CN106413334A - Radiating assembly - Google Patents
Radiating assembly Download PDFInfo
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- CN106413334A CN106413334A CN201510446193.8A CN201510446193A CN106413334A CN 106413334 A CN106413334 A CN 106413334A CN 201510446193 A CN201510446193 A CN 201510446193A CN 106413334 A CN106413334 A CN 106413334A
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- area
- working fluid
- housing
- lower house
- radiating subassembly
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Abstract
A radiating assembly provided by the present invention is suitable for an electronic device, and comprises a shell, a pipe body and a block body. The pipe body is connected with the shell to form a loop, a working fluid is suitable for filling in the loop, and the block body is configured in the shell to divide the space in the shell into a first area and a second area. The block body is equipped with a first channel to be communicated with the first and second areas, a heat source of the electronic device is suitable for being contacted with the shell thermally and corresponds to the first area, and the liquid working fluid flows into the second area of the shell from the pipe body, receives the heat transmitted by the heat source in the first area and become a gaseous working fluid in a phase transformation manner to flow to the pipe body from the first area. According to the present invention, the driving kinetic energy of the working fluid can be maintained, and the working fluid is not limited by the gravity influence any more.
Description
Technical field
The present invention relates to a kind of radiating subassembly, specially a kind of radiating subassembly of electronic installation.
Background technology
With scientific and technological progress, such as central processing unit (CPU, Central Processing Unit), graphic process unit (GPU,
Graphics Processing Unit), north bridge chips (North Bridge Chip) or random access memory (RAM, Random
Access Memory) etc. electronic component arithmetic speed also more quick so that the heat dissipation problem of electronic component is also more serious.
Conventional loop formula thermosyphons use as heat transfer element, and above-mentioned electronic component can be reached with heat transfer and radiating effect,
But because it mainly applies capillary and gravity as the power driving air-liquid circulation, therefore it is vulnerable to the restriction of gravity, especially exists
When this loop-type thermosyphons is as electronic installation and is in horizontal arrangement, once lacking potential energy (gravity) difference, just easily
Produce the situation of poor circulation.Accordingly, how to strengthen the circulation efficiency of loop-type thermosyphons, even if to overcome with electronics
Device and be in remain to during horizontal positioned allow its working fluid possess enough cycle kinetic energies, actually think deeply in detail needed for related personnel.
Content of the invention
The present invention provides a kind of radiating subassembly, and it is separated out different spaces by block in housing inner region, using as offer work
Make fluid phase change to be used with offer or supplementary working fluid, with driving kinetic energy in radiating subassembly for the maintenance work fluid.
The radiating subassembly of the present invention, including housing, body and block.Body connects housing and forms loop, and working fluid is fitted
In being filled in loop.Block is configured in housing and for the space in housing to divide into the firstth area and the secondth area.Block has first
Passage, connection the firstth area and the secondth area.The thermal source of electronic installation is suitable to thermally contact housing corresponding firstth area.Gaseous working fluid
Flow into the secondth area of housing from body, and the firstth area accept the heat that transmitted by thermal source and be mutually deformed into gaseous working fluid with from
Firstth area flow to body.
Based on above-mentioned, radiating subassembly passes through housing and forms loop with body, and allow working fluid be filled in loop with
Reach the effect of heat absorption and radiating by its phase change.Furthermore, the inner space of housing is divided into two by block, and allows thermal source to connect
Wherein one space is corresponded only to, the workflow physical ability therefore in this space is therefore absorbed heat and produced phase change, and another during tactile housing
One space is then no, so another space remains to maintenance work fluid in the state of liquid.Accordingly, once the space being heated, its work
Make fluid because heat absorption produces phase change when reducing, the gaseous working fluid in another space just can be constantly towards this space being heated
Transmission, provides the power of working fluid flowing in housing with body simultaneously according to this, and allows radiating subassembly be not necessarily limited to gravity
Impact.
Brief description
Fig. 1 is a kind of partial top view of the electronic installation according to one embodiment of the invention.
Fig. 2 is the partial side view of the electronic installation of Fig. 1.
Fig. 3 and Fig. 4 illustrates the explosive view of the housing of Fig. 1 respectively with different visual angles.
Fig. 5 illustrates the axonometric chart of the housing of Fig. 1.
Fig. 6 illustrates the sectional view of the housing of Fig. 1.
Description of reference numerals：
100：Radiating subassembly； 110：Housing；
112：Upper shell； 112a：First depression；
112b：Second depression； 112c：3rd depression；
114：Lower house； 116：Projection；
120：Body； 130：Block；
140：Capillary medium； 200：Electronic installation；
210：Keysheet module； 220：Part；
230：Thermal source； 240：Circuit board；
A1：3rd area； A2：4th area；
BL：Bottom； E1：Entrance；
E2：Outlet； F1：First passage；
F2：Second channel； P1：Firstth area；
P2：Secondth area； S1：First surface；
S2：Second surface.
Specific embodiment
Features described above and advantage for enabling the present invention become apparent, special embodiment below, and coordinate institute's accompanying drawing to make specifically
Bright as follows.
Fig. 1 is a kind of partial top view of the electronic installation according to one embodiment of the invention.Fig. 2 is the office of the electronic installation of Fig. 1
Portion's side view.Please also refer to Fig. 1 and Fig. 2, in the present embodiment, radiating subassembly 100 is suitable to be installed in electronic installation 200
In, it is beneficial to the thermal source 230 to electronic installation 200 and radiate.As shown in figure 1, here is with the main frame portion of notebook computer
It is divided into example, but the present embodiment is not limited thereto.Radiating subassembly 100 be, for example, hydrocone type heat abstractor, it include housing 110,
Body 120 and working fluid (not illustrating), the two ends of body 120 are connected with housing 110 and form loop, and allow work
Fluid filled is in loop, to produce, because absorbing heat or radiate, the transmission action that phase change completes heat by working fluid, here
In each schema, the flow direction of working fluid is only represented with arrow.
In the present embodiment, body 120 circumferentially configures by the Keysheet module 210 of electronic installation 200, furtherly,
Keysheet module 210 has part 220, and it is, for example, the support member of Keysheet module 210, and the metal material for heat conductor, leads to
Cross and allow body 120 to thermally contact in part 220, and the heat of body 120 can be sent to part 220 and via part 220
Dissipate out electronic installation 200, allow the part that body 120 abutted with part 220 according to this as the condensation segment of radiating subassembly 100,
I.e. gaseous working fluid is via the phase transformation chemical conversion gaseous working fluid because of radiating herein.
As shown in Fig. 2 housing 110 actually (is for example disposed on circuit board 240 with the thermal source 230 of electronic installation 200
Processor) mutually thermally contact, according to this heat is successfully sent to housing 110 from thermal source 230 (processor), to allow housing
Working fluid in 110 therefore absorbs heat and produces phase change and form gaseous working fluid, and flow to pipe from the outlet E2 of housing 110
Body 120, because body 120 is the periphery of the part 220 being connected to Keysheet module 210, thus absorbs in body 120 whereby
The heat of working fluid, and allow its phase transformation be melted into gaseous working fluid, and flow to housing 110 from the entrance E1 of housing 110 again,
Form circuit cycle as shown in Figure 1.
Fig. 3 and Fig. 4 illustrates the explosive view of the housing of Fig. 1 respectively with different visual angles.Fig. 5 illustrates the axonometric chart of the housing of Fig. 1.
Fig. 6 illustrates the sectional view of the housing of Fig. 1.Wherein, Fig. 5 is had an X-rayed can clearly recognize its assembling by the part of housing 110
Situation afterwards.Please also refer to Fig. 3 to Fig. 6, in the present embodiment, housing 110 include each other being soldered or welded mode and
In conjunction with upper shell 112 and lower house 114, wherein lower house 114 is plate-like structure, and upper shell 112 has aforesaid entrance
E1, outlet E2 and first depression 112a, the second depression 112b and the 3rd depression 112c, wherein from entrance E1 towards outlet
On the direction (also for the flow direction of working fluid) of E2, upper shell 112 is sequentially configured with the second depression 112b, the 3rd depression
112c and first depression 112a.After upper shell 112 is be combined with each other with lower house 114, aforementioned depression will be with lower house 114
Form chamber, so that accommodating or circulation are made for fluid and are used.
Furthermore it is often more important that, radiating subassembly 100 also includes block 130, and it is clamped in upper shell 112 and lower house 114
Between, and the top side of block 130 be connected to upper shell 112 the 3rd depression 112c in.Aforementioned upper shell 112 and lower house 114
Therefore the first area P1 and the second area P2 (being shown in Fig. 6), wherein entrance E1 are divided into by block 130 in conjunction with the chamber being formed
It is connected between the second area P2 and body 120, outlet E2 is then connected between the first area P1 and body 120, the first depression
112a corresponds to the first area P1, and the second depression 112b corresponds to the second area P2.The thermal source 230 of electronic installation 100 substantially with housing
110 contact and correspond to the first area P1.Consequently, it is possible to the gaseous working fluid being located in the first area P1 just can therefore absorb heat
And produce phase change, and then form gaseous working fluid and flow to body 120 from outlet E2.
Additionally, block 130 has first passage F1, it is adjacent to lower house 114 and connects the first area P1 and the second area P2,
Gaseous working fluid is allowed to be able to flow to the first area P1 from the second area P2 according to this, to carry out the work of phase change as aforementioned first area P1
The supplement making fluid is used.
Specifically, radiating subassembly 100 also includes capillary medium 140 (being shown in Fig. 6), and wherein part capillary medium 140 is joined
Put in the first area P1 and the second area P2 and pass through first passage F1, and another part capillary medium 140 extends ground and configures second
Area P2 and body 120.In the present embodiment, capillary medium 140 is selected from：Porous material, powder metallurgy, porous are burnt
Knot body, porous foaming body (foam), porous carbonized (carbonized) body etc., the present invention is simultaneously not limited, wherein
Powder metallurgy or porous sintered body are then selected from：Silver, copper, aluminium alloy, and other suitable metals, alloy material person.
Accordingly, the gaseous working fluid that heat reaches the first area P1 to heat this area is formed gas by the thermal source 230 of electronic installation 200
After state working fluid, by the presence of capillary medium 140, the gaseous working fluid that just can make way for the second area P2 is according to this through
One passage F1 and be sent to the first area P1, and allow the workflow physical ability of the first area P1 constantly to absorb heat and to carry out phase change.Furthermore,
Gaseous working fluid at body 120 also can constantly be sent to the second area P2 of housing 110 by capillary medium 140.
Consequently, it is possible to gaseous working fluid just can in a steady stream hourly from body 120, the second area P2 of housing 110 and be sent to housing 110
The first area P1.Therefore, the second area P2 of housing 110 just can be considered the additional area of the working fluid of the first area P1, simultaneously
Also therefore reach and allow working fluid to be flowed in body 120, the first area P1 of housing 110 and the second area P2, body 120
Power resources.
Separately, as shown in fig. 6, the height with respect to the bottom BL of lower house 114 for the entrance E1 is less than outlet E2 with respect to lower casing
The height of the bottom BL of body 114, therefore liquid working stream physical ability successfully flow into housing 110 from body 120 via entrance E1
The second area P2, allow gaseous working stream physical ability successfully flow out housing 110 with via going out from the first area P1 of housing 110 simultaneously
Mouth E2 flow to body 120.In other words, by the high and low configuration (for the BL of bottom) of entrance E1 and outlet E2,
Just flow direction in housing 110 for the working fluid can be efficiently controlled, i.e. allow gaseous working fluid via relatively low entrance E1
Flow into housing 110, and allow gaseous working fluid flow out housing 110 via higher outlet E2, to meet working fluid in closing
Simple subprogram characteristic in loop, also can prevent the situation of gaseous working fluid backflow (countercurrently) from occurring simultaneously.Furthermore, at this
In the housing 110 of embodiment, the aperture of entrance E1 is less than the aperture of outlet E2, and this measure also can cause housing 110 inner space
Pressure gap, and then improve, promote working fluid circulation power in the loop.
Refer again to Fig. 3 to Fig. 5, in the present embodiment, the first area P1 (i.e. first depression of upper shell 112 of housing 110
112a is combined rear formed space with lower house 114) it is to assume tapered appearance profile from block 130 towards at outlet E2,
With allow the gaseous working fluid in the first area P1 be therefore caught and exit E2 at.Additionally, block 130 also has
Second channel F2, is adjacent to upper shell 112 and connects the first area P1 and the second area P2, i.e. second channel F2 is located at first
The top of passage F1.With the first area P1 similarly, second channel F2 also have from second area P2 towards the first area P1 and be in
The gaseous working fluid of the second area P2 therefore can be collected guiding and flow to the first area P1, can also simultaneously by existing tapered appearance profile
The gaseous working fluid blocking the first area P1 is back to the second area P2.
Refer again to Fig. 6, in the present embodiment, the first depression 112a of upper shell 112 has in the face of lower house 114 first
Surface S1, the second depression 112b then has the second surface S2 in the face of lower house 114, and first surface S1 and second surface
S2 at entrance E1 towards outlet E2 at oblique both with respect to the bottom BL of lower house 114, that is, as shown in fig. 6,
The side of the second surface S2 at entrance E1 is relatively low, and the side of the first surface S1 at outlet E2 is higher, because
And be in now correspond to entrance E1, the high and low configuration (assuming the state of right low left high in schema) of outlet E2.This measure represents
It is big positioned at the space of the first area P1 substantially space compared with the second area P2, to allow the first area P1 can accommodate more gaseous state work
Make fluid, simultaneously because of first surface S1, being arranged obliquely of second surface S2, and can increase gaseous working fluid from entrance E1
Motion mode at place's guiding flow direction outlet E2.
On the other hand, radiating subassembly 100 also includes multiple projections 116, and configuration on the surface of lower house 114 and is located at the firstth area
P1, these projections 116 are divided into the 3rd area A1 and the 4th area A2 according to it in the position of lower house 114, the wherein the 3rd area A1
The profile that formed of multiple projections 116 be consistent in the orthographic projection profile of lower house 114 with thermal source 230 (being illustrated in Fig. 2), and
The projection 116 of the 4th area A2 is located between block 130 and the projection 116 of the 3rd area A1.In other words, divide in the present embodiment
The projection 116 in area can be considered that the main thermal treatment zone (i.e. the 3rd area A1) directly corresponding to thermal source 230 is secondary with not corresponding with thermal source 230
The thermal treatment zone (i.e. the 4th area A2), the wherein structure of projection 116 are just in order to absorb heat from thermal source 230 and to heat the firstth area according to this
The working fluid of P1.
Accordingly, the most gaseous working fluid positioned at the first area P1 just can be worked to liquid by the projection 116 of the 3rd area A1
Fluid heats and produces, and because the projection 116 of the 4th area A2 does not directly correspond to thermal source 230, therefore gaseous working fluid is heated
Then relatively the 3rd area A1 is few to produced gaseous working fluid, and so, the gaseous working stream of the main thermal treatment zone is known from experience along inclination
First surface S1 and flow to outlet E2, and thus result in pressure step-down above the main thermal treatment zone, and then guide on time thermal treatment zone
The gaseous working fluid of side moves towards the top of the main thermal treatment zone.Meanwhile, because the secondary thermal treatment zone produce gaseous working fluid not
Can be many and vigorous as the main thermal treatment zone, so the gaseous working fluid of the secondary thermal treatment zone is just not easy to pour into second channel F2 block
130, and successfully can be drained to outlet E2 because the low pressure of the main thermal treatment zone is given, to allow the gaseous working stream physical ability in housing 110 to have
Preferably one-way circulation effect.
Another it should be mentioned that the block 130 of the present embodiment is poor conductor of heat, therefore heat produced by thermal source 230 be able to by
First area P1 of housing 110 is absorbed, and also therefore avoids causing the feelings of the gaseous working fluid excessively gasification positioned at the second area P2
Shape produces.
In sum, in the above embodiment of the present invention, radiating subassembly passes through housing and body and forms loop, and allows work
Make fluid filled in loop to reach the effect of heat absorption and radiating by its phase change, its middle tube body is passed through on electronic installation
Have by the good part of thermal conduction characteristic, so that the heat of body can be gone out electronic installation by dissipation whereby and can be considered the cold of radiating subassembly
Solidifying section.
Furthermore, the inner space of housing is divided into two by block, and allows thermal source correspond only to wherein one space when contacting housing, because
The workflow physical ability that this is located at this space is therefore absorbed heat and is produced phase change, and another space is then no, and another space remains to maintain
Working fluid is in the state of liquid.
Meanwhile, by configuring the capillary medium with the condensation segment of body in housing, and working fluid is allowed to produce phase change because of heat absorption
And when reducing, can persistently provide gaseous working fluid to this space of heat absorption from the condensation segment in another space and body, thus result in
Workflow physical ability successfully in housing and body constant flow power resources, even if radiating subassembly is in water with electronic installation
During flat configuration, remain to therefore and with being not influenced by gravitation continue its radiating circulation.
Additionally, the surface that upper shell is passed through in enclosure interior space is inclined, thus allows gaseous working fluid to be caught and guide
To exporting, simultaneously by profile and the configuration mode of block and its passage, and arrange in pairs or groups in the projection of heat absorption space diverse location, and
The gaseous working fluid of generation is allowed to avoid being back to the aforementioned space providing gaseous working fluid.
Although the present invention is disclosed above with embodiment, so it is not limited to the present invention, has in any art
Generally skill, without departing from the spirit and scope of the present invention, when a little change and retouching can be made, therefore the protection of the present invention
Scope ought be defined depending on those as defined in claim.
Claims (14)
1. it is adaptable to an electronic installation, this radiating subassembly includes a kind of radiating subassembly：
One housing；
One body, connects this housing and forms primary Ioops, and a working fluid is suitable to be filled in this loop；And
One block, is configured in this housing and for the space in this housing to divide into one first area and one second area, and this block has
One first passage, connects this firstth area and this secondth area, and a thermal source of this electronic installation is suitable to thermally contact this housing and to should the
One area, gaseous working fluid flows into this secondth area of this housing from this body, and accepts the heat being transmitted by this thermal source in this firstth area
Measure and be mutually deformed into gaseous working fluid to flow to this body from this firstth area.
2. radiating subassembly according to claim 1 is it is characterised in that also include：
One capillary medium, at least partly this capillary medium configuration with this secondth area and passes through this first passage, liquid in this firstth area
Working fluid is suitable to be sent to this firstth area from this secondth area via this first passage by this capillary medium.
3. radiating subassembly according to claim 2 is it is characterised in that this capillary medium of another part is joined from this secondth area with extending
Put to this body, gaseous working fluid is sent to this secondth area from this body.
4. it is characterised in that this housing has an entrance and an outlet, this entrance connects radiating subassembly according to claim 1
Between this secondth area and this body, this outlet connects between this firstth area and this body, and this firstth area has from this block court
To the appearance profile that this outlet is tapered.
5. radiating subassembly according to claim 4 is it is characterised in that this housing includes：
One upper shell, has this entrance and this outlet；And
One lower house, is assembled to this upper shell, and this block is clamped between this upper shell and this lower house, and this first passage adjoins
In this lower house, this thermal source thermally contacts this lower house.
6. radiating subassembly according to claim 5, it is characterised in that this block also has a second channel, is adjacent to this upper casing
Body and connect this firstth area and this secondth area, this second channel is in tapered appearance profile from this secondth area towards this firstth area,
It is sent to this firstth area to guide the gaseous working fluid being located at this secondth area, and block the gaseous working fluid backflow in this firstth area
To this secondth area.
7. radiating subassembly according to claim 5 is it is characterised in that this entrance is less than this outlet with respect to the height of this lower house
Height with respect to this lower house.
8. radiating subassembly according to claim 7 is it is characterised in that this upper shell is on from this entrance towards the direction of this outlet
There is one second depression, one the 3rd depression and one first depression successively, this block is connected to the 3rd depression, and this first depression is right
Should the first space, this second depression is to should second space.
9. radiating subassembly according to claim 8 is it is characterised in that this first depression has one first table in the face of this lower house
Face, this second depression has the second surface in the face of this lower house, and this first surface and this second surface are from this porch court
Oblique both with respect to this lower house to this exit.
10. radiating subassembly according to claim 5 is it is characterised in that also include：
Multiple projections, are configured at this lower house and are located at this firstth area.
11. radiating subassemblies according to claim 10 are it is characterised in that those projections divide according to the position on this lower house
For one the 3rd area and one the 4th area, the profile in the 3rd area is consistent in the orthographic projection profile of this lower house with this thermal source, the 4th area
Those projections be located between those projections in the 3rd area and this block.
12. radiating subassemblies according to claim 4 are it is characterised in that the aperture of this entrance is less than the aperture of this outlet.
13. radiating subassemblies according to claim 1, it is characterised in that this electronic installation also has a part, are heat conductor, should
Body thermally contacts in this part, to transfer heat to this part.
14. radiating subassemblies according to claim 13 it is characterised in that this electronic installation has a Keysheet module, this keyboard mould
Block has this part, and this body around this Keysheet module and is connected to the periphery of this part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510446193.8A CN106413334A (en) | 2015-07-27 | 2015-07-27 | Radiating assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510446193.8A CN106413334A (en) | 2015-07-27 | 2015-07-27 | Radiating assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106413334A true CN106413334A (en) | 2017-02-15 |
Family
ID=58009242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510446193.8A Pending CN106413334A (en) | 2015-07-27 | 2015-07-27 | Radiating assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106413334A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109974491A (en) * | 2017-12-13 | 2019-07-05 | 双鸿科技股份有限公司 | Hydrocone type radiator and heat absorption head |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110000646A1 (en) * | 2009-07-03 | 2011-01-06 | Foxconn Technology Co., Ltd. | Loop heat pipe |
| CN102723316A (en) * | 2011-03-29 | 2012-10-10 | 北京奇宏科技研发中心有限公司 | Loop heat pipe structure |
| CN203761742U (en) * | 2014-02-28 | 2014-08-06 | 双鸿科技股份有限公司 | Liquid-gas divided-flow type heat exchange cavity |
-
2015
- 2015-07-27 CN CN201510446193.8A patent/CN106413334A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110000646A1 (en) * | 2009-07-03 | 2011-01-06 | Foxconn Technology Co., Ltd. | Loop heat pipe |
| CN102723316A (en) * | 2011-03-29 | 2012-10-10 | 北京奇宏科技研发中心有限公司 | Loop heat pipe structure |
| CN203761742U (en) * | 2014-02-28 | 2014-08-06 | 双鸿科技股份有限公司 | Liquid-gas divided-flow type heat exchange cavity |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109974491A (en) * | 2017-12-13 | 2019-07-05 | 双鸿科技股份有限公司 | Hydrocone type radiator and heat absorption head |
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Application publication date: 20170215 |