量的阻燃剂也可以达到V0级的阻燃效果。
最后应当说明的是，以上实施例仅用以说明本发明的技术方案而非对其限制，尽管参照上述实施例对本发明进行了详细的说明，所属领域的普通技术人员应当理解，技术人员阅读本申请说明书后依然可以对本发明的具体实施方式进行修改或者等同替换，但这些修改或变更均未脱离本发明申请待批权利要求保护范围之内。
Claims (10)
1.一种热固性低密度、高强度、高导热、V0阻燃的绝缘材料，其特征在于，所述绝缘材料由下列重量份比的原料组成：环氧树脂基材100份、固化剂80-100份、绝缘材料80-160份、高导热材料10-45份、固体增韧粉6-12份、阻燃剂15-30份。
2.根据权利要求1所述热固性低密度、高强度、高导热、V0阻燃的绝缘材料，其特征在于，所述环氧树脂为绝缘材料的20%-40%。
3.根据权利要求1所述热固性低密度、高强度、高导热、V0阻燃的绝缘材料，其特征在于，所述固化剂为绝缘材料的16-40%。
4.根据权利要求1所述热固性低密度、高强度、高导热、V0阻燃的绝缘材料，其特征在于，所述绝缘材料由纳米陶瓷微珠、纳米玻璃空心微珠组成，所述纳米陶瓷微珠为绝缘材料的8%-35%、纳米玻璃空心微珠为绝缘材料的8%-35%。
5.根据权利要求1所述热固性低密度、高强度、高导热、V0阻燃的绝缘材料，其特征在于，所述高导热材料由纳米氧化铝、纳米氮化铝、纳米氮化硼组成，所述纳米氧化铝为绝缘材料的2%-8%、纳米氮化铝为绝缘材料的1%-2%、纳米氮化硼为绝缘材料的1%-2%。
6.根据权利要求5所述热固性低密度、高强度、高导热、V0阻燃的绝缘材料，其特征在于，所述纳米氧化铝的粒径为1-10um，所述纳米氮化铝粒径为5-50nm，所述纳米氮化硼粒径为5-25nm。
7.根据权利要求1所述热固性低密度、高强度、高导热、V0阻燃的绝缘材料，其特征在于，所述固体增韧粉由纳米蒙脱土、纳米PET粉组成，所述纳米蒙脱土为绝缘材料的3%-6%，所述纳米PET粉为绝缘材料的3%-6%。
8.根据权利要求1所述热固性低密度、高强度、高导热、V0阻燃的绝缘材料，其特征在于，所述绝缘材料还包括抗氧剂、表面活性剂，所述抗氧剂为绝缘材料的1%~4%，所述表面活性剂为绝缘材料的2‰~5‰。
9.据权利要求1所述热固性低密度、高强度、高导热、V0阻燃的绝缘材料，其特征在于，所述环氧树脂选自脂环族树脂、双酚A/F环氧树脂、双酚醛树脂中的一种或多种。
10.根据权利要求1所述热固性低密度、高强度、高导热、V0阻燃的绝缘材料，其特征在于，所述固化剂选自甲基六氢苯酚、羧酸酐、丙二醇苯醚中的一种或多种。
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