CN101943533A - Loop heat pipe - Google Patents

Loop heat pipe Download PDF

Info

Publication number
CN101943533A
CN101943533A CN200910304005.2A CN200910304005A CN101943533A CN 101943533 A CN101943533 A CN 101943533A CN 200910304005 A CN200910304005 A CN 200910304005A CN 101943533 A CN101943533 A CN 101943533A
Authority
CN
China
Prior art keywords
heat pipe
capillary
loop heat
steam
capillary portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN200910304005.2A
Other languages
Chinese (zh)
Other versions
CN101943533B (en
Inventor
侯春树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nantong Zhengping Photoelectric Equipment Co Ltd
Original Assignee
Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hong Jun Precision Industry Co ltd, Fuzhun Precision Industry Shenzhen Co Ltd filed Critical Hong Jun Precision Industry Co ltd
Priority to CN200910304005.2A priority Critical patent/CN101943533B/en
Priority to US12/549,387 priority patent/US20110000646A1/en
Publication of CN101943533A publication Critical patent/CN101943533A/en
Application granted granted Critical
Publication of CN101943533B publication Critical patent/CN101943533B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/062Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/043Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2999/00Aspects linked to processes or compositions used in powder metallurgy
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F28F2255/18Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes sintered
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention discloses a loop heat pipe, comprising an evaporation part adhered to a heat source and a pipeline forming a sealed loop with two ends of the evaporation part, wherein the evaporation part comprises a housing and a capillary structure adhered to the inner wall of the housing, the capillary structure comprises a first capillary part adhered to the entire inner surface of the housing of the evaporation part and a second capillary part surrounded by the first capillary part, and a plurality of steam channels are arranged between the first capillary part and the second capillary part. Compared with the prior art, the first capillary part in the loop heat pipe covers the housing of a heat absorption part of the evaporation part completely to rapidly absorb the heat of the housing, so that the heat of the housing is brought away by means of rapid evaporation of a liquid working medium inside the first capillary part in order to enhance the heat dissipation efficiency of the loop heat pipe.

Description

Loop heat pipe
Technical field
The present invention relates to a kind of heat abstractor, be meant a kind of loop heat pipe especially.
Background technology
Along with the constantly development of electronic information industry, electronic product is towards trend development more compact and multi-functional, quicker operation, the heat that electronic building brick disengaged is also more and more many thereupon, causes it to further develop and must face the bottleneck that how to reduce the electronic building brick operating temperature.Desire to make the high-tech electronic product to bring into play due function, designing high efficiency heat abstractor has become the significant challenge that industry develops advanced electronic product of future generation, so the utilization of loop hot-pipe will be a future trend.
Present loop hot-pipe mainly comprises an evaporation part, a condensation part usually and connects a steam pipe line and a liquid line of described evaporation part and condensation part.Described evaporation part is used for contacting with thermal source, to absorb the heat of thermal source.Described evaporation part comprises a metal shell and is contained in the interior capillary structure of housing.Described capillary structure comprise a central tool reservoir central part and from the central part lateral surface be radial extension and with some extensions of shell inner surface thermo-contact.Two adjacent extensions and shell inner surface enclose jointly and form a steam channel.The steam that working media in the capillary structure is produced by thermal evaporation is circulated to steam pipe line by described steam channel, through the condensation part condensation after liquid line is back to the evaporation part.Capillary structure only passes through the end face and the housing thermo-contact of extension, so, thereby the working media only in the extension directly absorbs the heat of housing and the heat of undergoing phase transition absorption housing, the capillary structure of other parts is by absorbing the undergoing phase transition of heat of housing radiation, so, the phase change probability and the evaporation efficiency of working media is low in the evaporation part, and then causes the radiating efficiency of loop heat pipe to reduce, and very causes inefficacy.
Summary of the invention
In view of this, be necessary the loop heat pipe that provides a radiating efficiency higher.
A kind of loop heat pipe, comprise that an evaporation part that is used for being sticked with thermal source reaches a pipeline that forms a sealed circuit with two ends, described evaporation part, described evaporation part comprises a housing and is attached at a capillary structure of inner walls, described capillary structure comprises first capillary portion that is attached at evaporation part housing total inner surface and the one second capillary portion that is centered on by the first capillary portion, offers some steam channels between described first, second capillary portion.
Compared with prior art, the first capillary portion covers the housing of the endothermic section of evaporation part fully among the present invention, can absorb the heat of housing fast, thereby make the liquid working media rapid evaporation in the first capillary portion and take away the heat of housing, and then improve the radiating efficiency of loop heat pipe.
With reference to the accompanying drawings, the invention will be further described in conjunction with specific embodiments.
Description of drawings
Fig. 1 is the schematic diagram of loop heat pipe in the first embodiment of the invention.
Fig. 2 is the cutaway view of the evaporation part of loop heat pipe among Fig. 1 along the II-II section.
Fig. 3 be in the second embodiment of the invention evaporation part along the cutaway view of II-II section.
The specific embodiment
As shown in Figure 1, be the loop heat pipe of first embodiment of the invention.This loop heat pipe comprise an evaporation part that is sticked with thermal source 10 and with this evaporation part 10 be tightly connected one around property pipeline 20.Some working medias are contained in this loop heat pipe.
Please consult Fig. 2 simultaneously, this evaporation part 10 comprises a metal shell 11 and is attached at a capillary structure 13 of housing 11 inwalls.This evaporation part 10 can have multiple shape, and as rectangle, square, cylindric etc., its concrete shape is according to the shape decision of the thermal source that is mated.In the present embodiment, this evaporation part 10 is cylindric, and is symmetrical arranged about the central shaft of its level.
This capillary structure 13 comprises one first capillary portion 131 that is attached at evaporation part 10 housings, 11 total inner surface and the one second capillary portion 133 that is attached at the first capillary portion 131 and is communicated with this first capillary portion 131, between first, second capillary portion 131,133, offer some steam channels 135 along its length direction.
This first capillary portion 131 is formed by the powder of braiding structure or sintering, is provided with in the form of a ring.One side of the first capillary portion 131 is attached on the inwall of this housing 11, and the whole inwall of covering shell 11.
This second capillary portion 133 is formed by the powder of braiding structure or sintering equally, and it comprises the central part 1331 of a column and is radial outward extending some extensions 1333 from central part 1331 outer surfaces.These central part 1331 middle parts offer the reservoir 137 of a column along its bearing of trend, are used to store working media.Extension 1333 is uniformly distributed in central part 1331 outsides, and its outermost end is connected with the first capillary portion 131.The two adjacent extension 1333 and the first capillary portions 131 surround described steam channel 135 jointly.First, second capillary portion 133 connects by sintering, welding or alternate manner.
The housing 11 of this evaporation part 10 comprises an endothermic section that contacts with thermal source 112 and 112 the outward extending extending part 114 of an end from the endothermic section.The diameter of this extending part 114 is used for the storing liquid working media greater than the diameter of endothermic section 112.The other end middle part of this endothermic section 112 offers a steam (vapor) outlet 1121.This extending part 114 offers a liquid inlet 1141 away from the middle part of endothermic section 112 1 ends.This capillary structure 13 has a closed section 132 and self-enclosed section 132 open section 134 that extends.This closed section 132 is attached at endothermic section 112 inner surfaces and replaces endothermic section 112 steam (vapor) outlets, 1121 corresponding side walls.This open section 134 is attached at extending part 114 inner surfaces, and the corresponding liquid inlet 1141 of its opening.
Described reservoir 137 comprises first reservoir 1371 that is positioned at closed section 132 middle parts and second reservoir 1373 that is positioned at open section 134 middle parts.This first, second reservoir 1371,1373 is interconnected, and the diameter of second reservoir 1373 is greater than the diameter of first reservoir 1371.First reservoir 1371 is used to accommodate the liquid working medias in capillary structure 13 closed sections 132 and is heated and the steam state working media that forms by these liquid working medias.Second reservoir 1373 is used to accommodate the liquid working media that refluxes from pipeline 20.
Described steam (vapor) outlet 1121 around property pipeline 20 1 ends and evaporation part 10 is tightly connected, and the other end and liquid inlet 1141 are tightly connected.The part that this pipeline 20 is connected with steam (vapor) outlet 1121 is a steam pipe line 21, and its part that is connected with liquid inlet 1141 is a liquid line 22.
During use, the endothermic section 112 of evaporation part 10 housings 11 absorbs the heat of thermal source, and the first capillary portion 131 on its inwall is heated and causes its inner working media evaporation to form the steam state working media, thereby takes away these heats.The steam state working media that the first capillary portion 131 produces enters steam pipe line 21 by steam channel 135 from steam (vapor) outlet 1121.Steam pipe line 21 outside radiations heat energies and make cooling of steam state working medias and formation liquid working media in the steam pipe line 21 simultaneously, liquid working media enters liquid line 22, enters in second reservoir 1373 of evaporation part 10 by liquid inlet 1141 then.Be the cooling of steam state working medias in the quickening steam pipe line 21, the heat abstractor that can be sticked in steam pipe line 21 outsides, in the present embodiment, this heat abstractor is a heat-conducting plate 30.Because the effect of capillary force, liquid working media in first, second reservoir 1371,1373 is sent to the first capillary portion 131 by the central part 1331 and the extension 1333 of the second capillary portion 133, thereby the dry combustion method phenomenon takes place in the first capillary portion 131 that prevents, has ensured the stability of loop heat pipe.
Please consult Fig. 3 simultaneously, be the cutaway view of evaporation part 10a in the second embodiment of the invention.In the present embodiment among the evaporation part 10a and first embodiment evaporation part 10 be that one difference is: the 131a of first, second capillary portion, 133a are integrally formed.
Be appreciated that ground, among the present invention, the first capillary portion 131 covers the housing 11 of the endothermic section 112 of evaporation part 10 fully, can absorb the heat of housing 11 fast, thereby make the liquid working media rapid evaporation in the first capillary portion 131 and take away the heat of housing 11, and then improve the radiating efficiency of loop heat pipe.

Claims (13)

1. loop heat pipe, comprise that an evaporation part that is used for being sticked with thermal source reaches a pipeline that forms a sealed circuit with two ends, described evaporation part, described evaporation part comprises a housing and is attached at a capillary structure of inner walls, it is characterized in that: described capillary structure comprises first capillary portion that is attached at evaporation part housing total inner surface and the one second capillary portion that is centered on by the first capillary portion, offers some steam channels between described first, second capillary portion.
2. loop heat pipe as claimed in claim 1 is characterized in that: the described first capillary portion is attached on the inwall of housing in the form of a ring.
3. loop heat pipe as claimed in claim 1 is characterized in that: the described second capillary portion has the extension that some intervals are provided with, and the outermost end of described extension and the first capillary portion are sticked.
4. loop heat pipe as claimed in claim 3 is characterized in that: the extension of the second capillary portion of described two adjacent settings and the first capillary portion enclose jointly and form described steam channel.
5. loop heat pipe as claimed in claim 4 is characterized in that: the described second capillary portion further comprises a central part that connects described extension, and described extension is radial extension outside the lateral of described central part.
6. loop heat pipe as claimed in claim 5 is characterized in that: the middle part of described central part offers a reservoir along its bearing of trend.
7. loop heat pipe as claimed in claim 1 is characterized in that: described first, second capillary is by being welded to connect.
8. loop heat pipe as claimed in claim 1 is characterized in that: described first, second capillary portion is integrally formed.
9. loop heat pipe as claimed in claim 1 is characterized in that: described first, second capillary portion is formed by the powder of braiding structure or sintering.
10. loop heat pipe as claimed in claim 1 is characterized in that: the housing of described evaporation part comprises an endothermic section that is sticked with thermal source and the extending part that one end extends from the endothermic section, and described extending part is used to accommodate liquid working media.
11. loop heat pipe as claimed in claim 1, it is characterized in that: described evaporation part housing one side offers a steam (vapor) outlet, opposite side offer one with described steam (vapor) outlet together with the liquid inlet, described capillary structure has an open section of a closed section and self-enclosed section extension, this closed section is replaced the wall of the corresponding side of this evaporation part steam (vapor) outlet, the corresponding described liquid inlet of the opening of this open section.
12. loop heat pipe as claimed in claim 11 is characterized in that: described pipeline is divided into a steam pipe line that links to each other with steam (vapor) outlet and a liquid line that links to each other with the liquid inlet, and described steam pipe line and liquid line one connect.
13. loop heat pipe as claimed in claim 12 is characterized in that: a condensation part that further comprises the described steam pipe line that is sticked.
CN200910304005.2A 2009-07-03 2009-07-03 Loop heat pipe Expired - Fee Related CN101943533B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200910304005.2A CN101943533B (en) 2009-07-03 2009-07-03 Loop heat pipe
US12/549,387 US20110000646A1 (en) 2009-07-03 2009-08-28 Loop heat pipe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN200910304005.2A CN101943533B (en) 2009-07-03 2009-07-03 Loop heat pipe

Publications (2)

Publication Number Publication Date
CN101943533A true CN101943533A (en) 2011-01-12
CN101943533B CN101943533B (en) 2013-06-05

Family

ID=43411997

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200910304005.2A Expired - Fee Related CN101943533B (en) 2009-07-03 2009-07-03 Loop heat pipe

Country Status (2)

Country Link
US (1) US20110000646A1 (en)
CN (1) CN101943533B (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102305563A (en) * 2011-07-23 2012-01-04 鞍山钦元节能设备制造有限公司 Heat pipe radiator working in revolution motion state
CN102954723A (en) * 2011-08-17 2013-03-06 富士通株式会社 Loop heat pipe, and electronic apparatus including loop heat pipe
CN106535565A (en) * 2016-10-26 2017-03-22 维沃移动通信有限公司 Heat dissipation structure of mobile terminal and mobile terminal
CN110895429A (en) * 2019-05-14 2020-03-20 研祥智能科技股份有限公司 Device heat dissipation system and method
CN114251963A (en) * 2021-12-13 2022-03-29 大连理工大学 High-temperature loop heat pipe with novel evaporator arrangement mode

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2527776A1 (en) * 2011-05-24 2012-11-28 Thermal Corp. Capillary device for use in heat pipe and method of manufacturing such capillary device
US20130206369A1 (en) * 2012-02-13 2013-08-15 Wei-I Lin Heat dissipating device
US9170058B2 (en) * 2012-02-22 2015-10-27 Asia Vital Components Co., Ltd. Heat pipe heat dissipation structure
US9599408B1 (en) * 2012-03-03 2017-03-21 Advanced Cooling Technologies, Inc. Loop heat pipe evaporator including a second heat pipe
WO2015132250A1 (en) * 2014-03-05 2015-09-11 Universite Libre De Bruxelles Wick structure for two-phase heat transfer apparatus
CN106413334A (en) * 2015-07-27 2017-02-15 宏碁股份有限公司 Radiating assembly
WO2017212646A1 (en) * 2016-06-10 2017-12-14 日本碍子株式会社 Wick
WO2017212652A1 (en) * 2016-06-10 2017-12-14 日本碍子株式会社 Wick
US20180209746A1 (en) * 2017-01-26 2018-07-26 Asia Vital Components Co., Ltd. Wick structure and loop heat pipe using same
JP6843158B2 (en) * 2017-07-18 2021-03-17 日本碍子株式会社 Wick
US20190154352A1 (en) * 2017-11-22 2019-05-23 Asia Vital Components (China) Co., Ltd. Loop heat pipe structure
US11408684B1 (en) * 2018-10-11 2022-08-09 Advanced Cooling Technologies, Inc. Loop heat pipe evaporator
CN114076531A (en) * 2020-08-19 2022-02-22 华为技术有限公司 Evaporator, condenser and heat dissipation device
IT202200003092A1 (en) * 2022-02-18 2023-08-18 Thales Alenia Space Italia Spa Con Unico Socio MODULAR EVAPORATOR ASSEMBLY FOR A CLOSED LOOP HEAT PIPE THERMAL CONTROL SYSTEM

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4765396A (en) * 1986-12-16 1988-08-23 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Polymeric heat pipe wick
US4883116A (en) * 1989-01-31 1989-11-28 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Ceramic heat pipe wick
JP3450148B2 (en) * 1997-03-07 2003-09-22 三菱電機株式会社 Loop type heat pipe
TWI271501B (en) * 2005-01-14 2007-01-21 Foxconn Tech Co Ltd Heat pipe and method of manufacturing it
CN100552366C (en) * 2006-09-15 2009-10-21 富准精密工业(深圳)有限公司 Loop heat pipe

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102305563A (en) * 2011-07-23 2012-01-04 鞍山钦元节能设备制造有限公司 Heat pipe radiator working in revolution motion state
CN102305563B (en) * 2011-07-23 2012-11-14 鞍山钦元节能设备制造有限公司 Heat pipe radiator working in revolution motion state
CN102954723A (en) * 2011-08-17 2013-03-06 富士通株式会社 Loop heat pipe, and electronic apparatus including loop heat pipe
CN102954723B (en) * 2011-08-17 2014-10-29 富士通株式会社 Loop heat pipe, and electronic apparatus including loop heat pipe
CN106535565A (en) * 2016-10-26 2017-03-22 维沃移动通信有限公司 Heat dissipation structure of mobile terminal and mobile terminal
CN106535565B (en) * 2016-10-26 2019-04-12 维沃移动通信有限公司 A kind of mobile terminal radiator structure and mobile terminal
CN110895429A (en) * 2019-05-14 2020-03-20 研祥智能科技股份有限公司 Device heat dissipation system and method
CN114251963A (en) * 2021-12-13 2022-03-29 大连理工大学 High-temperature loop heat pipe with novel evaporator arrangement mode

Also Published As

Publication number Publication date
CN101943533B (en) 2013-06-05
US20110000646A1 (en) 2011-01-06

Similar Documents

Publication Publication Date Title
CN101943533A (en) Loop heat pipe
CN100480611C (en) Heat pipe
CN102595861A (en) Vapor chamber having support posts with inner-sintering structure
CN103528035B (en) Great power LED integrated thermal heat dissipating method and device
TWI675177B (en) Complex temperature plate combined assembly
CN101943532A (en) Loop heat pipe
CN202514230U (en) Vapor chamber with inner-sintered structured support columns
CN209930821U (en) Liquid-cooled heat conduction block and water-cooled radiator
CN103269573A (en) Temperature equalization superconductive heat radiator
CN100584167C (en) Radiating module and heat tube thereof
TW202043690A (en) Heat dissipation unit with axial capillary structure
US20120037344A1 (en) Flat heat pipe having swirl core
JP7044781B2 (en) Heat transfer equipment
CN100456458C (en) Radiating apparatus
CN112739153B (en) Space synthesis power amplifier and heat dissipation device thereof
CN108168346B (en) Heat pipe heat storage heat exchanger with variable heat storage capacity
CN110132034B (en) Method for optimizing radial through density of heat accumulator
CN108225068B (en) Expand heat pipe heat accumulation heat exchanger of evaporation end area
CN203772086U (en) Efficient heat pipe
TWM532022U (en) Vapor chamber and upper shell parts thereof
CN2470774Y (en) Hollow toothed heat-tube exchanger
CN202373576U (en) Radiating module
CN204697453U (en) Uniform-temperature radiator
CN103900411B (en) Efficient heat pipe
RU2005136495A (en) METHOD FOR PRODUCING A LAMINATE HEAT EXCHANGER

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: NANTONG HUACHENG LIGHTING ELECTRICAL APPLIANCE CO.

Free format text: FORMER OWNER: FUHUAI (SHENZHENG) PRECISION INDUSTRY CO., LTD.

Effective date: 20141115

Free format text: FORMER OWNER: HONGZHUN PRECISION INDUSTRY CO., LTD.

Effective date: 20141115

C41 Transfer of patent application or patent right or utility model
COR Change of bibliographic data

Free format text: CORRECT: ADDRESS; FROM: 518109 SHENZHEN, GUANGDONG PROVINCE TO: 226000 NANTONG, JIANGSU PROVINCE

TR01 Transfer of patent right

Effective date of registration: 20141115

Address after: Tongzhou District Ping Chao Zhen Wan Zi tou Cun, Jiangsu city of Nantong province 226000

Patentee after: Nantong Huacheng Lighting Electrical Appliance Co. Ltd.

Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two

Patentee before: Fuhuai (Shenzheng) Precision Industry Co., Ltd.

Patentee before: Foxconn Precision Industry Co., Ltd.

ASS Succession or assignment of patent right

Owner name: NANTONG ZHENGPING PHOTO-ELECTRIC EQUIPMENTS CO., L

Free format text: FORMER OWNER: NANTONG HUACHENG LIGHTING ELECTRICAL APPLIANCE CO., LTD.

Effective date: 20150215

C41 Transfer of patent application or patent right or utility model
COR Change of bibliographic data

Free format text: CORRECT: ADDRESS; FROM: 226000 NANTONG, JIANGSU PROVINCE TO: 226353 NANTONG, JIANGSU PROVINCE

TR01 Transfer of patent right

Effective date of registration: 20150215

Address after: Tongzhou District Pingchao Town Village 226353 head of Nantong city in Jiangsu Province

Patentee after: Nantong Zhengping Photoelectric Equipment Co. Ltd.

Address before: Tongzhou District Ping Chao Zhen Wan Zi tou Cun, Jiangsu city of Nantong province 226000

Patentee before: Nantong Huacheng Lighting Electrical Appliance Co. Ltd.

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130605

Termination date: 20180703

CF01 Termination of patent right due to non-payment of annual fee