CN212367683U

CN212367683U - Semiconductor circuit electronic application equipment

Info

Publication number: CN212367683U
Application number: CN202021114266.6U
Authority: CN
Inventors: 王家校
Original assignee: Shenzhen Weicun Technology Co ltd
Current assignee: Shenzhen Weicun Technology Co ltd
Priority date: 2020-06-16
Filing date: 2020-06-16
Publication date: 2021-01-15
Anticipated expiration: 2030-06-16

Abstract

The utility model discloses a semiconductor circuit electronic application device, which comprises a main body, a fireproof plate, a bottom plate and an insulating plate, wherein the bottom end of the main body is provided with the bottom plate, the bottom end inside the bottom plate is uniformly provided with a buffer structure, the buffer structure comprises a fixed connecting rod, a buffer spring, a limiting connecting rod and a rubber pad, the fixed connecting rod is uniformly fixed at the bottom end inside the bottom plate, the top end of the fixed connecting rod is provided with the limiting connecting rod, the top end of the limiting connecting rod is provided with the rubber pad, the inside of the fixed connecting rod is provided with the buffer spring, two sides inside the bottom plate are provided with chutes, the utility model discloses a clamping groove arranged at the bottom ends of two sides of the insulating plate, clamping blocks are clamped in the clamping grooves, so that active carbon is fixed, the active carbon can absorb moisture, the electric leakage, the clamping block is pressed, the return spring is compressed, the clamping groove and the clamping block are loosened, and then the active carbon can be taken down.

Description

Semiconductor circuit electronic application equipment

Technical Field

The utility model relates to a semiconductor application technology field specifically is a semiconductor circuit electronic application equipment.

Background

The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, the semiconductor is applied to the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, and common semiconductor materials include silicon, germanium, gallium arsenide and the like:

the traditional circuit electronic application equipment has poor buffering capacity when in use, and is easy to cause the damage of precision instruments or precision matching parts in the circuit electronic application equipment when moving or being subjected to external force action.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a semiconductor circuit electronic application equipment to solve the relatively poor problem of circuit electronic application equipment buffer capacity who proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a semiconductor circuit electronic application device comprises a main body, a fireproof plate, a bottom plate and an insulating plate, wherein the bottom of the main body is provided with the bottom plate, the bottom inside the bottom plate is uniformly provided with a buffer structure, the buffer structure comprises a fixed connecting rod, a buffer spring, a limiting connecting rod and a rubber pad, the fixed connecting rod is uniformly fixed at the bottom inside the bottom plate, the top ends of the fixed connecting rod are respectively provided with the limiting connecting rod, the top ends of the limiting connecting rod are respectively provided with the rubber pad, the inside of the fixed connecting rod is respectively provided with the buffer spring, two sides inside the bottom plate are respectively provided with a sliding chute, the bottom ends of two sides of the main body are respectively provided with a sliding block, two sides of the main body are respectively provided with a servo motor, one side of each servo motor is respectively provided with a rotating shaft, one side of each rotating shaft is hinged with a movable rod, the fan is all installed to one side of movable frame, the PLASTIC LAMINATED is all installed to the inside both sides of main part, and the insulation board is all installed to one side of PLASTIC LAMINATED, the fixed block is all installed at the both ends of insulation board one side, the inside bottom of main part is provided with water absorption structure.

Preferably, the outer diameter of the sliding block is smaller than the inner diameter of the sliding groove, and the bottom plate and the sliding groove form a sliding structure.

Preferably, the water absorption structure comprises a clamping groove, a clamping block, a connecting block and activated carbon, the clamping groove is fixed at the bottom of two sides of the insulating plate, the clamping block is installed at one side of the clamping groove, a reset spring is installed between every two adjacent clamping blocks, the connecting block is installed at one side of each clamping block, and the activated carbon is installed between every two adjacent connecting blocks.

Preferably, the clamping block is arranged in an L shape, and the clamping block and the clamping groove form a clamping structure.

Preferably, the buffer springs are all located in the same horizontal plane, and the buffer springs are symmetrically distributed about the vertical center of the rubber pad.

Preferably, the top ends of the buffer structures are connected with the bottom end of the main body, and the buffer structures are arranged at equal intervals at the bottom end of the main body.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the buffer spring can play a role in buffering through the buffer spring uniformly arranged at the bottom end of the main body, when the equipment runs, the vibration generated by the equipment is transmitted to the rubber pad, the buffer spring is compressed, the limiting connecting rod slides downwards along the fixed connecting rod, and the main body can slide downwards along the sliding chute along with the sliding block, so that the main body has a certain space for moving downwards, and a certain buffering effect is obtained;

2. the clamping grooves are arranged at the bottom ends of the two sides of the insulating plate, the clamping blocks are clamped in the clamping grooves, so that the active carbon is fixed, the active carbon can absorb moisture, the electric leakage in the main body is prevented to a certain extent, when the active carbon needs to be disassembled or replaced, the clamping blocks are pressed, the reset spring is compressed, the clamping grooves and the clamping blocks are loosened, and the active carbon can be taken down;

3. through the servo motor of main part both sides fixed mounting, start servo motor, pivot and movable rod rotate, and the fixed movable connecting rod of fixed block, fan along with movable connecting rod reciprocating motion from top to bottom starts the fan, can dispel the heat to main part inside to a certain extent.

Drawings

Fig. 1 is a schematic view of a front view structure section structure of the present invention;

FIG. 2 is a schematic view of a partial structure of the water absorption structure of the present invention;

fig. 3 is an enlarged schematic structural view of a point a in fig. 1 according to the present invention;

fig. 4 is a schematic diagram of the side-viewing structure of the up-down moving structure of the present invention.

In the figure: 1. a main body; 2. a fire-proof plate; 3. a servo motor; 4. a base plate; 5. a chute; 6. a water absorbing structure; 601. a card slot; 602. a clamping block; 603. connecting blocks; 604. activated carbon; 605. a return spring; 7. a buffer structure; 701. fixing the connecting rod; 702. a buffer spring; 703. a limiting connecting rod; 704. a rubber pad; 8. a slider; 9. a movable connecting rod; 10. a fixed block; 11. a fan; 12. a rotating shaft; 13. a movable frame; 14. an insulating plate; 15. a movable rod.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides an embodiment: a semiconductor circuit electronic application device comprises a main body 1, a fireproof plate 2, a bottom plate 4 and an insulating plate 14, wherein the bottom end of the main body 1 is provided with the bottom plate 4, the bottom end inside the bottom plate 4 is uniformly provided with a buffer structure 7, the buffer structure 7 comprises a fixed connecting rod 701, buffer springs 702, limiting connecting rods 703 and rubber pads 704, the fixed connecting rods 701 are uniformly fixed at the bottom end inside the bottom plate 4, the limiting connecting rods 703 are mounted at the top ends of the fixed connecting rods 701, the rubber pads 704 are mounted at the top ends of the limiting connecting rods 703, the buffer springs 702 are mounted inside the fixed connecting rods 701 and are positioned in the same horizontal plane, and the buffer springs 702 are symmetrically distributed about the vertical center of the rubber pads 704, so that the buffer;

the top end of the buffer structure 7 is connected with the bottom end of the main body 1, the buffer structures 7 are arranged at the bottom end of the main body 1 at equal intervals, when the equipment runs, the vibration generated by the equipment is transmitted to the rubber pad 704, the buffer spring 702 is compressed, the limiting connecting rod 703 slides downwards along the fixed connecting rod 701, and the main body 1 can slide downwards along the sliding chute 5 along with the sliding block 8, so that the main body 1 has a certain space moving downwards to obtain a certain buffer effect;

the sliding grooves 5 are formed in the two sides of the inner part of the bottom plate 4, the sliding blocks 8 are mounted at the bottom ends of the two sides of the main body 1, the outer diameter of each sliding block 8 is smaller than the inner diameter of each sliding groove 5, and the bottom plate 4 and the sliding grooves 5 form a sliding structure which is convenient to slide;

the circuit electronic equipment comprises a main body 1, servo motors 3, a rotating shaft 12, a movable rod 15, a movable frame 13, movable connecting rods 9, a fan 11, a fixed block 10, a fan 11 and a fan body, wherein the servo motors 3 are arranged on two sides of the main body 1, the rotating shaft 12 is arranged on one side of each servo motor 3, the movable rod 15 is hinged to one side of each rotating shaft 12, the movable frame 13 is arranged on one side of each movable rod 15, the movable connecting rods 9 are arranged at the top end and the bottom end of each movable frame 13, and the fan 11 is started and can dissipate heat inside the main body 1 to a certain extent when the circuit electronic equipment needs to dissipate heat during working;

the fireproof plate 2 is arranged on two sides of the interior of the main body 1, the insulating plate 14 is arranged on one side of the fireproof plate 2, the fixing blocks 10 are arranged on two ends of one side of the insulating plate 14, the water absorption structure 6 is arranged on the bottom end of the interior of the main body 1, the water absorption structure 6 comprises clamping grooves 601, clamping blocks 602, connecting blocks 603 and active carbon 604, the clamping grooves 601 are fixed on the bottom ends of two sides of the insulating plate 14, the clamping blocks 602 are arranged on one side of the clamping grooves 601, the reset springs 605 are arranged between the adjacent clamping blocks 602, the connecting blocks 603 are arranged on one side of each clamping block 602, the active carbon 604 is arranged between the adjacent connecting blocks 603, the clamping blocks 602 are arranged in an L shape, the clamping blocks 602 and the clamping grooves 601 form a clamping structure, the clamping grooves 601 clamp the clamping blocks 602, so that the active carbon 604 is fixed, the active carbon 604 can absorb moisture, the fixture block 602 is pressed, the return spring 605 is compressed, the fixture groove 601 and the fixture block 602 are loosened, and the active carbon 604 can be taken down.

The working principle is as follows: when the circuit electronic equipment works and needs heat dissipation, the servo motor 3 is started, the rotating shaft 12 and the movable rod 15 rotate, the fixed block 10 fixes the movable connecting rod 9, the fan 11 moves up and down in a reciprocating mode along with the movable connecting rod 9, the fan 11 is started, and the inside of the main body 1 can be dissipated to a certain degree;

then, the clamping groove 601 is clamped with the clamping block 602, so that the active carbon 604 is fixed, the active carbon 604 can absorb moisture, the electric leakage in the main body 1 is prevented to a certain extent, when the active carbon 604 needs to be dismounted or replaced, the clamping block 602 is pressed, the return spring 605 is compressed, the clamping groove 601 and the clamping block 602 are loosened, and the active carbon 604 can be taken down;

finally, when the device is operated, the vibration generated by the device is transmitted to the rubber pad 704, the buffer spring 702 is compressed, the limit connecting rod 703 slides downwards along the fixed connecting rod 701, and the main body 1 can slide downwards along the sliding chute 5 along with the sliding block 8, so that the main body 1 has a certain space moving downwards, a certain buffer effect is obtained, and the work of the semiconductor circuit electronic application device is finally completed.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.

Claims

1. A semiconductor circuit electronic appliance comprising a main body (1), a fire-resistant plate (2), a base plate (4) and an insulating plate (14), characterized in that: the bottom of the main body (1) is provided with a bottom plate (4), the bottom inside the bottom plate (4) is uniformly provided with a buffer structure (7), the buffer structure (7) comprises a fixed connecting rod (701), a buffer spring (702), a limiting connecting rod (703) and a rubber pad (704), the fixed connecting rod (701) is uniformly fixed at the bottom inside the bottom plate (4), the limiting connecting rod (703) is installed at the top end of the fixed connecting rod (701), the rubber pad (704) is installed at the top end of the limiting connecting rod (703), the buffer spring (702) is installed inside the fixed connecting rod (701), sliding grooves (5) are arranged at two sides inside the bottom plate (4), sliding blocks (8) are installed at the bottom ends of two sides of the main body (1), a servo motor (3) is installed at two sides of the main body (1), and a rotating shaft (12) is installed at one side of the servo motor (3, one side of pivot (12) all articulates there is movable rod (15), movable frame (13) are all installed to one side of movable rod (15), and movable connecting rod (9) are all installed to the top and the bottom of movable frame (13), fan (11) are all installed to one side of movable frame (13), PLASTIC LAMINATED (2) are all installed to the inside both sides of main part (1), and one side of PLASTIC LAMINATED (2) all installs insulation board (14), fixed block (10) are all installed at the both ends of insulation board (14) one side, the inside bottom of main part (1) is provided with water-absorbing structure (6).

2. A semiconductor circuit electronic appliance as claimed in claim 1, characterized in that: the outer diameter of the sliding block (8) is smaller than the inner diameter of the sliding groove (5), and the bottom plate (4) and the sliding groove (5) form a sliding structure.

3. A semiconductor circuit electronic appliance as claimed in claim 1, characterized in that: water absorption structure (6) are including draw-in groove (601), fixture block (602), connecting block (603) and active carbon (604), the bottom in insulation board (14) both sides is all fixed in draw-in groove (601), fixture block (602) are all installed to one side of draw-in groove (601), and all install reset spring (605) between adjacent fixture block (602), connecting block (603) are all installed to one side of fixture block (602), and install active carbon (604) between adjacent connecting block (603).

4. A semiconductor circuit electronic appliance as claimed in claim 3, characterized in that: the clamping block (602) is arranged in an L shape, and the clamping block (602) and the clamping groove (601) form a clamping structure.

5. A semiconductor circuit electronic appliance as claimed in claim 1, characterized in that: the buffer springs (702) are all in the same horizontal plane, and the buffer springs (702) are symmetrically distributed around the vertical center of the rubber pad (704).

6. A semiconductor circuit electronic appliance as claimed in claim 1, characterized in that: the top of buffer structure (7) all is connected with the bottom of main part (1), buffer structure (7) are the equidistant range in the bottom of main part (1).