CN110648986A

CN110648986A - Packaging assembly of IGBT module

Info

Publication number: CN110648986A
Application number: CN201911071095.5A
Authority: CN
Inventors: 韩波; 刘天宇; 冯建鑫
Original assignee: Hans Automation Technology (jiangsu) Co Ltd
Current assignee: Hans Automation Technology (jiangsu) Co Ltd
Priority date: 2019-11-05
Filing date: 2019-11-05
Publication date: 2020-01-03
Anticipated expiration: 2039-11-05
Also published as: CN110648986B

Abstract

The invention relates to the technical field of packaging assemblies and discloses a packaging assembly of an IGBT module, which comprises a lower assembly, wherein limiting blocks are fixedly connected to the left side wall of an inner bottom and the right side wall of the inner bottom of the lower assembly, the IGBT module is fixedly connected between the two groups of limiting blocks, a heat-conducting insulating plate is fixedly connected to the bottom end of the IGBT module, a heat-radiating plate is fixedly connected to the lower surface of the heat-conducting insulating plate, heat-radiating silicone grease is arranged on the lower surface of the heat-radiating plate, and a dustproof plate. This encapsulation subassembly of IGBT module through the mating reaction of heat conduction insulation board, heating panel and through-hole, can play the radiating effect of cooling to the IGBT module, through the mating reaction of stopper, smooth ball, dwang, auxiliary shaft, auxiliary block, elasticity spring group and movable plate, can make the subassembly more inseparable connect with lower subassembly, through the effect of draw-in groove, can carry on spacingly to smooth ball, improved the practicality.

Description

Packaging assembly of IGBT module

Technical Field

The invention relates to the technical field of packaging assemblies, in particular to a packaging assembly of an IGBT module.

Background

At present, the packaging technology is a technology for packaging an integrated circuit by using insulating plastic or ceramic materials, the actually seen volume and appearance are not the size and appearance of a real integrated circuit, but the integrated circuit and other elements are products after packaging, the packaging technology is necessary for a chip and is also vital, because the chip is isolated from the outside, the electric performance reduction caused by the corrosion of impurities in the air to the chip circuit is prevented, on the other hand, the packaged chip is more convenient to install and transport, the upper component structure and the lower component structure of the packaging component of the existing IGBT module are not tightly connected, the fixity is poor, meanwhile, the cooling operation on the IGBT module is inconvenient, the practicability is low, and the popularization and the use are not facilitated.

Disclosure of Invention

Technical problem to be solved

Aiming at the defects of the prior art, the invention provides the packaging assembly of the IGBT module, which has the advantages that the upper assembly and the lower assembly can be connected more tightly, the IGBT module can be cooled, and the like, and solves the problems that the upper assembly structure and the lower assembly structure of the packaging assembly of the IGBT module are not connected tightly, the fixity is poor, and meanwhile, the cooling operation on the IGBT module is inconvenient, the practicability is low, and the popularization and the use are not facilitated.

(II) technical scheme

In order to realize the purposes that the upper assembly and the lower assembly can be connected more tightly and the IGBT module can be cooled, the invention provides the following technical scheme: a packaging assembly of an IGBT module comprises a lower assembly, wherein limiting blocks are fixedly connected with the left side wall of an inner bottom and the right side wall of the inner bottom of the lower assembly, the IGBT module is fixedly connected between two groups of limiting blocks, a heat-conducting insulating plate is fixedly connected with the bottom end of the IGBT module, a heat-radiating plate is fixedly connected with the lower surface of the heat-radiating plate, heat-radiating silicone grease is arranged on the lower surface of the heat-radiating plate, a through hole is formed in the lower surface of the lower assembly, a dustproof plate is fixedly connected with the lower surface of the lower assembly, a communication hole is formed in the dustproof plate, an upper assembly is arranged on the upper surface of the lower assembly, the lower surface of the upper assembly is in contact with the upper surface of the lower assembly, three groups of first working holes are transversely arranged on the upper assembly, a fixed frame is, the inside smooth ball that is provided with of draw-in groove, the inside dwang that is provided with two sets of crisscross installations of stopper, crisscross installation two sets of the dwang middle part is rotated and is connected with the auxiliary shaft, and the dwang bottom is rotated with smooth ball and is connected, and the equal fixedly connected with auxiliary block of auxiliary shaft left end and right-hand member, auxiliary block top and last subassembly inside top lateral wall fixed connection go up the subassembly upper surface left end and right-hand member and have all seted up the second working mouth, the equal fixedly connected with movable plate in dwang top, are provided with the elasticity spring assembly between two sets of dwang of cross installation.

Preferably, a radiating wire mesh is arranged inside the radiating plate, and the radiating wire mesh is made of a copper material.

Preferably, four corners of the upper surface of the lower component are provided with placing grooves, clamping blocks are clamped in the placing grooves, and the top ends of the clamping blocks are fixedly connected with the lower surface of the upper component.

Preferably, the outer side wall of the top end of the moving plate is fixedly connected with a moving sleeve, and the moving sleeve is made of rubber materials.

Preferably, the four corners of the lower surface of the lower component are fixedly connected with pillars, and the bottoms of the pillars are fixedly connected with bases.

Preferably, the bottom end of the base is fixedly connected with an anti-slip mat, and the bottom end of the anti-slip mat is provided with anti-slip convex lines.

Preferably, the elastic spring group is provided with two groups of elastic springs.

(III) advantageous effects

Compared with the prior art, the invention provides a packaging assembly of an IGBT module, which has the following beneficial effects:

1. this encapsulation subassembly of IGBT module through the mating reaction of heat conduction insulation board, heating panel and through-hole, can play the radiating effect of cooling to the IGBT module, through the mating reaction of stopper, smooth ball, dwang, auxiliary shaft, auxiliary block, elasticity spring group and movable plate, can make the subassembly more inseparable connect with lower subassembly, through the effect of draw-in groove, can carry on spacingly to smooth ball, improved the practicality.

2. This encapsulation subassembly of IGBT module through the effect of fixed frame, can fix the link of IGBT module, through the effect of dust screen, can prevent that external dust and debris from getting into down inside the subassembly through the through-hole, through the effect of supplementary piece, can carry out certain fixed to the auxiliary shaft, make the auxiliary shaft can more firm carry out work.

Drawings

Fig. 1 and fig. 2 are schematic structural diagrams of a package assembly of an IGBT module according to the present invention;

fig. 3 is a schematic diagram of an expanded structure of a limiting block part of a package assembly of an IGBT module according to the present invention;

fig. 4 is a schematic perspective view of a heat conductive insulating plate portion of a package assembly of an IGBT module according to the present invention.

In the figure: 1. a lower assembly; 2. a limiting block; 3. an IGBT module; 4. a heat dissipation plate; 5. heat dissipation silicone grease; 6. a dust-proof plate; 7. a communicating hole; 8. an upper assembly; 9. a first working hole; 10. a fixing frame; 11. a card slot; 12. smooth balls; 13. rotating the rod; 14. an auxiliary shaft; 15. an auxiliary block; 16. moving the plate; 17. an elastic spring set; 18. a heat-dissipating wire mesh; 19. a clamping block; 20. moving the sleeve; 21. a pillar; 22. a base; 23. a non-slip mat; 24. a thermally conductive insulating plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: a packaging assembly of an IGBT module comprises a lower assembly 1, wherein four corners of the upper surface of the lower assembly 1 are respectively provided with a placing groove, a clamping block 19 is clamped in the placing groove, the top end of the clamping block 19 is fixedly connected with the lower surface of an upper assembly 8, the clamping block 19 and a clamping groove 11 are matched to improve the connection tightness of the upper assembly 8 and the lower assembly 1, four corners of the lower surface of the lower assembly 1 are respectively and fixedly connected with a pillar 21, the bottom end of the pillar 21 is fixedly connected with a base 22, the pillar 21 and the base 22 are matched to enable the device to be more stably fixed at a proper position, the bottom end of the base 22 is fixedly connected with an anti-skid pad 23, the bottom end of the anti-skid pad 23 is provided with anti-skid convex patterns, the anti-skid pad 23 can enable the device to be more stably, the left side wall and the right side wall of an inner, the lower surface of the heat-conducting insulating plate 24 is fixedly connected with a heat-dissipating plate 4, a heat-dissipating wire mesh 18 is arranged in the heat-dissipating plate 4, the heat-dissipating wire mesh 18 is made of a copper material, the heat-dissipating wire mesh 18 can assist the heat-dissipating plate 4 to dissipate heat, the lower surface of the heat-dissipating plate 4 is provided with heat-dissipating silicone grease 5, the lower surface of the lower component 1 is provided with through holes, the lower surface of the lower component 1 is fixedly connected with a dust-proof plate 6, the dust-proof plate 6 is provided with a communication hole 7, the upper surface of the lower component 1 is provided with an upper component 8, the lower surface of the upper component 8 is contacted with the upper surface of the lower component 1, three groups of first working holes 9 are transversely arranged on the upper component 8, a fixed frame 10 is fixedly connected in the first working holes 9, the connecting end of, stopper 2 inside dwang 13 that is provided with two sets of crisscross installations, two sets of dwang 13 middle parts of crisscross installation rotate and are connected with auxiliary shaft 14, dwang 13 bottom is rotated with smooth ball 12 and is connected, the equal fixedly connected with auxiliary block 15 of auxiliary shaft 14 left end and right-hand member, the equal fixedly connected with auxiliary block 15 in auxiliary block 15 top and the last subassembly 8 inside top lateral wall fixed connection, the second working mouth has all been seted up to last subassembly 8 upper surface left end and right-hand member, the equal fixedly connected with movable plate 16 in dwang 13 top, 16 top lateral wall fixedly connected with of movable plate removes cover 20, the material that removes cover 20 is rubber materials, it is more comfortable when the staff contacts with movable plate 16 to remove cover 20, the use travelling comfort of device has been improved, be provided with elasticity spring group 17 between two sets of dwang 13 of alternately installation, elasticity spring group 17 is provided with two sets of elasticity springs, elasticity spring group 17 is.

When the IGBT module is used, the IGBT module 3 can move in the fixed frame 10, the fixed frame 10 can fix the IGBT module 3 to a certain extent, when the upper assembly 8 and the lower assembly 1 are connected more closely, an operator operates the moving plate 16 to reduce the distance between the two groups of moving plates 16 positioned on the left side and the two groups of moving plates 16 positioned on the right side, so that the smooth ball 12 can move up and down in the limiting block 2, when the smooth ball 12 moves into the clamping groove 11, the operator reduces the control force on the moving plate 16, the smooth ball 12 is clamped in the clamping groove 11 under the control of the elastic spring group 17, so that the upper assembly 8 and the lower assembly 1 are connected more closely, the auxiliary block 15 can fix the auxiliary shaft 14, the heat-conducting insulating plate 24 can more rapidly dissipate the heat in the IGBT module 3, and the heat-dissipating plate 4 and the heat-dissipating silicone grease 5 can assist the IGBT module 3 to dissipate heat, and then carry out the processing of heat dissipation cooling to IGBT module 3, improved the practicality.

In conclusion, this encapsulation subassembly of IGBT module 3, through heat conduction insulation board 24, the mating reaction of heating panel 4 and through-hole, can play the radiating effect of cooling to IGBT module 3, through stopper 2, smooth ball 12, dwang 13, auxiliary shaft 14, auxiliary block 15, the mating reaction of elastic spring group 17 and movable plate 16, can make subassembly 8 and lower subassembly 1 more inseparable connect, through the effect of draw-in groove 11, can carry out spacingly smooth ball 12, the practicality has been improved, through the effect of fixed frame 10, can fix the link of IGBT module 3, through the effect of dust screen, can prevent that external dust and debris from getting into down inside subassembly 1 through the through-hole, through the effect of auxiliary block 15, can carry out certain fixed to auxiliary shaft 14, make auxiliary shaft 14 can work more firm.

The electrical components presented in the document are all electrically connected with an external master controller and 220V mains, and the master controller can be a conventional known device controlled by a computer or the like.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A package assembly for an IGBT module, comprising a lower assembly (1), characterized in that: the inner bottom left side wall and the inner bottom right side wall of the lower component (1) are fixedly connected with limit blocks (2), an IGBT module (3) is fixedly connected between the two groups of limit blocks (2), a heat-conducting insulation plate (24) is fixedly connected to the bottom end of the IGBT module (3), a heat-radiating plate (4) is fixedly connected to the lower surface of the heat-conducting insulation plate (24), heat-radiating silicone grease (5) is arranged on the lower surface of the heat-radiating plate (4), a through hole is formed in the lower surface of the lower component (1), a dust-proof plate (6) is fixedly connected to the lower surface of the lower component (1), a communication hole (7) is formed in the dust-proof plate (6), an upper component (8) is arranged on the upper surface of the lower component (1), the lower surface of the upper component (8) is in contact with the upper surface of the lower component (1), three groups of, the connecting end of the IGBT module (3) extends into the fixing frame (10), the limiting block (2) is provided with a limiting groove, the inner front side wall and the inner rear side wall of the limiting block (2) are both provided with a clamping groove (11), smooth balls (12) are arranged in the clamping groove (11), two groups of staggered rotating rods (13) are arranged in the limiting block (2), auxiliary shafts (14) are rotatably connected to the middle parts of the staggered rotating rods (13), the bottom ends of the rotating rods (13) are rotatably connected with the smooth balls (12), auxiliary blocks (15) are fixedly connected to the left end and the right end of each auxiliary shaft (14), supplementary piece (15) top and last subassembly (8) inside top lateral wall fixed connection, go up subassembly (8) upper surface left end and right-hand member and all seted up the second working mouth, dwang (13) top equal fixedly connected with movable plate (16), be provided with elasticity spring group (17) between two sets of dwang (13) of cross arrangement.

2. The packaging assembly of an IGBT module according to claim 1, characterized in that: the heating panel (4) is internally provided with a heat dissipation wire mesh (18), and the heat dissipation wire mesh (18) is made of a copper material.

3. The packaging assembly of an IGBT module according to claim 1, characterized in that: the four corners of the upper surface of the lower component (1) are provided with placing grooves, clamping blocks (19) are clamped in the placing grooves, and the top ends of the clamping blocks (19) are fixedly connected with the lower surface of the upper component (8).

4. The packaging assembly of an IGBT module according to claim 1, characterized in that: the outer side wall of the top end of the moving plate (16) is fixedly connected with a moving sleeve (20), and the moving sleeve (20) is made of rubber materials.

5. The packaging assembly of an IGBT module according to claim 1, characterized in that: the lower component (1) is characterized in that four corners of the lower surface of the lower component are fixedly connected with supporting columns (21), and the bottom ends of the supporting columns (21) are fixedly connected with bases (22).

6. The packaging assembly of an IGBT module according to claim 1, characterized in that: the anti-skid device is characterized in that an anti-skid pad (23) is fixedly connected to the bottom end of the base (22), and anti-skid convex lines are arranged at the bottom end of the anti-skid pad (23).

7. The packaging assembly of an IGBT module according to claim 1, characterized in that: the elastic spring group (17) is provided with two groups of elastic springs.