CN110936434A - Drilling method for circuit board body - Google Patents
Drilling method for circuit board body Download PDFInfo
- Publication number
- CN110936434A CN110936434A CN201911254478.6A CN201911254478A CN110936434A CN 110936434 A CN110936434 A CN 110936434A CN 201911254478 A CN201911254478 A CN 201911254478A CN 110936434 A CN110936434 A CN 110936434A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- drilling
- board body
- hole
- machining
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/16—Perforating by tool or tools of the drill type
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The invention discloses a drilling method of a circuit board body, which comprises the following steps of S1: determining the thickness of the circuit board body and the position of the hole groove to be processed; s2: marking the upper side and the lower side of the circuit board body according to the position determined in the step S1; s3: drilling the upper side of the circuit board body, wherein the machining depth is 1/6-1/5 of the thickness of the circuit board body; s4: drilling the lower side of the circuit board body, wherein the machining depth is 1/4-1/3 of the thickness of the circuit board body; s5: drilling the upper side of the circuit board again, continuously drilling along the hole machined in the step S3, and communicating the hole machined in the step S4 with the hole machined in the step S4 to obtain a through hole; s6: polishing the inner wall of the through hole; s7: cleaning the circuit board polished in the step S6 to finish drilling; according to the drilling method provided by the invention, the opening is formed from one side, then the opening is formed from the other side, and finally the processing is performed from the opening at the first side, so that the problem that the drill bit is interrupted in the drilling process is avoided.
Description
Technical Field
The invention relates to the technical field of circuit board processing, in particular to a drilling method for a circuit board body.
Background
With the rapid development of electronic technology, electronic products gradually tend to be miniaturized, light and highly integrated, and printed wiring boards are indispensable parts of electronic products, which inevitably requires that printed wiring boards are also small-sized, light-weighted and highly densified.
In the production process of the circuit board, a plurality of drilling operations are usually required, and in the prior art, when a general board is drilled, a method that a cutter directly drills from one side of the board to the other side is usually adopted. This method has little effect on thinner plates, but causes problems of broken drill and over-drilled hole diameter due to poor chip removal for thicker plates. In the circuit board industry, particularly when a thicker circuit board motherboard is drilled, the problem of poor chip removal can occur, so that the problems of broken drill and too thick bore diameter of the drilled hole are caused, and the quality of the circuit board is seriously affected. Meanwhile, for a thicker circuit board, the problem of deviation in the drilling process is also easily caused by adopting a method of directly drilling from one surface of the board to the other surface by a cutter.
Disclosure of Invention
The invention aims to provide a drilling method of a circuit board body, which aims to solve the problems in the prior art.
In order to achieve the purpose, the invention provides the following technical scheme: a drilling method for a circuit board body comprises the following steps
S1: determining the thickness of the circuit board body and the position of the hole groove to be processed;
s2: marking the upper side and the lower side of the circuit board body according to the position determined in the step S1;
s3: drilling the upper side of the circuit board body, wherein the machining depth is 1/6-1/5 of the thickness of the circuit board body;
s4: drilling the lower side of the circuit board body, wherein the machining depth is 1/4-1/3 of the thickness of the circuit board body;
s5: drilling the upper side of the circuit board again, continuously drilling along the hole machined in the step S3, and communicating the hole machined in the step S4 with the hole machined in the step S4 to obtain a through hole;
s6: polishing the inner wall of the through hole;
s7: and (5) cleaning the circuit board polished in the step S6 to finish drilling.
Preferably, in step S1, the thickness of the circuit board at the position of the hole to be processed is measured, so as to facilitate the planning of the subsequent drilling thickness.
Preferably, in step S2, the upper and lower sides of the machining hole groove are marked with a cross symbol, and detection is performed after the marking is completed, thereby reducing an error.
Preferably, in step S3, the drill used for machining is smaller than the hole diameter required for forming the hole by 0.1mm to 0.15 mm.
Preferably, in step S4, the drill used for machining is the same as the drill used in step S3, and after drilling is completed, the upper and lower counterbores are detected to determine whether the counterbores are aligned.
Preferably, in the step S5, the drill used for machining is smaller than the hole diameter required for hole forming by 0.03mm to 0.05mm, and the machining is continued from the counter bore machined in the step S3 until the drill completely penetrates out of the counter bore machined in the step S4, and the machining is finished.
Preferably, in the steps S3, S4, and S5, the drill is retreated every 1mm to 2mm while drilling; and (5) retracting the cutter and drilling holes in a grading manner until the specified depth is reached.
Preferably, in the step S6, the inner wall of the through hole obtained in the step S5 is polished to remove traces left by the drill processing, so that the inner wall is smooth.
Preferably, in step S7, the circuit board is cleaned by using a plasma cleaning machine to clean the waste impurities left by the drilling process.
Compared with the prior art, the invention has the beneficial effects that: according to the drilling method provided by the invention, the opening is formed from one side, then the opening is formed from the other side, and finally the processing is performed from the opening at the first side, so that the problem that the drill bit is interrupted in the drilling process is avoided, and the drilling quality of the circuit board is effectively improved; the method of drilling from two sides also effectively avoids the deviation in the drilling process.
Drawings
FIG. 1 is a flow chart of the steps of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
Referring to fig. 1, the present invention provides a technical solution: a drilling method for a circuit board body comprises the following steps
S1: determining the thickness of the circuit board body and the position of the hole groove to be processed;
s2: marking the upper side and the lower side of the circuit board body according to the position determined in the step S1;
s3: drilling the upper side of the circuit board body, wherein the machining depth is 1/6-1/5 of the thickness of the circuit board body;
s4: drilling the lower side of the circuit board body, wherein the machining depth is 1/4-1/3 of the thickness of the circuit board body;
s5: drilling the upper side of the circuit board again, continuously drilling along the hole machined in the step S3, and communicating the hole machined in the step S4 with the hole machined in the step S4 to obtain a through hole;
s6: polishing the inner wall of the through hole;
s7: and (5) cleaning the circuit board polished in the step S6 to finish drilling.
Further, in step S1, the thickness of the circuit board at the position of the hole to be processed is measured, so as to facilitate the planning of the subsequent drilling thickness.
Further, in step S2, the upper and lower sides of the machined hole groove are marked with a cross symbol, and detection is performed after the marking is completed, thereby reducing an error.
Further, in step S3, the drill used for machining is smaller than the hole diameter required for hole formation by 0.1mm to 0.15 mm.
Further, in step S4, the drill used for machining is the same as the drill used in step S3, and after drilling is completed, the upper and lower counterbores are detected to determine whether the counterbores are aligned.
Further, in the step S5, the drill used for machining is smaller than the hole diameter required for hole forming by 0.03mm to 0.05mm, and the machining is continued from the counter bore machined in the step S3 until the drill completely penetrates out of the counter bore machined in the step S4, and the machining is finished.
Further, in the steps S3, S4, and S5, retracting the drill once every 1mm to 2mm while the drill drills; and (5) retracting the cutter and drilling holes in a grading manner until the specified depth is reached.
Further, in step S6, the inner wall of the through hole obtained in step S5 is polished to remove traces left by the drill processing, so that the inner wall is smooth.
Further, in step S7, the circuit board is cleaned by using a plasma cleaning machine, and waste impurities left by drilling are cleaned.
The working principle is as follows: in step S1, the thickness of the hole to be processed and the corresponding circuit board is determined, so as to plan the depth of processing in the subsequent steps. In step S2, the upper and lower sides of the hole groove are marked with a cross symbol to facilitate subsequent processing, while performing detection to reduce errors. Processing is performed from the upper side, the lower side, and the upper side in steps S3, S4, and S5, respectively; meanwhile, drilling-through is uniformly distributed in the steps S3 and S4, only a part of depth is processed, the processing hole is detected after the processing in the step S4 is finished, and the processing hole is timely adjusted or directly scrapped after an error occurs, so that more cost is avoided; in step S5, a main step of completing the drilling from the upper side to the through hole groove; in the steps S3 and S4, a smaller drill bit is used, and in the step S5, a larger drill bit is used, mainly for drilling holes in a grading manner, so that the working strength of the drill bit is reduced, and chips are removed in a grading manner, so that the problem of poor chip removal is avoided; in the whole steps S3, S4 and S5, the drill is drilled by retracting the cutter in different times, so as to protect the drill and avoid the occurrence of fracture. In step S6, polishing the inner side of the final through hole to eliminate drilling marks; meanwhile, in step S5, the drill used is still smaller than the final hole-forming hole diameter, and the insufficient size is compensated by grinding. In step S7, the circuit board is cleaned by a plasma cleaning machine to remove impurities, which facilitates the next processing.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. A drilling method of a circuit board body is characterized in that: comprises the following steps
S1: determining the thickness of the circuit board body and the position of the hole groove to be processed;
s2: marking the upper side and the lower side of the circuit board body according to the position determined in the step S1;
s3: drilling the upper side of the circuit board body, wherein the machining depth is 1/6-1/5 of the thickness of the circuit board body;
s4: drilling the lower side of the circuit board body, wherein the machining depth is 1/4-1/3 of the thickness of the circuit board body;
s5: drilling the upper side of the circuit board again, continuously drilling along the hole machined in the step S3, and communicating the hole machined in the step S4 with the hole machined in the step S4 to obtain a through hole;
s6: polishing the inner wall of the through hole;
s7: and (5) cleaning the circuit board polished in the step S6 to finish drilling.
2. The method for drilling a board body of a circuit board according to claim 1, wherein: in the step S1, the thickness of the circuit board at the position of the hole to be processed is measured, which facilitates the planning of the subsequent drilling thickness.
3. The method for drilling a board body of a circuit board according to claim 1, wherein: in step S2, the upper and lower sides of the machining hole groove are marked with a cross symbol, and detection is performed after marking is completed to reduce an error.
4. The method for drilling a board body of a circuit board according to claim 1, wherein: in step S3, the drill used for machining is 0.1mm to 0.15mm smaller than the hole diameter required for forming the hole.
5. The method for drilling a board body of a circuit board according to claim 1, wherein: in step S4, the drill used for machining is the same as the drill used in step S3, and after drilling is completed, the upper and lower counterbores are detected to determine whether the counterbores are aligned.
6. The method for drilling a board body of a circuit board according to claim 1, wherein: in the step S5, the drill used for machining is 0.03mm to 0.05mm smaller than the hole diameter required for hole forming, and the machining is continued from the counter bore machined in the step S3 until the drill completely penetrates out of the counter bore machined in the step S4, and the machining is finished.
7. The method for drilling a board body of a circuit board according to claim 1, wherein: in the steps S3, S4 and S5, retracting the drill bit once every 1-2 mm of drill bit in the process of drilling; and (5) retracting the cutter and drilling holes in a grading manner until the specified depth is reached.
8. The method for drilling a board body of a circuit board according to claim 1, wherein: in step S6, the inner wall of the through hole obtained in step S5 is polished to remove traces left by the drill processing and to make the inner wall smooth.
9. The method for drilling a board body of a circuit board according to claim 1, wherein: in the step S7, the circuit board is cleaned by using a plasma cleaning machine, and waste impurities left by drilling processing are cleaned.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911254478.6A CN110936434A (en) | 2019-12-10 | 2019-12-10 | Drilling method for circuit board body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911254478.6A CN110936434A (en) | 2019-12-10 | 2019-12-10 | Drilling method for circuit board body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110936434A true CN110936434A (en) | 2020-03-31 |
Family
ID=69909929
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911254478.6A Pending CN110936434A (en) | 2019-12-10 | 2019-12-10 | Drilling method for circuit board body |
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| CN (1) | CN110936434A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5158645A (en) * | 1991-09-03 | 1992-10-27 | International Business Machines, Inc. | Method of external circuitization of a circuit panel |
| CN101765296A (en) * | 2009-12-31 | 2010-06-30 | 深圳崇达多层线路板有限公司 | Drilling method of motherboard of circuit board |
| CN101862843A (en) * | 2010-06-13 | 2010-10-20 | 大连太平洋多层线路板有限公司 | Drilling method of thick copper power circuit board of 5-12oz |
| CN104874826A (en) * | 2015-05-04 | 2015-09-02 | 深圳崇达多层线路板有限公司 | Drilling method of thick copper circuit board |
| CN108541145A (en) * | 2018-04-16 | 2018-09-14 | 生益电子股份有限公司 | A kind of method to drill on PCB |
| CN110022648A (en) * | 2018-01-08 | 2019-07-16 | 深南电路股份有限公司 | A kind of back drilling method and system of PCB |
-
2019
- 2019-12-10 CN CN201911254478.6A patent/CN110936434A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5158645A (en) * | 1991-09-03 | 1992-10-27 | International Business Machines, Inc. | Method of external circuitization of a circuit panel |
| CN101765296A (en) * | 2009-12-31 | 2010-06-30 | 深圳崇达多层线路板有限公司 | Drilling method of motherboard of circuit board |
| CN101862843A (en) * | 2010-06-13 | 2010-10-20 | 大连太平洋多层线路板有限公司 | Drilling method of thick copper power circuit board of 5-12oz |
| CN104874826A (en) * | 2015-05-04 | 2015-09-02 | 深圳崇达多层线路板有限公司 | Drilling method of thick copper circuit board |
| CN110022648A (en) * | 2018-01-08 | 2019-07-16 | 深南电路股份有限公司 | A kind of back drilling method and system of PCB |
| CN108541145A (en) * | 2018-04-16 | 2018-09-14 | 生益电子股份有限公司 | A kind of method to drill on PCB |
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Application publication date: 20200331 |
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| RJ01 | Rejection of invention patent application after publication |