CN115642141B - Packaging structure of IGBT module - Google Patents
Packaging structure of IGBT module Download PDFInfo
- Publication number
- CN115642141B CN115642141B CN202211221147.4A CN202211221147A CN115642141B CN 115642141 B CN115642141 B CN 115642141B CN 202211221147 A CN202211221147 A CN 202211221147A CN 115642141 B CN115642141 B CN 115642141B
- Authority
- CN
- China
- Prior art keywords
- butt joint
- disc
- igbt module
- upper disc
- connecting wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 25
- 210000001503 joint Anatomy 0.000 claims abstract description 125
- 230000000149 penetrating effect Effects 0.000 claims abstract description 5
- 230000017525 heat dissipation Effects 0.000 claims description 26
- 230000000694 effects Effects 0.000 claims description 24
- 238000003756 stirring Methods 0.000 claims description 16
- 238000001179 sorption measurement Methods 0.000 claims description 15
- 230000001681 protective effect Effects 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 10
- 239000007769 metal material Substances 0.000 claims description 9
- 238000005452 bending Methods 0.000 claims description 5
- 239000013013 elastic material Substances 0.000 claims description 3
- SZVJSHCCFOBDDC-UHFFFAOYSA-N iron(II,III) oxide Inorganic materials O=[Fe]O[Fe]O[Fe]=O SZVJSHCCFOBDDC-UHFFFAOYSA-N 0.000 claims description 3
- 238000004804 winding Methods 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 2
- 241000309551 Arthraxon hispidus Species 0.000 claims 2
- 230000007704 transition Effects 0.000 claims 1
- 230000000712 assembly Effects 0.000 abstract description 13
- 238000000429 assembly Methods 0.000 abstract description 13
- 230000005855 radiation Effects 0.000 abstract 5
- 230000000191 radiation effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 17
- 238000003032 molecular docking Methods 0.000 description 17
- 238000005538 encapsulation Methods 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 230000001771 impaired effect Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000007812 deficiency Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Abstract
The invention belongs to the field of IGBT modules, in particular to a packaging structure of an IGBT module, which comprises an upper disc and a lower disc, wherein the upper disc and the lower disc are fixedly connected through bolts, the bottom surface of the upper disc is provided with an opening, the top surface of the lower disc is provided with a butt joint groove, the butt joint groove is used for placing the IGBT module, the outer side of the lower disc is provided with a heat radiation groove penetrating to the other side, the inner side of the heat radiation groove is fixedly provided with a heat radiation plate, the top surface of the upper disc is provided with three butt joint assemblies, the butt joint assemblies are used for connecting an external circuit and the IGBT module, the IGBT module is fixedly connected to the inner side of the butt joint groove, the upper disc and the lower disc are fixedly connected through the butt joint assemblies, the external circuit and the IGBT module are connected through the butt joint assemblies, the heat radiation groove is arranged below the butt joint groove, and meanwhile, the structure of the heat radiation groove is added can improve the contact area with the outside, effectively increase the heat radiation effect, and the heat generated by the IGBT module during working can be rapidly dispersed.
Description
Technical Field
The invention belongs to the field of IGBT modules, and particularly relates to a packaging structure of an IGBT module.
Background
The IGBT Chinese name insulated gate bipolar transistor is a compound full-control voltage-driven power semiconductor device composed of a BJT (bipolar transistor) and a MOS (insulated gate field effect transistor), and mainly used as an adjusting circuit;
the outside of the IGBT module needs to be wrapped with a packaging structure, so that the IGBT module can be protected from impact, meanwhile, the data such as power, voltage and the like can be noted on the outside of the structure, the user can distinguish conveniently, the line connection position can be standardized, and connection errors are avoided; the IGBT module is long used in a high-voltage line and can generate heat in the use process.
The existing packaging structure is easy to be simple in structure, not only lacks a heat dissipation structure, but also is inconvenient to connect due to the fact that an external circuit and a circuit of the IGBT module are required to be in spot welding or physical contact connection, but the IGBT module and the packaging structure thereof are small in general, three circuits are required to be connected with the IGBT module, the outer joint of the traditional packaging module is often fixedly arranged on the outer side of the packaging module, the operation space is insufficient in the connection process, and connection of adjacent circuits is also mutually influenced.
To this end, the present invention provides a package structure of an IGBT module.
Disclosure of Invention
In order to overcome the deficiencies of the prior art, at least one technical problem presented in the background art is solved.
The technical scheme adopted for solving the technical problems is as follows: the invention discloses a packaging structure of an IGBT module, which comprises an upper disc and a lower disc, wherein the upper disc and the lower disc are fixedly connected through bolts, the bottom surface of the upper disc is provided with an opening, the top surface of the lower disc is provided with a butt joint groove, the butt joint groove is used for placing the IGBT module, the outer side of the lower disc is provided with a heat dissipation groove penetrating to the other side, the inner side of the heat dissipation groove is fixedly provided with a heat dissipation plate, the top surface of the upper disc is provided with three butt joint assemblies, the butt joint assemblies are used for connecting an external circuit and the IGBT module, during operation, the IGBT module is fixedly connected to the inner side of the butt joint groove, the upper disc and the lower disc are fixedly connected through the butt joint assemblies, the external circuit is connected with the IGBT module through the butt joint assemblies, the heat dissipation groove is arranged below the butt joint groove, and meanwhile, the structure of the heat dissipation plate is added, so that the contact area with the outside can be improved, the heat dissipation effect is effectively increased, and the heat generated by the IGBT module during operation can be rapidly dissipated.
Preferably, the docking assembly comprises three conductive sheets, the conductive sheets are made of metal materials, connecting wires are fixedly connected to the outer sides of the conductive sheets, three docking pipes are fixedly installed on the top surface of the upper disc, one end of each connecting wire, which is far away from the conductive sheets, penetrates through the inside of the upper disc and the inner sides of the docking pipes, one end of each connecting wire, which is far away from the conductive sheets, is fixedly connected with the docking head, the inner sides of the upper disc are provided with power assemblies, the power assemblies are used for winding the connecting wires, in the process of docking with an external circuit, in order to ensure the stability of circuit connection, the external circuit and the circuit of the IGBT module are generally required to be connected in a spot welding or physical contact mode, but the structure of the IGBT module and the packaging structure of the IGBT module is generally small in size, three circuits are generally required to be connected with the IGBT module, the outside at encapsulation module is often laid to the fixed outside at encapsulation module to the external joint of traditional encapsulation module, lead to the operation space in the connection process not enough, make the connection inconvenient, and the connection of adjacent circuit still can influence each other, through the setting of connecting wire and conducting strip, after the upper disc is laminated with the lower disc, through the contact of conducting strip, let IGBT module and conducting strip circuit connection, the outside extension of conducting strip rethread connecting wire, when connecting circuit, let three connecting wires pull open in three direction, reuse external circuit and butt joint connect in proper order, the problem that the space is insufficient, lead to the connection process to be blocked, after connecting, start power component can stimulate three connecting wires, with the butt joint income in the butt joint pipe, make the circuit integration of separation draw together, have spacious space when having guaranteed the circuit butt joint promptly, also can let the butt joint end after simultaneously, the circuit is neatly arranged.
Preferably, the power component includes the dial, the inboard fixed mounting of upper disc has the snap ring, the cross-section of snap ring is the form of buckling, the dial is located between snap ring and the upper disc, runs through three groups of holes have all been seted up in the outside of snap ring and dial, three groups of spouts have been seted up to the inside of upper disc, the connecting wire passes the snap ring and the hole of dial, also passes the spout of upper disc inside simultaneously, the through-hole has been seted up in the outside of upper disc, the inboard rotation of through-hole is connected with the driver plate, the outside of driver plate and the outside activity laminating of dial, during operation, after circuit connection is accomplished, only need manual rotation driver plate, let the driver plate rotate to a direction, just can drive the dial and rotate because the connecting wire has passed the hole of snap ring and dial, just can let the connecting wire buckle in the inboard of upper disc to let the rolling that the external world stretches out, let the butt joint of connecting wire tip retrieve in the butt joint take over, this kind of setting, not only simple structure can not take place trouble easily and the card, and the diameter of driver plate is less than the diameter of driver plate that the driver plate is difficult to take place to rotate the dial and the process of the driver plate is difficult to take place, and the driver plate rotates the driver plate and the process of the driver plate is rotated by oneself and can be difficult to take place, and the driver plate rotates the process of the driver plate is moved by oneself.
Preferably, the cross section of upper disc and lower disc all is oval setting, stir the dish and be oval annular setting, stir the dish and be elastic plastic material, three butt joint pipe is the equidistance and arranges at the upper disc outside edge, during operation, because the IGBT module is mostly rectangle structure, sets up upper disc and lower disc into oval, can adapt IGBT module more, can not excessively bloated, and elastic plastic material's stir the dish simultaneously also can normally rotate at the upper disc inboard.
Preferably, the outside of stirring the dish is provided with a plurality of unidirectional sheet, and a plurality of unidirectional sheet is the equidistance annular and arranges, unidirectional sheet's one end and the outside fixed connection of stirring the dish, unidirectional sheet is the arc setting, fixed mounting has a plurality of dog on the inside wall of upper disc, the dog is the arc setting, the dog is laminated with unidirectional sheet outside activity, during operation, cooperates unidirectional sheet and the setting of upper disc inside wall upper block, can form a unidirectional structure similar to the ratchet for stir the dish and only can unidirectional rotation, let the connecting wire of rolling outwards scatter easily in the later use under the effect of vibrations.
Preferably, the inside fixed mounting of stirring the dish has the interpolation ring, the interpolation ring is elastic metal material, the outside fixedly connected with of interpolation ring a plurality of inserted sheet, the inserted sheet is located the inboard of unidirectional sheet, during operation, elastic metal's interpolation ring can effectually improve stirring the whole intensity of dish, reduces under the high temperature environment of work, stirs the dish and is softened by the high temperature for can't continue the problem of restriction connecting wire, and the setting of inserted sheet can improve stirring the dish and only can unidirectional rotation's effect.
Preferably, the top surface of upper disc is last fixed mounting has three adsorption disc, circular shape recess has been seted up to the top surface of adsorption disc, the butt joint is metal material, the adsorption disc is magnetite material, and during operation, before structure encapsulation IGBT module, three connecting wire leaks in the upper disc outside, uses butt joint and adsorption disc butt joint, and the cooperation adsorbs the effect, can firmly grasp the butt joint, reduces external environment pollution, prevents too loose messy problem of three connecting wires simultaneously.
Preferably, annular draw-in groove has been seted up in the outside of butt joint, fixed mounting has the restriction piece that two symmetries set up on the inside wall of butt joint pipe, the restriction piece is the arc setting, and the restriction piece is elastic material, during operation, when the butt joint is pulling to enter into the butt joint pipe, curved restriction piece can not hinder the entering of butt joint pipe, gets into the back completely, and the restriction piece can block into the draw-in groove, can play a buckle effect, lets that butt joint can't outwards remove, has further guaranteed that three butt joint maintain in three butt joint pipe departments, lets the orderly effect of arranging of circuit.
Preferably, the butt joint is round platform form, and the tip is the opening setting, the width that the butt joint kept away from connecting wire one end is wider than the one end that is close to the connecting wire, the bending resistance that the butt joint kept away from connecting wire one end is weaker than the one end bending resistance that is close to the connecting wire, fixed mounting has a plurality of metal piece on the inside wall of butt joint, the tip of metal piece is smooth excessive setting, and during operation, cooperation butt joint's structure setting only needs to insert external circuit in the butt joint, inwards presses the edge of butt joint outermost side at this moment, makes its sunken, grabs external circuit with deformed butt joint edge, also can directly click the soldering tin of heating in the butt joint, with external circuit butt joint again to guaranteed the stability of circular telegram, and the metal piece can improve the effect of grabbing external terminal.
Preferably, the connecting wire comprises a conducting wire, the conducting wire is spiral, the outside of conducting wire has cup jointed the protective sheath, there is the gap between protective sheath and the conducting wire, during operation, the setting of cooperation connecting wire for the conducting wire of conducting circuit is spiral and lies in the protective sheath inboard for external pulling and extrusion to the connecting wire all can be used for the protective sheath outside, can not cause great influence to the conducting wire, effectually reduced the impaired problem of circuit
The beneficial effects of the invention are as follows:
1. according to the packaging structure of the IGBT module, the heat dissipation groove and the heat dissipation plate are arranged, the heat dissipation groove is arranged below the butt joint groove, and meanwhile, the heat dissipation plate is additionally arranged, so that the contact area with the outside can be increased, the heat dissipation effect is effectively increased, and the heat generated by the IGBT module during operation can be rapidly dissipated.
2. According to the packaging structure of the IGBT module, through the arrangement of the connecting wires and the conducting plates, after the upper disc is attached to the lower disc, the IGBT module is connected with the conducting plate through the contact of the conducting plates, the conducting plates are outwards extended through the connecting wires, when the circuit is connected, the three connecting wires are pulled away from each other in three directions, then the external circuit and the butt joint are sequentially connected, the problem of space deficiency and the blocking of the connecting process is solved, after the connection is finished, the power assembly is started to pull the three connecting wires, the butt joint is retracted into the butt joint pipe, so that separated circuits are integrated and folded, namely, the spacious space is ensured when the butt joint of the circuits is finished, and meanwhile, the circuits can be orderly distributed.
Drawings
The invention is further described below with reference to the accompanying drawings.
FIG. 1 is a perspective view of the present invention;
FIG. 2 is a perspective view of the lower disc of the present invention;
FIG. 3 is a bottom perspective view of the upper plate of the present invention;
FIG. 4 is a cross-sectional perspective view of the upper plate of the present invention;
FIG. 5 is a partial cutaway perspective view of the upper plate of the present invention;
FIG. 6 is a cross-sectional perspective view of a dial in accordance with the present invention;
FIG. 7 is a cross-sectional perspective view of the connecting wire of the present invention;
in the figure: 1. a top plate; 2. a dial; 3. a heat sink; 4. a butt joint pipe; 5. an adsorption plate; 6. butt joint; 7. a clamping groove; 8. a connecting wire; 9. a lower plate; 10. a heat dissipation plate; 11. a butt joint groove; 13. a conductive sheet; 14. a clasp; 15. limiting slices; 16. a chute; 17. a toggle plate; 18. a unidirectional sheet; 19. adding a ring; 20. inserting sheets; 21. a protective sleeve; 22. conductive wires.
Detailed Description
The invention is further described in connection with the following detailed description in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the invention easy to understand.
Example 1
As shown in fig. 1 to 2, the package structure of an IGBT module according to the embodiment of the invention includes an upper disc 1 and a lower disc 9, the upper disc 1 and the lower disc 9 are fixedly connected by bolts, the bottom surface of the upper disc 1 is provided with an opening, the top surface of the lower disc 9 is provided with a docking slot 11, the docking slot 11 is used for placing the IGBT module, the outer side of the lower disc 9 is provided with a heat dissipation slot 3 penetrating to the other side, the inner side of the heat dissipation slot 3 is fixedly provided with a heat dissipation plate 10, the top surface of the upper disc 1 is provided with three docking assemblies, the docking assemblies are used for connecting an external circuit and the IGBT module, during operation, the IGBT module is fixedly connected to the inner side of the docking slot 11, the upper disc 1 and the lower disc 9 are fixedly connected by the docking assemblies, the external circuit and the IGBT module are matched with the opening of the heat dissipation slot 3, the heat dissipation slot 3 is located below the docking slot 11, and meanwhile, the structure of the heat dissipation plate 10 is added, the contact area with the outside can be increased, the effect can be effectively increased, and the heat generated by the IGBT module can be rapidly dissipated during operation.
As shown in fig. 1 to 3, the docking assembly includes three conductive plates 13, the conductive plates 13 are made of metal materials, the outside of the conductive plates 13 is fixedly connected with a connecting wire 8, three docking pipes 4 are fixedly installed on the top surface of the upper disc 1, one end of the connecting wire 8 far away from the conductive plates 13 passes through the inside of the upper disc 1 and the inside of the docking pipes 4, one end of the connecting wire 8 far away from the conductive plates 13 is fixedly connected with a docking head 6, the inside of the upper disc 1 is provided with a power assembly, the power assembly is used for winding the connecting wire 8, in the process of docking with an external circuit, in order to ensure the stability of circuit connection, the external circuit and the circuit of the IGBT module are generally required to be in spot welding or physical contact connection, but the IGBT module and the packaging structure thereof are generally small in size, and three circuits are generally required for connection with the IGBT module, the outer joint of the traditional packaging module is often fixedly arranged at the outer side of the packaging module, so that the operation space is insufficient in the connecting process, the connection is inconvenient, the connection of adjacent lines can be mutually influenced, through the arrangement of the connecting lines 8 and the conducting sheets 13, after the upper disc 1 and the lower disc 9 are attached, the IGBT module is in circuit connection with the conducting sheets 13 through the contact of the conducting sheets 13, the conducting sheets 13 are outwards extended through the connecting lines 8, when the circuit is connected, the three connecting lines 8 are pulled out in three directions, then the external circuit and the butt joint 6 are sequentially connected, the problem of insufficient space is reduced, the connecting process is blocked is solved, after the connection is finished, the power assembly is started, the butt joint 6 can be pulled into the butt joint pipe 4, the separated lines are integrated and folded, so that the spacious space is ensured when the butt joint of the lines is finished, meanwhile, after the butt joint is finished, the lines are orderly arranged.
As shown in fig. 3 to 5, the power assembly comprises a toggle disc 17, a snap ring 14 is fixedly installed on the inner side of the upper disc 1, the cross section of the snap ring 14 is in a bent shape, the toggle disc 17 is positioned between the snap ring 14 and the upper disc 1, three groups of holes are formed through the outer sides of the snap ring 14 and the toggle disc 17, three groups of sliding grooves 16 are formed in the upper disc 1, the connecting wire 8 passes through the holes of the snap ring 14 and the toggle disc 17 and also passes through the sliding grooves 16 in the upper disc 1, through holes are formed in the outer side of the upper disc 1, a driving plate 2 is connected to the inner side of the through holes in a rotating mode, the outer side of the driving plate 2 is movably attached to the outer side of the toggle disc 17, and when the circuit connection is finished, the driving plate 2 only needs to be manually rotated, the dial 2 rotates towards one direction, the dial 17 can be driven to rotate, the connecting wire 8 passes through the holes of the clamping ring 14 and the dial 17, and the connecting wire 8 can be bent at the inner side of the upper disc 1 under the rotation of the dial 17, so that the connecting wire 8 which extends out from the outside is wound, the butt joint 6 at the end part of the connecting wire 8 is recycled into the butt joint pipe 4, the dial 2 is simple in structure and is not easy to fail and clamp, the diameter of the dial 2 is far smaller than that of the dial 17, the dial 2 drives the dial 17 to rotate in a labor-saving process, the dial 2 can easily drive the dial 17 to rotate, and the dial 17 is large in friction with the upper disc 1 and is difficult to move by itself.
As shown in fig. 1 to 4, the cross sections of the upper disc 1 and the lower disc 9 are all oval, the poking disc 17 is oval and annular, the poking disc 17 is made of elastic plastic materials, the three butt joint pipes 4 are distributed at equal intervals on the outer side edge of the upper disc 1, and in operation, the upper disc 1 and the lower disc 9 are arranged into oval shapes due to the fact that the IGBT modules are of rectangular structures, so that the IGBT modules can be more adapted, the poking disc 17 made of elastic plastic materials can not be excessively bulked, and meanwhile, the poking disc 17 made of the elastic plastic materials can normally rotate on the inner side of the upper disc 1.
As shown in fig. 3 to 6, the outside of the dial 17 is provided with a plurality of unidirectional sheets 18, a plurality of unidirectional sheets 18 are equidistantly and annularly arranged, one end of the unidirectional sheets 18 is fixedly connected with the outside of the dial 17, the unidirectional sheets 18 are in arc-shaped arrangement, a plurality of stoppers are fixedly mounted on the inner side wall of the upper disc 1 and are in arc-shaped arrangement, the stoppers are movably attached to the outer side of the unidirectional sheets 18, and in operation, the unidirectional sheets 18 and the stoppers on the inner side wall of the upper disc 1 are matched to form a unidirectional structure similar to a ratchet wheel, so that the dial 17 can only rotate unidirectionally, and the coiled connecting wire 8 cannot be easily scattered outwards in the future use process under the action of vibration.
As shown in fig. 6, the inside fixed mounting of dial 17 has the addition ring 19, the addition ring 19 is elastic metal material, the outside fixedly connected with of addition ring 19 has a plurality of inserted sheet 20, inserted sheet 20 is located the inboard of unidirectional sheet 18, during operation, the addition ring 19 of elastic metal can effectually improve dial 17 bulk strength, reduce under the high temperature environment of work, dial 17 is softened by the high temperature for unable problem of continuing restriction connecting wire 8, and the setting of inserted sheet 20 can improve dial 17 and only can unidirectional rotation's effect.
As shown in fig. 1 and fig. 4, three adsorption discs 5 are fixedly installed on the top surface of the upper disc 1, a circular lower groove is formed in the top surface of the adsorption disc 5, the butt joint 6 is made of metal materials, the adsorption disc 5 is made of magnetite materials, and when the structure is used for packaging an IGBT module, three connecting wires 8 are leaked outside the upper disc 1, butt joint is performed by using the butt joint 6 and the adsorption disc 5, the butt joint 6 can be firmly grasped by matching with the adsorption effect, the pollution of the external environment is reduced, and meanwhile, the problem that the three connecting wires 8 are too loose and messy is prevented.
As shown in fig. 3 to 4, the annular clamping groove 7 is formed in the outer side of the butt joint 6, two limiting pieces 15 which are symmetrically arranged are fixedly mounted on the inner side wall of the butt joint pipe 4, the limiting pieces 15 are arc-shaped, and the limiting pieces 15 are made of elastic materials, when the butt joint 6 is pulled to enter the butt joint pipe 4, the arc-shaped limiting pieces 15 cannot prevent the butt joint pipe 4 from entering, after the butt joint pipe is completely entered, the limiting pieces 15 can be clamped into the clamping groove 7, a clamping effect can be achieved, the butt joint pipe 6 cannot move outwards, and the effect that the three butt joint pipes 6 are maintained at the three butt joint pipes 4 is further guaranteed, and the lines are orderly distributed is further guaranteed.
As shown in fig. 1 to 3, the butt joint 6 is in a circular truncated cone shape, the end part is provided with an opening, the width of one end of the butt joint 6 far away from the connecting wire 8 is wider than the width of one end close to the connecting wire 8, the bending resistance of one end of the butt joint 6 far away from the connecting wire 8 is weaker than the bending resistance of one end close to the connecting wire 8, a plurality of metal blocks are fixedly arranged on the inner side wall of the butt joint 6, the end parts of the metal blocks are in smooth and excessive arrangement, and in operation, the structure arrangement of the butt joint 6 is matched, only an external circuit is needed to be inserted into the butt joint 6, at the moment, the edge of the outermost side of the butt joint 6 is inwards pressed to be sunken, the external circuit is grabbed by the deformed edge of the butt joint 6, and heated soldering tin can be directly screwed into the butt joint of the butt joint 6 and then is butted with an external circuit, so that the electrifying stability is ensured, and the effect of grabbing the external wire ends can be improved.
Example two
As shown in fig. 7, in comparative example one, another embodiment of the present invention is: the connecting wire 8 includes the conducting wire 22, the conducting wire 22 is the heliciform, the protective sheath 21 has been cup jointed in the outside of conducting wire 22, there is the gap between protective sheath 21 and the conducting wire 22, during operation, the setting of cooperation connecting wire 8 for the conducting wire 22 of conducting circuit is the heliciform and is located the protective sheath 21 inboard for external pulling and the extrusion to connecting wire 8 all can be used in the protective sheath 21 outside, can not cause great influence to the conducting wire 22, effectually reduced the impaired problem of circuit.
During operation, the IGBT module is fixedly connected to the inner side of the butt joint groove 11, the upper disc 1 and the lower disc 9 are in butt joint and fixed, an external circuit is connected with the IGBT module through the butt joint assembly, the heat dissipation groove 3 is arranged below the butt joint groove 11 in cooperation with the opening of the heat dissipation groove 3, meanwhile, the structure of the heat dissipation plate 10 is added, the contact area with the outside can be increased, the heat dissipation effect is effectively increased, and the heat generated by the IGBT module during operation can be rapidly dissipated; through the arrangement of the connecting wires 8 and the conducting plates 13, after the upper disc 1 and the lower disc 9 are attached, the IGBT module is connected with the conducting plates 13 through the contact of the conducting plates 13, the conducting plates 13 are outwards extended through the connecting wires 8, when the circuit is connected, the three connecting wires 8 are pulled away to three directions, then the external circuit and the butt joint 6 are sequentially connected, the problem of the blocking of the connecting process is solved, after the connection is finished, the power assembly is started to pull the three connecting wires 8, the butt joint 6 is retracted into the butt joint pipe 4, the separated circuits are integrated and folded, namely, the spacious space is ensured when the circuit is in butt joint, and meanwhile, the circuits are orderly arranged after the butt joint is finished; after circuit connection is finished, the dial plate 2 is only required to be manually rotated, the dial plate 2 rotates in one direction, the dial plate 17 can be driven to rotate, the connecting wire 8 passes through the holes of the clamping ring 14 and the dial plate 17, and the connecting wire 8 can be bent at the inner side of the upper plate 1 under the rotation of the dial plate 17, so that the connecting wire 8 which is stretched out from the outside is wound, the butt joint 6 at the end part of the connecting wire 8 is recycled into the butt joint pipe 4, the structure is simple, faults and blocking cannot easily occur, the diameter of the dial plate 2 is far smaller than that of the dial plate 17, the dial plate 2 drives the dial plate 17 to rotate in a labor-saving process, the dial plate 2 can easily drive the dial plate 17 to rotate, and the friction force between the dial plate 17 and the upper plate 1 is large, so that the dial plate is difficult to automatically move; because the IGBT module is mostly in a rectangular structure, the upper disc 1 and the lower disc 9 are arranged in an oval shape, the IGBT module can be more matched, the IGBT module is not excessively bulked, and meanwhile, the poking disc 17 made of elastic plastic materials can also normally rotate at the inner side of the upper disc 1; by matching with the arrangement of the one-way sheet 18 and the stop block on the inner side wall of the upper disc 1, a one-way structure similar to a ratchet wheel can be formed, so that the toggle disc 17 can only rotate in one direction, and the rolled connecting wire 8 can not be easily outwards dispersed under the action of vibration in the future use process; the elastic metal adding ring 19 can effectively improve the overall strength of the dial 17, reduce the problem that the dial 17 is softened at high temperature under the working high-temperature environment and cannot continuously limit the connecting wire 8, and the effect that the dial 17 can only rotate unidirectionally can be improved due to the arrangement of the inserting piece 20; before the IGBT module is packaged by the structure, three connecting wires 8 are leaked outside the upper disc 1, butt joint ends 6 are used for butt joint with the adsorption disc 5, and the butt joint ends 6 can be firmly grasped by matching with the adsorption effect, so that the pollution to the external environment is reduced, and meanwhile, the problem that the three connecting wires 8 are too loose and messy is prevented; when the butt joint 6 is pulled to enter the butt joint pipe 4, the arc-shaped limiting piece 15 does not prevent the butt joint pipe 4 from entering, after the butt joint pipe 4 completely enters, the limiting piece 15 can be clamped into the clamping groove 7, so that a clamping effect can be achieved, the butt joint 6 cannot move outwards, and the effect that three butt joint joints 6 are maintained at three butt joint pipes 4 and circuits are orderly distributed is further ensured; according to the structural arrangement of the butt joint 6, only an external circuit is required to be inserted into the butt joint 6, at the moment, the outermost edge of the butt joint 6 is pressed inwards to be sunken, the deformed edge of the butt joint 6 is used for grasping the external circuit, heated soldering tin can be directly put in the butt joint 6 and then is in butt joint with the external circuit, so that the electrifying stability is ensured, and the effect of grasping the external wire ends can be improved by the metal block; during operation, the setting of cooperation connecting wire 8, the conducting wire 22 for the conducting circuit is the heliciform and is located the protective sheath 21 inboard for the external world can both be used in the protective sheath 21 outside to the pulling and the extrusion of connecting wire 8, can not cause great influence to conducting wire 22, the impaired problem of circuit has effectually been reduced.
In the description of the present invention, it should be understood that the terms "center," "longitudinal," "lateral," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present invention and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the scope of the present invention.
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which is defined in the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (8)
1. The utility model provides a packaging structure of IGBT module which characterized in that: the intelligent solar energy collector comprises an upper disc (1) and a lower disc (9), wherein the upper disc (1) and the lower disc (9) are fixedly connected through bolts, the bottom surface of the upper disc (1) is provided with an opening, a butt joint groove (11) is formed in the top surface of the lower disc (9), the butt joint groove (11) is used for placing an IGBT module, a heat dissipation groove (3) penetrating through the outer side of the lower disc (9) is formed in the outer side of the lower disc, a heat dissipation plate (10) is fixedly arranged on the inner side of the heat dissipation groove (3), and three butt joint components are arranged on the top surface of the upper disc (1) and are used for connecting an external circuit and the IGBT module;
the butt joint assembly comprises three conducting plates (13), the conducting plates (13) are made of metal materials, connecting wires (8) are fixedly connected to the outer sides of the conducting plates (13), three butt joint pipes (4) are fixedly installed on the top surface of the upper disc (1), one end, far away from the conducting plates (13), of each connecting wire (8) penetrates through the inside of the upper disc (1) and the inner side of each butt joint pipe (4), one end, far away from the conducting plates (13), of each connecting wire (8) is fixedly connected with a butt joint head (6), and a power assembly is arranged on the inner side of the upper disc (1) and used for winding the connecting wires (8);
the power assembly comprises a stirring disc (17), a clamping ring (14) is fixedly arranged on the inner side of the upper disc (1), the section of the clamping ring (14) is in a bent shape, the stirring disc (17) is located between the clamping ring (14) and the upper disc (1), three groups of holes are formed in the outer sides of the clamping ring (14) and the stirring disc (17) in a penetrating mode, three groups of sliding grooves (16) are formed in the inner side of the upper disc (1), connecting wires (8) penetrate through the clamping ring (14) and the holes of the stirring disc (17), meanwhile penetrate through the sliding grooves (16) in the inner side of the upper disc (1), through holes are formed in the outer side of the upper disc (1), and a driving plate (2) is connected in a rotating mode on the inner side of the through holes and is in movable fit with the outer side of the stirring disc (17).
2. The IGBT module packaging structure of claim 1 wherein: the cross sections of the upper disc (1) and the lower disc (9) are all oval, the poking disc (17) is oval annular, the poking disc (17) is made of elastic plastic materials, and the three butt joint pipes (4) are distributed at equal intervals on the outer side edge of the upper disc (1).
3. The packaging structure of an IGBT module according to claim 2, wherein: the utility model discloses a dial dish, including dial dish (17), unidirectional piece (18), dog and unidirectional piece (18) are provided with a plurality of unidirectional piece (18) in the outside of dial dish (17), unidirectional piece (18) one end and dial the outside fixed connection of dish (17), unidirectional piece (18) are the arc setting, fixed mounting has a plurality of dog on the inside wall of upper disc (1), the dog is the arc setting, dog and unidirectional piece (18) outside activity laminating.
4. A packaging structure of an IGBT module according to claim 3, wherein: the inside fixed mounting of stir dish (17) has interpolation ring (19), interpolation ring (19) are elastic metal material, the outside fixedly connected with of interpolation ring (19) has a plurality of inserted sheet (20), inserted sheet (20) are located the inboard of unidirectional sheet (18).
5. The IGBT module packaging structure of claim 4 wherein: three adsorption discs (5) are fixedly mounted on the top surface of the upper disc (1), a circular lower groove is formed in the top surface of each adsorption disc (5), the butt joint (6) is made of metal materials, and each adsorption disc (5) is made of magnetite materials.
6. The IGBT module packaging structure of claim 5 wherein: annular draw-in groove (7) have been seted up in the outside of butt joint head (6), fixed mounting has two restriction piece (15) that the symmetry set up on the inside wall of butt joint pipe (4), restriction piece (15) are the arc setting, and restriction piece 15 is elastic material.
7. The IGBT module packaging structure of claim 6 wherein: the butt joint (6) is round table-shaped, the end part is provided with an opening, the width of one end of the butt joint (6) far away from the connecting wire (8) is wider than one end close to the connecting wire (8), the bending resistance of one end of the butt joint (6) far away from the connecting wire (8) is weaker than that of one end close to the connecting wire (8), a plurality of metal blocks are fixedly arranged on the inner side wall of the butt joint (6), and the end parts of the metal blocks are in smooth transition.
8. The IGBT module packaging structure of claim 7 wherein: the connecting wire (8) comprises a conducting wire (22), the conducting wire (22) is in a spiral shape, a protective sleeve (21) is sleeved on the outer side of the conducting wire (22), and a gap exists between the protective sleeve (21) and the conducting wire (22).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211221147.4A CN115642141B (en) | 2022-10-08 | 2022-10-08 | Packaging structure of IGBT module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211221147.4A CN115642141B (en) | 2022-10-08 | 2022-10-08 | Packaging structure of IGBT module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115642141A CN115642141A (en) | 2023-01-24 |
| CN115642141B true CN115642141B (en) | 2023-11-07 |
Family
ID=84943223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211221147.4A Active CN115642141B (en) | 2022-10-08 | 2022-10-08 | Packaging structure of IGBT module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115642141B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110648986A (en) * | 2019-11-05 | 2020-01-03 | 汉斯自动化科技(江苏)有限公司 | Packaging assembly of IGBT module |
| CN210605629U (en) * | 2019-12-10 | 2020-05-22 | 郑州商学院 | Big data server is with supplementary heat dissipation mechanism |
| CN210628291U (en) * | 2019-09-09 | 2020-05-26 | 湖北创新电气股份有限公司 | IGBT module |
| CN112542434A (en) * | 2019-09-23 | 2021-03-23 | 福特全球技术公司 | Power module assembly with cooling device |
| CN112635426A (en) * | 2020-12-17 | 2021-04-09 | 曾永响 | Lead frame for chip packaging |
| CN213210938U (en) * | 2020-11-25 | 2021-05-14 | 国家电网有限公司 | Electronic label reading device |
| CN114034890A (en) * | 2021-11-12 | 2022-02-11 | 台州安耐杰电力设备有限公司 | Three-phase digital low-voltage loop measurement and control terminal |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090213541A1 (en) * | 2008-02-27 | 2009-08-27 | Matthew Allen Butterbaugh | Cooling Plate Assembly with Fixed and Articulated Interfaces, and Method for Producing Same |
| JP7528557B2 (en) * | 2020-06-19 | 2024-08-06 | 日本電気株式会社 | Quantum device and method of manufacturing same |
-
2022
- 2022-10-08 CN CN202211221147.4A patent/CN115642141B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210628291U (en) * | 2019-09-09 | 2020-05-26 | 湖北创新电气股份有限公司 | IGBT module |
| CN112542434A (en) * | 2019-09-23 | 2021-03-23 | 福特全球技术公司 | Power module assembly with cooling device |
| CN110648986A (en) * | 2019-11-05 | 2020-01-03 | 汉斯自动化科技(江苏)有限公司 | Packaging assembly of IGBT module |
| CN210605629U (en) * | 2019-12-10 | 2020-05-22 | 郑州商学院 | Big data server is with supplementary heat dissipation mechanism |
| CN213210938U (en) * | 2020-11-25 | 2021-05-14 | 国家电网有限公司 | Electronic label reading device |
| CN112635426A (en) * | 2020-12-17 | 2021-04-09 | 曾永响 | Lead frame for chip packaging |
| CN114034890A (en) * | 2021-11-12 | 2022-02-11 | 台州安耐杰电力设备有限公司 | Three-phase digital low-voltage loop measurement and control terminal |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115642141A (en) | 2023-01-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN115642141B (en) | Packaging structure of IGBT module | |
| CN109623220A (en) | Converge welder and solar cell chip bonding machine | |
| CN215007915U (en) | Clamping device for winding of inductor | |
| CN219268883U (en) | Prevent energy router of taking off line | |
| CN203718161U (en) | Wire clip | |
| CN206561200U (en) | Continuous aluminium-to-nickel positioner | |
| CN206595534U (en) | USB terminal automatic feeding devices | |
| CN205159544U (en) | Low pressure is salvageed and is pressed from both sides with anti tension wire | |
| US4135573A (en) | Heat shielding tool | |
| CN217363628U (en) | Heat-dissipation insulation fixing device for electronic component | |
| CN214627482U (en) | MOS tube with quick plug-in structure | |
| CN221862658U (en) | Frequency converter convenient for internal wiring | |
| CN220462546U (en) | Duplex position welding jig | |
| CN210703077U (en) | Ultrasonic wire harness welding machine | |
| CN214989327U (en) | High-efficient coiling mechanism of cable for power cable | |
| CN212625436U (en) | Circuit breaker wiring terminal with locking structure | |
| CN220971063U (en) | Device for improving on-resistance of power device | |
| CN217302742U (en) | Large-scale LED heat abstractor | |
| CN112984240B (en) | Quick-inserting pipe fitting | |
| CN220934748U (en) | Wire traction device | |
| CN217666123U (en) | Clamping tool for processing pin of high-power diode | |
| CN214602676U (en) | Trapezoidal welding strip | |
| CN210246143U (en) | Based on electric wire is laid and is dragged ware with portable | |
| CN203401174U (en) | Welding wire connecting device | |
| CN110096110B (en) | Built-in clamping groove for computer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |