CN110864233A - LED lamp bead - Google Patents
LED lamp bead Download PDFInfo
- Publication number
- CN110864233A CN110864233A CN201911164369.5A CN201911164369A CN110864233A CN 110864233 A CN110864233 A CN 110864233A CN 201911164369 A CN201911164369 A CN 201911164369A CN 110864233 A CN110864233 A CN 110864233A
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- CN
- China
- Prior art keywords
- lamp
- conductive substrate
- led
- led lamp
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011324 bead Substances 0.000 title claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 51
- 230000017525 heat dissipation Effects 0.000 claims abstract description 17
- 238000002347 injection Methods 0.000 claims abstract description 5
- 239000007924 injection Substances 0.000 claims abstract description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 239000000084 colloidal system Substances 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000002349 favourable effect Effects 0.000 abstract description 2
- 238000009434 installation Methods 0.000 abstract description 2
- 230000002035 prolonged effect Effects 0.000 abstract description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 239000003292 glue Substances 0.000 description 3
- 230000015271 coagulation Effects 0.000 description 2
- 238000005345 coagulation Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses an LED lamp bead which comprises a conductive substrate, wherein an injection molded lamp holder is arranged above the conductive substrate, the lamp holder is fixed on the conductive substrate, a lamp cavity is arranged in the middle of the lamp holder, an LED wafer is arranged in the lamp cavity, and a heat dissipation base is arranged at the bottom of the conductive substrate. The bottom of the conductive substrate is provided with the buckle, the buckle is connected with the radiating substrate in a clamping manner, so that the installation and the replacement are convenient, the manufacturing cost is reduced, meanwhile, the whole bottom of the conductive substrate is connected with the radiating substrate, the quick radiating of the conductive substrate is facilitated, the problem that the LED chip is damaged due to the slow radiating of the conductive substrate is solved, and the service life of a product is prolonged; set up the lamp chamber of slope type and strengthen the step, when applying the lamp and taking, be favorable to the even scattering of light, strengthen the intensity of the atress of product simultaneously, appear cutting and the problem of deformation when having avoided the product to apply the lamp to take.
Description
Technical Field
The invention relates to the technical field of lighting lamps, in particular to an LED lamp bead.
Background
The LED lamp beads are English abbreviation LEDs of the light emitting diodes, the LED lamp beads use low-voltage power supplies, the power supply voltage is between two and four volts, and the power supply voltage is different according to different products, so that the LED lamp beads are driven to be high-voltage power supplies; safer power supply, especially suitable for public places. The consumed energy is reduced by eighty percent compared with an incandescent lamp with the same luminous efficiency, and each unit LED small piece is a square of 3-5 mm, so that the LED lamp can be prepared into devices with various shapes and is suitable for a variable environment. The existing LED lighting lamp in the market at home and abroad at present, the lamp bead, power to the lamp body are an integral structure, because the lamp bead of the existing LED lamp adopts the positive and negative ends of the lamp bead to be welded on the front of the aluminum substrate, the aluminum substrate is welded with the power wire, the reverse side of the aluminum substrate is contacted with the inner plate of the lamp holder (lamp body) by coating heat-conducting coagulation slurry such as silicone grease and the like when the LED lamp is installed, the manufacturing process is complicated, and the integral LED lamp can not be used and is completely scrapped if a light-emitting diode (LED) or a small element is damaged, while the cost of the aluminum substrate accounts for a considerable proportion in the whole LED lamp, thereby causing great waste of materials and leading the price of the LED lamp to be always high; meanwhile, the efficiency of the LED lamp is easily affected by high temperature and sharply decreases, more heat is generated after electricity is wasted, the temperature is further increased, vicious circle is easily formed, the service life of the LED is shortened besides electricity is wasted, good heat dissipation has great driving force for popularization and application of the LED lamp, and the heat dissipation effect of the existing LED lamp bead is not ideal when the aluminum substrate is used as an electric substrate and heat is dissipated through the coated heat conduction coagulation slurry.
And the LED lamp beads of a part of models are not perfect in design, compared with the conventional 5050RGB and 5054RGB lamp beads on the market, the LED lamp is large in hardware and plastic consumption, large in filling glue amount, large in inner surface coating area, high in product silver plating cost, insufficient in integral support strength, and prone to deformation or breakage. When installing on the lamp area of certain length, the density and the degree of consistency of design are low, have influenced the luminance of LED lamp and the degree of consistency that different colours LED lamp were luminous, and do not arrange module and base plate well, make resistance, lamp pearl and other subassembly overall arrangement unreasonable, lead to the product uneven heat dissipation, have reduced the life of product.
Disclosure of Invention
The invention aims to solve the technical problem of providing an LED lamp bead, which solves the problems that the service life of a product is influenced due to poor heat dissipation performance of the conventional LED lamp bead, the product is inconvenient to install and replace, the manufacturing cost is high, and the uniformity of light is influenced due to uneven layout when the conventional LED lamp bead is applied to a lamp strip.
In order to solve the technical problems, the invention adopts the technical scheme that:
the utility model provides a LED lamp pearl, includes conductive substrate, conductive substrate's top is provided with injection moulding's lamp stand, the lamp stand is fixed in on the conductive substrate, be provided with the lamp chamber in the middle of the lamp stand, be provided with the LED wafer in the lamp chamber, conductive substrate's middle part is provided with the filling glue center, the filling glue central point is arranged in the lamp chamber bottom, be provided with the conducting block in the filling glue center, the LED wafer is connected with the conducting block, conducting block and conductive substrate integrated into one piece, conductive substrate's bottom is provided with the heat dissipation base.
Furthermore, buckles are arranged on two sides of the bottom of the conductive substrate and clamped at the bottom of the heat dissipation base.
Further, the bottom both sides of heat dissipation base are provided with the recess of cooperation buckle joint.
Further, the number of buckles is 6.
Further, the number of the grooves is 6.
Furthermore, a packaging colloid is injected into the lamp cavity.
Further, the side wall of the lamp cavity is provided with a slope which is easy to scatter light, the top of the slope is provided with a step for enhancing hardness, and the step and the lamp holder are integrally formed.
The invention has the beneficial effects that:
the bottom of the conductive substrate is provided with the buckle, the buckle is connected with the radiating substrate in a clamping manner, so that the installation and the replacement are convenient, the manufacturing cost is reduced, meanwhile, the whole bottom of the conductive substrate is connected with the radiating substrate, the quick radiating of the conductive substrate is facilitated, the problem that the LED chip is damaged due to the slow radiating of the conductive substrate is solved, and the service life of a product is prolonged; set up the lamp chamber of slope type and strengthen the step, when applying the lamp and taking, be favorable to the even scattering of light, strengthen the intensity of the atress of product simultaneously, appear cutting and the problem of deformation when reducing the product and applying the lamp and taking.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is an exploded view of the present invention;
FIG. 3 is a schematic structural diagram of a conductive substrate according to the present invention;
fig. 4 is a schematic structural diagram of the heat dissipation base of the present invention.
In the figure: 1-conductive substrate, 10-fastener, 11-conductive block, 2-lamp holder, 20-lamp cavity, 21-slope, 22-step, 3-heat dissipation base and 30-groove.
Detailed Description
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Referring to fig. 1-4, in the embodiment of the invention, an LED lamp bead includes a conductive substrate 1, an injection molded lamp holder 2 is disposed above the conductive substrate 1, the lamp holder 2 is fixed on the conductive substrate 1, a lamp cavity 20 is disposed in the middle of the lamp holder 2, an LED chip is disposed in the lamp cavity 20, a filling adhesive center is disposed in the middle of the conductive substrate 1, the filling adhesive center is disposed at the bottom of the lamp cavity 20, a conductive block 11 is disposed in the filling adhesive center, the LED chip is connected to the conductive block 11, the conductive block 11 and the conductive substrate 1 are integrally formed, and a heat dissipation base 3 is disposed at the bottom of the conductive substrate 1.
As further shown in fig. 3, two sides of the bottom of the conductive substrate 1 are provided with fasteners 10, and the fasteners 10 are fastened to the bottom of the heat dissipation base 3.
As further shown in fig. 4, grooves 30 for engaging with the fasteners 10 are disposed on two sides of the bottom of the heat dissipation base 3.
As further shown in fig. 3, the number of the clasps 10 is 6.
As further shown in fig. 4, the number of grooves 30 is 6.
As further shown in fig. 1, the side wall of the lamp cavity 20 is provided with a slope 21 which is easy to scatter light, the top of the slope 21 is provided with a step 22 which enhances the hardness, and the step 22 is integrally formed with the lamp holder 2.
The working principle is as follows:
the method comprises the following steps of injection molding a lamp holder 2 on a conductive substrate 1, wherein the lamp holder 2 comprises a lamp cavity 20 formed in the middle of the lamp holder 2 and a step 22 formed at the top of the lamp holder 2, mounting a heat dissipation substrate 3 on the conductive substrate 1, and clamping and matching a buckle 10 at the bottom of the conductive substrate 1 with a groove 30 at the bottom of the heat dissipation substrate 3; after the LED chip is connected to the conductive bumps 11 on the conductive substrate 1, the encapsulant (mixed with phosphor) is injected into the lamp cavity 20.
A glue injection step: the driving of the dispensing equipment comprises a plurality of dispensing units, one dispensing unit corresponds to one lamp position, the needle head above each dispensing unit is matched with one lamp cavity 20 dispensing action and is used for dispensing, the dispensing step is performed at least once, the needle head above each dispensing unit moves downwards to reach the lamp cavity 20, the needle head of each dispensing unit injects the packaging colloid (mixed with fluorescent powder) into the lamp cavity 20, after the injection, the needle head above the dispensing unit is driven to move upwards to reset to complete the dispensing action of one lamp cavity 20, and then the needle head above each dispensing unit is driven to move transversely to one lamp position and execute the next dispensing action.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. It will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, and the scope of protection is still within the scope of the invention.
Claims (7)
1. The utility model provides a LED lamp pearl, includes conductive substrate, its characterized in that: the LED lamp comprises a conductive substrate and is characterized in that an injection molded lamp holder is arranged above the conductive substrate, the lamp holder is fixed on the conductive substrate, a lamp cavity is arranged in the middle of the lamp holder, an LED wafer is arranged in the lamp cavity, a filling adhesive center is arranged in the middle of the conductive substrate and is arranged at the bottom of the lamp cavity, a conductive block is arranged on the filling adhesive center, the LED wafer is connected with the conductive block, the conductive block and the conductive substrate are integrally molded, and a heat dissipation base is arranged at the bottom of the conductive substrate.
2. The LED lamp bead of claim 1, wherein: the bottom both sides of electrically conductive base plate are provided with the buckle, the buckle joint is in the bottom of heat dissipation base.
3. The LED lamp bead of claim 2, wherein: the bottom both sides of heat dissipation base are provided with the recess of cooperation buckle joint.
4. The LED lamp bead of claim 2, wherein: the number of the buckles is 6.
5. The LED lamp bead of claim 3, wherein: the number of the grooves is 6.
6. The LED lamp bead of claim 1, wherein: and a packaging colloid is injected into the lamp cavity.
7. The LED lamp bead of claim 1, wherein: the lamp comprises a lamp cavity and is characterized in that a slope is arranged on the side wall of the lamp cavity, a step is arranged at the top of the slope, and the step and a lamp holder are integrally formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911164369.5A CN110864233A (en) | 2019-11-25 | 2019-11-25 | LED lamp bead |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911164369.5A CN110864233A (en) | 2019-11-25 | 2019-11-25 | LED lamp bead |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110864233A true CN110864233A (en) | 2020-03-06 |
Family
ID=69655859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911164369.5A Pending CN110864233A (en) | 2019-11-25 | 2019-11-25 | LED lamp bead |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110864233A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201858543U (en) * | 2010-08-26 | 2011-06-08 | 蔡新传 | Light body structure capable of facilitating replacement of LED (light-emitting diode) lamp |
| CN103840060A (en) * | 2012-11-26 | 2014-06-04 | 梁建忠 | LED support and LED |
| CN103883995A (en) * | 2014-03-28 | 2014-06-25 | 木林森股份有限公司 | COB lamp bead easy to assemble, support used for lamp bead, method for manufacturing lamp bead and easily-assembled LED module |
| CN204332956U (en) * | 2014-12-30 | 2015-05-13 | 木林森股份有限公司 | A kind of dual-colored LED lamp pearl and the light bar based on this lamp pearl |
| CN107516706A (en) * | 2016-06-17 | 2017-12-26 | 深圳市斯迈得半导体有限公司 | A kind of anti-vulcanization and halogenation and the LED light source with anti-oxidation function |
| CN207364799U (en) * | 2017-11-01 | 2018-05-15 | 山东华方智联科技股份有限公司 | The substrate and board device of LED light |
| CN208139228U (en) * | 2018-04-24 | 2018-11-23 | 深圳市联胜和照明股份有限公司 | A kind of large-power LED light bead radiator structure based on COB encapsulation |
-
2019
- 2019-11-25 CN CN201911164369.5A patent/CN110864233A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201858543U (en) * | 2010-08-26 | 2011-06-08 | 蔡新传 | Light body structure capable of facilitating replacement of LED (light-emitting diode) lamp |
| CN103840060A (en) * | 2012-11-26 | 2014-06-04 | 梁建忠 | LED support and LED |
| CN103883995A (en) * | 2014-03-28 | 2014-06-25 | 木林森股份有限公司 | COB lamp bead easy to assemble, support used for lamp bead, method for manufacturing lamp bead and easily-assembled LED module |
| CN204332956U (en) * | 2014-12-30 | 2015-05-13 | 木林森股份有限公司 | A kind of dual-colored LED lamp pearl and the light bar based on this lamp pearl |
| CN107516706A (en) * | 2016-06-17 | 2017-12-26 | 深圳市斯迈得半导体有限公司 | A kind of anti-vulcanization and halogenation and the LED light source with anti-oxidation function |
| CN207364799U (en) * | 2017-11-01 | 2018-05-15 | 山东华方智联科技股份有限公司 | The substrate and board device of LED light |
| CN208139228U (en) * | 2018-04-24 | 2018-11-23 | 深圳市联胜和照明股份有限公司 | A kind of large-power LED light bead radiator structure based on COB encapsulation |
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