CN110648810A - Manufacturing method of turning gauge resistor and turning gauge resistor - Google Patents
Manufacturing method of turning gauge resistor and turning gauge resistor Download PDFInfo
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- CN110648810A CN110648810A CN201910796291.2A CN201910796291A CN110648810A CN 110648810 A CN110648810 A CN 110648810A CN 201910796291 A CN201910796291 A CN 201910796291A CN 110648810 A CN110648810 A CN 110648810A
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- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
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- H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
- H01C17/242—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by laser
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Abstract
The invention relates to the technical field of electronic components and discloses a manufacturing method of a car gauge resistor and the car gauge resistor, wherein the manufacturing method of the car gauge resistor selects a plurality of substrates with length-width ratios meeting a set range to manufacture the resistor, when the resistor is produced, the length-width ratios of resistor layers on the substrates are equal, the resistor layers with the same resistance can be manufactured by using the same tank of resistor paste and different specifications, so that the stock types and the number of the resistor paste to be used after paste preparation are greatly reduced, the current situation that the resistor paste with the abnormal resistance is wasted due to expiration can be greatly reduced, and the use cost of the resistor paste is greatly reduced; the substrate with the front electrode and the back electrode is heated before the resistance layer is manufactured, and water vapor in micropores of the substrate is removed, so that bubbles in the resistance layer are reduced, and the electrical property of the resistor and the stability of the pulse property are improved. The turning gauge resistor disclosed by the invention has the characteristics of low cost, stable electrical property and highly uniform process control standard.
Description
Technical Field
The invention relates to the technical field of electronic components, in particular to a method for manufacturing a vehicle gauge resistor and the vehicle gauge resistor.
Background
As a convenient and fast vehicle, the automobile has been developed for over 100 years, and more automobile manufacturers have been invested in the development and production of hybrid power and new energy automobiles along with the gradual reduction of petroleum raw materials and the continuous enhancement of environmental awareness of people. With the progress of science and technology, the development of the era and the demands of people on the comfort level, the intellectualization, the car networking and the automatic driving of car products, the functions and the complexity of the car are continuously increased, and the electric faults of newly purchased cars account for 45 percent of the total fault rate in half a year according to the statistics of an authoritative detection mechanism because the functions of the car, particularly the electronic control functions, are increased, so that more and more car electrical appliance manufacturers continuously improve the high reliability requirements on the car electrical appliances, and the car gauge resistor is taken as the most basic car electronic element, and the reliability of the car electrical appliance is also continuously required to be improved.
The high reliability car gauge resistor needs to meet special requirements continuously proposed by some markets and customers besides the AEC-Q200 test requirements. The manufacturing process of the common thick film chip resistor is generally carried out by printing a back electrode on the back of a substrate with transverse and longitudinal cutting lines, drying, printing a front electrode on the front surface of the substrate, drying, sintering at 850 ℃, printing a resistance layer between the front electrodes, drying and sintering, printing a first protective layer on the surface of the resistance layer, drying and sintering, performing laser resistance adjustment on the resistance value, then printing a second protective layer on the surface of the first protective layer to completely cover the first protective layer and the resistance layer, drying, printing character codes on the surface of the second protective layer, drying and sintering, then folding the strip, sputtering, folding the grain, electroplating nickel, electroplating tin, magnetizing and checking the package to form a finished product of the resistor, the reliability of the resistor manufactured in this way is not high, mainly because the common chip thick film resistor has the following defects in product design and manufacturing process:
firstly, the sizes of the resistor layers of each specification of the thick film chip resistor are designed independently, so that the printed resistance values of the same tank of resistor paste on each specification cannot be consistent, and thus each specification needs to be provided with a series of independently corresponding resistor pastes to meet the production requirements of the resistors of each specification, and a great amount of resistor pastes need to be prepared in advance for standby. Because the resistance paste has a storage period, overdue waste of a plurality of pieces of unusual resistance paste is easily caused, and the manufacturing cost of the resistor is increased.
Secondly, after analyzing some resistor products of well-known brands at home and abroad, the thick film chip resistor can be seen through slicing and grinding, pinholes and bubbles with different degrees are generated on the resistor layer, the existence of the pinholes in the resistor layer can cause uneven heat conduction of the resistor, the processing performance of the resistor and the stability of the resistance performance of a finished product are influenced, and particularly the pulse performance of the resistor is reduced.
Disclosure of Invention
The invention aims to provide a manufacturing method of a lathe gauge resistor and the lathe gauge resistor, which reduce the current situation that the commonly-used resistance paste is wasted due to overdue resistance and greatly reduce the use cost of the resistance paste; and the water vapor in the micropores of the substrate can be removed, so that bubbles in the resistance layer are reduced, and the pulse performance of the resistance is improved.
In order to achieve the purpose, the invention adopts the following technical scheme:
the invention provides a manufacturing method of a turning gauge resistor, which comprises the following steps:
s1, selecting a plurality of substrates with the length-width ratio satisfying the set range;
s2, a plurality of vertical folding line and folding grain line are respectively engraved on the upper surface and the lower surface of the substrate, the folding line and the folding grain line divide the upper surface and the lower surface of the substrate into a plurality of same unit cells, and electrode slurry is respectively coated in the unit cells on the upper surface and the lower surface of the substrate to form a front electrode and a back electrode;
s3, heating the substrate on which the front electrode and the back electrode are formed;
s4, printing resistance paste between the front electrodes between two adjacent folding lines to form a resistance layer, wherein the length-width ratio of the resistance layer of each substrate is equal;
s5, coating first slurry on the resistance layer to form a first protection layer, and adjusting the resistance values of the first protection layer and the resistance layer through laser cutting;
s6, sequentially coating second slurry and third slurry on the first protective layer to form a second protective layer and a third protective layer, and printing an identification layer on the third protective layer;
s7, folding the substrates processed in the steps S1-S6 into strip-shaped semi-finished products along each folding line of the substrates in sequence, and forming side electrodes on the side surfaces of the strip-shaped semi-finished products;
and S8, folding the strip-shaped semi-finished product into a granular semi-finished product along each grain folding line of the strip-shaped semi-finished product, and sequentially electroplating nickel and tin on the front electrode, the back electrode and the side electrode of the granular semi-finished product to form a nickel coating and a tin coating.
According to the manufacturing method of the vehicle-gauge resistor, the substrates with the length-width ratios meeting the set range are selected to manufacture the resistor, when the resistor is produced, the length-width ratios of the resistor layers on the substrates are equal, the same tank of resistor paste can be used, and the resistor layers with the same resistance can be manufactured in different specifications, so that the stock types and the number of the resistor pastes to be used after paste preparation are greatly reduced, the current situation that the resistor paste with the abnormal resistance is wasted due to expiration is reduced, and the use cost of the resistor paste is greatly reduced; the substrate with the front electrode and the back electrode is heated before the resistance layer is manufactured, so that water vapor in micropores of the substrate can be removed, bubbles in the resistance layer are reduced, and the pulse performance of the resistor is improved.
In a preferred embodiment of the method for manufacturing the gauge resistor, in step S3, the substrate on which the front electrode and the back electrode are formed is heated in a nitrogen atmosphere. The substrate on which the front electrode and the back electrode are formed is heated in a nitrogen atmosphere, so that the front electrode and the back electrode are protected and the oxidation phenomenon is prevented.
As a preferable configuration of the manufacturing method of the turning gauge resistor, in step S6, the second protective layer completely covers the first protective layer, extends to the fold grain line along the width direction of the substrate, does not cover the fold grain line, and extends along the length direction of the substrate at both ends of the second protective layer to cover at least part of the front electrode. The second protective layer completely covers the first protective layer, whereby the resistive layer can be protected.
As a preferable mode of the method for manufacturing the turning resistor, in step S6, the third protective layer completely covers the second protective layer, extends in the width direction of the substrate and covers the grain folding line, and both ends of the third protective layer extend in the length direction of the substrate and cover at least part of the front electrode. The third protective layer completely covers the second protective layer, and the resistive layer can be sufficiently protected by multilayer protection.
As a preferable mode of the method for manufacturing the car resistor, in step S2, the electrode paste is printed in the unit cells on the lower surface of the substrate with the folding line as a symmetry axis to form the back electrodes, the back electrodes between two adjacent folding lines are disposed at intervals, and the back electrodes in the width direction of the substrate are disposed symmetrically with respect to the folding line between the two back electrodes.
As a preferable mode of the method for manufacturing the car resistor, in step S2, electrode paste is printed in the unit cells on the upper surface of the substrate with the folding line as a symmetry axis to form the front electrodes, the front electrodes between two adjacent folding lines are disposed at intervals, and the front electrodes in the width direction of the substrate are disposed symmetrically with respect to the folding line between the two front electrodes.
In a preferred embodiment of the method for manufacturing a lathe gauge resistor, in step S4, both ends of the resistive layer in the longitudinal direction of the substrate are respectively lapped over two adjacent front electrodes.
As a preferable scheme of the manufacturing method of the turning gauge resistor, the first paste is glass paste, and the second paste and the third paste are both resin paste.
The invention also provides a car gauge resistor which is manufactured by adopting the manufacturing method of the car gauge resistor, the car gauge resistor comprises a substrate, the upper surface and the lower surface of the substrate are carved with folding lines and folding grain lines which are perpendicular to each other, the folding lines and the folding grain lines form a unit grid, front electrodes and back electrodes are printed in the unit grids on the upper surface and the lower surface of the substrate, a resistance layer is printed between the adjacent front electrodes in the unit grid, a first protection layer is arranged on the resistance layer, laser cutting lines are arranged on the resistance layer and the first protection layer, a second protection layer, a third protection layer and a marking layer are sequentially covered on the first protection layer, and side electrodes are respectively arranged on the two side surfaces of the substrate and are used for conducting the front electrodes and the back electrodes.
The vehicle gauge resistor is obtained by the method, and has good performance stability and strong pulse performance.
As a preferable mode of the above vehicle gauge resistor, the surfaces of the front electrode, the back electrode and the side electrodes are all plated with nickel plating layers, and the outer surfaces of the nickel plating layers are plated with tin plating layers. The side electrodes can be protected by an electro-nickel plating layer and a tin plating layer.
The invention has the beneficial effects that:
according to the manufacturing method of the vehicle-gauge resistor, the resistor is manufactured by selecting the substrates with the length-width ratios meeting the set range, when the resistor is produced, the length-width ratios of the resistor layers on the substrates are equal, the same tank of resistor paste can be used, and the resistor layers with the same resistance can be manufactured in different specifications, so that the stock types and the number of the resistor pastes to be used after paste preparation are greatly reduced, the current situation that the resistor paste with the abnormal resistance is wasted due to expiration is reduced, and the use cost of the resistor paste is greatly reduced; by heating the substrate with the front electrode and the back electrode before the resistance layer is manufactured, water vapor in micropores of the substrate can be removed, so that bubbles in the resistance layer are reduced, and the qualitative performance and the pulse resistance performance of the resistor are improved.
The vehicle gauge resistor provided by the invention is obtained by the method, and has good performance stability and strong pulse performance.
Drawings
Fig. 1 is a schematic structural diagram of a substrate provided with a folding line and a folding grain line according to an embodiment of the present invention;
fig. 2 is a schematic structural view of a substrate provided with a back electrode on a lower surface thereof according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a front electrode disposed on an upper surface of a substrate according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a structure of coating a resistive layer on a substrate according to an embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a resistive layer coated with a first protective layer according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram showing a laser cutting line after step S5 according to the embodiment of the present invention;
fig. 7 is a schematic structural diagram of coating a second protective layer on the first protective layer in step S6 according to the embodiment of the present invention;
fig. 8 is a schematic structural diagram of coating a third protective layer on the second protective layer in step S6 according to the embodiment of the present invention;
fig. 9 is a schematic structural diagram of disposing the identification layer on the third protective layer in step S6 according to the embodiment of the present invention;
fig. 10 is a schematic structural diagram of the strip-shaped semi-finished product after step S7 according to the embodiment of the present invention;
FIG. 11 is a schematic structural diagram of a sputtering side electrode on a strip-shaped semi-finished product according to an embodiment of the present invention;
FIG. 12 is a schematic diagram of a granular semi-finished product according to an embodiment of the present invention;
FIG. 13 is a schematic structural view of an electroplated nickel coating on a pellet shaped semi-finished product according to an embodiment of the present invention;
FIG. 14 is a schematic structural view of a tin plating layer on a nickel plating layer of a granular semi-finished product according to an embodiment of the present invention;
fig. 15 is a cross-sectional view of a lathe gauge resistor according to an embodiment of the present invention.
In the figure:
10. a substrate; 11. folding the grain line; 12. folding the lines; 21. an upper surface; 31. a lower surface;
22. a front electrode; 32. a back electrode; 23. a resistive layer; 24. a first protective layer; 25. laser cutting; 26. a second protective layer; 27. a third protective layer; 28. an identification layer; 33. a side electrode; 41. a nickel plating layer; 42. and (7) tin plating.
Detailed Description
In order to make the technical problems solved, technical solutions adopted and technical effects achieved by the present invention clearer, the technical solutions of the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, removably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The present embodiment provides a method for manufacturing a turning gauge resistor, as shown in fig. 1 to 14, including the following steps:
s1, selecting a plurality of substrates 10 having aspect ratios satisfying the set range.
By uniformly adjusting the substrate 10, selecting a plurality of substrates 10 with the length-width ratios meeting the set range, and manufacturing the resistor layers 23 with the same resistance value on the substrates 10 with different specifications by adopting the same resistor paste on the substrates 10 with the length-width ratios meeting the set range, the stock quantity and the types of the resistor pastes to be used are greatly reduced, the current situation that the resistor pastes with the abnormal resistance values are wasted due to expiration is reduced, and the use cost of the resistor pastes is greatly reduced. Optionally, the aspect ratios of the substrates 10 are similar, and the aspect ratios of the substrates 10 are as close as possible.
In this embodiment, Al with notches is used2O3The length and width of the substrate 10 are 70mm x 60mm, the dimensional tolerance of the substrate 10 is 0.05mm, the position deviation of the resistance printing module with the specification of 0402 can be controlled within 50um, the printing position of the character code of the mark layer 28 can be centered, and the unification of the process position deviation control standard can be achieved. In addition, the overlapped size of the resistance layer 23 and the front electrode 22 can be further reduced by selecting the substrate 10 with high precision size, and unnecessary waste of the resistance paste is reduced.
S2, a plurality of vertical fold lines 12 and fold lines 11 are engraved on both the upper surface 21 and the lower surface 31 of the substrate 10, the fold lines 12 and the fold lines 11 divide both the upper surface 21 and the lower surface 31 of the substrate 10 into a plurality of identical cells, and electrode paste is coated in the cells on the upper surface 21 and the lower surface 31 of the substrate 10 to form the front electrode 22 and the back electrode 32.
As shown in fig. 1-3, a plurality of folding lines 12 along the width direction of the substrate 10 and a plurality of folding lines 11 along the length direction of the substrate 10 are uniformly formed on the upper surface 21 and the lower surface 31 of the substrate 10, and the folding lines 12 and the folding lines 11 are intersected to form unit cells, each unit cell corresponding to a high-reliability vehicle-sized thick film chip resistor which is finally manufactured.
Specifically, the back electrode 32 is first manufactured, electrode paste is screen-printed in the unit cell of the lower surface 31 of the substrate 10 with the fold line 12 as the symmetry axis, and the back electrode 32 is formed after drying and sintering, the back electrodes 32 on two adjacent fold lines 12 are arranged at intervals, and the back electrodes 32 along the width direction of the substrate 10 are arranged symmetrically with respect to the fold line 11 between the two back electrodes 32. Then, front electrodes 22 are manufactured, electrode paste is printed in a screen printing mode in the unit cells of the upper surface 21 of the substrate 10 by taking the folding line 12 as a symmetry axis, the front electrodes 22 are formed after drying and sintering, the front electrodes 22 on two adjacent folding lines 12 are arranged at intervals, and the front electrodes 22 along the width direction of the substrate 10 are symmetrically arranged relative to the folding line 11 between the two front electrodes 22.
S3, the substrate 10 on which the front electrode 22 and the back electrode 32 are formed is heated.
The semi-finished products forming the front electrode 22 and the back electrode 32 are placed on a nitrogen baking furnace for baking, so that the moisture in the micropores of the substrate 10 enters the resistance layer 23 during sintering of the resistance layer 23 to generate small bubbles or pinholes, and the performance stability and the pulse resistance of the resistance layer are improved. The front electrode 22 and the back electrode 32 are protected by heating the substrate 10 on which the front electrode 22 and the back electrode 32 are formed in a nitrogen atmosphere, and the front electrode 22 and the back electrode 32 are prevented from being oxidized.
S4, printing a resistive paste between the front electrodes 22 between two adjacent folding lines 12 to form the resistive layer 23, wherein the length-width ratio of the resistive layer 23 of each substrate 10 is equal.
As shown in fig. 4, both ends of the resistive layer 23 in the longitudinal direction of the substrate 10 are respectively overlapped on the adjacent two front electrodes 22.
The high-reliability car rule thick film chip resistor is a resistor with greatly improved quality of a printing film layer, on the premise of ensuring the thickness of the printing layer, the selected printing screen cloth is screen cloth with a larger opening rate so as to reduce the influence of the printing network junction effect, and in order to obtain better film quality, in the design of a drying process, the resistor layer 23 is required to obtain enough leveling time after being printed, so that the influence of the network junction effect can be reduced to the maximum extent, and the consistency and the reliability of the performance of the product are improved.
In order to obtain a sufficient leveling time after the printing of the resistance layer 23, a drying furnace used after the printing of the resistance layer 23 has a leveling area which is long enough to ensure that the resistance layer 23 is dried after leveling so as to ensure the concentration of the resistance, a sintering curve used for sintering the resistance layer 23 is a curve which is verified by DOE design and can reduce the internal stress of the resistance layer 23, and the initial value control standard of the resistance layer 23 is within 0-30%.
S5, coating the first paste on the resistive layer 23 to form the first protective layer 24, and adjusting the resistance values of the first protective layer 24 and the resistive layer 23 by laser cutting.
As shown in fig. 5, a layer of the first paste is coated on the resistive layer 23 to form the first protective layer 24, as shown in fig. 6, a laser cutting line 25 is formed on the first protective layer 24 and the resistive layer 23 by using a laser, and L-blade or two-blade laser cutting is performed on the resistive layer 23, respectively, where the length of the first-blade laser cutting line should be less than 1/3 of the width of the resistive layer 23, and the resistance values of the first protective layer 24 and the resistive layer 23 are adjusted to a desired resistance value.
S6, coating the second slurry and the third slurry on the first protective layer 24 in sequence to form a second protective layer 26 and a third protective layer 27, and printing the identification layer 28 on the third protective layer 27.
As shown in fig. 7-9, a layer of insulating material is printed on the surface of the first protective layer 24 between the front electrodes 22 on two adjacent folding lines 12, a second protective layer 26 is formed after drying and sintering, a layer of insulating material is printed on the second protective layer 26, drying and sintering are performed to form a third protective layer 27, then a character code identification layer 28 is printed on the surface of the third protective layer 27, and after drying and sintering are performed, the second protective layer 26, the third protective layer 27 and the identification layer 28 are formed.
The second passivation layer 26 completely covers the first passivation layer 24, the second passivation layer 26 extends to the folded grain line 11 along the width direction of the substrate 10, but does not cover the folded grain line 11, and two ends of the second passivation layer 26 extend along the length direction of the substrate 10 and cover at least a part of the front electrode 22; the third passivation layer 27 completely covers the second passivation layer 26, the third passivation layer 27 extends along the width direction of the substrate 10 and covers the grain folding line 11, and two ends of the third passivation layer 27 extend along the length direction of the substrate 10 and cover at least a portion of the front electrode 22. The third passivation layer 27 has a length equal to that of the second passivation layer 26, and a width direction of the third passivation layer 27 is a stripe shape, and the third passivation layer 27 completely overlaps the second passivation layer 26 along the length direction of the substrate 10 and completely covers the second passivation layer 26 in the width direction.
The second protective layer 26 completely covers the first protective layer 24, and can protect the resistive layer 23. The third protective layer 27 completely covers the second protective layer 26, and the third protective layer 27 extends in the width direction of the substrate 10,
both ends of the third protective layer 27 cover at least part of the front electrode 22. The third protective layer 27 completely covers the second protective layer 26, and the resistive layer 23 can be sufficiently protected by a plurality of protective layers.
S7, folding the substrate 10 processed in steps S1-S6 into strip-shaped semi-finished products in sequence along each folding line 12 of the substrate 10, and forming the side electrodes 33 on the sides of the strip-shaped semi-finished products by a sputtering process.
As shown in fig. 10 and 11, the substrates 10 after the steps from S1 to S6 are sequentially folded into strip-shaped semi-finished products along the folding line 12 of the substrate 10, and are neatly stacked in a stacking jig. The jig for stacking materials is hung on a vacuum sputtering jig frame in order, the side surface of the strip-shaped semi-finished product folded strip is sputtered by a vacuum sputtering machine to form a side electrode 33, and the side electrode 33 extends to cover the end surface of the front electrode 22 and the end surface of the back electrode 32 and extends to cover a part of the surface of the front electrode 22 and the back electrode 32.
Preferably, the first paste is a glass paste, and the second paste and the third paste are both resin pastes.
S8, folding the bar-shaped semi-finished product along each folding line 11 to form a granular semi-finished product, and electroplating nickel and tin on the front electrode 22, the back electrode 32 and the side electrode 33 of the granular semi-finished product in sequence to form a nickel plating layer 41 and a tin plating layer 42 (see fig. 12 to 14).
Sintering curve of the resistance layer 23: firstly, the sintering time of the high-temperature region of 850 ℃ is kept within 10min +/-1 min, and secondly, the temperature region of the curve rising edge of 450-550 ℃ is required to correspond to the lower part of the air suction opening of the glue discharging region, so that organic matters in the resistance layer 23 can be fully volatilized when the resistance product is sintered; thirdly, the falling edge of the sintering curve, the region of 800-600 ℃, is the crystallization region of the glass body, therefore, the descending speed is controlled to be as small as possible, is preferably controlled to be below 30 ℃/min, can form smooth butt joint with the curve of the descending edge of 600-300 ℃, so as to reduce the internal stress generated when the resistor layer 23 is cured, such a sintering curve can greatly reduce the cracks generated by the cutting line in the laser process, and can enlarge the process control window in the laser process, meanwhile, the resistance stability of a PCT test at 121 ℃ under 2 atmospheric pressure and 100% RH 168H can be greatly improved, the stability of the PCT on a curve before the improvement is within +/-1%, the stability of the PCT test on the improved curve can be controlled within +/-0.5%, the improvement not only improves the stability of the product, but also makes breakthrough progress on improving the yield and the stability of high-precision products.
According to the manufacturing method of the vehicle-mounted resistor, the plurality of substrates 10 with the length-width ratios meeting the set range are selected to manufacture the resistor, when the resistor is produced, the length-width ratios of the resistor layers 23 of the substrates 10 are equal, the same tank of resistor paste can be used, and the resistor layers 23 with the same resistance can be manufactured on different specifications, so that the stock types and the number of the resistor pastes to be used after paste preparation are greatly reduced, the current situation that the resistor paste with the abnormal resistance is wasted due to expiration is reduced, and the use cost of the resistor paste is greatly reduced; by heating the substrate 10 on which the front electrode 22 and the back electrode 32 are formed before the resistive layer 23 is formed, moisture in the pores of the substrate 10 can be removed to reduce bubbles in the resistive layer 23, thereby improving the pulse performance of the resistor.
The invention also provides a turning gauge resistor which is manufactured by the manufacturing method of the turning gauge resistor, as shown in fig. 15, the car-size resistor includes a substrate 10, a folding line 12 and a folding line 11 that are perpendicular to each other are engraved on an upper surface 21 and a lower surface 31 of the substrate 10, the folding line 12 and the folding line 11 constitute a unit cell, a front electrode 22 and a back electrode 32 are printed in each of the unit cells of the upper surface 21 and the lower surface 31 of the substrate 10, a resistive layer 23 is printed between adjacent front electrodes 22 in the unit cell, an upper surface 21 of the resistive layer 23 is provided with a first protective layer 24, laser cutting lines 25 are provided on the resistive layer 23 and the first protective layer 24, the first protective layer 24 is sequentially covered with a second protective layer 26 and a third protective layer 27, an identification layer 28 is provided on the third protective layer 27, and side electrodes 33 are respectively provided on two side surfaces of the substrate 10 on the two side surfaces of the front electrode 22, and are used for conducting the front electrode 22. The resistor is obtained by the method, and has strong pulse performance and good stability.
Preferably, the substrate 10 is Al2O3The substrate is low in cost and convenient for mass production, the surfaces of the front electrode 22, the back electrode 32 and the side electrode 33 are all electroplated with a nickel plating layer 41, and the outer surface of the nickel plating layer 41 is electroplated with a tin plating layer 42. By nickel coating41 and tin plating 42 can protect the side electrode 33.
The front electrode 22 is made of a silver-palladium material, and the silver-palladium material has good heat dissipation performance, so that the reliability of the resistor and better power performance can be improved.
In the description herein, it is to be understood that the terms "upper", "lower", "right", and the like are based on the orientations and positional relationships shown in the drawings and are used for convenience in description and simplicity in operation, but do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be constructed in a particular operation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used merely for descriptive purposes and are not intended to have any special meaning.
In the description herein, references to the description of "an embodiment," "an example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example.
In addition, the foregoing is only the preferred embodiment of the present invention and the technical principles applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, and that the aforementioned aspect ratios of the resistive layers 23 of each specification are equal, and that in practice, fine tuning of the printing screen pattern after evaluation of the printing process is required to achieve a high degree of uniformity in the resistance values of the different specifications, and that various obvious changes, readjustments and substitutions may be made by those skilled in the art without departing from the scope of the present invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (10)
1. A manufacturing method of a lathe gauge resistor is characterized by comprising the following steps:
s1, selecting a plurality of substrates (10) with the length-width ratio satisfying the set range;
s2, a plurality of vertical folding line (12) and folding grain line (11) are respectively engraved on the upper surface (21) and the lower surface (31) of the substrate (10), the folding line (12) and the folding grain line (11) divide the upper surface (21) and the lower surface (31) of the substrate (10) into a plurality of same unit cells, and electrode slurry is respectively coated in the unit cells of the upper surface (21) and the lower surface (31) of the substrate (10) to form a front electrode (22) and a back electrode (32);
s3, heating the substrate (10) on which the front electrode (22) and the back electrode (32) are formed;
s4, printing resistance paste between the front electrodes (22) between two adjacent folding lines (12) to form a resistance layer (23), wherein the length-width ratio of the resistance layer (23) of each substrate (10) is equal;
s5, coating first slurry on the resistance layer (23) to form a first protective layer (24), and adjusting the resistance values of the first protective layer (24) and the resistance layer (23) through laser cutting;
s6, sequentially coating a second slurry and a third slurry on the first protective layer (24) to form a second protective layer (26) and a third protective layer (27), and printing an identification layer (28) on the third protective layer (27);
s7, folding the substrate (10) processed in the steps S1-S6 into strip-shaped semi-finished products in sequence along each folding line (12) of the substrate (10), and forming side electrodes (33) on the side surfaces of the strip-shaped semi-finished products;
s8, folding the strip-shaped semi-finished product into a granular semi-finished product along each grain folding line (11), and sequentially electroplating nickel and tin on the front electrode (22), the back electrode (32) and the side electrode (33) of the granular semi-finished product to form a nickel plating layer (41) and a tin plating layer (42).
2. The method of manufacturing a vehicle gauge resistor according to claim 1, wherein in step S3, the substrate (10) on which the front electrode (22) and the back electrode (32) are formed is heated in a nitrogen atmosphere.
3. The method of manufacturing a vehicle gauge resistor according to claim 1, wherein in step S6, the second protective layer (26) completely covers the first protective layer (24), the second protective layer (26) extends to the grain folding line (11) along the width direction of the substrate (10), the second protective layer (26) does not cover the grain folding line (11), and both ends of the second protective layer (26) extend along the length direction of the substrate (10) and cover at least a portion of the front electrode (22).
4. The method of manufacturing a vehicle gauge resistor according to claim 1, wherein in step S6, the third protective layer (27) completely covers the second protective layer (26), the third protective layer (27) extends along the width direction of the substrate (10) and covers the grain folding line (11), and both ends of the third protective layer (27) extend along the length direction of the substrate (10) and cover at least a portion of the front electrode (22).
5. The method of manufacturing a vehicle resistor according to claim 1, wherein in step S2, the electrode paste is printed in the cells of the lower surface (31) of the substrate (10) with the fold line (12) as a symmetry axis to form the back electrodes (32), the back electrodes (32) between two adjacent fold lines (12) are disposed at intervals, and the back electrodes (32) in the width direction of the substrate (10) are disposed symmetrically with respect to the fold line (11) between two back electrodes (32).
6. The method of manufacturing a vehicle resistor according to claim 5, wherein in step S2, electrode paste is printed in the unit cells on the upper surface (21) of the substrate (10) with the fold line (12) as a symmetry axis to form the front electrodes (22), the front electrodes (22) between two adjacent fold lines (12) are disposed at intervals, and the front electrodes (22) along the width direction of the substrate (10) are disposed symmetrically with respect to the fold line (11) between the two front electrodes (22).
7. The method of claim 5, wherein in step S4, both ends of the resistive layer (23) along the length direction of the substrate (10) are respectively overlapped with two adjacent front electrodes (22).
8. The method of claim 1, wherein the first paste is a glass paste, and the second paste and the third paste are both resin pastes.
9. A car gauge resistor, characterized in that, the car gauge resistor is manufactured by the method of any one of claims 1-8, the car gauge resistor comprises a substrate (10), the upper surface (21) and the lower surface (31) of the substrate (10) are engraved with perpendicular fold lines (12) and fold lines (11), the fold lines (12) and the fold lines (11) form a unit cell, the cells of the upper surface (21) and the lower surface (31) of the substrate (10) are printed with front electrodes (22) and back electrodes (32), a resistance layer (23) is printed between the adjacent front electrodes (22) in the unit cell, the resistance layer (23) is provided with a first protection layer (24), the resistance layer (23) and the first protection layer (24) are provided with laser cutting lines (25), the protective film comprises a substrate (10) and is characterized in that a first protective layer (24) is sequentially covered with a second protective layer (26), a third protective layer (27) and an identification layer (28), and two side faces of the substrate (10) are respectively provided with a side electrode (33) for communicating a front electrode (22) with a back electrode (32).
10. The vehicle gauge resistor of claim 9, wherein the front electrode (22), the back electrode (32) and the side electrode (33) are each plated with a nickel plating layer (41) on a surface thereof, and a tin plating layer (42) is plated on an outer surface of the nickel plating layer (41).
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116844802A (en) * | 2023-06-29 | 2023-10-03 | 宁波鼎声微电子科技有限公司 | Manufacturing method of car gauge anti-sulfuration film high-precision resistor and resistor |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09270303A (en) * | 1996-03-29 | 1997-10-14 | Murata Mfg Co Ltd | Thermistor device, and method of adjusting resistance value of thermistor device |
| CN1252887A (en) * | 1997-04-16 | 2000-05-10 | 松下电器产业株式会社 | Resistor and method for manufacturing the same |
| EP1011110A1 (en) * | 1997-07-09 | 2000-06-21 | Matsushita Electric Industrial Co., Ltd. | Resistor and method for manufacturing the same |
| CN103165250A (en) * | 2013-04-09 | 2013-06-19 | 昆山厚声电子工业有限公司 | Thick-film anti-vulcanization paster resistor and manufacturing method thereof |
| CN104616850A (en) * | 2015-02-10 | 2015-05-13 | 清华大学 | Method for preparing zinc oxide/epoxy resin composite voltage dependent resistor |
| CN105304241A (en) * | 2014-06-20 | 2016-02-03 | 昆山厚声电子工业有限公司 | Thick-film patch resistor with high power and low resistance value and manufacturing method of thick-film patch resistor |
| CN107134330A (en) * | 2017-05-22 | 2017-09-05 | 丽智电子(昆山)有限公司 | A kind of high power thick film Chip-R and its manufacture method |
| CN107146666A (en) * | 2017-05-22 | 2017-09-08 | 丽智电子(昆山)有限公司 | A kind of high-density and superminiature thick film Chip-R and its manufacture method |
| CN108470613A (en) * | 2018-05-17 | 2018-08-31 | 丽智电子（南通）有限公司 | A kind of automobile sulfuration resistant thick film Chip-R and its manufacturing method |
-
2019
- 2019-08-27 CN CN201910796291.2A patent/CN110648810B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09270303A (en) * | 1996-03-29 | 1997-10-14 | Murata Mfg Co Ltd | Thermistor device, and method of adjusting resistance value of thermistor device |
| CN1252887A (en) * | 1997-04-16 | 2000-05-10 | 松下电器产业株式会社 | Resistor and method for manufacturing the same |
| EP1011110A1 (en) * | 1997-07-09 | 2000-06-21 | Matsushita Electric Industrial Co., Ltd. | Resistor and method for manufacturing the same |
| CN103165250A (en) * | 2013-04-09 | 2013-06-19 | 昆山厚声电子工业有限公司 | Thick-film anti-vulcanization paster resistor and manufacturing method thereof |
| CN105304241A (en) * | 2014-06-20 | 2016-02-03 | 昆山厚声电子工业有限公司 | Thick-film patch resistor with high power and low resistance value and manufacturing method of thick-film patch resistor |
| CN104616850A (en) * | 2015-02-10 | 2015-05-13 | 清华大学 | Method for preparing zinc oxide/epoxy resin composite voltage dependent resistor |
| CN107134330A (en) * | 2017-05-22 | 2017-09-05 | 丽智电子(昆山)有限公司 | A kind of high power thick film Chip-R and its manufacture method |
| CN107146666A (en) * | 2017-05-22 | 2017-09-08 | 丽智电子(昆山)有限公司 | A kind of high-density and superminiature thick film Chip-R and its manufacture method |
| CN108470613A (en) * | 2018-05-17 | 2018-08-31 | 丽智电子（南通）有限公司 | A kind of automobile sulfuration resistant thick film Chip-R and its manufacturing method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116844802A (en) * | 2023-06-29 | 2023-10-03 | 宁波鼎声微电子科技有限公司 | Manufacturing method of car gauge anti-sulfuration film high-precision resistor and resistor |
| CN116844802B (en) * | 2023-06-29 | 2024-04-30 | 宁波鼎声微电子科技有限公司 | Manufacturing method of car gauge anti-sulfuration film high-precision resistor and resistor |
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