CN110848583A - Single-light-source LED lamp bead - Google Patents
Single-light-source LED lamp bead Download PDFInfo
- Publication number
- CN110848583A CN110848583A CN201911164360.4A CN201911164360A CN110848583A CN 110848583 A CN110848583 A CN 110848583A CN 201911164360 A CN201911164360 A CN 201911164360A CN 110848583 A CN110848583 A CN 110848583A
- Authority
- CN
- China
- Prior art keywords
- conductive substrate
- lamp
- support
- cavity
- led lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011324 bead Substances 0.000 title claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 87
- 238000004806 packaging method and process Methods 0.000 claims abstract description 6
- 239000000084 colloidal system Substances 0.000 claims abstract description 5
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 230000002708 enhancing effect Effects 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 4
- 238000007747 plating Methods 0.000 abstract description 4
- 229910052709 silver Inorganic materials 0.000 abstract description 4
- 239000004332 silver Substances 0.000 abstract description 4
- 230000002035 prolonged effect Effects 0.000 abstract description 2
- 230000009471 action Effects 0.000 description 4
- 239000008393 encapsulating agent Substances 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The invention discloses a single-light-source LED lamp bead which comprises a support, wherein an injection-molded lamp holder is arranged on the support, the lamp holder is provided with a lamp cavity, an LED wafer is arranged in the lamp cavity, and a first conductive substrate and a second conductive substrate are arranged at the bottom of the lamp holder. The LED lamp is provided with the two conductive substrates, most areas of the two conductive substrates are exposed out of the bracket, heat generated during conduction can be effectively dissipated, the service life of a product is prolonged, the lamp cavity is arranged to be a slope, the whole area of the lamp cavity is reduced, the use amount of packaging colloid and plastic is reduced, the silver plating cost of the inner surface is also reduced, light emitted by an LED wafer is more uniform, the weight of the product is reduced, steps are arranged on the lamp holder through the fastening and matching mode of the bracket and the two conductive substrates, and the whole hardness is enhanced; arrange on the lamp area arrange that the lamp area is evenly arranged more easily, can be applicable to on the littleer circuit board, reduce the cost in lamp area.
Description
Technical Field
The invention relates to the technical field of LED lamps, in particular to a single-light-source LED lamp bead.
Background
The LED has the advantages of environmental protection, energy conservation, long service life and the like, is regarded as a lighting source in the 21 st century, and has begun to replace the traditional light source to be widely applied to various lighting lamps. The LED is recognized as a green fourth-generation light source, is a solid cold light source, and has many advantages of high efficiency, long service life, safety, environmental protection, small volume, high reliability, fast response speed, and the like. At present, the same lighting effect is achieved, the power consumption of the LED is about 1/10 of an incandescent lamp and 1/2 of a fluorescent lamp, the LED lamp is widely used, and the LED is often made into a lamp strip by the existing using method. With the technical development of electronic semiconductors, LED lamps are adopted in more and more lighting places to replace the conventional lighting lamps, and the structures of the LED lamps are diversified due to the diversity of the lighting places. As a new light source, the LED lamp has advantages of safety, high efficiency and good appearance, and thus, in order to preempt the first opportunity and the market, various models and different designs of LED lamps are emerging in the consumer market.
Compared with conventional 2835, 5050 and 5054 lamp beads on the market, the LED lamps of a part of models are not perfect in design, the quantity of hardware and plastic used for manufacturing the LED lamps is large, the quantity of packaging glue is also large, the inner surface coating area is large, the silver plating cost of the product is increased, the strength of the integral support of the product is not enough, and the problem of deformation or breakage is easy to occur. When installing on the lamp area of certain length, the density and the degree of consistency of design are low, have influenced the luminance of LED lamp and the degree of consistency that different colours LED lamp were luminous, and do not arrange module and base plate well, make resistance, lamp pearl and other subassembly overall arrangement unreasonable, lead to the product uneven heat dissipation, have reduced the life of product.
Disclosure of Invention
The invention aims to solve the technical problems that an existing LED lamp is large in material consumption, high in silver plating cost, insufficient in strength of an integral support of a product and prone to deformation or breakage, and the LED lamp bead with a single light source is provided, influences on uneven brightness and color emission and poor arrangement when installed on a lamp strip, influences on heat dissipation of the product, and reduces the service life of the product.
The purpose of the invention is realized by the following technical scheme:
a single-light-source LED lamp bead comprises a support, wherein an injection-molded lamp holder is arranged on the support, a lamp cavity is arranged in the middle of the lamp holder, an LED wafer is arranged inside the lamp cavity, a first conductive substrate and a second conductive substrate are arranged at the bottom of the lamp holder, the bottom of the lamp cavity is communicated with the first conductive substrate and the second conductive substrate, and the first conductive substrate and the second conductive substrate are arranged on the support; the first conductive substrate is connected with the anode of the LED wafer, and the second conductive substrate is connected with the cathode of the LED wafer.
Furthermore, the cross section of the bracket is H-shaped.
Furthermore, the tail ends of the first conductive substrate and the second conductive substrate are provided with inversions, the inversions are connected with the tail end face of the support, and the bottoms of the first conductive substrate and the second conductive substrate are exposed out of the bottom of the support.
Further, the cross sections of the first conductive substrate and the second conductive substrate are in an omega shape.
Further, the side wall of the lamp cavity is provided with a slope which is easy to scatter light, the top of the slope is provided with a step for enhancing hardness, and the step and the lamp holder are integrally formed.
Furthermore, a packaging colloid is injected into the lamp cavity.
Furthermore, the first conductive substrate and the second conductive substrate are provided with through holes for dissipating heat at the bottom of the lamp holder.
Further, the side walls of the first conductive substrate and the second conductive substrate are provided with first steps, the support connected with the first steps on the first conductive substrate and the second conductive substrate is provided with second steps, the side wall of the first step is tightly matched with the side wall of the support, and the side wall of the second step is tightly matched with the side walls of the first conductive substrate and the second conductive substrate.
Furthermore, grooves are formed in two sides of the support, bosses are arranged in the grooves, and the bosses and the support are integrally formed.
The invention has the beneficial effects that:
the invention provides a single-light-source LED lamp bead, which is provided with two conductive substrates, wherein the anode of an LED wafer is connected with a first conductive substrate, the cathode of the LED wafer is connected with a second conductive substrate, most areas of the two conductive substrates are exposed outside, heat generated during conduction can be effectively dissipated, the service life of a product is prolonged, a lamp cavity is arranged into a slope, the whole area of the lamp cavity is reduced, the using amount of packaging colloid and plastic is reduced, the silver plating cost of the inner surface is also reduced, the light dissipated by the LED wafer is more uniform, the using amount of hardware is reduced by the fastening and matching of a bracket and the two conductive substrates, the weight of the product is reduced, steps are arranged on a lamp holder, the integral hardness is enhanced, and the product is prevented from being deformed or broken due to excessive force during use; arrange on the lamp area arrange more easily even arrange the lamp area to can be applicable to on the less circuit board, reduce the cost in lamp area.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is an exploded view of the present invention;
FIG. 3 is a schematic structural diagram of a first conductive substrate according to the present invention;
fig. 4 is a schematic structural view of the stent of the present invention.
In the figure: 1-lamp holder, 10-lamp cavity, 11-slope, 12-step, 2-first conductive substrate, 21-through hole, 230-reverse buckle, 231-first step, 3-second conductive substrate, 4-bracket, 40-second step, 41-groove, and 42-boss.
Detailed Description
The following further describes embodiments of the present invention with reference to the drawings. It should be noted that the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto. In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Referring to fig. 1-4, in the embodiment of the invention, the single-light-source LED lamp bead includes a support 4, a lamp holder 1 formed by injection molding is arranged on the support 4, a lamp cavity 10 is arranged in the middle of the lamp holder 1, an LED chip is arranged inside the lamp cavity 10, a first conductive substrate 2 and a second conductive substrate 3 are arranged at the bottom of the lamp holder 1, the bottom of the lamp cavity 10 is communicated with the first conductive substrate 2 and the second conductive substrate 3, and the first conductive substrate 2 and the second conductive substrate 3 are fixed on the support 4; the first conductive substrate 2 is connected with the anode of the LED wafer, and the second conductive substrate 3 is connected with the cathode of the LED wafer.
As further shown in fig. 4, the stent 4 has an "H" shape in cross-section.
As further shown in fig. 1, the ends of the first conductive substrate 2 and the second conductive substrate 3 are provided with an inverse buckle 230, the inverse buckle 230 is connected with the end face of the end of the support 4, and the bottoms of the first conductive substrate 2 and the second conductive substrate 3 are exposed at the bottom of the support 4.
As further shown in fig. 3, the cross-sections of the first conductive substrate 2 and the second conductive substrate 3 are in an "Ω" shape.
As further shown in fig. 1, the side wall of the lamp cavity 10 is provided with a slope 11 which is easy to scatter light, the top of the slope 11 is provided with a step 12 which enhances the hardness, and the step 12 is integrally formed with the lamp holder 1.
As further shown in fig. 1, the lamp cavity 10 is filled with an encapsulant.
As further shown in fig. 2, the first conductive substrate 2 and the second conductive substrate 3 are provided with through holes 21 for dissipating heat from the bottom of the lamp socket 1.
As further shown in fig. 2, a first step 231 is disposed on the side walls of the first conductive substrate 2 and the second conductive substrate 3, a second step 40 is disposed on the support 4 connected to the first step 231 on the first conductive substrate 2 and the second conductive substrate 3, the side wall of the first step 231 is tightly fitted with the side wall of the support 4, and the side wall of the second step 40 is tightly fitted with the side walls of the first conductive substrate 2 and the second conductive substrate 3.
As further shown in fig. 4, two sides of the bracket 4 are provided with grooves 41, bosses 42 are provided in the grooves 41, and the bosses 42 are integrally formed with the bracket 4.
The working principle is as follows:
installing a first conductive substrate 2 and a second conductive substrate 3 at corresponding positions on a support 4, clamping and matching the first conductive substrate 2 and the second conductive substrate 3 with the support 4, and injection-molding a lamp holder 1 on the first conductive substrate 2 and the second conductive substrate 3, wherein the lamp holder 1 comprises a lamp cavity 10 formed in the middle of the lamp holder 1 and a step 12 formed at the top of the lamp holder 1; the anode of the LED chip is connected to the first conductive substrate 2, the cathode of the LED chip is connected to the second conductive substrate 3, and then the encapsulant (mixed with phosphor) is injected into the lamp cavity 10.
A glue injection step: driving a dispensing device, wherein the dispensing device comprises a plurality of dispensing units, one dispensing unit corresponds to one lamp position, a needle head above each dispensing unit is matched with one lamp cavity 10 dispensing action and is dispensed by the dispensing unit, the dispensing step at least needs one dispensing action, the needle head above each dispensing unit moves downwards to reach the lamp cavity 10, so that the needle head of each dispensing unit injects packaging colloid (mixed with fluorescent powder) into the lamp cavity 10, after the injection, the needle head above the dispensing unit is driven to move upwards to reset to complete the dispensing action of one lamp cavity 10, and then the needle head above each dispensing unit is driven to transversely move one lamp position and execute the next dispensing action.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. It will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, and the scope of protection is still within the scope of the invention.
Claims (9)
1. The utility model provides a single light source LED lamp pearl, includes the support, its characterized in that: the LED lamp comprises a support, and is characterized in that an injection molded lamp holder is arranged on the support, a lamp cavity is arranged in the middle of the lamp holder, an LED wafer is arranged in the lamp cavity, a first conductive substrate and a second conductive substrate are arranged at the bottom of the lamp holder, the bottom of the lamp cavity is communicated with the first conductive substrate and the second conductive substrate, and the first conductive substrate and the second conductive substrate are arranged on the support; the first conductive substrate is connected with the anode of the LED wafer, and the second conductive substrate is connected with the cathode of the LED wafer.
2. The single light source LED lamp bead of claim 1, wherein: the cross section of the bracket is H-shaped.
3. The single light source LED lamp bead of claim 1, wherein: the tail ends of the first conductive substrate and the second conductive substrate are provided with inversions, the inversions are connected with the tail end face of the support, and the bottoms of the first conductive substrate and the second conductive substrate are exposed out of the bottom of the support.
4. The single light source LED lamp bead of claim 1, wherein: the cross sections of the first conductive substrate and the second conductive substrate are in an omega shape.
5. The single light source LED lamp bead of claim 1, wherein: the lamp comprises a lamp cavity and is characterized in that a slope is arranged on the side wall of the lamp cavity, a step for enhancing hardness is arranged at the top of the slope, and the step and the lamp holder are integrally formed.
6. The single light source LED lamp bead of claim 1, wherein: and a packaging colloid is injected into the lamp cavity.
7. The single light source LED lamp bead of claim 1, wherein: and through holes for dissipating heat at the bottom of the lamp holder are formed in the first conductive substrate and the second conductive substrate.
8. The single light source LED lamp bead of claim 1, wherein: the side walls of the first conductive substrate and the second conductive substrate are provided with first steps, the support connected with the first steps on the first conductive substrate and the second conductive substrate is provided with second steps, the side wall of the first step is tightly matched with the side wall of the support, and the side wall of the second step is tightly matched with the side walls of the first conductive substrate and the second conductive substrate.
9. The single light source LED lamp bead of claim 1, wherein: the support is characterized in that grooves are formed in two sides of the support, bosses are arranged in the grooves, and the bosses and the support are integrally formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911164360.4A CN110848583A (en) | 2019-11-25 | 2019-11-25 | Single-light-source LED lamp bead |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911164360.4A CN110848583A (en) | 2019-11-25 | 2019-11-25 | Single-light-source LED lamp bead |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110848583A true CN110848583A (en) | 2020-02-28 |
Family
ID=69604163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911164360.4A Pending CN110848583A (en) | 2019-11-25 | 2019-11-25 | Single-light-source LED lamp bead |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110848583A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203536432U (en) * | 2013-06-08 | 2014-04-09 | 吉安市蓝田伟光电子有限公司 | Photoelectric module of surface-mounted type integrated power LED |
| CN108954201A (en) * | 2018-09-12 | 2018-12-07 | Tcl华瑞照明科技（惠州）有限公司 | LED lamp bead and LED illumination lamp |
| CN208608227U (en) * | 2018-07-24 | 2019-03-15 | 木林森股份有限公司 | LED lamp bead and LED support thereof |
| CN211260383U (en) * | 2019-11-25 | 2020-08-14 | 广东鑫特美科技有限公司 | Single-light-source LED lamp bead |
-
2019
- 2019-11-25 CN CN201911164360.4A patent/CN110848583A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203536432U (en) * | 2013-06-08 | 2014-04-09 | 吉安市蓝田伟光电子有限公司 | Photoelectric module of surface-mounted type integrated power LED |
| CN208608227U (en) * | 2018-07-24 | 2019-03-15 | 木林森股份有限公司 | LED lamp bead and LED support thereof |
| CN108954201A (en) * | 2018-09-12 | 2018-12-07 | Tcl华瑞照明科技（惠州）有限公司 | LED lamp bead and LED illumination lamp |
| CN211260383U (en) * | 2019-11-25 | 2020-08-14 | 广东鑫特美科技有限公司 | Single-light-source LED lamp bead |
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