CN211667614U - LED bulb - Google Patents

Abstract

The utility model relates to the technical field of lamps and lanterns, a LED bulb is provided, include: a glass bulb shell; the at least two light-emitting modules are arranged in the glass bulb shell, and adjacent light-emitting modules are connected in a deformable manner; the light-emitting module comprises an insulating plate and a conductive layer which is formed on one side of the insulating plate in a coating mode, the conductive layer comprises a plurality of base bodies and circuits for bearing LED chips, the base bodies are arranged at intervals, mounting holes are formed in the insulating plate in a penetrating mode and correspond to the base bodies, mounting grooves are formed in the hole walls of the mounting holes and the surfaces of the base bodies, the LED chips are arranged in the mounting grooves, and fillers for packaging the LED chips are arranged in the mounting grooves in a sealing mode; the utility model provides a LED bulb has following advantage: the light mixing effect is good, the service life is long, and the heat dissipation performance is good.

Description

LED bulb

Technical Field

The utility model relates to the technical field of lighting fixtures, more specifically say, relate to a LED bulb.

Background

The realization scheme of the LED bulb in the prior art is mainly two in color mixing or color temperature mixing: 1. the filament-shaped LEDs with different colors or different color temperatures are used for mixing light, so that the purpose of adjusting the color of the LED bulb or the color temperature of the LED bulb is achieved; 2. the surface mounted LEDs (the LEDs packaged by adopting the surface packaging technology) with different colors or different color temperatures are attached to the PCB for light mixing. However, the two above-mentioned implementations have the following problems: 1. in the scheme of mixing light by using the filament-shaped LEDs, the distance between the filament-shaped LEDs is large, the light mixing is not uniform enough, and complicated control cannot be realized due to the limitation of packaging; 2. the light mixing is uniform by using the surface mounted LED, but the inside of the LED bulb is polluted in the process of surface mounting, so that the service life of the light source is short.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a LED bulb to solve the technical problem who mixes the inhomogeneous and easy production of light pollution in the production process that exists among the prior art.

In order to achieve the above object, the utility model adopts the following technical scheme: provided is an LED bulb including:

a glass bulb shell; and

the at least two light-emitting modules are arranged in the glass bulb shell, and the adjacent light-emitting modules are connected in a deformable manner;

the light-emitting module comprises an insulating plate and a conducting layer coated and molded on one side of the insulating plate, the conducting layer comprises a plurality of base bodies and circuits for bearing LED chips, the base bodies are arranged at intervals, mounting holes are formed in the insulating plate in a penetrating mode and correspond to the base bodies, mounting grooves are formed in the hole walls of the mounting holes and the surfaces of the base bodies, the LED chips are arranged in the mounting grooves, and fillers for packaging the LED chips are arranged in the mounting grooves in a sealing mode.

In one embodiment, the light emitted by a plurality of the LED chips comprises at least two colors or color temperatures.

In one embodiment, a deformable bridge member is disposed between the insulating plates of adjacent light emitting modules, and the bridge member electrically connects the conductive layers.

In one embodiment, the conductive layer, the circuit and the bridge are formed by etching the same metal plate after being overmolded on the insulating plate.

In one embodiment, a blocking portion is arranged in the mounting groove, the blocking portion divides the mounting groove into two grooves, the base body is divided into two base body units which are insulated from each other corresponding to the two grooves, the LED chip is arranged in one of the grooves, the LED chip is connected with a first bonding wire, and the first bonding wire is connected to the surface of the base body unit with the bottom of the other groove exposed.

In one embodiment, the LED chip is further connected to a second bonding wire, which is connected to the surface of the base unit exposed at the bottom of the groove where the LED chip is located.

In one embodiment, the mounting grooves form at least two light emitting areas, each light emitting area at least comprises two mounting grooves, and in the same light emitting area, the color or color temperature of at least one LED chip is different from that of other LED chips.

In one embodiment, in different light emitting areas, the LED chips with the same color or the same color temperature are connected in series or in parallel through the circuit.

In one embodiment, each of the light emitting regions includes a red LED, a green LED, a blue LED, and a white LED; or each light emitting area comprises a red light LED, a green light LED, a blue light LED and a white light LED; alternatively, each of the light emitting regions includes a cold white LED and a warm white LED.

In one embodiment, the material of the insulating plate is a white high-reflection plastic plate.

The utility model provides a beneficial effect of LED bulb lies in:

firstly, adjacent light-emitting modules are connected in a deformable manner, can be bent into the shape of a required light source according to requirements, have strong applicability, and can reduce the space occupied by a plurality of light-emitting modules;

secondly, a mounting groove is formed in the insulating plate, the LED chip is arranged in the mounting groove, and a filler for sealing the LED chip is arranged in the mounting groove, so that the LED chip can be effectively prevented from being polluted by harmful gas, and the durability of the LED chip is improved;

thirdly, an insulating plate is formed on one side of the conducting layer in a coating mode, and the insulating plate can play a role in supporting the conducting layer, so that the conducting layer is not prone to falling off from the insulating plate after being processed;

finally, the insulation board is provided with a mounting hole in a penetrating manner, and the mounting hole can be formed simultaneously in the injection molding process, so that the processing efficiency is improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a three-dimensional structure diagram of an LED bulb provided in an embodiment of the present invention;

fig. 2 is an exploded view of an LED light bulb according to an embodiment of the present invention;

fig. 3 is a three-dimensional structure diagram of a light emitting module according to an embodiment of the present invention;

fig. 4 is a rear view of a light emitting module according to an embodiment of the present invention;

fig. 5 is an enlarged view of fig. 3 "a".

The figures are numbered:

a glass bulb (1);

a light emitting module (2); an insulating plate (21); a conductive layer (22); a base (23); a line (24); a mounting hole (25); a bridge (26); a blocking portion (27); a base unit (28);

an LED chip (3); a first bonding wire (31); a second bond wire (32).

Detailed Description

In order to make the technical problem, technical solution and advantageous effects to be solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to illustrate the present invention in further detail. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected or indirectly connected to the other element.

It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the invention, and are not intended to indicate that a device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the invention.

Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating relative importance or as indicating a number of technical features. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise. The following describes the specific implementation of the present invention in more detail with reference to specific embodiments:

as shown in fig. 1 to fig. 3, an embodiment of the present invention provides an LED bulb, including:

the glass bulb shell 1 is of a hollow structure; and at least two light emitting modules 2 disposed in the glass bulb 1, adjacent light emitting modules 2 being connected to each other in a deformable manner, so that the adjacent light emitting modules 2 can be formed into different shapes. The glass bulb 1 can be filled with helium, air or other mixed gas to help the light-emitting module 2 to dissipate heat.

Referring to fig. 3 to 5, the light emitting module 2 includes an insulating plate 21 and a conductive layer 22, the conductive layer 22 is overmolded on one side of the insulating plate 21, and the conductive layer 22 includes a plurality of substrates 23 for carrying the LED chips 3 and a circuit 24. The multiple substrates 23 are arranged at intervals, the circuit 24 is correspondingly connected to the substrates 23, the insulating plate 21 is provided with mounting holes 25 in a penetrating manner at positions corresponding to the substrates 23, and mounting grooves are formed between the hole walls of the mounting holes 25 and the surfaces of the substrates 23. The mounting groove is internally provided with an LED chip 3, and the mounting groove is internally provided with a filler for packaging the LED chip 3 in a sealing manner.

One of the manufacturing methods of the LED bulb of the present embodiment is as follows:

preparing a conductive material such as a metal tape for forming the conductive layer 22; placing the metal material belt into a mold for injection molding, wherein the injection molding component in the mold is resin, and of course, other insulating materials can also be adopted; forming a frame of the light emitting module 2 by injecting an insulating material into a mold to form an insulating plate 21 having a mounting hole 25, one side surface of the metal tape being mostly covered with a resin and the other side surface being mostly exposed; then, etching the exposed part of the metal material belt according to a pre-drawn circuit diagram to form a matrix 23 and a circuit 24, wherein the matrix 23 corresponds to the anode and the cathode of the LED chip 3 respectively; it should be further noted that, the molding of the mounting hole 25 is completed at the same time of injection molding to form the insulating plate 21, and the hole wall of the mounting hole 25 and the surface of the base 23 form a mounting groove for accommodating the LED chip 3; finally, different LED chips 3 are installed in the installation groove, the bonding wires are used for realizing the connection between the LED chips 3 and the base body 23, and finally, fillers such as optical cement are used for packaging the LED chips 3 in the installation groove.

The LED bulb provided by the embodiment has the beneficial effects that:

firstly, adjacent light-emitting modules 2 are connected in a deformable manner, and can be bent into the shape of a required light source according to requirements, so that the applicability is high, and the space occupied by the plurality of light-emitting modules 2 can be reduced. In addition, compared with the traditional filament-shaped LED light source, the LED chip 3 of the light-emitting module 2 is closer in distance, and the light mixing effect is better;

secondly, a mounting groove is formed in the insulating plate 21, the LED chip 3 is arranged in the mounting groove, and a filler for sealing the LED chip 3 is arranged in the mounting groove, so that the LED chip 3 can be effectively prevented from being polluted by harmful gas, and the durability of the LED chip 3 is improved;

thirdly, the insulating plate 21 is formed on one side of the conducting layer 22 in an cladding mode, and the insulating plate 21 can play a role of supporting the conducting layer 22, so that the conducting layer 22 is not easy to fall off from the insulating plate 21 after being processed;

finally, the insulation plate 21 is provided with a mounting hole 25 in a penetrating manner, and the mounting hole 25 can be formed simultaneously in the injection molding process, so that the processing efficiency is improved.

In one embodiment, the light emitted by the plurality of LED chips 3 or packages (the LED chips 3 together with the filling in the mounting grooves constitute a "package") comprises at least two colors or color temperatures. In the present embodiment, the colors or color temperatures of the light emitted by the different LED chips 3 or packages are different, and the colors of the emitted light include red light, blue light, green light, and white light, or include two colors or three colors thereof. Through set up the LED chip 3 that sends two kinds or the light of multiple different colours at light-emitting module 2 to this LED chip 3 that sends different colours light is controlled alone, makes light-emitting module 2 have the function of mixing the light of different colours, thereby light-emitting module 2 has the function of adjusting self luminous colour. Alternatively, the light emitted from the LED package includes a white light with a warm color temperature (for example, 3300K or less) and a white light with a cold color temperature (for example, 5300K or more), and the LED packages emitting white lights with at least two color temperatures are provided in the light emitting module 2, and the LED packages emitting lights with different color temperatures are individually controlled, so that the light emitting module 2 has a function of mixing lights with different color temperatures, and thus the light emitting module 2 has a function of adjusting the color temperature of its own light emission.

It should be further noted that, the so-called "white LED" is not a white LED chip that can emit white light, but a blue (or other short wavelength) LED chip is used, together with an excitation material (such as a phosphor powder doped in the filling material in the mounting groove) to form a "white LED package".

In one embodiment, deformable bridges 26 are disposed between the insulating plates 21 of adjacent light emitting modules 2, and the bridges 26 electrically connect the conductive layers 22. In the present embodiment, the shape of the adjacent light emitting modules 2 can be adjusted by changing the shape of the bridge 26, so that the plurality of light emitting modules 2 can be adjusted in shape after the plurality of light emitting modules 2 are assembled together by changing the shape of the bridge 26. For example, a plurality of light emitting modules 2 are connected end to end in sequence through deformable bridges 26 to form a cylindrical light source; or a plurality of light-emitting modules 2 are connected in sequence to form a Z-shaped light source, and the light source of the embodiment can be changed into various shapes so as to be suitable for glass bulbs 1 with different shapes or different light-emitting requirements.

In this embodiment, bridge 26 electrically connects conductive layer 22. Specifically, the bridge 26 is electrically connected to the wires 24 of the conductive layer 22, the wires 24 are electrically connected to the substrate 23, and the substrate 23 is electrically connected to the LED chips 3, so that the bridge 26 not only has a function of maintaining the deformation of the adjacent light emitting modules 2, but also has a function of electrically connecting the adjacent light emitting modules 2. And then make the integrated level of the light-emitting module 2 higher, help to narrow the volume of the light-emitting module 2 and save the manufacturing material.

In one embodiment, the conductive layer 22, the circuit 24 and the bridge 26 are formed by etching the same metal plate after being overmolded on the insulating plate 21. In the present embodiment, the conductive layer 22, the line 24 and the bridge 26 are formed according to the following principle: the metal plate is placed in a mold for injection molding, one side surface of the metal plate is mostly covered with resin, and the other side surface of the metal plate is mostly exposed to form a frame of the light emitting module 2, the resin is used to form the insulating plate 21, but the resin may be replaced with other insulating materials. After the metal plate is overmolded on the insulating plate 21, the metal plate is etched according to a circuit pattern drawn in advance, thereby forming the conductive layer 22, the wiring 24, and the bridge 26. It can be understood that the insulating plate 21 of the plurality of light emitting modules 2 is first overmolded by a mold, wherein a metal plate is overmolded on the insulating plate 21; then, the conductive layers 22, the lines 24 and the bridges 26 of a plurality of light emitting modules 2 are etched on the same metal plate, so that the insulating plate 21 can be more tightly combined with the conductive layers 22, the lines 24 and the bridges 26; in addition, such a design facilitates the etching process to form the conductive layer 22, the circuit 24 and the bridge 26 at the same time, thereby improving the manufacturing efficiency of the light emitting module 2.

Specifically, the conductive layer 22, the line 24, and the bridge 26 may be formed in a flat shape by etching the same metal plate. It can be understood that the flat conductive layer 22, the circuit 24 and the bridge 26 have a larger surface area, that is, the conductive layer 22, the circuit 24 and the bridge 26 have a larger heat dissipation area, so that the light emitting module 2 has a better heat dissipation performance, which is beneficial to prolonging the service life of the light emitting module 2.

Referring to fig. 5, in one embodiment, a blocking portion 27 is disposed in the mounting groove, the blocking portion 27 divides the mounting groove into two grooves, and the base 23 is divided into two base units 28 insulated from each other corresponding to the two grooves. An LED chip 3 is arranged in one of the grooves, the LED chip 3 is connected with a first bonding wire 31, and the first bonding wire 31 is connected to the surface of the base unit 28 exposed at the bottom of the other groove.

Specifically, the barrier 27 may be formed during injection molding, and the base unit 28 may be formed while etching a metal plate.

Optionally, the LED chip 3 is mounted in two ways:

the first is that the LED chip 3 is connected to the base unit 28 provided with the LED chip 3 by a conductive material, and then electrically connected to the base unit 28 exposed at the bottom of the other groove by a first bonding wire 31 electrically connected to the LED chip 3. The mounting mode can avoid that excessive bonding wires are connected with the LED chip 3, thereby influencing the luminous efficiency of the LED chip 3. In a refinement, the conductive material may be a conductive glue.

In the second mode, the LED chip 3 is further connected with a second bonding wire 32, which is connected to the surface of the base unit 28 exposed at the bottom of the groove where the LED chip 3 is located. The LED chip 3 is connected with the base unit 28 provided with the LED chip 3 through an insulating material, the LED chip 3 is electrically connected with the base unit 28 of the groove where the LED chip 3 is located through a second bonding wire 32, and meanwhile, the LED chip 3 is electrically connected with the base unit 28 of the other groove through a first bonding wire 31. Finely, the insulating material is insulating glue.

It can be understood that the LED chip 3 does not need to be fixed on the conductive layer by soldering, so that harmful vapor released during soldering is prevented from remaining in the glass bulb 1, and the service life of the LED chip 3 is prolonged.

In one embodiment, the thickness of the conductive layer 22 is greater than the thickness of copper foil conventionally used to form circuits, and thus the conductive layer 22 has better thermal conductivity and mechanical strength than conventional copper foil.

In one embodiment, the surface of the conductive layer 22 within the mounting slot is provided with a silver layer. It is understood that the light reflectivity of the light emitting module 2 can be enhanced and the bonding yield of the bonding wires can be improved by providing the silver layer.

Specifically, a silver layer is disposed on the conductive layer 22 in an electroplating manner.

In one embodiment, the material of the insulating plate 21 is a white high reflective plastic plate (e.g., a material with a reflectivity of greater than 85%, or even greater than 95%). It can be understood that the white high-reflection plastic plate enables the wall of the mounting groove formed by the insulating plate 21 to have high reflectivity, and the LED chip 3 is disposed in the mounting groove formed by the material to increase the light emitting efficiency.

In one embodiment, in one light emitting module 2, the plurality of mounting grooves form at least two light emitting areas, each light emitting area at least comprises two mounting grooves, and in the same light emitting area, the color or color temperature of at least one LED chip 3 is different from that of other LED chips 3. In the present embodiment, the same light emitting region includes LED chips 3 with different colors or color temperatures, and the color or color temperature of light emitted by the same light emitting region can be adjusted by individually controlling the LED chips 3 with different colors or color temperatures.

Optionally, the layouts of the LED chips 3 in different light emitting areas may be the same or different, and when the layouts of the LED chips 3 in different light emitting areas are different, the adjustable range of the light emitted by the light emitting module 2 may be larger.

In one embodiment, the LED chips 3 of the same color or color temperature in different light emitting areas are connected in series or in parallel by the line 24. It can be understood that the LED chips 3 with the same color or color temperature in different light emitting areas are connected in series through the line 24, so as to conveniently and synchronously control the LED chips 3 with the same color or color temperature in different light emitting areas to emit light; when the LED chips 3 with the same color or color temperature in different light emitting areas are connected in parallel through the circuit 24, the LED chips 3 with the same color or color temperature in different light emitting areas can be conveniently and independently controlled to emit light.

In one embodiment, each light emitting region includes 4 grooves in which a red LED, a green LED, a blue LED, and a white LED are disposed, respectively. In this embodiment, the light emitting color in each light emitting area can be controlled by individually controlling the light emission of the red LED, the green LED, the blue LED and the white LED, so that the user can obtain the desired light emitting color of the light emitting module 2.

Specifically, the mounting groove where the white light LED is located is packaged by fluorescent powder, so that the white light LED emits white light; and the mounting grooves of the red light LED, the green light LED and the blue light LED are packaged by using optical glue without fluorescent powder, and the red light LED, the green light LED and the blue light LED emit light with different colors. The lights can be mixed uniformly in a close distance to form white light of different hues. Of course, the red LED or the green LED may also be a blue LED for exciting the red or green phosphor to emit light, respectively.

In one embodiment, each light emitting region includes 3 grooves in which a red LED, a green LED, and a blue LED are disposed, respectively. The red LED, the green LED and the blue LED chips can be controlled to emit red, green and blue light independently.

In one embodiment, each light emitting region contains 2 grooves corresponding to warm white LEDs and cold white LEDs, respectively, the color temperature of the light being controlled by controlling the current of the warm white LEDs and the cold white LEDs.

The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims (10)

1. An LED bulb, comprising:

a glass bulb (1); and

at least two light-emitting modules (2) arranged in the glass bulb shell (1), wherein the adjacent light-emitting modules (2) are connected in a deformable manner;

the LED light-emitting module is characterized in that the light-emitting module (2) comprises an insulating plate (21) and a conducting layer (22) which is formed on one side of the insulating plate (21) in a coating mode, the conducting layer (22) comprises a plurality of base bodies (23) used for bearing LED chips (3) and a circuit (24), the base bodies (23) are arranged at intervals, a mounting hole (25) penetrates through the position, corresponding to the base body (23), of the insulating plate (21), a mounting groove is formed in the hole wall of the mounting hole (25) and the surface of the base body (23), the LED chips (3) are arranged in the mounting groove, and fillers for packaging the LED chips (3) are arranged in the mounting groove in a sealing mode.

2. The LED bulb according to claim 1, characterized in that the light emitted by a plurality of said LED chips (3) comprises at least two colors or color temperatures.

3. LED bulb according to claim 1, characterized in that deformable bridges (26) are provided between the insulating plates (21) of adjacent light modules (2), said bridges (26) electrically connecting the conductive layers (22).

4. The LED bulb according to claim 3, wherein the conductive layer (22), the lines (24) and the bridges (26) are formed by etching the same metal plate after being overmolded on the insulating plate (21).

5. The LED light bulb according to claim 1, wherein a blocking portion (27) is disposed in the mounting groove, the blocking portion (27) divides the mounting groove into two grooves, the base body (23) is divided into two base body units (28) insulated from each other corresponding to the two grooves, the LED chip (3) is disposed in one of the grooves, the LED chip (3) is connected with a first bonding wire (31), and the first bonding wire (31) is connected to a surface of the base body unit (28) exposed from the bottom of the other groove.

6. The LED bulb as claimed in claim 5, wherein the LED chip (3) is further connected with a second bonding wire (32) connected to the surface of the base unit (28) exposed from the bottom of the groove where the LED chip (3) is located.

7. The LED bulb as claimed in claim 1, wherein a plurality of the mounting grooves constitute at least two light emitting areas, each light emitting area includes at least two mounting grooves, and at least one LED chip (3) is different from other LED chips (3) in color or color temperature in the same light emitting area.

8. The LED bulb according to claim 7, characterized in that the LED chips (3) of the same color or color temperature in different light emitting areas are connected in series or in parallel by the line (24).

9. The LED bulb of claim 7, wherein each of the light emitting regions comprises a red LED, a green LED, a blue LED; or each light emitting area comprises a red light LED, a green light LED, a blue light LED and a white light LED; alternatively, each of the light emitting regions includes a cold white LED and a warm white LED.

10. The LED bulb according to any of claims 1 to 9, characterized in that the material of the insulating plate (21) is a white highly reflective plastic plate.

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