CN110895429A

CN110895429A - Device heat dissipation system and method

Info

Publication number: CN110895429A
Application number: CN201910396858.7A
Authority: CN
Inventors: 付典林; 史洪波
Original assignee: EVOC Intelligent Technology Co Ltd
Current assignee: EVOC Intelligent Technology Co Ltd
Priority date: 2019-05-14
Filing date: 2019-05-14
Publication date: 2020-03-20

Abstract

The invention provides a device heat dissipation system and a device heat dissipation method. The device comprises: case and fixed position in the inside heat-generating body of case, cooling system includes: the heat absorption assembly, the heat conduction assembly and the heat dissipation assembly; the heat absorption component is positioned in the case and is in abutting connection with the heating body; the heat dissipation assembly is positioned outside the case; the heat conduction assembly is located between the heat absorption assembly and the heat dissipation assembly, and the two ends of the heat conduction assembly are respectively fixedly connected with the heat absorption assembly and the heat dissipation assembly so as to exchange heat of the heat absorption assembly and heat of the heat dissipation assembly. The invention can reduce the temperature of the internal environment of the closed case, prevent the device with large heat productivity from transferring and radiating heat to the device with small heat productivity, save energy, protect environment, have no noise and have high heat dissipation efficiency.

Description

Device heat dissipation system and method

Technical Field

The invention relates to the technical field of heat dissipation of electrical equipment, in particular to a device heat dissipation system and method.

Background

Along with the development of electronic technology, the performance of electronic devices is continuously improved, but along with the great improvement of the integration level of the electronic devices, the size is smaller and smaller, and the problem of high heat flux density can be inevitable in the long-time working process. The high-efficiency and practical cooling scheme is formulated, so that the working stability of the electronic device can be ensured, and the safety and reliability of the electronic components can be improved.

The industrial computer is the core of the whole machine measurement control and the man-machine interaction processing, and comprises a CPU, a memory, a south bridge, a north bridge chip and the like. The volume of the chip is smaller and smaller, but the operation speed is improved continuously, and the heat productivity power of the chip is also increased continuously. The main failure mode of the industrial computer is thermal failure, and the stability of the electronic equipment operation is directly influenced by the heat dissipation condition of the industrial computer.

Especially for the fan-free middle, small and miniature closed industrial computer, the internal space is narrow, and the temperature of the radiating fins of the chassis shell is increased after high-power components such as a CPU and the like are transmitted to the chassis shell radiator through heat conduction. The heat is transferred to the external environment through the housing heat sink. However, the heat dissipation efficiency of a general case heat sink is low, so that the operating temperature inside a small, medium, or miniature sealed industrial computer without a fan is high. The components work in a high-temperature environment for a long time, so that the low-power thermosensitive components can break down, the normal work and use of the fan-free medium, small and miniature closed industrial computer are influenced, and the labor cost for maintaining and repairing the industrial computer is increased. Under the severe condition of untimely heat dissipation, the surface temperature of a radiator of the chassis shell is overhigh, the heat is easy to scald hands, the interference is caused to other industrial equipment used for matching the periphery of the chassis, and the working efficiency is seriously influenced.

Disclosure of Invention

The device heat dissipation system and the device heat dissipation method provided by the invention can reduce the temperature of the internal environment of the closed case, prevent the device with large heat productivity from transferring and radiating heat to the device with small heat productivity, and are energy-saving, environment-friendly, noiseless and high in heat dissipation efficiency.

In a first aspect, the present invention provides a heat dissipation system for a device, the device comprising: case and fixed position in the inside heat-generating body of case, cooling system includes: the heat absorption assembly, the heat conduction assembly and the heat dissipation assembly;

the heat absorption component is positioned in the case and is in abutting connection with the heating body;

the heat dissipation assembly is positioned outside the case;

the heat conduction assembly is located between the heat absorption assembly and the heat dissipation assembly, and the two ends of the heat conduction assembly are respectively fixedly connected with the heat absorption assembly and the heat dissipation assembly so as to exchange heat of the heat absorption assembly and heat of the heat dissipation assembly.

Optionally, the heat sink assembly comprises: the capillary core is positioned in the packaging body;

a liquid collecting cavity and a steam collecting cavity are formed in the packaging body and are communicated with the capillary core;

the surface of the packaging body is respectively provided with a working medium inlet communicated with the liquid collecting cavity and a working medium outlet communicated with the steam collecting cavity, so that working medium can circulate among the heat absorbing assembly, the heat conducting assembly and the heat radiating assembly.

Optionally, the heat dissipation assembly comprises: a condenser tube and a radiator;

the radiator comprises fins and a base, the fins are uniformly vertical to the upper surface of the base, and the bottoms of the fins are fixedly connected with the base; the base is fixedly connected with the case;

the condensing tube is S-shaped and is inserted in the fin in a penetrating way.

Optionally, the thermally conductive assembly comprises: a vapor line, a liquid line and a reservoir;

two ends of the steam pipeline are respectively communicated with the working medium outlet and the inlet of the condensing pipe;

one end of the liquid pipeline penetrates through the liquid storage device and is communicated with the working medium inlet, and the other end of the liquid pipeline is communicated with the outlet of the condensing pipe.

Optionally, the capillary wick comprises an arc-shaped portion and a straight-shaped portion;

the arc-shaped parts are arranged under the steam collecting cavity at equal intervals along the radial direction by taking the central position of the steam collecting cavity as the center of a circle, and the straight parts are sequentially connected with the adjacent arc-shaped parts along the radial direction of the arc-shaped parts.

Optionally, the straight portion starts from the working medium inlet, and the width of the straight portion gradually increases.

Optionally, a heat insulation layer is disposed between the chassis and the heat dissipation assembly.

In a second aspect, the present invention provides a device heat dissipation method, which employs the device heat dissipation system as described above, including:

step S1: the working medium in the heat absorption assembly absorbs the heat generated by the heating body;

step S2: the working medium transmits heat to the heat dissipation assembly through the steam pipeline;

step S3: the working medium returns to the heat absorbing assembly through the liquid pipe, and the step S1 is repeatedly performed.

According to the device heat dissipation system and method provided by the embodiment of the invention, the heat absorption assembly can conduct the heat of the heating body to the heat dissipation assembly through the heat conduction assembly for diffusion, so that the normal work of the heating body can be effectively prevented from being influenced by the overhigh heat of the heating body, meanwhile, the temperature of the environment in the sealed case can be reduced, and the heat is prevented from being transferred and radiated to the device with small heat productivity by the device with large heat productivity.

Drawings

FIG. 1 is an isometric view of the overall construction of a device heat dissipation system according to an embodiment of the present application;

FIG. 2 is a cross-sectional view of a vertical cross-section of a device heat dissipation system of an embodiment of the present application;

FIG. 3 is a cross-sectional view of a horizontal cross-section of a heat sink assembly according to an embodiment of the present application;

FIG. 4 is a cross-sectional view of a heat sink assembly of an embodiment of the present application taken in the direction A-A of FIG. 3;

FIG. 5 is a cross-sectional view of a heat sink assembly of an embodiment of the present application taken in the direction B-B of FIG. 3;

FIG. 6 is a top view of a package according to an embodiment of the present application;

FIG. 7 is a top view of a device heat dissipation system of an embodiment of the present application;

FIG. 8 is a schematic structural diagram illustrating the shape of a condenser according to an embodiment of the present invention;

fig. 9 is a schematic structural view of a capillary wick according to an embodiment of the present application;

fig. 10 is a schematic flow chart of a method for dissipating heat of a device according to an embodiment of the present application.

Reference numerals

1. A chassis; 2. a heating element; 3. a heat sink assembly; 31. a package body; 311. a liquid collection cavity; 312. a steam collecting cavity; 313. a working medium inlet; 314. a working medium outlet; 32. a capillary core; 321. an arc-shaped portion; 322. a straight portion; 4. a heat conducting component; 41. a steam line; 42. a liquid line; 43. a reservoir; 5. a heat dissipating component; 51. a condenser tube; 52. a heat sink; 521. a fin; 522. a base; 6. an insulating layer.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

First, the noun terms to which the present invention relates are explained.

Loop heat pipe: it is a loop closed loop type heat pipe. Typically consisting of an evaporator, condenser, accumulator 43 and vapor and liquid lines. The working principle is as follows: the heat load is applied to the evaporator, the working medium is evaporated on the outer surface of the capillary core of the evaporator, the generated steam flows out from the steam channel and enters the steam pipeline, then enters the condenser to be condensed into liquid and is supercooled, the backflow liquid enters the liquid main channel through the liquid pipeline to supply the capillary core of the evaporator, and the circulation of the working medium is driven by the capillary pressure generated by the capillary core of the evaporator without additional power. Because the condensing section and the evaporating section are separated, the loop type heat pipe is widely applied to the comprehensive application of energy and the recovery of waste heat.

Capillary structure evaporator: the core component of the loop heat pipe has two important functions of absorbing heat from a heat source and providing working medium circulating power.

Heat load: the distribution of the amount of heat on the device.

Working medium: the working medium is a working substance for realizing heat and power conversion, and is called the working medium for short. Various heat engines or thermal devices are used to implement medium substances for converting heat energy and mechanical energy into each other. The following are common: combustion gas, water vapor, refrigerant, air, and the like. The interconversion of heat energy and mechanical work is realized by a series of state changes of the working medium.

In a first aspect, the present invention provides a device heat dissipation system, combining fig. 1 and fig. 2, wherein arrows in fig. 2 indicate the flow direction of a working medium. The device comprises: the heating device comprises a case 1 and a heating element 2 fixedly positioned in the case 1. The heating element 2 is exemplified by a CPU of a computer, and the heating element 2 is located inside the sealed case 1.

The heat dissipation system includes: the heat absorbing component 3, the heat conducting component 4 and the heat radiating component 5; the heat absorption component 3 is positioned in the case 1 and is abutted and connected with the heating body 2; the heat dissipation assembly 5 is positioned outside the case 1; the heat conducting component 4 is located between the heat absorbing component 3 and the heat dissipating component 5, and two ends of the heat conducting component 4 are respectively fixedly connected with the heat absorbing component 3 and the heat dissipating component 5 so as to exchange heat of the heat absorbing component 3 and heat of the heat dissipating component 5.

The heat dissipation system forms a loop heat pipe through the heat absorption component 3, the heat conduction component 4 and the heat dissipation component 5, so that heat generated by the CPU can be led out of the box body, and the normal work of equipment is prevented from being influenced because the heat generated by the CPU cannot be led out of the box body in time. Wherein the heat absorbing component 3 can conduct the heat of the heating body 2 to the heat dissipating component 5 for diffusion through the heat conducting component 4, thereby effectively avoiding the normal work of the heating body 2 caused by the overhigh heat of the heating body 2, reducing the temperature of the internal environment of the closed case 1, and avoiding the heat transfer and radiation of the device with large heat productivity to the device with small heat productivity.

In an alternative embodiment, with reference to fig. 3, 4 and 5, the heat absorbing assembly 3 comprises: the capillary core comprises a packaging body 31, a capillary core 32 and a working medium, wherein the working medium is not shown in the figure, and the capillary core is positioned inside the packaging body 31. The lower surface of the packaging body 31 is in contact connection with the upper surface of the heating body 2; a liquid collecting cavity 311 and a vapor collecting cavity 312 are formed in the package body 31, and both the liquid collecting cavity 311 and the vapor collecting cavity 312 are communicated with the capillary core 32; referring to fig. 6, a working medium inlet 313 communicated with the liquid collecting cavity 311 and a working medium outlet 314 communicated with the steam collecting cavity 312 are respectively formed on the surface of the package body 31, so that working medium can circulate among the heat absorbing assembly 3, the heat conducting assembly 4 and the heat dissipating assembly 5.

Specifically, under the condition that the working medium absorbs the heat generated by the heating element 2, the working medium enters the heat dissipation assembly 5 through the working medium outlet 314 and the heat conduction assembly 4 in a gaseous state, and the working medium diffuses the absorbed heat to the outside of the case 1 under the action of the heat dissipation assembly 5. The working medium is changed from gas state to liquid state and enters the liquid collecting cavity 311 through the heat conducting component 4 and the working medium inlet 313 to continuously absorb the heat generated by the heating element 2, so that the working medium can circularly and repeatedly carry out heat dissipation treatment on the heating element 2 in the heat dissipation system.

In an alternative embodiment, in conjunction with fig. 7 and 8, the arrows in fig. 7 indicate the direction of flow of the working substance. The heat dissipation assembly 5 includes: a condenser tube 51 and a radiator 52;

the heat sink 52 comprises fins 521 and a base 522, the fins 521 are uniformly perpendicular to the upper surface of the base 522, and the bottoms of the fins 521 are fixedly connected with the base 522; the base 522 is fixedly connected with the case 1; the condensation pipe 51 is S-shaped and inserted into the fin 521. The top of the case 1 is open, and the base 522 seals the opening of the case 1.

The condensation pipe 51 can absorb heat of the working medium and diffuse the absorbed heat to the outside through the fins 521, so that the condensation pipe 51 continuously absorbs the heat of the working medium. The condenser pipe 51 is inserted into the fins 521 in an S-shape, so that the contact area between the condenser pipe 51 and the fins 521 can be increased, the heat dissipation speed of the condenser pipe 51 can be increased, and the effect of absorbing heat generated by the heating element 2 by the working medium can be further improved.

In an alternative embodiment, the heat conducting assembly 4 comprises: a vapor line 41, a liquid line 42, and a liquid reservoir 43; two ends of the steam pipeline 41 are respectively communicated with the working medium outlet 314 and the inlet of the condenser pipe 51, and are respectively fixedly connected with the packaging body 31 and the condenser pipe 51; one end of the liquid pipeline 42 penetrates through the liquid storage device 43 and is communicated with the working medium inlet 313, the other end of the liquid pipeline 42 is communicated with the outlet of the condensation pipe 51, two ends of the liquid storage device 43 are fixedly connected with the liquid pipeline 42, and two ends of the liquid pipeline 42 are fixedly connected with the outlet of the condensation pipe 51 and the packaging body 31 respectively.

The arrangement of the steam pipeline 41 and the liquid pipeline 42 can ensure that the working medium circularly flows between the heat absorption assembly 3 and the heat dissipation assembly 5, so that the working medium can continuously absorb the heat generated by the heating body 2. The liquid storage device 43 can store a certain amount of cooled working medium, so that the capillary core 32 in the packaging body 31 can be replenished, and the heat absorption of the heat absorption component 3 on the heating body part position is prevented from being influenced due to insufficient supply of the working medium.

The working medium flows into the liquid collecting cavity 311 from the liquid storage device 43 through the working medium inlet 313; under the driving of capillary pressure generated by the capillary core 32 and hydraulic pressure generated by liquid in the liquid reservoir 43, the working medium is uniformly distributed in the packaging body 31 along the capillary core 32; because the bottom of the packaging body 31 is directly attached to the CPU, when the CPU generates heat, heat load is applied to the heat absorption component 3, the working medium absorbs a large amount of heat and then is evaporated on the outer surface of the capillary core 32 to generate steam, and the steam is concentrated in the steam collection cavity 312; finally, the steam in the steam collecting cavity 312 flows into the condensing pipe 51 from the working medium outlet 314 for cooling, and flows into the liquid collecting cavity 311 again through the liquid pipeline 42 and the working medium inlet 313 after cooling, and the circulation can continuously dissipate the heat of the CPU.

In an alternative embodiment, in conjunction with fig. 3 and 9, the capillary wick 32 includes an arcuate portion 321 and a straight portion 322.

The arc-shaped parts 321 are arranged under the steam collecting cavity 312 at equal intervals along the radial direction by taking the central position of the steam collecting cavity 311 as the center of a circle, and the straight parts 322 are sequentially connected with the adjacent arc-shaped parts 321 along the radial direction of the arc-shaped parts 321.

The cooled working medium enters the liquid collecting cavity 311 through the working medium inlet 313 and diffuses towards the arc-shaped part 321 along the straight part 322, so that all the capillary cores 32 are filled with the cooled working medium.

In an alternative embodiment, the capillary wick 32 is arranged in a spider web configuration within the enclosure 31.

In an alternative embodiment, referring to fig. 3 and 9, straight portion 322 begins at working medium inlet 313 and gradually increases in width.

The width of the straight portion 322 is limited, so that the attraction force of the heat absorbing assembly 3 to the working medium is uniformly distributed in the packaging body 31, and the working medium is uniformly distributed in the packaging body 31.

In an alternative embodiment, a thermal insulation layer 6 is disposed between the chassis 1 and the base 522. The base 522 is fixedly connected with the edge of the top of the case 1 through the heat insulation layer 6.

The arrangement of the heat insulation layer 6 can prevent the heat radiated by the radiator 52 from being retransmitted to the case 1 and the inside of the box body, thereby ensuring good heat radiation effect and ensuring that the radiator 52 does not interfere with the inside of the case 1 and other devices in the heat radiation process.

In an embodiment of the present application, the circulation of the working medium is driven by the capillary pressure generated by the capillary core 32 and the hydraulic pressure generated by the liquid in the liquid reservoir 43, and no external power is needed, so that the energy saving, the environmental protection, the noise free and the high heat dissipation efficiency are achieved. The heat generated by the heating body 2, especially the CPU, is separated out through the heat insulation layer 6 and the loop heat pipe, so that the CPU does not interfere with other devices in the case 1 in the heat dissipation process. Meanwhile, the working temperature of the CPU is reduced, the internal temperature of the closed case 1 is optimized, and the reliability of the product is improved.

In a second aspect, the present invention provides a device heat dissipation method, which, with reference to fig. 10, employs the device heat dissipation system as described above, including:

step S1: the working medium in the heat absorption component 3 absorbs the heat generated by the heating body 2.

Step S2: the working medium transfers heat to the heat sink 5 through the steam line 41.

Step S3: the working fluid returns to the heat absorption module 3 through the liquid line 42, and the step S1 is repeatedly performed.

Specifically, the working medium flows into the liquid collecting cavity 311 from the liquid storage device 43 through the working medium inlet 313; under the driving of capillary pressure generated by the capillary core 32 and hydraulic pressure generated by liquid in the liquid reservoir 43, the working medium is uniformly distributed in the packaging body 31 along the capillary core 32; because the bottom of the packaging body 31 is directly attached to the CPU, when the CPU generates heat, heat load is applied to the heat absorption component 3, the working medium absorbs a large amount of heat and then is evaporated on the outer surface of the capillary core 32 to generate steam, and the steam is concentrated in the steam collection cavity 312; finally, the steam in the steam collecting cavity 312 flows into the condensing pipe 51 from the working medium outlet 314 for cooling, and flows into the liquid collecting cavity 311 again through the liquid pipeline 42 and the working medium inlet 313 after cooling, and the circulation can continuously dissipate the heat of the CPU.

Because the circulation of the working medium is driven by the capillary pressure generated by the capillary core 32 and the hydraulic pressure generated by the liquid in the liquid storage device 43, no external power is needed, and the device is energy-saving, environment-friendly, noiseless and high in heat dissipation efficiency.

The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. A device heat dissipation system, the device comprising: case and fixed position in the inside heat-generating body of case, cooling system includes: the heat absorption assembly, the heat conduction assembly and the heat dissipation assembly;

the heat dissipation assembly is positioned outside the case;

2. The device heat dissipation system of claim 1, wherein the heat sink assembly comprises: the capillary core is positioned in the packaging body;

3. The device heat dissipation system of claim 1, wherein the heat dissipation assembly comprises: a condenser tube and a radiator;

4. The device heat dissipation system of claim 1, wherein the thermally conductive assembly comprises: a vapor line, a liquid line and a reservoir;

5. The device heat dissipation system of claim 2, wherein the capillary wick comprises an arc-shaped portion and a straight-shaped portion;

6. The device heat dissipation system of claim 5, wherein the straight portion begins at the working medium inlet and gradually increases in width.

7. The device heat dissipation system of claim 1, wherein a thermal insulation layer is disposed between the chassis and the heat dissipation assembly.

8. A device heat dissipation method, using the device heat dissipation system of any of claims 1 to 7, comprising: