CN110918551A - Rotary swinging type wafer cleaning and drying machine - Google Patents
Rotary swinging type wafer cleaning and drying machine Download PDFInfo
- Publication number
- CN110918551A CN110918551A CN201911074649.7A CN201911074649A CN110918551A CN 110918551 A CN110918551 A CN 110918551A CN 201911074649 A CN201911074649 A CN 201911074649A CN 110918551 A CN110918551 A CN 110918551A
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- CN
- China
- Prior art keywords
- wafer cleaning
- drying machine
- air outlet
- bottom plate
- frame
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/004—Nozzle assemblies; Air knives; Air distributors; Blow boxes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/06—Controlling, e.g. regulating, parameters of gas supply
- F26B21/12—Velocity of flow; Quantity of flow, e.g. by varying fan speed, by modifying cross flow area
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
- F26B25/001—Handling, e.g. loading or unloading arrangements
- F26B25/003—Handling, e.g. loading or unloading arrangements for articles
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention relates to the technical field of dryers, in particular to a rotary swinging type wafer cleaning dryer, which comprises a bottom plate (11), an upright post, a hinged turntable (13) and a motor, wherein the bottom plate is provided with a support plate; a circular guide track (2) is arranged on the bottom plate (11); the circular guide track (2) is provided with a low concave section (21); the rotary swing type wafer cleaning dryer also comprises a hanger mechanism, a fixing mechanism and a hinged arm (3); one end of the articulated arm (3) is articulated with the articulated rotary table (13); the other end of the articulated arm (3) is connected with a hanger mechanism through a fixing mechanism; the fixing mechanism is provided with a roller (62) which is used for rolling on the circular guide track (2); the bottom plate (11) is provided with a water tank (4) at the bottom of the low concave section (21); an air injection mechanism (5) is arranged in the water tank (4); the hanger mechanism enters the water tank (4) through the low concave section (21). According to the invention, by changing the configuration of the air outlet, the air flow parameters can be conveniently adjusted, and the drying effect is ensured; the wafer is driven to move by the roller (62), the fixing mechanism and the articulated arm (3), so that the efficiency and the precision are high.
Description
Background
In the production process of semiconductor integrated circuits, wafer cleaning and drying are the most frequent production processes, and the cleaning and drying quality directly affects the yield of final chips. At present, the most advanced mode for cleaning and drying the wafer is the Marangoni drying method, which is to spray a high-temperature IPA vapor and nitrogen mixed gas to a meniscus of the wafer in contact with deionized water to induce the water and the surface of the wafer to generate the Marangoni effect when the wafer is pulled out of the ion water surface, so as to dry the wafer. In the existing scheme for drying the wafer by adopting the Marangley effect principle, the wafer is cleaned and dried in an intermittent production mode, the efficiency is low, and the requirement on industrial production efficiency cannot be met.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides a rotary swinging type wafer cleaning and drying machine.
The purpose of the invention is realized by the following technical scheme: a rotary swinging type wafer cleaning and drying machine comprises a bottom plate, an upright post arranged on the bottom plate, a hinged turntable rotationally connected with the upright post and a motor used for driving the hinged turntable to rotate;
a circular guide rail is arranged on the bottom plate; the circular guide track is provided with a low concave section;
the rotary swing type wafer cleaning dryer also comprises a hanger mechanism, a fixing mechanism and a hinged arm; one end of the hinge arm is hinged with the hinge turntable; the other end of the articulated arm is connected with the hanger mechanism through a fixing mechanism; the fixing mechanism is provided with a roller for rolling on the circular guide rail;
the bottom plate is provided with a water tank at the bottom of the low concave section; an air injection mechanism is arranged in the water tank; the hanger mechanism enters the water tank through the low concave section.
The invention is further provided that the rotary oscillating wafer cleaning and drying machine further comprises a top plate connected with the bottom plate; the motor is arranged in the upright post.
The invention is further configured in that the fixing mechanism comprises a mounting frame, a suspension arm hinged with the mounting frame and a telescopic rod hinged with the mounting frame; the telescopic rod is movably telescopic at the other end of the hinged arm; the suspension arm is fixedly connected with the hanger mechanism; the idler wheels are rotatably connected with the mounting rack.
The invention is further arranged in that the hanger mechanism comprises a frame and a grabbing component arranged in the frame; the frame is fixedly connected with the suspension arm; the grabbing component comprises a movable groove arranged in the frame; an electromagnet is arranged at one end in the movable groove; the other end in the movable groove is movably provided with a clamping jaw in a penetrating way; and a return spring is arranged between the electromagnet and the clamping jaw.
The invention is further provided that the grabbing components are an upper grabbing component and a lower grabbing component which are arranged at the upper end and the lower end of the frame, and a left grabbing component and a right grabbing component which are arranged at the left end and the right end of the frame.
The invention is further provided that the air injection mechanism comprises an outer pipe fixed on the water tank, an inner pipe sleeved in the outer pipe and an air cylinder used for driving the inner pipe to rotate in the outer pipe; the cylinder is fixed on the water tank; the outer pipe is provided with a first air outlet; the inner tube is provided with a plurality of second air outlet holes.
The invention is further provided that the second air outlet comprises a plurality of air outlet groups with different shapes; the air outlet group is arranged on the inner pipe along the length direction of the inner pipe.
The invention has the beneficial effects that: 1. by changing the configuration of the air outlet, the air flow parameters can be conveniently adjusted, and the drying effect is ensured; 2. the wafer is driven to move by the roller, the fixing mechanism and the hinged arm, so that the efficiency and the precision are high.
Drawings
The invention is further illustrated by means of the attached drawings, but the embodiments in the drawings do not constitute any limitation to the invention, and for a person skilled in the art, other drawings can be derived on the basis of the following drawings without inventive effort.
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the present invention after hiding the top and bottom plates;
FIG. 3 is a schematic view of the configuration of the articulated arm, securing mechanism and hanger mechanism of the present invention in cooperation;
FIG. 4 is a schematic structural view of the hanger mechanism of the present invention;
FIG. 5 is a cross-sectional view of the hanger mechanism of the present invention;
FIG. 6 is a schematic view of the structure of the air injection mechanism of the present invention;
FIG. 7 is a schematic structural view of the outer tube hidden by the air injection mechanism of the present invention;
wherein: 11-a base plate; 12-a top plate; 13-an articulated turntable; 14-upright post; 2-circular guide track; 21-low concave section; 3-an articulated arm; 4-a water tank; 5-an air injection mechanism; 51-an outer tube; 52-inner tube; 53-a first outlet hole; 54-a second outlet aperture; 61-a mounting frame; 62-a roller; 63-a suspension arm; 64-a telescopic rod; 7-a frame; 71-an upper gripper assembly; 72-a lower gripper assembly; 73-left grasping assembly; 74-a right grasping assembly; 8-a movable groove; 81-an electromagnet; 82-a clamping jaw; 83-a return spring; 9-cylinder.
Detailed Description
The invention is further described with reference to the following examples.
As can be seen from fig. 1 to 7, the rotary oscillating type wafer cleaning and drying machine of the present embodiment includes a bottom plate 11, a vertical column 14 disposed on the bottom plate 11, a hinge rotary table 13 rotatably connected to the vertical column 14, and a motor for driving the hinge rotary table 13 to rotate; the motor is not shown in the figure;
the bottom plate 11 is provided with a circular guide track 2; the circular guide track 2 is provided with a low concave section 21;
the rotary swing type wafer cleaning dryer also comprises a hanger mechanism, a fixing mechanism and a hinged arm 3; one end of the articulated arm 3 is articulated with an articulated rotary table 13; the other end of the articulated arm 3 is connected with a hanger mechanism through a fixing mechanism; the fixing mechanism is provided with a roller 62 for rolling on the circular guide track 2;
the bottom plate 11 is provided with a water tank 4 at the bottom of the low concave section 21; an air injection mechanism 5 is arranged in the water tank 4; the hanger mechanism enters the sink 4 through the low concave section 21.
Specifically, in the rotary oscillating type wafer cleaning and drying machine of the embodiment, the wafer is suspended on the circular guide rail 2 through the hanger mechanism, and the fixing mechanism is clamped in the circular guide rail 2 through the roller 62 and slides in the circular guide rail 2 together with the hanger mechanism under the driving of the articulated arm 3. The guide rail is provided with a low concave section 21 in one direction, a water tank 4 and an air injection mechanism 5 are arranged below the low concave section 21, and when the fixing mechanism with the hanger mechanism enters the area, the hanger mechanism is pushed downwards, so that the wafer is washed in water. And the fixing mechanism continues to move in the low concave section 21 of the circular guide rail 2 to drive the hanger mechanism to move and clean in the water tank 4, and after reaching the ascending section, the wafer and the hanger mechanism are lifted out of the water surface and matched with the air injection mechanism 5 to inject air to induce the Marangley effect to dry the wafer.
In the rotary oscillating type wafer cleaning and drying machine of the embodiment, the rotary oscillating type wafer cleaning and drying machine further comprises a top plate 12 connected with a bottom plate 11; the motor is disposed within the column 14.
In the rotary oscillating type wafer cleaning and drying machine of the embodiment, the fixing mechanism includes a mounting frame 61, a suspension arm 63 hinged to the mounting frame 61, and an expansion link 64 hinged to the mounting frame 61; the telescopic rod 64 is movably telescopic at the other end of the articulated arm 3; the suspension arm 63 is fixedly connected with the hanger mechanism; the roller 62 is rotatably connected to the mounting frame 61. In particular, the arrangement described above enables the fixing means to be moved along the circular guide rail 2.
In the rotary oscillating type wafer cleaning and drying machine of the embodiment, the hanger mechanism comprises a frame 7 and a grabbing assembly arranged in the frame 7; the frame 7 is fixedly connected with the suspension arm 63; the grabbing component comprises a movable groove 8 arranged in the frame 7; an electromagnet 81 is arranged at one end in the movable groove 8; a clamping jaw 82 is movably arranged at the other end in the movable groove 8 in a penetrating manner; and a return spring 83 is arranged between the electromagnet 81 and the clamping jaw 82.
Specifically, the clamping jaw 82 clamps the wafer through the elastic force of the return spring 83, and the electromagnet 81 can adsorb the clamping jaw 82 after being electrified, so that the clamping jaw 82 is retracted into the movable groove 8, and the wafer is clamped and released.
In the rotary oscillating type wafer cleaning and drying machine of the embodiment, the grabbing components are an upper grabbing component 71 and a lower grabbing component 72 which are arranged at the upper end and the lower end of the frame 7, and a left grabbing component 73 and a right grabbing component 74 which are arranged at the left end and the right end of the frame 7.
When the wafer is loaded, the four clamping jaws 82 simultaneously clamp and position the wafer, when the wafer is washed in water, the wafer is kept in a four-way clamping state, when the discharged water is dry, the wafer is clamped by the upper grabbing component 71 and the lower grabbing component 72, the left grabbing component 73 and the right grabbing component 74 are opened, after the left grabbing component 73 and the right grabbing component 74 discharge water and dry, the left grabbing component 73 and the right grabbing component 74 are clamped, the upper grabbing component 71 and the lower grabbing component 72 are loosened, after the upper grabbing component 71 and the lower grabbing component 72 discharge water and dry, the upper grabbing component 71 and the lower grabbing component 72 are clamped, the left grabbing component 73 and the right grabbing component 74 are loosened, and the situation that the contact part of the clamping jaws 82 and the side wall of the wafer is dry and the drying defect can be avoided by the alternate clamping mode until the wafer completely discharges water. The space between the frame 7 and the wafer is large, so that the water flow and the air flow can circulate left and right when the wafer is cleaned and dried conveniently, and the drying effect is improved.
In the rotary oscillating type wafer cleaning and drying machine of the present embodiment, the air injection mechanism 5 includes an outer tube 51 fixed to the water tank 4, an inner tube 52 sleeved in the outer tube 51, and an air cylinder 9 for driving the inner tube 52 to rotate in the outer tube 51; the cylinder 9 is fixed on the water tank 4; the outer tube 51 is provided with a first air outlet 53; the inner tube 52 is provided with a plurality of second outlet holes 54.
In the rotary oscillating type wafer cleaning and drying machine of the present embodiment, the second air outlet 54 includes a plurality of air outlet sets with different shapes; the gas outlet group is arranged on the inner pipe 52 along the length direction of the inner pipe 52.
The air injection mechanism 5 is composed of an inner sleeve and an outer sleeve, a plurality of air outlet groups with various configurations are uniformly distributed on the inner pipe 52, and parameters such as the dispersion characteristic, the flow rate, the air flow direction and the like of the air flow can be controlled by changing the contact ratio of the first air outlet 53 and the second air outlet 54 through the air cylinder 9.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the protection scope of the present invention, although the present invention is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.
Claims (8)
1. The utility model provides a gyration pendulum-type wafer washer-dryer which characterized in that: the method is characterized in that: the device is characterized by comprising a bottom plate (11), an upright post (14) arranged on the bottom plate (11), a hinged turntable (13) rotationally connected with the upright post (14) and a motor for driving the hinged turntable (13) to rotate;
a circular guide track (2) is arranged on the bottom plate (11); the circular guide track (2) is provided with a low concave section (21);
the rotary swing type wafer cleaning dryer also comprises a hanger mechanism, a fixing mechanism and a hinged arm (3); one end of the articulated arm (3) is articulated with the articulated rotary table (13); the other end of the articulated arm (3) is connected with a hanger mechanism through a fixing mechanism; the fixing mechanism is provided with a roller (62) which is used for rolling on the circular guide track (2);
the bottom plate (11) is provided with a water tank (4) at the bottom of the low concave section (21); an air injection mechanism (5) is arranged in the water tank (4); the hanger mechanism enters the water tank (4) through the low concave section (21).
2. The rotary oscillating wafer cleaning and drying machine of claim 1, wherein: the rotary swing type wafer cleaning dryer also comprises a top plate (12) connected with the bottom plate (11); the motor is arranged in the upright post (14).
3. The rotary oscillating wafer cleaning and drying machine of claim 1, wherein: the fixing mechanism comprises a mounting frame (61), a suspension arm (63) hinged with the mounting frame (61) and a telescopic rod (64) hinged with the mounting frame (61); the telescopic rod (64) is movably telescopic at the other end of the articulated arm (3); the suspension arm (63) is fixedly connected with the hanger mechanism; the roller (62) is rotatably connected with the mounting frame (61).
4. The rotary oscillating wafer cleaning and drying machine of claim 3, wherein: the hanger mechanism comprises a frame (7) and a grabbing assembly arranged in the frame (7); the frame (7) is fixedly connected with the suspension arm (63); the grabbing component comprises a movable groove (8) arranged in the frame (7); an electromagnet (81) is arranged at one end in the movable groove (8); a clamping jaw (82) is movably arranged at the other end in the movable groove (8) in a penetrating way; and a return spring (83) is arranged between the electromagnet (81) and the clamping jaw (82).
5. The rotary oscillating wafer cleaning and drying machine of claim 4, wherein: the grabbing components comprise an upper grabbing component (71) and a lower grabbing component (72) which are arranged at the upper end and the lower end of the frame (7), and a left grabbing component (73) and a right grabbing component (74) which are arranged at the left end and the right end of the frame (7).
6. The rotary oscillating wafer cleaning and drying machine of claim 1, wherein: the air injection mechanism (5) comprises an outer pipe (51) fixed on the water tank (4), an inner pipe (52) sleeved in the outer pipe (51) and an air cylinder (9) used for driving the inner pipe (52) to rotate in the outer pipe (51); the cylinder (9) is fixed on the water tank (4); the outer pipe (51) is provided with a first air outlet hole (53); the inner tube (52) is provided with a plurality of second air outlet holes (54).
7. The rotary oscillating wafer cleaning and drying machine of claim 6, wherein: the second air outlet holes (54) comprise a plurality of air outlet groups with different shapes; the air outlet group is arranged on the inner pipe (52) along the length direction of the inner pipe (52).
8. The rotary oscillating wafer cleaning and drying machine of claim 6, wherein: the second air outlet holes (54) comprise a plurality of air outlet groups with different shapes; the air outlet group is arranged on the inner pipe (52) along the length direction of the inner pipe (52).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911074649.7A CN110918551A (en) | 2019-11-06 | 2019-11-06 | Rotary swinging type wafer cleaning and drying machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911074649.7A CN110918551A (en) | 2019-11-06 | 2019-11-06 | Rotary swinging type wafer cleaning and drying machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110918551A true CN110918551A (en) | 2020-03-27 |
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ID=69853317
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911074649.7A Withdrawn CN110918551A (en) | 2019-11-06 | 2019-11-06 | Rotary swinging type wafer cleaning and drying machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110918551A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111672804A (en) * | 2020-06-12 | 2020-09-18 | 湖南省骏北科技有限公司 | Infrared signal coding and decoding chip cleaning device for intelligent pen |
| CN112056955A (en) * | 2020-09-23 | 2020-12-11 | 陈赛燕 | Rotary automatic rice washing device |
| CN112274034A (en) * | 2020-09-23 | 2021-01-29 | 陈赛燕 | Automatic rice washing equipment |
| CN112294151A (en) * | 2020-09-23 | 2021-02-02 | 陈赛燕 | Automatic change kitchen equipment |
| CN112353270A (en) * | 2020-09-23 | 2021-02-12 | 陈赛燕 | Continuous type self-cleaning equipment for dining room |
| CN113357991A (en) * | 2021-05-28 | 2021-09-07 | 艾华(无锡)半导体科技有限公司 | Detection tool for wafer carrier |
-
2019
- 2019-11-06 CN CN201911074649.7A patent/CN110918551A/en not_active Withdrawn
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111672804A (en) * | 2020-06-12 | 2020-09-18 | 湖南省骏北科技有限公司 | Infrared signal coding and decoding chip cleaning device for intelligent pen |
| CN112056955A (en) * | 2020-09-23 | 2020-12-11 | 陈赛燕 | Rotary automatic rice washing device |
| CN112274034A (en) * | 2020-09-23 | 2021-01-29 | 陈赛燕 | Automatic rice washing equipment |
| CN112294151A (en) * | 2020-09-23 | 2021-02-02 | 陈赛燕 | Automatic change kitchen equipment |
| CN112353270A (en) * | 2020-09-23 | 2021-02-12 | 陈赛燕 | Continuous type self-cleaning equipment for dining room |
| CN113357991A (en) * | 2021-05-28 | 2021-09-07 | 艾华(无锡)半导体科技有限公司 | Detection tool for wafer carrier |
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Application publication date: 20200327 |