CN212230417U - Electronic chip with constant temperature function - Google Patents
Electronic chip with constant temperature function Download PDFInfo
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- CN212230417U CN212230417U CN202021135128.6U CN202021135128U CN212230417U CN 212230417 U CN212230417 U CN 212230417U CN 202021135128 U CN202021135128 U CN 202021135128U CN 212230417 U CN212230417 U CN 212230417U
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- electronic chip
- constant temperature
- heat dissipation
- outer side
- temperature function
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Abstract
The utility model discloses an electronic chip with constant temperature function, which comprises an electronic chip main body, wherein the outer side of the electronic chip main body is connected with an auxiliary heat dissipation mechanism, the bottom of the auxiliary heat dissipation mechanism is provided with a positioning sucker, the top of the auxiliary heat dissipation mechanism is provided with heat dissipation silicone grease, and an installation mechanism extending to the outer side is embedded in the electronic chip main body; the utility model can be used by matching the heat conducting sleeve with the heat radiating silicone grease through the arrangement of the auxiliary heat radiating mechanism, has high heat conductivity and excellent heat conductivity, can radiate the electronic chip main body, ensures that the electronic chip main body can keep constant temperature for a long time when in use, and ensures stable operation; the utility model discloses can pass through installation mechanism's setting, make the erection column move to the outside and the card goes into to go into in the installation position to completion that can be convenient is comparatively simple and convenient to the installation of electronic chip main part.
Description
Technical Field
The utility model belongs to the technical field of the electronic chip, concretely relates to electronic chip with constant temperature function.
Background
The electronic chip is manufactured by interconnecting elements such as transistors, diodes, resistors, capacitors, inductors and the like required in a circuit and wiring together on a small or a plurality of small semiconductor wafers or medium substrates by adopting a certain process, and then is packaged in a tube shell to form a micro structure with the required circuit function; all elements are structurally integrated, certain heat can be emitted when the conventional electronic chip is used, and the problem of influencing the running stability of the electronic chip exists if the temperature is too high.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an electronic chip with constant temperature function to current electronic chip who proposes in solving above-mentioned background art can give off certain heat during the use, if the high temperature then can have the stable problem of influence electronic chip operation.
In order to achieve the above object, the utility model provides a following technical scheme: an electronic chip with a constant temperature function comprises an electronic chip main body, wherein an auxiliary heat dissipation mechanism is connected to the outer side of the electronic chip main body, a positioning sucker is mounted at the bottom of the auxiliary heat dissipation mechanism, heat dissipation silicone grease is arranged at the top of the auxiliary heat dissipation mechanism, and an installation mechanism extending to the outer side is embedded in the electronic chip main body;
the auxiliary heat dissipation mechanism comprises a heat conduction sleeve, wherein the inner walls of two sides of the heat conduction sleeve are provided with movable rods penetrating through the other sides of the heat conduction sleeve, one ends of the movable rods are fixed with connecting blocks, the other ends of the movable rods are fixed with installation blocks, the outer sides of the installation blocks are connected with extrusion springs, the outer sides of the movable rods are in threaded connection with threaded sleeves, connection pads are fixed on the outer sides of the installation blocks, and sliders are arranged at the tops of the connection pads.
Preferably, installation mechanism includes the protective housing, one side inner wall of protective housing is provided with the mounting pad, the outside of mounting pad is connected with connecting spring, connecting spring's the other end is connected with the connecting plate, the opposite side of connecting plate is fixed with the erection column, the outside of connecting plate is provided with the stopper.
Preferably, a limiting groove is formed in the protective shell, and a matching component is arranged between the limiting groove and the limiting block.
Preferably, the inner top wall of the heat conduction sleeve is attached to the outer side of the electronic chip main body.
Preferably, a sliding groove is formed in the heat conduction sleeve, and a sliding fit component is arranged between the sliding groove and the sliding block.
Preferably, the outer side of the connecting block is provided with a groove, and the outer side of the connecting block is provided with anti-skid lines.
Preferably, one end of the extrusion spring is fixedly connected with the inner wall of the heat conduction sleeve, and the positioning sucker is fixedly connected with the bottom of the heat conduction sleeve.
Compared with the prior art, the beneficial effects of the utility model are that:
(1) the utility model discloses can be through the setting of supplementary heat dissipation mechanism, heat conduction sleeve cooperation heat dissipation silicone grease uses, has the high thermal conductivity, and splendid heat conductivity can dispel the heat to the electronic chip main part, ensures that the electronic chip main part can keep constant temperature for a long time when using, ensures to operate stably.
(2) The utility model discloses can pass through installation mechanism's setting, make the erection column move to the outside and the card goes into to go into in the installation position to completion that can be convenient is comparatively simple and convenient to the installation of electronic chip main part.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a schematic structural view of the auxiliary heat dissipation mechanism of the present invention;
FIG. 3 is a schematic view of the structure of the installation mechanism of the present invention;
in the figure: 1. an electronic chip body; 2. an auxiliary heat dissipation mechanism; 21. a heat conducting sleeve; 22. a movable rod; 23. connecting blocks; 24. mounting blocks; 25. a compression spring; 26. a threaded sleeve; 27. a connecting pad; 28. a slider; 3. positioning a sucker; 4. heat dissipation silicone grease; 5. an installation mechanism; 51. a protective shell; 52. a mounting mat; 53. a connecting spring; 54. a connecting plate; 55. mounting a column; 56. and a limiting block.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example 1
Referring to fig. 1-2, the present invention provides a technical solution: an electronic chip with a constant temperature function comprises an electronic chip main body 1, wherein the outer side of the electronic chip main body 1 is connected with an auxiliary heat dissipation mechanism 2, the bottom of the auxiliary heat dissipation mechanism 2 is provided with a positioning sucker 3, the top of the auxiliary heat dissipation mechanism 2 is provided with heat dissipation silicone grease 4, and an installation mechanism 5 extending to the outer side is embedded in the electronic chip main body 1;
the auxiliary heat dissipation mechanism 2 comprises a heat conduction sleeve 21, the inner walls of two sides of the heat conduction sleeve 21 are respectively provided with a movable rod 22 penetrating through the other side of the heat conduction sleeve, one end of the movable rod 22 is fixed with a connecting block 23, the other end of the movable rod 22 is fixed with an installation block 24, the outer side of the installation block 24 is connected with an extrusion spring 25, the outer side of the movable rod 22 is in threaded connection with a threaded sleeve 26, the outer side of the installation block 24 is fixed with a connecting pad 27, and the top of the connecting pad 27 is provided with a slide block 28. when the device is used, the position of the movable rod 22 can be limited through the auxiliary heat dissipation mechanism 2, the extrusion spring 25 can provide elastic force, one side of the installation block 24 can be pushed in the horizontal direction to move, meanwhile, the connecting pad 27 can be driven to move in the horizontal direction, at the moment, the position of the movable rod 22 can, the electronic chip body 1 has high thermal conductivity and excellent thermal conductivity, can dissipate heat, ensures that the electronic chip body 1 can keep constant temperature for a long time when in use, and ensures stable operation.
In this embodiment, preferably, the inner top wall of the heat conductive sleeve 21 is attached to the outer side of the electronic chip main body 1.
In this embodiment, preferably, a sliding groove is formed in the heat conducting sleeve 21, and a sliding fit component is arranged between the sliding groove and the sliding block 28.
In this embodiment, preferably, the outer side of the connecting block 23 is provided with a groove, and the outer side of the connecting block 23 is provided with an anti-slip pattern.
In this embodiment, preferably, one end of the pressing spring 25 is fixedly connected to the inner wall of the heat conductive sleeve 21, and the positioning suction cup 3 is fixedly connected to the bottom of the heat conductive sleeve 21.
Example 2
Referring to fig. 1-3, the present invention provides a technical solution: an electronic chip with a constant temperature function comprises an electronic chip main body 1, wherein the outer side of the electronic chip main body 1 is connected with an auxiliary heat dissipation mechanism 2, the bottom of the auxiliary heat dissipation mechanism 2 is provided with a positioning sucker 3, the top of the auxiliary heat dissipation mechanism 2 is provided with heat dissipation silicone grease 4, and an installation mechanism 5 extending to the outer side is embedded in the electronic chip main body 1;
the auxiliary heat dissipation mechanism 2 comprises a heat conduction sleeve 21, the inner walls of two sides of the heat conduction sleeve 21 are respectively provided with a movable rod 22 penetrating through the other side of the heat conduction sleeve, one end of the movable rod 22 is fixed with a connecting block 23, the other end of the movable rod 22 is fixed with an installation block 24, the outer side of the installation block 24 is connected with an extrusion spring 25, the outer side of the movable rod 22 is in threaded connection with a threaded sleeve 26, the outer side of the installation block 24 is fixed with a connecting pad 27, and the top of the connecting pad 27 is provided with a slide block 28. when the device is used, the position of the movable rod 22 can be limited through the auxiliary heat dissipation mechanism 2, the extrusion spring 25 can provide elastic force, one side of the installation block 24 can be pushed in the horizontal direction to move, meanwhile, the connecting pad 27 can be driven to move in the horizontal direction, at the moment, the position of the movable rod 22 can, the electronic chip body 1 has high thermal conductivity and excellent thermal conductivity, can dissipate heat, ensures that the electronic chip body 1 can keep constant temperature for a long time when in use, and ensures stable operation.
In this embodiment, preferably, the mounting mechanism 5 includes a protective housing 51, a mounting pad 52 is disposed on an inner wall of one side of the protective housing 51, a connecting spring 53 is connected to an outer side of the mounting pad 52, a connecting plate 54 is connected to another end of the connecting spring 53, a mounting post 55 is fixed to another side of the connecting plate 54, a limiting block 56 is disposed on an outer side of the connecting plate 54, in a using process, the mounting mechanism 5 can be set, when the electronic chip main body 1 is mounted, a user can press one side of the mounting post 55, and can provide an elastic force through the connecting spring 53 in the protective housing 51, one side of the connecting plate 54 can be pushed to the outside, and the mounting post 55 can be moved to the outside and can be clamped into a mounting portion, so that the mounting of the.
In this embodiment, preferably, a limiting groove is formed in the protective shell 51, and a matching member is arranged between the limiting groove and the limiting block 56.
In this embodiment, preferably, the inner top wall of the heat conductive sleeve 21 is attached to the outer side of the electronic chip main body 1.
In this embodiment, preferably, a sliding groove is formed in the heat conducting sleeve 21, and a sliding fit component is arranged between the sliding groove and the sliding block 28.
In this embodiment, preferably, the outer side of the connecting block 23 is provided with a groove, and the outer side of the connecting block 23 is provided with an anti-slip pattern.
In this embodiment, preferably, one end of the pressing spring 25 is fixedly connected to the inner wall of the heat conductive sleeve 21, and the positioning suction cup 3 is fixedly connected to the bottom of the heat conductive sleeve 21.
The utility model discloses a theory of operation and use flow: when the device is used, the auxiliary heat dissipation mechanism 2 can be arranged, elastic force can be provided through the extrusion spring 25, one side of the installation block 24 can be pushed to move in the horizontal direction, meanwhile, the connection pad 27 can be driven to move in the horizontal direction, the position of the movable rod 22 can be limited through the threaded sleeve 26 at the moment, the connection pad 27 is ensured to be clamped on the outer side of the electronic chip main body 1, the heat conduction sleeve 21 is matched with the heat dissipation silicone grease 4 for use at the moment, the heat conduction sleeve has high heat conductivity and excellent heat conductivity, the heat dissipation can be carried out on the electronic chip main body 1, the electronic chip main body 1 can be ensured to keep constant temperature for a long time when in; in the use process, through the setting of installation mechanism 5, when installing electronic chip main part 1, the user can press one side of erection column 55 to the connecting spring 53 in accessible protective housing 51 provides elasticity, can outwards promote one side of connecting plate 54, and make erection column 55 outwards remove and block in the card income installation position, thereby can be convenient the completion to the installation of electronic chip main part 1, it is comparatively simple and convenient to operate.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides an electronic chip with constant temperature function, includes electronic chip main part (1), the outside of electronic chip main part (1) is connected with supplementary heat dissipation mechanism (2), its characterized in that: a positioning sucker (3) is installed at the bottom of the auxiliary heat dissipation mechanism (2), heat dissipation silicone grease (4) is arranged at the top of the auxiliary heat dissipation mechanism (2), and an installation mechanism (5) extending to the outer side is embedded in the electronic chip main body (1);
supplementary heat dissipation mechanism (2) are including heat conduction cover (21), the both sides inner wall of heat conduction cover (21) all is provided with movable rod (22) that runs through its opposite side, the one end of movable rod (22) is fixed with connecting block (23), the other end of movable rod (22) is fixed with installation piece (24), the outside of installation piece (24) is connected with extrusion spring (25), the outside threaded connection of movable rod (22) has thread bush (26), the outside of installation piece (24) is fixed with connection pad (27), the top of connection pad (27) is provided with slider (28).
2. An electronic chip with a constant temperature function according to claim 1, characterized in that: installation mechanism (5) are including protective housing (51), one side inner wall of protective housing (51) is provided with mounting pad (52), the outside of mounting pad (52) is connected with connecting spring (53), the other end of connecting spring (53) is connected with connecting plate (54), the opposite side of connecting plate (54) is fixed with erection column (55), the outside of connecting plate (54) is provided with stopper (56).
3. An electronic chip with a constant temperature function according to claim 2, characterized in that: a limiting groove is formed in the protective shell (51), and a matching component is arranged between the limiting groove and the limiting block (56).
4. An electronic chip with a constant temperature function according to claim 1, characterized in that: the inner top wall of the heat conduction sleeve (21) is attached to the outer side of the electronic chip main body (1).
5. An electronic chip with a constant temperature function according to claim 1, characterized in that: a sliding groove is formed in the heat conduction sleeve (21), and a sliding fit component is arranged between the sliding groove and the sliding block (28).
6. An electronic chip with a constant temperature function according to claim 1, characterized in that: the outer side of the connecting block (23) is provided with a groove, and the outer side of the connecting block (23) is provided with anti-skid lines.
7. An electronic chip with a constant temperature function according to claim 1, characterized in that: one end of the extrusion spring (25) is fixedly connected with the inner wall of the heat conduction sleeve (21), and the positioning sucker (3) is fixedly connected with the bottom of the heat conduction sleeve (21).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021135128.6U CN212230417U (en) | 2020-06-18 | 2020-06-18 | Electronic chip with constant temperature function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021135128.6U CN212230417U (en) | 2020-06-18 | 2020-06-18 | Electronic chip with constant temperature function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212230417U true CN212230417U (en) | 2020-12-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021135128.6U Active CN212230417U (en) | 2020-06-18 | 2020-06-18 | Electronic chip with constant temperature function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212230417U (en) |
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2020
- 2020-06-18 CN CN202021135128.6U patent/CN212230417U/en active Active
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