CN207364799U - The substrate and board device of LED light - Google Patents
The substrate and board device of LED light Download PDFInfo
- Publication number
- CN207364799U CN207364799U CN201721441495.7U CN201721441495U CN207364799U CN 207364799 U CN207364799 U CN 207364799U CN 201721441495 U CN201721441495 U CN 201721441495U CN 207364799 U CN207364799 U CN 207364799U
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- Prior art keywords
- substrate
- led light
- buckle
- heat dissipation
- substrate body
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- 239000000758 substrate Substances 0.000 title claims abstract description 125
- 230000017525 heat dissipation Effects 0.000 claims abstract description 52
- 239000005030 aluminium foil Substances 0.000 claims abstract description 31
- 238000009413 insulation Methods 0.000 claims abstract description 21
- 229910010293 ceramic material Inorganic materials 0.000 claims abstract description 7
- 238000012544 monitoring process Methods 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 9
- 239000012528 membrane Substances 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000000741 silica gel Substances 0.000 claims description 6
- 229910002027 silica gel Inorganic materials 0.000 claims description 6
- 238000000605 extraction Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 14
- 239000011324 bead Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- 229920002799 BoPET Polymers 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 230000032683 aging Effects 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 206010019233 Headaches Diseases 0.000 description 2
- 241001465382 Physalis alkekengi Species 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 231100000869 headache Toxicity 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000003205 fragrance Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model provides the substrate and board device of LED light, including the substrate body of ceramic material, insulation glue-line and aluminium foil；The upper surface of substrate body is provided with the aluminium foil for heat dissipation, and some insulation glue-lines are provided with aluminium foil, and circuit and light emitting diode are provided with the glue-line that insulate.The utility model solves the problem of LED substrate heat dissipation effect is poor, and radiating rate is not high, and the service life of LED lamp is effectively ensured, and light-weight and endurance strength is big.
Description
Technical field
Technical field of lamps is the utility model is related to, more particularly, to the substrate and board device of LED light.
Background technology
The heat dissipation problem of LED lamp is one of the problem of LED lamp producer most has a headache.In LED product application, usually need
Multiple LED are assembled on a circuit substrate.Circuit substrate is in addition to playing the part of the role of carrying LED module structure；The opposing party
Face, since the LED chip being fixed on above LED substrate can produce substantial amounts of heat, substrate also plays the role of heat dissipation,
Lamp bead temperature just aging quickly more than 60 degree without substrate, luminance-reduction is serious to burn lamp bead, so preferably connecting base
Plate uses.
The LED substrate heat dissipation effect of the prior art is poor, and radiating rate is not high, although can heat radiation using aluminum substrate
Effect, but weight is heavy, and it is not convenient.
Utility model content
In view of this, the purpose of this utility model is to provide the substrate and board device of LED light, LED bases are solved
The problem of plate heat dissipation effect is poor, and radiating rate is not high, is effectively ensured the service life of LED lamp bead, light-weight and endurance strength
Greatly.
In a first aspect, the utility model embodiment provides the substrate of LED light, including the substrate body of ceramic material, absolutely
Edge glue-line and aluminium foil；
The upper surface of the substrate body is provided with the aluminium foil for heat dissipation, is provided with the aluminium foil some described
Insulate glue-line, and circuit and light emitting diode are provided with the insulation glue-line.
With reference to first aspect, the utility model embodiment provides the first possible embodiment of first aspect, its
In, the insulation glue-line and the aluminium foil are symmetrical arranged in the substrate body.
The possible embodiment of with reference to first aspect the first, the utility model embodiment provide the of first aspect
Two kinds of possible embodiments, wherein, the aluminium foil is set in the substrate body by end to end mode in polygon
Put.
Second aspect, the utility model embodiment provide the board device of LED light, including LED light as described above
Substrate, further includes the heat dissipation base being connected with the substrate of the LED light, and the heat dissipation base includes heated body and radiator
's；
It is detachably connected between the substrate of multiple LED light, the heat dissipation base and the substrate of each LED light
Lower face is connected by the heated body, and transfers heat to the radiator to carry out heat extraction.
With reference to second aspect, the utility model embodiment provides the first possible embodiment of first aspect, its
In, any four side of substrate body is both provided with the connection buckle for being connected with substrate body other described, the connection card
Button includes the first buckle, the second buckle, the 3rd buckle and the 4th buckle.
With reference to the first possible embodiment of second aspect, the utility model embodiment provides the of second aspect
Two kinds of possible embodiments, wherein, first buckle is buckled in the substrate body with described second to be oppositely arranged, institute
State the 3rd buckle and the 4th to be buckled in the substrate body and be oppositely arranged, and first buckle and described second is buckled and institute
State the 3rd buckle or the 4th buckle is detachably connected.
With reference to second aspect, the utility model embodiment provides the third possible embodiment of first aspect, its
In, the substrate of the LED light is connected by high viscosity heat conductive silica gel with the heated body, and the LED light substrate with
High heat conductive insulating organosilicon material is filled between the heat dissipation base, the high heat conductive insulating organosilicon material is coated on described
High viscosity heat conductive silica gel surrounding.
With reference to the first possible embodiment of second aspect, the utility model embodiment provides the of second aspect
Four kinds of possible embodiments, wherein, the PET light reflecting membranes for improving brightness are provided with the substrate, the PET is anti-
Optical thin film is uniformly laid on the upper surface of the substrate.
With reference to second aspect, the utility model embodiment provides the 5th kind of possible embodiment of first aspect, its
In, the radiator includes some heat sinks, and the heat sink is porous type potsherd.
With reference to second aspect, the utility model embodiment provides the 6th kind of possible embodiment of first aspect, its
In, the heat dissipation base further includes the monitoring cavity for being provided with temperature monitoring module, and the temperature monitoring module is passed including temperature
Sensor and alarm lamp.
The utility model embodiment provides the substrate and board device of LED light, including the substrate body of ceramic material,
Insulate glue-line and aluminium foil；The upper surface of substrate body is provided with the aluminium foil for heat dissipation, and some insulation glue-lines are provided with aluminium foil,
Circuit and light emitting diode are provided with insulation glue-line.It is poor that the utility model solves LED substrate heat dissipation effect, radiating rate
The problem of not high, the service life of LED lamp bead is effectively ensured, light-weight and endurance strength is big.
Other feature and advantage of the utility model will illustrate in the following description, also, partly from specification
In become apparent, or understood by implementing the utility model.The purpose of this utility model and other advantages are illustrating
Specifically noted structure is realized and obtained in book, claims and attached drawing.
To enable the above-mentioned purpose of the utility model, feature and advantage to become apparent, preferred embodiment cited below particularly, and
Attached drawing appended by cooperation, is described in detail below.
Brief description of the drawings
, below will be right in order to illustrate more clearly of the utility model embodiment or technical solution of the prior art
Embodiment or attached drawing needed to be used in the description of the prior art are briefly described, it should be apparent that, describe below
In attached drawing be the utility model some embodiments, for those of ordinary skill in the art, do not paying creativeness
On the premise of work, other attached drawings can also be obtained according to these attached drawings.
Fig. 1 is the board structure schematic diagram for the LED light that the utility model embodiment provides；
Fig. 2 is the board structure schematic diagram for another LED light that the utility model embodiment provides；
Fig. 3 is the board device structure diagram for the LED light that the utility model embodiment provides；
Fig. 4 is the connection buckle structure diagram that the utility model embodiment provides.
Icon：
1- substrate bodies；2- insulation glue-lines；3- aluminium foils；4- heat dissipation bases；5- heated bodies；6- connection buckles；7- first blocks
Button；8- second is buckled；9- the 3rd is buckled；10- the 4th is buckled；11- heat sinks.
Embodiment
To make the purpose, technical scheme and advantage of the utility model embodiment clearer, below in conjunction with attached drawing to this
The technical solution of utility model is clearly and completely described, it is clear that described embodiment is that the utility model part is real
Example is applied, instead of all the embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making
All other embodiments obtained under the premise of creative work, shall fall within the protection scope of the present invention.
At present, the heat dissipation problem of LED lamp is one of the problem of LED lamp producer most has a headache.In LED product application,
It is generally necessary to multiple LED are assembled on a circuit substrate.Circuit substrate is in addition to playing the part of the role of carrying LED module structure；
On the other hand, the role of heat dissipation is also play, lamp bead temperature just aging quickly more than 60 degree without substrate, luminance-reduction,
It is serious to burn lamp bead, so preferably connecting substrate use.The LED substrate heat dissipation effect of the prior art is poor, and radiating rate is not
Height, although using aluminum substrate can improving radiating effect, weight is heavy, and not convenient.Based on this, the utility model embodiment
The substrate and board device of the LED light of offer, solve the problem of LED substrate heat dissipation effect is poor, and radiating rate is not high, have
Effect ensures the service life of LED lamp bead, and light-weight and endurance strength is big.
For ease of understanding the present embodiment, first to the substrate of the LED light disclosed in the utility model embodiment into
Row is discussed in detail.
Embodiment one：
Fig. 1 is the board structure schematic diagram for the LED light that the utility model embodiment provides.
With reference to Fig. 1, the substrate of LED light includes the substrate body 1 of ceramic material, insulation glue-line 2 and aluminium foil 3；
The upper surface of substrate body 1 is provided with the aluminium foil 3 for heat dissipation, some insulation glue-lines 2 is provided with aluminium foil 3, absolutely
Circuit and light emitting diode are provided with edge glue-line 2.
Specifically, Fig. 1 includes four insulation glue-lines 2, is symmetrical arranged in substrate body 1, four of the diamond shape of LED substrate
Angle is formed with chamfering.As shown in side elevation in figure 2, aluminium foil 3 is provided with the upper surface of substrate body 1, insulation is provided with aluminium foil 3
Glue-line 2 is, it is necessary to illustrate, 3 arrangement mode of aluminium foil in substrate body 1 can be configured as needed, it is not limited to Fig. 1
Set-up mode, and the number for the glue-line 2 that insulate also limit to the utility model embodiment number limitation.
Here, substrate is set as to the composite wood to be integrally combined by the substrate body 1 of ceramic material, insulation glue-line 2, aluminium foil 3
Material, then insulation glue-line 2 is set on aluminium foil 3, circuit and light emitting diode (chip) are set on insulation glue-line 2；Pass through aluminium foil 3
Fast endothermic, the effect of heat dissipation are can obtain, and promotes the effect of heat conduction, heat dissipation again by ceramic layer (substrate body) again, because
This can be by heat temperature quick heat radiating caused by light emitting diode.
It should be noted that aluminum base plate body compared with the prior art, ceramic substrate body can mitigate weight, from
And the effect of light-weight, endurance strength is big, is obtained by the composite material of multilayer.Its mechanical stress is strong, dimensionally stable, has height
Intensity, high thermal conductivity, high-insulativity and etch-proof feature, are easier to radiate and insulate than aluminum base plate.
Further, insulation glue-line 2 and aluminium foil 3 are symmetrical arranged in substrate body 1.
Further, aluminium foil 3 is set in substrate body 1 by end to end mode in polygon.
The utility model provides the substrate of LED light, including the substrate body of ceramic material, insulation glue-line and aluminium foil；Base
The upper surface of plate body is provided with the aluminium foil for heat dissipation, and some insulation glue-lines are provided with aluminium foil, is provided with the glue-line that insulate
Circuit and light emitting diode.The utility model solves the problem of LED substrate heat dissipation effect is poor, and radiating rate is not high, effectively
Ensure the service life of LED lamp bead, light-weight and endurance strength is big, makes the substrate of LED light have more preferably practical effect.
Embodiment two：
Fig. 3 is the board device structure diagram for the LED light that the utility model embodiment provides.
With reference to Fig. 3, the board device of LED light, includes the substrate of LED light as described above, further includes the substrate with LED light
The heat dissipation base 4 being connected, heat dissipation base 4 include heated body 5 and radiator；
It is detachably connected between the substrate of multiple LED light, heat dissipation base 4 and the lower face of the substrate of each LED light pass through
Heated body 5 is connected, and transfers heat to radiator to carry out heat extraction.
Specifically, can splice two-by-two between the substrate of multiple LED light, the relative position between self-defined substrate, adjustment is shone
Bright moulding.
Further, any 1 four side of substrate body is both provided with the connection card for being connected with other substrate bodies 1
Button, connection buckle 6 include the 8, the 3rd buckle 9 of first the 7, second buckle of buckle and the 4th buckle 10.
Specifically, if substrate body 1 is rectangular configuration as shown in Figure 1, four buckles can be matched, equally also can be by base
Plate body 1 is arranged to other polygonized structures, then needs to choose the matched buckle number of setting according to specific shape and installation requirement
Amount.
Further, as shown in figure 4, the first buckle 7 is oppositely arranged with the second buckle 8 in substrate body, the 3rd buckle 9
Be oppositely arranged with the 4th buckle 10 in substrate body 1, and the first buckle 7 and the second buckle 8 respectively with the 3rd buckle 9 or the 4th
Buckle 10 is detachably connected.
Specifically, the first buckle 7 can be connected with the 3rd buckle 9 or the 4th buckle 10, and the second buckle 8 also can be with the 3rd card
9 or the 4th buckle 10 of button is connected, and the first buckle 7 is identical structure with the second buckle 8, opposite on the periphery of substrate body 1
Set, the 3rd buckle 9 is identical structure with the 4th buckle 10, is equally oppositely arranged on the periphery of substrate body 1.Here,
One buckle 7 and the rod-like structure that the second buckle 8 is cylinder, the 3rd buckle 9 and the 4th buckle 10 are open type hollow tubular knot
Structure, the 3rd of certain substrate body buckle 9, which is sleeved on the first buckle 7 of other substrate bodies, can complete between two substrates
Connect forming substrate combination, the 4th buckle and second buckle similarly, equally by other substrate body in the same way with
The substrate in combination connected is connected, then can progressively extend to substrate in combination.Due to open type hollow tubular structures
Transversal radius is slightly less than the transversal radius of cylindrical rod structure, therefore can adjust the relative position between two substrates, realizes LED bases
The different spatial of plate and lamp is put, and is not only satisfied with the requirement of different infields, but also can obtain more aesthetic feelings.
Further, the substrate of LED light is connected by high viscosity heat conductive silica gel with the heated body, and in LED light
High heat conductive insulating organosilicon material is filled between substrate and heat dissipation base, high heat conductive insulating organosilicon material is coated on high viscosity
Heat conductive silica gel surrounding.
Further, the PET light reflecting membranes for improving brightness are provided with substrate, PET light reflecting membranes are uniformly laid with
On the upper surface of substrate.
Specifically, PET film is a kind of more comprehensive packing film of performance ratio.Its transparency is good, glossy；With good
Air-tightness and fragrance protectiveness；Moisture resistance is medium, and rate of perviousness declines at low temperature.The good mechanical performance of PET film, its obdurability
It is best in all thermoplastics, tensile strength and the general film of impact strength ratio are much higher；And very power is good, size is steady
It is fixed, suitable for secondary operation such as printing, paper bags.PET film also has excellent heat-resisting, cold resistance and good chemical proofing
And oil resistivity.The characteristics of PET reflective membranes is that film has an excellent optical property, surfacing, bright and clean, and heat endurance is good, receives
Shrinkage is small, light aging resisting, therefore PET light reflecting membranes can be laid with substrate body, is conducive to the irradiation light of enhancing LED indirectly
By force, which is 10-50 μm.Except PET film to be directly layed in substrate upper surface, other setting sides can be also used
Formula.For example, being provided with multiple grooves in substrate body, reflectorized material is filled in a groove to reflect the radiance of LED, it is necessary to say
Bright, groove needs more quantity fully to highlight the illuminance of LED.
Further, radiator includes some heat sinks 11, and heat sink 11 is porous type potsherd.
Specifically, can be connected between heat dissipation base 4 and substrate body 1 by setting element to position LED substrate with dissipating
The assembled state of hot base 4, setting element include first component and second component, first component be used to combining substrate body 1 with
Heat dissipation base 4, second component are used to produce LED substrate the elastic suppression power towards heat dissipation base.
Here, can also be connected between heat dissipation base 4 and substrate body 1 by movable buckle, in the upper surface of substrate body 1
Surrounding is provided with protrusion, and the relevant position of heat dissipation base 4 is provided with movable button, in the protrusion and heat dissipation base 4 in substrate body 1
Movable button be collectively forming movable buckle, when need install heat dissipation base when, can be manually by the movable button of heat dissipation base 4
It is connected with the male cooperation in substrate body 1, when heat dissipation base 4 are not required, movable button is snapped out from protrusion, will dissipates
Hot base 4 is removed from 1 lower face of substrate body.In weather hotter summer, can effectively be radiated by installing heat dissipation base 4,
Avoid LED light from being damaged be subject to high temperature, extend lamps and lanterns service life, in weather colder winter or need to LED substrate
When combined shaped is deformed, heat dissipation base can also be unloaded manually, save space, good heat dispersion performance.
It should be noted that heat dissipation base 4 includes the heated body 5 that is connected with substrate body 1, heated body 5 include one by
Hot face, is connected by sticky material with the lower face of substrate body 1, and heat dissipation base 4 further includes radiator, and radiator can be by
Some heat sinks 11 form, and 11 proper alignment of heat sink is in the another side of heated body, the heat row for effectively absorbing heated body 5
Go out, and be provided with some through holes on heat sink 11 and carry out auxiliary heat dissipation.
Further, heat dissipation base 4 further includes the monitoring cavity for being provided with temperature monitoring module, and temperature monitoring module includes
Temperature sensor and alarm lamp.
Specifically, one end of heating surface is provided with a monitoring cavity in heat dissipation base 4, in the surrounding of monitoring cavity
Some heat sinks 11 are arranged with, monitor cavity is internally provided with temperature sensor and alarm lamp, when temperature sensor is supervised
The LED substrate temperature measured exceedes predetermined threshold value, then flickers alarm lamp and reminded with giving.In order to preferably extend LED
The service life of lamps and lanterns, is additionally provided with communication module, in the case where temperature exceedes predetermined threshold value, into control in monitoring cavity
The heart sends alert message, to adjust the power of LED light in time, avoids LED light continuous firing under the temperature conditionss of overheat.
The utility model embodiment provides the board device of LED light, can effectively be radiated by heat dissipation base, and root
Need to dismantle heat dissipation base according to actual installation, also, the conversion of locus is respectively carried out between each substrate, for not
Stronger Installation Flexibility is shown with infield, while can be stronger with its ornamental value；Moreover, the reality of sensor is passed through
When monitor, effectively extend the service life of LED light and substrate, give staff by warning information and prompt.
It is apparent to those skilled in the art that for convenience and simplicity of description, the system of foregoing description
With the specific work process of device, the corresponding process in preceding method embodiment is may be referred to, details are not described herein.
In addition, in the description of the utility model embodiment, unless otherwise clearly defined and limited, term " installation ",
" connected ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected, or integratedly be connected
Connect；Can mechanically connect or be electrically connected；It can be directly connected, can also be indirectly connected by intermediary, can
To be the connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood with concrete condition
Concrete meaning in the utility model.
, it is necessary to explanation in the description of the utility model, term " " center ", " on ", " under ", it is "left", "right", " perpendicular
Directly ", the orientation of the instruction such as " level ", " interior ", " outer " or position relationship are based on orientation shown in the drawings or position relationship, are only
Described for the ease of description the utility model and simplifying, rather than instruction or imply signified device or element must have it is specific
Orientation, with specific azimuth configuration and operation, therefore it is not intended that limitation to the utility model.
In addition, term " first ", " second ", " the 3rd " are only used for description purpose, and it is not intended that instruction or implying phase
To importance.
Finally it should be noted that：Embodiment described above, is only specific embodiment of the present utility model, to illustrate this
The technical solution of utility model, rather than its limitations, the scope of protection of the utility model is not limited thereto, although with reference to foregoing
The utility model is described in detail in embodiment, it will be understood by those of ordinary skill in the art that：It is any to be familiar with this skill
For the technical staff in art field in the technical scope that the utility model discloses, it still can be to the skill described in previous embodiment
Art scheme is modified or can readily occur in change, or carries out equivalent substitution to which part technical characteristic；And these modifications,
Change is replaced, and the essence of appropriate technical solution is departed from the spirit and model of the utility model embodiment technical solution
Enclose, should be covered within the scope of the utility model.Therefore, the scope of protection of the utility model described should be wanted with right
Subject to the protection domain asked.
Claims (10)
1. a kind of substrate of LED light, it is characterised in that the substrate body (1) including ceramic material, insulation glue-line (2) and aluminium foil
(3)；
The upper surface of the substrate body (1) is provided with the aluminium foil (3) for heat dissipation, the aluminium foil (3) if on be provided with
The insulation glue-line (2) is done, circuit and light emitting diode are provided with the insulation glue-line (2).
2. the substrate of LED light according to claim 1, it is characterised in that the insulation glue-line (2) and the aluminium foil (3)
It is symmetrical arranged in the substrate body (1).
3. the substrate of LED light according to claim 2, it is characterised in that the aluminium foil (3) is in the substrate body (1)
On by end to end mode in polygon set.
4. a kind of board device of LED light, it is characterised in that including such as claim 1 to claim 3 any one of them
The substrate of LED light, further includes the heat dissipation base (4) being connected with the substrate of the LED light, the heat dissipation base (4) include by
Hot body (5) and radiator；
It is detachably connected between the substrate of multiple LED light, the heat dissipation base (4) and the substrate of each LED light
Lower face is connected by the heated body (5), and transfers heat to the radiator to carry out heat extraction.
5. the board device of LED light according to claim 4, it is characterised in that any four side of substrate body is both provided with
For the connection buckle (6) being connected with substrate body other described (1), the connection buckle (6) include first buckle (7),
Second buckle (8), the 3rd buckle (9) and the 4th buckle (10).
6. the board device of LED light according to claim 5, it is characterised in that first buckle (7) and described second
Buckle (8) is oppositely arranged in the substrate body (1), and the 3rd buckle (9) and the 4th buckle (10) are in the substrate sheet
Body is oppositely arranged on (1).
7. the board device of LED light according to claim 4, it is characterised in that the substrate of the LED light passes through high viscosity
Heat conductive silica gel is connected with the heated body (5), and is filled between the substrate and the heat dissipation base (4) of the LED light
High heat conductive insulating organosilicon material, the high heat conductive insulating organosilicon material are coated on the high viscosity heat conductive silica gel surrounding.
8. the board device of LED light according to claim 5, it is characterised in that be provided with use on the substrate body (1)
In the PET light reflecting membranes for improving brightness, the PET light reflecting membranes are uniformly laid on the upper surface of the substrate body.
9. the board device of LED light according to claim 4, it is characterised in that the radiator includes some heat sinks
(11), the heat sink (11) is porous type potsherd.
10. the board device of LED light according to claim 4, it is characterised in that the heat dissipation base (4), which further includes, to be set
The monitoring cavity of temperature monitoring module is equipped with, the temperature monitoring module includes temperature sensor and alarm lamp.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721441495.7U CN207364799U (en) | 2017-11-01 | 2017-11-01 | The substrate and board device of LED light |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721441495.7U CN207364799U (en) | 2017-11-01 | 2017-11-01 | The substrate and board device of LED light |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207364799U true CN207364799U (en) | 2018-05-15 |
Family
ID=62345054
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721441495.7U Active CN207364799U (en) | 2017-11-01 | 2017-11-01 | The substrate and board device of LED light |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207364799U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110864233A (en) * | 2019-11-25 | 2020-03-06 | 广东鑫特美科技有限公司 | LED lamp bead |
-
2017
- 2017-11-01 CN CN201721441495.7U patent/CN207364799U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110864233A (en) * | 2019-11-25 | 2020-03-06 | 广东鑫特美科技有限公司 | LED lamp bead |
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