CN214847970U - Surface-mounted electronic element with novel film electrode pattern - Google Patents

Abstract

The utility model provides a SMD electronic component with novel film electrode pattern has solved present SMD electronic component manufacturing cost higher and easy emergence when the base plate breaks into the platelet and glues even and inhomogeneous cracked problem. A patch type electronic element with novel film electrode pattern, the film electrode pattern is composed of four edges; one group of two opposite edges are straight lines which are parallel to each other, and the other group of two opposite edges are arc lines.

Description

Surface-mounted electronic element with novel film electrode pattern

Technical Field

The utility model belongs to the technical field of electronic components, concretely relates to SMD electronic component with novel film electrode pattern.

Background

The thin film thick film patch type electronic components are in various types, which are also called surface-mounted resistors, semiconductor thin film switches, functional detectors or capacitors, such as common carbon film and metal film resistors, and thermosensitive semiconductor resistors; is a new generation of leadless or short-lead micro electronic element suitable for Surface Mount Technology (SMT); the welding surfaces of the leading-out ends are on the same plane.

The Chip (SMD Resistor) is also called 'Rectangular Chip Resistors', invented by ROHM company and originally put into the market, and is characterized by humidity resistance, high temperature resistance, high reliability, uniform appearance size, accuracy and small tolerance of temperature coefficient and resistance value. According to the production process, the Chip packaging material can be divided into two packaging forms of Thick Film chips (Thick Film chips) and Thin Film chips (Thin Film chips). Wherein the thick film is formed by depositing a resistive material on an insulating substrate (e.g., glass or alumina ceramic) using screen printing and then sintering; or sputtering deposition is adopted to form a thin film element; the lead resistor has the advantages of small volume, light weight, suitability for wave soldering and reflow soldering, high mechanical strength, superior high-frequency characteristic, cheaper price of common specifications than that of the traditional lead resistor, low production cost, matching with an automatic chip mounter and suitability for mass production of modern electronic products.

Because the price is cheap, the production is convenient, can reduce the PCB area by a wide margin, reduce the apparent size of the products, therefore, replace most of the traditional lead wire resistance in the integrated circuit now. Among them, most of the common resistors and thermistors have also adopted a thick film printing method, and with the development of the technology, other electronic components will also adopt a thin film element form more and more.

For example: the specific structure of the four parts of a common typical chip resistor is shown as an introduction in fig. 1, and other thin-film elements can be analogized.

1) Substrate:

the substrate material typically uses 96% alumina or other insulating ceramic. The substrate has good electrical insulation, excellent thermal conductivity at high temperature, electrical properties, mechanical strength and the like; in addition, the substrate is required to be flat and accurately scribed. In order to sufficiently ensure the standard resistance, the electrode paste or paste material should be printed accurately at a predetermined position. Generally, after scribing the grooves on each substrate, the number of small chips of the patch electronic element included may be from 100 to 300 ten thousand according to the size of each chip.

2) An electrode:

in order to ensure good solderability and reliability of the resistor element, a three-layer electrode structure is generally adopted: the inner, middle and outer layer electrodes are made of gold, silver, palladium, nickel, copper and aluminum alloy with good conductivity by packaging, printing and calcining, and are shown in figure 2, which is a schematic diagram of an electrode pattern of a traditional existing electrode printed on a ceramic substrate, and a gray rectangle or a superimposed gray concave-convex shape; the whole electrode material in the form is more, so that the manufacturing cost of the electronic element is higher.

3) Resistive film:

a resistance paste having a certain resistivity or semiconductor characteristics is printed on a substrate and then sintered to form a generally rectangular shape. The resistance paste generally uses semiconductor oxides, specifically comprises transition metal manganese cobalt nickel iron copper oxide, auxiliary elements (Zr, Al, Ga, Sn, Zn, In, Au, Ag and rare earth element ion oxides), and monolithic capacitance characteristic titanate materials (such as barium titanate, strontium titanate, zirconium titanate and ruthenate, ruthenium dioxide), and relates to NTC and PTC characteristic oxide semiconductor film resistors. Such thin film semiconductor materials are expensive, which leads to high manufacturing costs of electronic components.

4) Protecting the film:

the protective film is covered on the resistive film, mainly for the purpose of maintaining the resistive element. The resistor has the advantages that on one hand, the maintenance effect of mechanical equipment is achieved, on the other hand, the surface layer of the resistor body has dielectric strength, and common faults caused by the fact that the resistor is in contact with adjacent electric conductors are prevented. In the process of the middle electric level of the electro-plating, the reduction of the resistor characteristics caused by the corrosion of the resistor film by the electro-plating liquid can be avoided. The protective film is generally made of sandwich glass slurry with low melting point through packaging, printing and calcining.

In the conventional standard resistive element or capacitive element, a common printing process is adopted, a front electrode and a back electrode are printed on a substrate, then a resistive body or a semiconductor functional thin film layer is printed, then a glass protective layer or other additional layers are printed, and finally, folding strips and folding particles are performed to split the whole substrate into small elements. At present, when a substrate is broken into small pieces, adhesion and uneven associated breakage are easy to occur, so that the shape of an electrode is randomly changed to form a defective product, and the yield is low.

Disclosure of Invention

An object of the utility model is to solve present SMD resistance manufacturing cost higher and easily take place gluing even and inhomogeneous cracked problem when the base plate splits into the platelet, and provide a SMD electronic component with novel film electrode pattern.

In order to achieve the above object, the present invention provides a technical solution:

a patch type electronic element with novel film electrode patterns is characterized in that: the thin film electrode pattern is formed by four edges; one group of two opposite edges are straight lines which are parallel to each other, and the other group of two opposite edges are arc lines.

When designing the membrane electrode pattern, only need ensure that the terminal surface of two positive thin-film electrodes about SMD electronic component between parallel can, and to the side (also called the edge) of positive thin-film electrode, then design for the cambered surface for adjacent SMD electronic component's cambered surface edge does not have the contact, when folding the strip and roll over the grain so, the electrode film can not appear gluing and inhomogeneous fracture, can improve electronic component and make the qualification rate.

In view of the above, the shape types of the other set of two opposite sides are diversified, for example, the other set of two opposite sides are both outward convex arcs, or both inward concave arcs, or one side is an inward concave arc and the other side is an outward convex arc. Meanwhile, different electrodes in the same surface mount electronic component can be selected from different shapes.

Further, in order to facilitate processing when screen printing (screen stencil is used to stencil out a pattern, and then ink paste is hollowed out from the stencil hollowed-out position to be cured to form a required film pattern), the film electrode pattern is semi-elliptical or semi-circular in consideration of liquid rounding (surface tension), that is, before the folding strip, a pattern shaped like an elliptical or circular gap is formed between film electrodes of adjacent surface mount electronic components, and accordingly, the stencil hollowed-out pattern is semi-elliptical or semi-circular.

If other deposition forming methods such as sputtering are adopted, another group of patterns with arc lines which are concave inwards relative to two edges is preferably selected from the film electrode patterns, so that electrode materials can be saved, and the cost can be reduced. For the thin film electrode with the pattern, if the thin film electrode is prepared by screen printing, the screen template needs to be tested in advance by considering the liquid rounding condition, so that a more standard pattern is obtained.

Furthermore, the thickness of the film electrode is 1-500 μm.

Furthermore, the patch type electronic component is a thick film patch type resistor, which comprises a substrate, two front surface thin film electrodes printed on the left side and the right side of the upper surface of the substrate, and two back surface thin film electrodes printed on the left side and the right side of the lower surface of the substrate;

the opposite end faces of the two front thin film electrodes are parallel to each other and have a gap;

a resistor body or a semiconductor function thin film layer is arranged above the two front surface thin film electrodes, and the resistor body or the semiconductor function thin film layer is overlapped with each front surface thin film electrode to form an overlapping area; the width of the overlapped area is adjusted to obtain the thick film SMD resistor with different resistance values.

Further, the resistor or the semiconductor function thin film layer is rectangular.

The utility model has the advantages that:

1. the utility model relates to an improvement of film electrode pattern in SMD electronic component, two limits design for the arc (be the edge side design for the cambered surface) that lie in the edge with the film electrode. Firstly, the arc design is adopted, and under the condition of printing the electrodes with the same thickness, compared with the prior rectangular electrode, the printing area is smaller, the consumption of slurry or ink for electrode printing can be saved, and the manufacturing cost is reduced; compared with the existing concave-convex shape (the shape surface of the concave-convex electrode is changed and narrowed at right angles, burrs are easily caused in the printing process, and the machining difficulty is higher due to the precision requirement), the electrode edge is excessive and smoother, the printing is smoother and easier, and the machining difficulty is greatly reduced; secondly, under the same thickness, if the electrode film is rectangular, when the whole substrate is broken into small elements, electrode films such as gold, silver electrodes or palladium, silver and copper electrodes between adjacent patch electronic elements are bonded and connected or the films are not uniform and connected and broken, so that the shape of the electrodes is changed, the contact surfaces or the widths of the electrodes and the resistance, the capacitance and the dielectric material film are randomly changed, and defective products are generated; and adopt the arc design, at monolithic component book grain or a strip process, two adjacent SMD electronic component's electrode can not take place to glue because of the distance is relatively far away, and the film breaks with discontinuous, and the yield of product promotes by a wide margin.

2. The existing method for changing the resistance value of a surface mount electronic element needs to change the material formula or change the thickness of a printing film, so that the difficulty of increasing the process is increased; and the utility model discloses in, under the condition that does not change electrode film thickness, the accessible changes electrode film printing coverage area and resistance body or semiconductor function thin layer contact position just can change the resistance value easily, specifically only need remove, change the position that conductive film silk screen and resistance body or semiconductor function thin layer counterpoint, this removal, change deltad (overlapping area's width) just can change the resistance easily, obtain the component of different resistance values, it is simpler on the manufacturing procedure, so use same semiconductor half tone alright to produce the serial chip resistor of different resistances, the technology is simpler.

Drawings

Fig. 1 is a schematic structural diagram of a conventional surface mount electronic component;

reference numbers in fig. 1: 1-substrate, 2-back electrode, 3-front electrode, 4-resistor or semiconductor functional layer, 5-primary protective film, 6-secondary protective film, 7-terminal electrode, 8-middle electrode, 9-external electrode;

fig. 2 is a schematic diagram of a pattern of a thin film electrode in a conventional surface mount electronic component, where a is a rectangle and b is a concave-convex rectangle;

fig. 3 is a schematic diagram of a pattern of a thin film electrode in the chip resistor before the folding strip of the present invention;

fig. 4 is a schematic diagram of a pattern of a thin film electrode in the chip resistor after particle folding according to the present invention;

fig. 5 is a schematic view showing the superposition of the thin film electrode printed pattern and the resistive body or the semiconductor functional thin film layer of the present invention, where a is a state of connecting the front-type element by folding the strip and folding the grain, and b is a state of separating the edge of the element after folding the strip and folding the grain;

fig. 6, 7 and 8 are schematic diagrams of other patterns of the thin film electrode in the chip resistor according to the present invention;

the reference numbers of fig. 3-8 are:

10-front thin film electrode, 11-resistor or semiconductor function thin film layer, 12-overlapping area.

Detailed Description

The invention is described in further detail below with reference to the following figures and specific examples:

as shown in fig. 3, 4 and 5, a chip resistor with a novel thin film electrode pattern includes a substrate, a left and a right front thin film electrodes silk-screened and printed on two sides of an upper surface of the substrate, and a left and a right back thin film electrodes printed on two sides of a lower surface of the substrate; wherein, the opposite end faces of the two front film electrodes are parallel to each other with a gap; the thickness of the front film electrode and the back film electrode is 1-500 mu m, and the front film electrode and the back film electrode are in a semi-elliptical segmental shape; a rectangular resistor or semiconductor functional thin film layer is arranged above the front electrode; and the width Delta d of the overlapped area of the resistor body or the semiconductor function film layer and each front surface film electrode can obtain resistors with different resistance values by adjusting the size of the Delta d. The rest structure is the same as that of the existing patch type resistor.

In addition to the semi-elliptical segmental shape, the two front electrodes and the two back electrodes may be different shapes from each other, as long as the shape of the membrane electrode pattern is: one set of two opposite sides are straight lines which are parallel to each other, and the other set of two opposite sides are both arc lines, so that the patterns in figures 6-8 all meet the requirements.

The utility model discloses an optimization to the membrane electrode shape, replace plane or step face edge with cambered surface edge, when reducing electrode film material quantity, more importantly takes place to glue when reducing the strip, book grain and link and inhomogeneous fracture and then lead to the electrode shape to take place the random change and the inconsistent condition of performance, improve the yield; the utility model discloses except above-mentioned SMD resistor of thick film, still be applicable to other SMD electronic component simultaneously, for example semiconductor film switch, functional type detector or electric capacity.

The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of various equivalent modifications or replacements within the technical scope of the present invention, and these modifications or replacements should be covered within the protection scope of the present invention.

Claims (9)

1. A patch type electronic element with novel film electrode patterns is characterized in that:

the thin film electrode pattern is formed by four edges; one group of two opposite edges are straight lines which are parallel to each other, and the other group of two opposite edges are arc lines.

2. The chip-on-sheet electronic component having a novel film electrode pattern according to claim 1, wherein:

and the other two opposite edges are arc lines which are convex outwards.

3. The chip-on-sheet electronic component having a novel film electrode pattern according to claim 1, wherein:

and the other two opposite edges are both inwards concave arc lines.

4. The chip-on-sheet electronic component having a novel film electrode pattern according to claim 1, wherein:

one side of the other group of two opposite sides is an arc line which is inwards concave, and the other side of the other group of two opposite sides is an arc line which is outwards convex.

5. The surface-mounted electronic component having a novel film electrode pattern according to claim 2, wherein:

the thin film electrode is prepared by a screen printing mode.

6. The surface-mounted electronic component having a novel film electrode pattern according to claim 5, wherein:

the film electrode pattern is in a semi-elliptical segmental shape or a semi-circular segmental shape.

7. The chip-on-film electronic component having a novel film electrode pattern according to any one of claims 1 to 6, wherein:

the thickness of the thin film electrode is 1-500 μm.

8. The chip-on-sheet electronic component having a novel film electrode pattern according to claim 7, wherein:

the patch type electronic component is a thick film patch type resistor and comprises a base body, two front surface thin film electrodes (10) printed on the left side and the right side of the upper surface of the base body and two back surface thin film electrodes printed on the left side and the right side of the lower surface of the base body;

the opposite end faces of the two front thin film electrodes are parallel to each other;

a resistor body or a semiconductor function thin film layer is arranged above the two front surface thin film electrodes, and the resistor body or the semiconductor function thin film layer is overlapped with each front surface thin film electrode to form an overlapping area (12); the width of the overlapped area is adjusted to obtain the thick film SMD resistor with different resistance values.

9. The chip-on-sheet electronic component having a novel film electrode pattern according to claim 8, wherein:

the resistor body or the semiconductor function thin film layer (11) is rectangular.

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