CN110849127B - Rotary pulling-up wafer drying method - Google Patents
Rotary pulling-up wafer drying method Download PDFInfo
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- CN110849127B CN110849127B CN201911092089.8A CN201911092089A CN110849127B CN 110849127 B CN110849127 B CN 110849127B CN 201911092089 A CN201911092089 A CN 201911092089A CN 110849127 B CN110849127 B CN 110849127B
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- chain
- wafer
- hanger mechanism
- hanger
- rotating arm
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B15/00—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form
- F26B15/10—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form with movement in a path composed of one or more straight lines, e.g. compound, the movement being in alternate horizontal and vertical directions
- F26B15/12—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form with movement in a path composed of one or more straight lines, e.g. compound, the movement being in alternate horizontal and vertical directions the lines being all horizontal or slightly inclined
- F26B15/18—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form with movement in a path composed of one or more straight lines, e.g. compound, the movement being in alternate horizontal and vertical directions the lines being all horizontal or slightly inclined the objects or batches of materials being carried by endless belts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/001—Drying-air generating units, e.g. movable, independent of drying enclosure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/004—Nozzle assemblies; Air knives; Air distributors; Blow boxes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
- F26B25/02—Applications of driving mechanisms, not covered by another subclass
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
- F26B25/06—Chambers, containers, or receptacles
- F26B25/14—Chambers, containers, receptacles of simple construction
- F26B25/18—Chambers, containers, receptacles of simple construction mainly open, e.g. dish, tray, pan, rack
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
Abstract
The invention relates to the technical field of dryers, in particular to a rotary pulling wafer drying method.A wafer is hung on a chain 2 through a hanger mechanism, the hanger mechanism is arranged on the chain 2 through a fixing mechanism, and the hanger mechanism and a rotating arm 31 cannot rotate; when the hanger mechanism is arranged at the top end of the chain 2, the plane of the rotating arm 31 is tightly attached to the rotation stopping plate 13 at the top of the vertical plate 12, the hanger mechanism is in a vertical state, at the moment, the wafer is clamped on the hanger mechanism through an external mechanical arm, the wafer moves downwards along with the hanger mechanism along with the operation of the chain 2, the stirring effect of the hanger mechanism on water flow can be utilized, and the cleaning effect is improved; in the wafer lifting process, the circumferential position of the hanger mechanism can be covered by airflow along with the rotation of the hanger mechanism, so that the drying dead angle and water accumulation point are avoided, and the drying effect is improved.
Description
Background
In the production process of semiconductor integrated circuits, wafer cleaning and drying are the most frequent production processes, and the cleaning and drying quality directly affects the yield of final chips. At present, the most advanced mode for cleaning and drying the wafer is the Marangoni drying method, which is to spray a high-temperature IPA vapor and nitrogen mixed gas to a meniscus of the wafer in contact with deionized water to induce the water and the surface of the wafer to generate the Marangoni effect when the wafer is pulled out of the ion water surface, so as to dry the wafer. In the existing scheme for drying the wafer by adopting the Marangley effect principle, the wafer is cleaned and dried in an intermittent production mode, the efficiency is low, and the requirement on industrial production efficiency cannot be met. In the cleaning process, the wafer is in a static state in water, and the contact interface between the water and the wafer has no fluidity, so that the cleaning effect is not ideal. The distance and the angle between the wafer and the air injection device are fixed in the lifting and drying process, and air flow easily forms dead angles at certain positions to influence the drying effect.
Disclosure of Invention
The invention aims to provide a rotary pulling-up wafer drying method aiming at the defects in the prior art.
The purpose of the invention is realized by the following technical scheme: a rotary pulling wafer drying method comprises a base, a vertical plate connected with the base, a chain wheel assembly rotatably connected with the vertical plate, a driving piece used for driving the chain wheel assembly to rotate and a chain sleeved on the chain wheel assembly;
a plurality of hanging tool mechanisms are arranged on the chain; a fixing mechanism is arranged between the hanger mechanism and the chain;
the fixing mechanism comprises a rotating arm clamped on the hanger mechanism, a rotary table fixedly connected with the rotating arm and a fixed seat rotatably connected with the rotary table; the fixed seat is fixedly connected with the chain;
the vertical plate is provided with a rotation stopping plate at the top of the chain; the rotation stopping plate is used for abutting against the rotating arm; the vertical plate is provided with a rotary guide plate at the bottom of the chain; the rotary guide plate is used for abutting against the rotary disc;
the invention has the beneficial effects that: 1. by changing the nozzle configuration, the air flow parameters can be conveniently adjusted, and the drying effect is ensured; 2. the rotary table drives the hanger mechanism to rotate in the cleaning process, so that the stirring effect of the hanger mechanism on water flow can be utilized, and the cleaning effect is improved; 3. in the wafer lifting process, the circumferential position of the hanger mechanism can be covered by airflow along with the rotation of the hanger mechanism, so that the drying dead angle and water accumulation point are avoided, and the drying effect is improved.
Description of the drawings
The invention is further illustrated by means of the attached drawings, but the embodiments in the drawings do not constitute any limitation to the invention, and for a person skilled in the art, other drawings can be derived on the basis of the following drawings without inventive effort.
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a partial enlarged view of portion A of FIG. 1;
FIG. 3 is a schematic view of the engagement of the hanger mechanism with the securing mechanism of the present invention;
FIG. 4 is an exploded view of the hanger mechanism of the present invention in cooperation with the securing mechanism;
FIG. 5 is a schematic structural view of the hanger mechanism of the present invention with the first cover plate hidden;
FIG. 6 is a schematic structural view of the hanger mechanism of the present invention with the second cover plate hidden;
FIG. 7 is a cross-sectional view of the hanger mechanism of the present invention;
FIG. 8 is a schematic view of the structure of the air injection mechanism of the present invention;
FIG. 9 is a schematic view of the outer tube hidden by the jet mechanism of the present invention;
wherein: 11-a base; 12-standing plates; 13-rotation stopping plate; 14-a rotating guide plate; 2-a chain; 21-a drive member; 22-upper driving wheel; 23-an upper driven wheel; 24-lower driving wheel; 25-lower driven wheel; 31-a swivel arm; 32-a turntable; 33-a fixed seat; 34-a linker; 35-a pin shaft; 4-a water tank; 5-an air injection mechanism; 51-an outer tube; 52-inner tube; 53-a second electric machine; 54-slit air outlet; 55-air outlet holes; 6-frame; 61-an upper gripper assembly; 62-a lower gripper assembly; 63-left grasping assembly; 64-a right grasping assembly; 65-first gas tank; 66-a second gas tank; 71-a first active slot; 72-a second active slot; 73-a piston; 74-a jaw; 75-lever; 76-clamping jaw air hole; 8-cover plate; 81-cover plate air holes; 82-rotating arm air holes; 83-air inlet hole.
Detailed Description
The invention is further described with reference to the following examples.
As shown in fig. 1 to 9, the method for drying a wafer lifted by rotation in this embodiment includes a base 11, a vertical plate 12 connected to the base 11, a sprocket assembly rotatably connected to the vertical plate 12, a driving member 21 for driving the sprocket assembly to rotate, and a chain 2 sleeved on the sprocket assembly;
a plurality of hanging tool mechanisms are arranged on the chain 2; a fixing mechanism is arranged between the hanger mechanism and the chain 2;
the fixing mechanism comprises a rotating arm 31 clamped on the hanger mechanism, a rotating disc 32 fixedly connected with the rotating arm 31 and a fixed seat 33 rotatably connected with the rotating disc 32; the fixed seat 33 is fixedly connected with the chain 2;
the vertical plate 12 is provided with a rotation stopping plate 13 at the top of the chain 2; the rotation stopping plate 13 is used for abutting against the rotating arm 31; the vertical plate 12 is provided with a rotary guide plate 14 at the bottom of the chain 2; the rotating guide plate 14 is used for abutting against the turntable 32;
the base 11 is provided with a water tank 4; an air injection mechanism 5 is arranged in the water tank 4; the hanger mechanism enters the water tank 4 through the rotating guide plate 14.
Specifically, in the rotary pull-up type wafer dryer of the embodiment, the wafer is suspended on the chain 2 through the hanger mechanism, the hanger mechanism is arranged on the chain 2 through the fixing mechanism, and the hanger mechanism and the rotating arm 31 cannot rotate; when the hanger mechanism is arranged at the top end of the chain 2, the plane of the rotating arm 31 is tightly attached to the rotation stopping plate 13 at the top of the vertical plate 12, the hanger mechanism is in a vertical state, at the moment, the wafer is clamped on the hanger mechanism through an external mechanical arm, the wafer moves downwards along with the hanger mechanism along with the operation of the chain 2, and when the elastic rotating disc 32 on the hanger mechanism is in contact with the rotating guide plate 14, the rotating disc 32 drives the hanger mechanism to rotate. Then the wafer is conveyed into a water tank 4, cleaned and then circularly ascended along with the chain 2 in a rotating way, and a gas injection mechanism 5 arranged at the liquid level at the top of the water tank 4 injects high-temperature nitrogen to induce the meniscus at the contact part of the surface of the wafer and the liquid level to generate the Marangley effect so as to dry the wafer. The wafer continuously moves upwards after running out of the drying area along with the chain 2, the hanger mechanism is oriented in the direction parallel to the chain 2 under the action of the rotation stopping plate, and the wafer in the hanger mechanism is taken out by the mechanical arm after reaching the material discharging position.
In the method for drying a wafer lifted by rotation according to this embodiment, the sprocket assembly includes an upper driving wheel 22, an upper driven wheel 23, a lower driving wheel 24, and a lower driven wheel 25; the driving part 21 is a first motor; the output end of the first motor is connected with an upper driving wheel 22; the chain 2 is sleeved on the upper driving wheel 22, the upper driven wheel 23, the lower driving wheel 24 and the lower driven wheel 25. Every chain link both ends of chain 2 all are provided with the chain link gyro wheel, and the joint of chain link gyro wheel is in the guide rail of chain 2 to increase the operation precision and the stability of chain 2. The above arrangement makes the structure of the chain 2 stable.
In the method for drying a wafer by rotating and lifting according to this embodiment, the fixing seat 33 is connected to a joint 34; the joint 34 is fixedly connected with the chain 2 through a pin shaft 35. The arrangement facilitates the fixing of the hanger mechanism on the chain 2.
In the method for drying a wafer by rotating and lifting in this embodiment, the hanger mechanism includes a frame 6; a plurality of grabbing components are arranged in the frame 6; the grabbing component comprises a first movable groove 71 arranged in the frame 6, a second movable groove 72 arranged in the frame 6, a piston 73 movably arranged in the first movable groove 71, a clamping jaw 74 movably extending in the second movable groove 72 and a lever 75 rotatably connected with the frame 6; the two ends of the lever 75 are respectively connected with the piston 73 and the clamping jaw 74;
an air groove is formed outside the frame 6; the first movable groove 71 is provided with a clamping jaw air hole 76 communicated with the air groove; the hanger mechanism further comprises a cover plate 8 connected with the frame 6; the cover plate 8 is provided with a cover plate air hole 81 communicated with the air groove; the rotating arm 31 is provided with a rotating arm air hole 82 communicated with the cover plate air hole 81 and an air passage communicated with the rotating arm air hole 82; the fixed seat 33 is provided with an air inlet 83 communicated with the air passage.
In the method for drying a wafer by rotating and lifting in this embodiment, the grabbing components include an upper grabbing component 61 and a lower grabbing component 62 which are arranged at the upper end and the lower end of the frame 6, and a left grabbing component 63 and a right grabbing component 64 which are arranged at the left end and the right end of the frame 6; the air grooves comprise a first air groove 65 arranged on one side of the frame 6 and a second air groove 66 arranged on the other side of the frame 6; the cover plate 8 comprises a first cover plate 8 arranged on one side of the frame 6 and a second cover plate 8 arranged on the other side of the frame 6; the first cover plate 8 is provided with a first cover plate air hole 81 communicated with the first air groove 65; the second cover plate 8 is provided with a second cover plate air hole 81 communicated with the second air groove 66; the swing arm air holes 82 include a first swing arm air hole 82 communicating with the first cover air hole 81 and a second swing arm air hole 82 communicating with the second cover air hole 81; the air passages include a first air passage in communication with the first rotating arm air hole 82 and a second air passage in communication with the second rotating arm air hole 82; the air inlet holes 83 comprise a first air inlet hole 83 communicated with the first air passage and a second air inlet hole 83 communicated with the second air passage; the clamping jaw air hole 76 of the upper grabbing component 61 and the clamping jaw air hole 76 of the lower grabbing component 62 are respectively communicated with the first air groove 65; the clamping jaw air hole 76 of the left grabbing assembly 63 and the clamping jaw air hole 76 of the right grabbing assembly 64 are respectively communicated with the second air groove 66.
Specifically, taking the left grabbing assembly 63 and the right grabbing assembly 64 as an example, when the clamping jaws 74 of the left grabbing assembly 63 and the clamping jaws 74 of the right grabbing assembly 64 are required to extend, firstly, air is introduced into the second air inlet holes 83 of the fixing seat 33, the air enters the second air passage of the rotating arm 31 from the second air inlet holes 83, and enters the second air groove 66 through the second rotating arm air holes 82 and the first cover plate air holes 81 of the second air passage, and then enters the first movable groove 71 of the left grabbing assembly 63 and the first movable groove 71 of the right grabbing assembly 64 from the clamping jaw air holes 76 of the left grabbing assembly 63 and the clamping jaw air holes 76 of the right grabbing assembly 64 respectively through the second air groove 66, so that the clamping jaws 74 are pushed out through the piston 73 and the lever 75; in addition, the principle of the upper and lower gripper assemblies 61 and 62 controlled through the first intake holes 83 is identical to that of the left and right gripper assemblies 63 and 64, and thus, a description thereof will not be repeated.
The grabbing component controls the opening and closing of the clamping jaws 74 in a pneumatic mode to alternately clamp the wafer, so that the cleaning and drying dead angle is avoided in the wafer cleaning and drying process, and the product yield is improved. When the wafer is loaded, the four clamping jaws 74 simultaneously clamp and position the wafer, when the wafer is washed in water, the wafer is kept in a four-way clamping state, when water is discharged and dried, the upper grabbing component 61 and the lower grabbing component 62 clamp the wafer, the left grabbing component 63 and the right grabbing component 64 open, after the left grabbing component 63 and the right grabbing component 64 discharge water and dry, the left grabbing component 63 and the right grabbing component 64 clamp the wafer, the upper grabbing component 61 and the lower grabbing component 62 loosen the wafer, after the upper grabbing component 61 and the lower grabbing component 62 discharge water and dry, the upper grabbing component 61 and the lower grabbing component 62 clamp the wafer, the left grabbing component 63 and the right grabbing component 64 loosen the wafer until the wafer completely discharges water, and by the alternative clamping mode, the drying defect at the contact part of the clamping jaws 74 and the side wall of the wafer can be avoided.
In the method for drying a wafer by rotating and lifting in this embodiment, the air injection mechanism 5 includes an outer tube 51 fixed to the water tank 4, an inner tube 52 sleeved in the outer tube 51, and a second motor 53 for driving the inner tube 52 to rotate; the second motor 53 is fixed on the water tank 4; the outer tube 51 is provided with a slit air outlet 54; the inner tube 52 is provided with a plurality of air outlet holes 55.
In the method for drying a wafer by rotating and lifting according to this embodiment, the air outlet holes 55 include a plurality of air outlet groups with different shapes; the gas outlet group is arranged on the inner pipe 52 along the length direction of the inner pipe 52.
The air injection mechanism 5 is composed of an inner layer of sleeve and an outer layer of sleeve, a plurality of air outlet groups with various configurations are uniformly distributed on the inner pipe 52, and the type of the air outlet group can be rotated by rotating the position of the second motor 53, so that the dispersion characteristic, the flow rate, the air flow direction and other parameters of the air flow are controlled.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the protection scope of the present invention, although the present invention is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.
Claims (2)
1. A drying method for a rotary pulling wafer is characterized in that:
comprises a base (11), a vertical plate (12) connected with the base (11), a chain wheel component rotationally connected with the vertical plate (12), a driving piece (21) used for driving the chain wheel component to rotate and a chain (2) sleeved on the chain wheel component;
a plurality of hanging tool mechanisms are arranged on the chain (2); a fixing mechanism is arranged between the hanger mechanism and the chain (2);
the fixing mechanism comprises a rotating arm (31) clamped on the hanger mechanism, a rotary disc (32) fixedly connected with the rotating arm (31) and a fixed seat (33) rotatably connected with the rotary disc (32); the fixed seat (33) is fixedly connected with the chain (2);
the vertical plate (12) is provided with a rotation stopping plate (13) at the top of the chain (2); the rotation stopping plate (13) is used for abutting against the rotating arm (31); the vertical plate (12) is provided with a rotary guide plate (14) at the bottom of the chain (2); the rotating guide plate (14) is used for abutting against a turntable (32);
the base (11) is provided with a water tank (4); an air injection mechanism (5) is arranged in the water tank (4); the hanger mechanism enters the water tank (4) through the rotating guide plate (14);
the wafer is hung on the chain (2) through a hanger mechanism, the hanger mechanism is arranged on the chain (2) through a fixing mechanism, and the hanger mechanism and the rotating arm (31) cannot rotate; when the hanger mechanism is arranged at the top end of the chain (2), the plane of the rotating arm (31) is tightly attached to the rotation stop plate (13) at the top of the vertical plate (12), the hanger mechanism is in a vertical state, at the moment, the wafer is clamped on the hanger mechanism through an external mechanical arm, the wafer moves downwards along with the hanger mechanism along with the operation of the chain (2), and when an elastic turntable (32) on the hanger mechanism is contacted with the rotating guide plate (14), the turntable (32) drives the hanger mechanism to rotate; then the wafer is conveyed into a water tank (4), cleaned and then circularly ascended along with the rotation of the chain (2), and a gas injection mechanism (5) arranged at the liquid level at the top of the water tank (4) injects high-temperature nitrogen to induce the meniscus at the contact part of the surface of the wafer and the liquid level to generate the Marangley effect so as to dry the wafer; the wafer continuously moves upwards after running out of the drying area along with the chain (2), the hanger mechanism is oriented in the direction parallel to the chain (2) under the action of the rotation stopping plate, and the wafer in the hanger mechanism is taken out by the mechanical arm after reaching the material discharging position.
2. A method as claimed in claim 1, wherein the drying step comprises: the chain wheel assembly comprises an upper driving wheel (22), an upper driven wheel (23), a lower driving wheel (24) and a lower driven wheel (25); the driving piece (21) is a first motor; the output end of the first motor is connected with an upper driving wheel (22); the chain (2) is sleeved on the upper driving wheel (22), the upper driven wheel (23), the lower driving wheel (24) and the lower driven wheel (25); two ends of each chain link of the chain (2) are respectively provided with a chain link roller, and the chain link rollers are clamped in a guide rail of the chain (2) so as to increase the operation precision and stability of the chain (2); the arrangement makes the structure of the chain (2) stable.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911092089.8A CN110849127B (en) | 2019-11-11 | 2019-11-11 | Rotary pulling-up wafer drying method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911092089.8A CN110849127B (en) | 2019-11-11 | 2019-11-11 | Rotary pulling-up wafer drying method |
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| CN110849127A CN110849127A (en) | 2020-02-28 |
| CN110849127B true CN110849127B (en) | 2021-01-08 |
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| CN201911092089.8A Active CN110849127B (en) | 2019-11-11 | 2019-11-11 | Rotary pulling-up wafer drying method |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111780537A (en) * | 2020-07-10 | 2020-10-16 | 华海清科股份有限公司 | Marangoni drying device applied to wafer post-processing |
| CN114396772B (en) * | 2022-01-24 | 2022-09-30 | 佛山市天劲新能源科技有限公司 | Lithium battery drying device and method with online moisture content detection function |
| CN115083971B (en) * | 2022-08-22 | 2022-10-25 | 江苏中清光伏科技有限公司 | Drying treatment equipment for cleaned photovoltaic cell silicon wafer |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100418324B1 (en) * | 2001-12-01 | 2004-02-14 | 한국디엔에스 주식회사 | Wafer dryer for semiconductor cleaning apparatus |
| CN102768972B (en) * | 2012-07-11 | 2015-02-18 | 清华大学 | Wafer drying device |
| CN108687025A (en) * | 2018-05-16 | 2018-10-23 | 安徽宏实自动化装备有限公司 | A kind of piece leaf formula wafer cleaning machine |
| CN208828649U (en) * | 2018-07-20 | 2019-05-07 | 东莞市宏邦精密机械科技有限公司 | Sub-prime, which is energized, to be positioned the big pin pitch of feeder and energizes chain delivery machanism |
| CN208674073U (en) * | 2018-08-02 | 2019-03-29 | 德淮半导体有限公司 | Wafer drying device |
| CN208814277U (en) * | 2018-08-23 | 2019-05-03 | 江苏远方动力科技有限公司 | A kind of chain type vertical cooling device |
| CN209143003U (en) * | 2018-11-28 | 2019-07-23 | 常州常利来电子有限公司 | A kind of glass tube transmission mechanism of glass-tube sorting machine |
| CN110864536B (en) * | 2019-11-11 | 2020-11-10 | 兰泽(荆门)智能科技有限公司 | Rotary pulling-up type wafer drying machine |
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Effective date of registration: 20201222 Address after: 064100 Xinxing Electronic Industrial Park, Yutian County, Tangshan City, Hebei Province Applicant after: TANGSHAN GUOXIN JINGYUAN ELECTRONICS Co.,Ltd. Address before: No. 021, pioneering Office of huofenghuang cloud base, 114 Yueyue Hubei Road, Dongbao District, Jingmen City, Hubei Province Applicant before: Lanze (Jingmen) Intelligent Technology Co.,Ltd. |
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