CN211789000U - High-power LED lamp bracket and light-emitting device - Google Patents
High-power LED lamp bracket and light-emitting device Download PDFInfo
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- CN211789000U CN211789000U CN202020161498.0U CN202020161498U CN211789000U CN 211789000 U CN211789000 U CN 211789000U CN 202020161498 U CN202020161498 U CN 202020161498U CN 211789000 U CN211789000 U CN 211789000U
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- led lamp
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Abstract
The utility model discloses a high-power LED lighting fixture and luminescent device, wherein, high-power LED lighting fixture includes: the upper end surface of the metal base is divided into a plurality of bosses through the first grooves, and the upper end surfaces of the bosses are provided with mounting planes for mounting the LED chips; the cup-shaped structure is formed outside the metal base in an injection molding mode, the upper end face of the cup-shaped structure is higher than the mounting plane, and the middle of the upper end of the cup-shaped structure is provided with an opening exposing the mounting plane. The utility model has the advantages that the upper end surface of the metal base is provided with a plurality of independent bosses, each boss is separated from each other through the first groove, the luminous effect of each independent lamp bead on the LED chip is better, the process is simple, and the production and the manufacture are convenient; and each independent boss area can be coated with fluorescent powder with different proportions, so that the blue light chip can excite spectrums with different colors. Meanwhile, the upper end face of the metal base is divided into a plurality of bosses, so that the problem of mixing of fluorescent powder with different proportions is solved, and the light-color consistency is improved more effectively.
Description
Technical Field
The utility model relates to a lighting device especially relates to a high-power LED lighting fixture and luminescent device.
Background
The LED has the outstanding advantages of long service life, low energy consumption, small volume, quick response, shock resistance, low temperature resistance, small pollution and the like, is called as a fourth-generation lighting source or a green light source, becomes another marked leap after incandescent lamps and fluorescent lamps in the human lighting history, brings about a new elimination revolution, and puts new and higher requirements on optical, thermal, electrical and mechanical structures of packaging and the like along with continuous innovation and breakthrough of high-efficiency energy-saving technology along with the increase of chip power, particularly the development requirement of solid-state lighting technology. The high-power LED refers to a light-emitting diode with large rated working power. The power of a common LED is generally 0.05W, the working current is 20mA, while the power of a high-power LED can reach 1W, 2W or even tens of watts, and the working current can be dozens of milliamperes to hundreds of milliamperes.
The modern LED packaging industry develops towards the application trend of realizing large-scale production, reducing cost, having flexible design and smaller size and meeting the requirements of light weight, thinness, high integration and small volume of products. Although the existing structure can achieve the effect of exciting different color spectrums by coating fluorescent powder with different proportions, because the support structure is unreasonable, the whole metal is adopted as the base, the fluorescent powder with different proportions can be mixed, the light emitting effect of the LED lamp bead is reduced, and the light and color consistency is influenced. Therefore, it is necessary to provide a high power bracket with low production cost, reasonable structural design, low processing cost, good heat dissipation performance, good light gathering performance and stable quality.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to solve one of the technical problem that exists among the prior art at least, provide a light colour uniformity higher, the light-emitting rate is better, LED life is longer high-power LED lighting fixture and luminescent device.
According to the utility model discloses an embodiment of the first aspect provides a high-power LED lighting fixture, include:
the upper end surface of the metal base is divided into a plurality of bosses through the first grooves, and the upper end surfaces of the bosses are provided with mounting planes for mounting the LED chips;
the cup-shaped structure is formed outside the metal base in an injection molding mode, the upper end face of the cup-shaped structure is higher than the mounting plane, and the middle of the upper end of the cup-shaped structure is provided with an opening exposing the mounting plane.
According to the utility model discloses high-power LED lighting fixture, still including passing a plurality of roots that the cup type lateral wall extends to the opening and be used for the pin of electricity to be connected, a boss corresponds two pins.
According to the utility model discloses high-power LED lighting fixture, the thickness of pin is 0.1mm ~ 2.0mm, metal base's thickness is 0.1mm ~ 3.0 mm.
According to the utility model discloses high-power LED lighting fixture, the cross sectional shape of first recess is triangle-shaped, circular or rectangle.
According to the utility model discloses high-power LED lighting fixture, the open-ended lateral wall is provided with annular boss, form annular space between annular boss and the opening diapire.
According to the utility model discloses high-power LED lighting fixture, open-ended lateral wall interval is provided with the second recess that is used for pouring into encapsulating material.
According to the utility model discloses a second aspect embodiment provides a light emitting device, including aforementioned high-power LED lighting fixture and a plurality of LED chip, the LED chip passes through the fluorescent glue to be fixed at the mounting plane, the fluorescent glue covers the illuminating part of LED chip at least, lens are installed to the opening, through packaging material layer encapsulation between lens and the cup type.
According to the light emitting device of the second aspect of the present invention, the fluorescent glue covers the boss partially or entirely.
According to the light emitting device of the embodiment of the second aspect of the present invention, the power of the LED chip is 1W-5W.
According to the utility model discloses light emitting device of second aspect embodiment, LED chip and mounting plane directly lay the conductive silver glue.
The utility model has the advantages that: the utility model has the advantages that the upper end surface of the metal base is provided with a plurality of independent bosses, each boss is separated from each other through the first groove, the luminous effect of each independent lamp bead on the LED chip is better, the process is simple, and the production and the manufacture are convenient; and each independent boss area can be coated with fluorescent powder with different proportions, so that the blue light chip can excite spectrums with different colors. Meanwhile, the upper end face of the metal base is divided into a plurality of bosses, so that the problem of mixing of fluorescent powder with different proportions is solved, and the light-color consistency is improved more effectively. In addition, the conductive silver adhesive is used between the LED chip and the conductive base of the LED bracket, so that the heat dissipation performance is greatly improved, and the light emitting quality and the service life of the LED chip are more stable.
Drawings
In order to more clearly illustrate the technical solution in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly described below. It is clear that the described figures represent only some embodiments of the invention, not all embodiments, and that a person skilled in the art can also derive other designs and figures from these figures without inventive effort.
Fig. 1 is a structural view of a light emitting device in an embodiment of the present invention;
fig. 2 is a cross-sectional view of a light emitting device in an embodiment of the invention;
fig. 3 is an isometric view of a high power LED light fixture in an embodiment of the invention;
fig. 4 is a front view of a high power LED lamp holder according to an embodiment of the present invention;
fig. 5 is a back view of a high power LED lamp holder according to an embodiment of the present invention;
fig. 6 is a left side view of a high power LED lamp holder according to an embodiment of the present invention;
fig. 7 is a left side view of a metal base in an embodiment of the invention;
fig. 8 is a sectional view of a high-power LED lamp bracket according to an embodiment of the present invention.
Detailed Description
This section will describe in detail the embodiments of the present invention, preferred embodiments of the present invention are shown in the attached drawings, which are used to supplement the description of the text part of the specification with figures, so that one can intuitively and vividly understand each technical feature and the whole technical solution of the present invention, but they cannot be understood as the limitation of the protection scope of the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship indicated with respect to the orientation description, such as up, down, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, a plurality of means are one or more, a plurality of means are two or more, and the terms greater than, less than, exceeding, etc. are understood as not including the number, and the terms greater than, less than, within, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless there is an explicit limitation, the words such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in combination with the specific contents of the technical solution.
Referring to fig. 1 to 8, a light emitting device includes a high power LED lamp holder, a lens 6 and a plurality of LED chips 7, wherein, as shown in fig. 3 to 8, the high power LED lamp holder includes a metal base 3 and a cup shape 2, the upper end surface of the metal base 3 is divided into 4 bosses by a first groove 4, and the upper end surface of the boss has a mounting plane for mounting the LED chips 7; the cup type 2 is formed outside the metal base 3 in an injection molding mode, the upper end face of the cup type 2 is higher than the mounting plane, and the middle of the upper end of the cup type 2 is provided with an opening exposing the mounting plane. The LED chip 7 is fixed on the mounting plane through the fluorescent glue 5, namely the LED chip 7 is respectively mounted on each boss, certainly, the anode and the cathode of the LED chip 7 are directly or indirectly exposed outside the fluorescent glue 5, the fluorescent glue 5 at least covers the light emitting part of the LED chip 7, the lens 6 is mounted at the opening, the lower end face of the lens 6 is in press contact with the cup-shaped 2, and the lens 6 and the cup-shaped 2 are packaged through the packaging material layer. Specifically, the processing technology of the cup type 2 is injection molding or extrusion molding, and the cup type 2 material is PPA or PA46 plastic. The metal base 3 is made of copper, aluminum or other metal having high electrical and thermal conductivity. The thermal conductivity of the metal base 3 is 200-500W/(m.K). The packaging material is high-transparency material such as epoxy resin, polycarbonate, polymethyl methacrylate, glass, organosilicon material and the like. The lens 6 is made of transparent materials such as silica gel, PMMA, PC, optical glass materials and the like.
Preferably, the upper end surface of the metal base 3 may be further divided into 6 or 8 bosses by the first groove 4.
The utility model discloses the up end of the metal base 3 of support is a plurality of independent bosss, and the experiment proves, compares for holistic LED support with metal base 3 on the market, and the phosphor powder of different ratios can not take place to mix man-hour respectively on the boss of difference, influences the phosphor powder and gets shaping control accuracy. Each fluorescent powder realizes shaping and quantification, so that the blue light chip can excite spectrums with different colors, the light-color consistency is effectively improved, and the light-emitting quality is good.
In some embodiments, after the fluorescent glue 5 completely covers the light emitting part of the LED chip 7 during processing, the fluorescent glue 5 may partially or completely cover the mounting surface of the boss as required, so as to save the amount of the fluorescent glue 5 and reduce the production cost.
In some embodiments, the power of the LED chip 7 is 1W-5W. The LED chip 7 belongs to a high-power LED lamp.
In some embodiments, LED chip 7 and mounting plane directly lay conductive silver glue, conductive silver glue makes the utility model discloses a heat dispersion obtains very big promotion for LED chip 7's luminous quality and life are more stable.
In some embodiments, a plurality of pins 1 for electrical connection are included, extending through the sidewall of the cup 2 into the opening, one boss for each of the two pins 1. Before the fluorescent glue 5 fixes the LED chip 7, the anode and the cathode of the LED chip 7 are connected with the corresponding pins 1 through connecting wires. After the fluorescent glue 5 fixes the LED chip 7, the fluorescent glue 5 covers the connection between the connection lead and the positive electrode or the negative electrode.
In some embodiments, the thickness of the lead 1 is 0.1mm to 2.0mm, and the thickness of the metal base 3 is 0.1mm to 3.0 mm. The integral thickness of the high-power LED lamp holder is 1.0-5.0 mm.
In some embodiments, the cross-sectional shape of the first groove 4 is triangular, circular or rectangular.
In some embodiments, the side wall of the opening is provided with an annular boss forming an annular space between the annular boss and the bottom wall of the opening. When the lens 6 is installed, the edge of the lens 6 is clamped in the annular space, and then the encapsulation is realized by pouring encapsulation material.
In some embodiments, the sidewall of the opening is spaced apart by a second groove for potting the potting material. The second groove plays a guiding role in installation, the lens 6 is rotated, so that the small hole of the lens 6 is positioned in the second groove, and the filling is realized by filling the packaging material through the small hole of the lens 6.
While the preferred embodiments of the present invention have been described in detail, it will be understood by those skilled in the art that the invention is not limited to the details of the embodiments shown, but is capable of various modifications and substitutions without departing from the spirit of the invention.
Claims (10)
1. A high-power LED lamp holder is characterized by comprising:
the upper end surface of the metal base is divided into a plurality of bosses through the first grooves, and the upper end surfaces of the bosses are provided with mounting planes for mounting the LED chips;
the cup-shaped structure is formed outside the metal base in an injection molding mode, the upper end face of the cup-shaped structure is higher than the mounting plane, and the middle of the upper end of the cup-shaped structure is provided with an opening exposing the mounting plane.
2. The high power LED lamp holder according to claim 1, wherein: the connector also comprises a plurality of pins which penetrate through the cup-shaped side wall and extend into the opening for electric connection, and one boss corresponds to two pins.
3. The high power LED fixture of claim 2, wherein: the thickness of the pin is 0.1 mm-2.0 mm, and the thickness of the metal base is 0.1 mm-3.0 mm.
4. The high power LED lamp holder according to claim 1, wherein: the cross-sectional shape of the first groove is triangular, circular or rectangular.
5. The high power LED lamp holder according to claim 1, wherein: the lateral wall of the opening is provided with an annular boss, and an annular space is formed between the annular boss and the bottom wall of the opening.
6. The high power LED lamp holder according to claim 1, wherein: and second grooves for pouring packaging materials are arranged on the side walls of the openings at intervals.
7. A light emitting device, characterized in that: the high-power LED lamp holder comprises the high-power LED lamp holder as claimed in any one of claims 1 to 6 and a plurality of LED chips, wherein the LED chips are fixed on a mounting plane through fluorescent glue, the fluorescent glue at least covers a light emitting part of the LED chips, the opening is provided with a lens, and the lens and the cup-shaped part are packaged through a packaging material layer.
8. The light-emitting device according to claim 7, wherein: the fluorescent glue partially or completely covers the boss.
9. The light-emitting device according to claim 7, wherein: the power of the LED chip is 1W-5W.
10. The light-emitting device according to claim 7, wherein: and the LED chip and the mounting plane are directly laid with conductive silver adhesive.
Priority Applications (1)
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CN202020161498.0U CN211789000U (en) | 2020-02-11 | 2020-02-11 | High-power LED lamp bracket and light-emitting device |
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CN202020161498.0U CN211789000U (en) | 2020-02-11 | 2020-02-11 | High-power LED lamp bracket and light-emitting device |
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