CN110624768A - 用于涂布机的分配喷嘴 - Google Patents

用于涂布机的分配喷嘴 Download PDF

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CN110624768A
CN110624768A CN201910544841.1A CN201910544841A CN110624768A CN 110624768 A CN110624768 A CN 110624768A CN 201910544841 A CN201910544841 A CN 201910544841A CN 110624768 A CN110624768 A CN 110624768A
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dispensing
dispensing nozzle
retraction
valve element
coating material
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梅吉亚斯·卡德
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Suess Microtec Lithography GmbH
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Suess Microtec Lithography GmbH
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/30Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages
    • B05B1/3033Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages the control being effected by relative coaxial longitudinal movement of the controlling element and the spray head
    • B05B1/304Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages the control being effected by relative coaxial longitudinal movement of the controlling element and the spray head the controlling element being a lift valve
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/30Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages
    • B05B1/3033Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages the control being effected by relative coaxial longitudinal movement of the controlling element and the spray head
    • B05B1/304Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages the control being effected by relative coaxial longitudinal movement of the controlling element and the spray head the controlling element being a lift valve
    • B05B1/3046Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages the control being effected by relative coaxial longitudinal movement of the controlling element and the spray head the controlling element being a lift valve the valve element, e.g. a needle, co-operating with a valve seat located downstream of the valve element and its actuating means, generally in the proximity of the outlet orifice
    • B05B1/306Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages the control being effected by relative coaxial longitudinal movement of the controlling element and the spray head the controlling element being a lift valve the valve element, e.g. a needle, co-operating with a valve seat located downstream of the valve element and its actuating means, generally in the proximity of the outlet orifice the actuating means being a fluid
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/08Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
    • B05B12/085Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to flow or pressure of liquid or other fluent material to be discharged
    • B05B12/087Flow or presssure regulators, i.e. non-electric unitary devices comprising a sensing element, e.g. a piston or a membrane, and a controlling element, e.g. a valve
    • B05B12/088Flow or presssure regulators, i.e. non-electric unitary devices comprising a sensing element, e.g. a piston or a membrane, and a controlling element, e.g. a valve the sensing element being a flexible member, e.g. membrane, diaphragm, bellows
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1039Recovery of excess liquid or other fluent material; Controlling means therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
    • B05C5/0237Fluid actuated valves
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0254Coating heads with slot-shaped outlet
    • B05C5/0258Coating heads with slot-shaped outlet flow controlled, e.g. by a valve
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/027Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated
    • B05C5/0275Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated flow controlled, e.g. by a valve
    • B05C5/0279Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated flow controlled, e.g. by a valve independently, e.g. individually, flow controlled
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16KVALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K1/00Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces
    • F16K1/32Details
    • F16K1/34Cutting-off parts, e.g. valve members, seats
    • F16K1/36Valve members
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16KVALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K23/00Valves for preventing drip from nozzles
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16KVALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K31/00Actuating devices; Operating means; Releasing devices
    • F16K31/12Actuating devices; Operating means; Releasing devices actuated by fluid
    • F16K31/122Actuating devices; Operating means; Releasing devices actuated by fluid the fluid acting on a piston
    • F16K31/1225Actuating devices; Operating means; Releasing devices actuated by fluid the fluid acting on a piston with a plurality of pistons
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16KVALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K41/00Spindle sealings
    • F16K41/10Spindle sealings with diaphragm, e.g. shaped as bellows or tube
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/28Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with integral means for shielding the discharged liquid or other fluent material, e.g. to limit area of spray; with integral means for catching drips or collecting surplus liquid or other fluent material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/08Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Coating Apparatus (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

本发明涉及一种用于将涂层涂敷到基底上的分配喷嘴(1),具有:阀座(16);阀元件(14),所述阀元件适于在关闭位置与打开位置之间移位,在所述关闭位置,所述阀元件与所述阀座(16)相互作用以关闭所述分配喷嘴(1)的涂层材料入口(2)与涂层材料出口(3)之间的连接,在所述打开位置,所述连接被打开;并且进一步具有收回元件(24),所述收回元件适于在前部位置与后部位置之间移位,所述收回元件(24)与所述分配喷嘴(1)的在所述阀元件(16)的下游的分配通道(18)流体连通。

Description

用于涂布机的分配喷嘴
技术领域
本发明涉及一种用于将涂层涂敷到基底,特别是晶圆上的分配喷嘴。
背景技术
为了制造半导体芯片和MEMS,已知的是将涂层涂敷到基底(晶圆)上,该涂层被处理或助于处理基底。由于公差将导致涂层的厚度高于或低于其应该有的厚度,因此精确地将所需量的涂层涂敷到晶圆的表面是重要的。此外,在向基底涂敷涂层的过程终止之后,要防止涂层材料的液滴从分配喷嘴分离。这种液滴将对涂层的尽可能平坦的表面产生显著扰动。
有各种尝试来防止在涂层的涂敷已经终止之后涂层材料的液滴从分配喷嘴分离。一种广泛使用的方法是使用连接到分配喷嘴的真空管线,使得在停止涂敷涂层材料的过程之后,一定体积的涂层材料可以被"吸回"到分配喷嘴中。这会导致在分配喷嘴的出口处形成所谓的弯液面(meniscus),从而防止在那里形成液滴并防止液滴变成从分配喷嘴处脱离。
这种解决方案的问题是,由于不能适当地控制在先前涂敷步骤结束时有多少涂层材料被"吸回"到分配喷嘴中,因此这妨碍了对供应到基底的涂层材料的量的精确计量,使得难以精确地计量在随后的涂敷步骤中被涂敷的涂层材料。
发明内容
本发明的目的是提高涂层材料可以通过分配喷嘴被计量的精确度,而同时可靠地防止在分配步骤终止之后涂层材料的液滴无意地从分配喷嘴分离。
为此,本发明提供一种用于将涂层涂敷到基底上的分配喷嘴,其具有:阀座;阀元件,其适于在关闭位置与打开位置之间移位,在所述关闭位置,其与阀座相互作用以关闭分配喷嘴的涂层材料入口与涂层材料出口之间的连接,在所述打开位置,该连接被打开;并且进一步具有收回元件,其适于在前部位置与后部位置之间移位,收回元件与分配喷嘴的在阀元件的下游的分配通道流体连通,其中收回元件为在一个侧部上暴露于分配通道的隔膜。
本发明基于使用收回元件的基本思想,所述收回元件机械地"吸回"阀座的下游的一定量的分配材料。由于可以通过使收回元件移动到前部位置而精确地将相同量的涂层材料"添加"到随后的分配步骤中,因此收回元件允许非常精确地控制在一个分配步骤结束时被吸回到分配喷嘴中的涂层材料的量,从而易于在随后的涂敷步骤中正确地计量涂层材料。额外优点是,在靠近分配喷嘴的前部端部处实现吸回。这避免了与现有方法相关的问题,在现有方法中,从远程位置实现吸回,这在精确度方面是有问题的,并且还导致材料倾向于脱气的问题。由于隔膜被用作收回元件,因此阀元件的分配通道侧部可以非常容易地从阀元件的"背侧"密封。
在一个实施例中,收回元件横向于分配通道布置,尤其是在分配喷嘴的喷嘴主体中。收回元件的这种位置导致了简单设计。
在替代实施例中,收回元件布置在阀元件中并且与分配通道流体连接。这种设计允许形成具有非常小尺寸的分配喷嘴,使得两个或更多个分配喷嘴可以在涂敷装置上布置成彼此非常靠近。
通过使阀元件形成为套筒的形式,隔膜被夹持到阀元件上,可以实现非常紧凑的设计。
为了防止涂层材料污染分配喷嘴的不应经受涂层材料的区域,提供了密封元件,其密封在分配喷嘴的阀元件和喷嘴主体之间。
为了在不需要很大空间的情况下将隔膜可靠地连接到阀元件,密封元件可以旋拧到阀元件中以便将隔膜夹持在其中。
在替代实施例中,收回元件是活塞,其在一个侧部上暴露于分配通道。由于活塞是刚性的,因此可以非常精确地控制被吸回到分配喷嘴中的涂层材料的量。
优选地,设置有收回控制腔室,其操作性地连接至收回元件。通过向控制元件的暴露于收回控制腔室中的压力的侧部施加不同水平的压力,收回控制腔室允许非常容易地使收回元件在前部位置和后部位置之间移位。作为示例,向收回控制腔室施加第一(正)压力会导致收回元件处于前部位置,而改变到第二(负或较低)压力会导致收回元件移位到后部位置中,使得限定体积的涂层材料被吸回到分配喷嘴中。可以继续使用真空管线和相关的控制元件以及现有分配阀的控制逻辑,以控制根据本发明的收回元件或分配阀的操作。
根据一个实施例,设置有收回控制活塞,其暴露于收回控制腔室中的压力。收回控制活塞是收回元件与例如真空管线之间的中间元件,并且确保收回元件被精确地控制,尤其是在收回元件是隔膜或膜片的情况下。收回控制活塞可以机械地连接到收回元件。
优选地,设置有可调节收回对接件以用于调节收回控制活塞的最大行程。收回对接件允许根据不同涂层材料的特定特性调节被吸回到分配喷嘴中的涂层材料的量,使得在独立于正在处理的特定涂层材料的分配步骤结束时被吸回的"正确"的涂层材料的量。
收回对接件可以是螺钉或者包含螺纹,并且可以手动调节或者通过使用步进马达来远程地调节。
根据本发明的优选实施例,设置有操作性地连接至阀元件的分配控制腔室。以类似于控制收回元件的移动的方式,分配控制腔室被用于控制阀元件的位置和位移。这可以通过以下来实现:改变分配控制腔室中的压力水平,使得当作用在阀元件上朝向阀座的力高于使阀元件偏置为远离阀座的力时,阀元件被压靠在阀座上,反之亦然。
优选地,密封元件在收回控制活塞上被引导,使得为阀元件提供径向引导功能。
优选地,收回控制活塞旋拧到隔膜的突出部上,这会导致紧凑而可靠的连接。
同样对于阀元件,可调节分配对接件可以被设置为用于调节阀元件的最大行程。因为其内的压力水平对于在打开位置处控制阀元件的位置不是必需的,这允许针对分配控制腔室中的压力水平使用非常基本的控制。相反,使用压力足够使阀元件在固定关闭位置(由阀座限定)与由分配对接件限定的固定(但仍可调节的)打开位置之间移位。
分配对接件可以是螺钉的形式或者使用螺纹连接,其将旋转转化为平移,使得阀元件的打开行程可以适于不同涂层材料的特定特性。
可以提供驱动机构(比如具有齿轮的步进马达)以用于基于控制信号以自动方式来调节分配对接件。
附图说明
现在将参照附图描述本发明。在附图中,
图1示出了分配喷嘴的示意性截面,
图2示出了图1的分配喷嘴的核芯元件的截面,
图3以截面示出了在分配喷嘴中使用的阀元件,
图4以透视图示出了图3的阀元件,
图5以截面示出了在分配喷嘴中使用的隔膜,
图6以透视图示出了图5的隔膜,
图7以截面示出了在分配喷嘴中使用的密封元件,
图8以截面示出了在分配喷嘴中使用的可调节收回对接件,
图9以透视图示出了图8的可调节收回对接件,
图10以放大比例示出了涂层材料处于被分配时的状态下的分配喷嘴的一部分,
图11示出了处于分配已被关闭的状态下的图10的分配喷嘴,
图12示出了处于一些涂层材料已被吸回的状态下的图10的分配喷嘴。
具体实施方式
现在参考图1至9说明用于在基底上涂敷涂层材料的分配喷嘴1。分配喷嘴1特别适用于被用来生产半导体芯片和MEMS的机器。
分配喷嘴1具有喷嘴主体10,其设置有涂层材料入口2和涂层材料出口3。涂层材料入口2经由管道或其它合适的部件连接到涂层材料的供应处。涂层材料出口3可以是喷嘴或适于将特定涂层材料施加到基底上的其它构造的形式。
在喷嘴主体10的内部,腔12设置在涂层材料入口2和涂层材料出口3之间。一阀元件14布置在腔12内,其可以与环形阀座16配合,所述环形阀座形成为以与用作涂层材料出口3的分配通道18外接。
阀座16的侧部或朝向阀座16的方向将在下文中被称为"前部",而相对的侧部或方向将被称为"后部"。
阀元件14可以在关闭位置与打开位置之间移位。在关闭位置中,阀元件14通过其前部环形端部接触阀座16。当阀元件14相对于喷嘴主体10(将在下面详细说明)被密封时,分配喷嘴1的涂层材料入口2和涂层材料出口3之间的连接在阀元件14的该位置处被关闭。在打开位置中,阀元件14(以可控方式)与阀座16间隔开,使得涂层材料入口2和涂层材料出口3之间的流动连接是打开的。那么,利用分配喷嘴1通过分配通道18分配的涂层材料的量取决于涂层材料被供应的压力、涂层材料的粘度、以及阀元件14的通过其使所述阀元件从阀座16被抬升的行程。
阀元件14是中空套筒(参见尤其是图3和4),其具有适用于接触阀座16的锥形且圆形的前向端面20。
在其内部,阀元件14具有用于隔膜24的对接部22(参见尤其是图5和6),所述隔膜布置在阀元件14的前部部分中。在对接部22的后部(当从端面20观察时),阀元件14具有内螺纹26。
隔膜24具有盘状的前部膜片28和连接到膜片28的中心的圆柱形突起30。螺纹32形成在突起30的外表面上。
隔膜24由聚四氟乙烯(PTFE)或全氟烷氧基树脂(PFA)形成。然而,也可以使用其它材料。
这里,膜片28和突起30形成为一个工件。然而,也可以将突起30形成为单独的工件,然后将其连接到膜片28。
隔膜24通过夹持膜片28的外周边抵靠形成在套筒状阀元件14中的对接部22上而安装在阀元件14的内部。为此,使用了密封元件34(请见图7)。
密封元件34是中空的、大致套筒状的主体,在其前部端部处具有引导套筒36并在其后部端部处具有密封波纹管38。
引导套筒36具有向内的锥形端面40,其形成了隔膜24的膜片28的支撑表面。在其外表面上形成有外螺纹37。
在其后部端部处,引导套筒36具有控制突出部42,其设置有外螺纹44。
在此,引导套筒36和控制突出部42形成连续的柱形引导表面46。
密封波纹管38设置有环形连接加强件48,所述环形连接加强件被用来将其夹持到喷嘴主体10上。
密封元件34可以由与隔膜24相同的材料形成、特别是PTFE。然而,也可以使用其它材料。
通过将具有其螺纹37的引导套筒36旋拧到阀元件14的螺纹26中,膜片28的外周边被夹紧抵靠对接部22。突起30突出到阀元件14的内部空间中。
密封波纹管38的环形连接加强件48以紧密的方式(in a tight manner)夹紧在喷嘴主体10的两个部分之间,由此密封腔12,从而阀元件14布置在腔12中位于涂层材料入口2与阀座16“之间”。隔膜24密封在阀元件14的内部与腔12之间。
阀元件14的移位由分配控制活塞50控制,所述分配控制活塞布置在形成于喷嘴主体10中的分配控制腔室52中。
分配控制活塞50具有连接突出部51,其在其前部端部处具有内螺纹,所述内螺纹螺接到形成在密封元件34的控制突起42上的外螺纹44上。因此,分配控制活塞50的任何轴向位移经由密封元件34传递到阀元件14上。当分配控制活塞50在喷嘴主体10中被引导时,其为阀元件14提供引导作用。
分配控制活塞50在分配控制腔室52内的移位可以通过改变腔52内的压力来控制。为此,提供了压力连接件54(请参见图1)。弹簧56在分配控制活塞50的与布置有压力连接件54的侧部相对的侧部上布置在分配控制腔室52中。
为了控制分配控制活塞50从阀座16沿抬升阀元件14的方向(后部方向)上的最大位移,提供了可调节分配对接件58。分配对接件58由延伸到分配控制腔室52中的螺钉形成。通过将分配对接件58或多或少地旋拧到分配控制腔室52中,可以调节分配控制活塞50的最大行程。
如可以在图2中看到的,分配对接件58可以形成为是中空的,以便与形成在分配控制活塞50上的突起相互作用,以用于实现引导功能。
以已知的方式,密封件60可以用于使活塞50密封抵靠在分配控制腔室52和喷嘴主体10上。
分配控制活塞50被形成为是中空的,使得在其中形成有收回控制腔室62。在收回控制腔室62中,布置有收回控制活塞64。其设有突出部66,所述突出部具有空腔,所述空腔在其前部端部处具有内部螺纹68。螺纹68螺接到隔膜24的螺纹32上。
通过收回控制活塞62,隔膜24的膜片28可以在前部位置和后部位置之间移位。由于在阀元件14处于关闭位置时,膜片28用作分配通道18的确定体积的边界中的一个,因此收回膜片28会导致分配通道18的体积的增加,由此当膜片28被收回时,小体积的涂层材料被收回到分配通道18中。由于隔膜24的膜片28施加在涂层材料上的收回作用,隔膜24被称为收回元件。
收回控制活塞64在收回控制腔室62内的移位通过改变收回控制腔室62中的压力来控制。为此,提供了压力连接件69(请参见图1和2)。弹簧70在收回控制活塞64的与布置有压力连接件69的侧部相对的侧部上布置在收回控制腔室62中。
压力连接件69可以形成在收回对接件72中,所述收回对接件在此被实施为中空调节螺钉,其通过外螺纹74接合到形成在分配控制活塞50的后部中的内螺纹76中。因此,当阀元件14进行移位时,收回对接件72与分配控制活塞50一起移动。
收回控制活塞64可以向后(远离阀座16)移位,直到它对接在收回对接件72处。对应的行程可以通过将收回对接件72或多或少地旋拧到分配控制活塞50的后方部分中来被调节。
为了分配涂层材料,通过将分配控制腔室52中的压力增加到克服弹簧56的力并且分配控制活塞50沿后部方向移动的程度,阀元件14被达至打开状态中。因此,分配控制活塞50经由密封元件34将阀元件14从阀座16抬升。在图10所示的这种状态下,经由涂层材料入口2供给的涂层材料流动通过腔室12,并通过分配通道18离开。
当分配涂层材料时,隔膜24处于前部位置。这通过适当地控制收回控制腔室62中的压力来完成。
当要停止涂层材料的流动时,分配控制腔室52中的压力降低,使得分配控制活塞50通过弹簧56的作用以及可能通过施加到分配控制腔室52的压力水平在前向方向上移动,直到阀元件14对接在阀座16处。然后,涂层材料的流动停止。这种状态示出在图11中。
为了防止涂层材料从分配喷嘴1的前部端部处滴落,少量的涂层材料被吸回到分配通道18中。这通过使收回元件24从前部位置移动到图12所示的后部位置来完成。当阀元件14接触阀座16时,收回元件24的移位(更具体地,膜片28的位移)仅对位于阀座16的"下游"的涂层材料起作用。因此,被吸回到阀元件14的前部端部中的体积会导致在分配通道18的外端部处形成小的弯液面,并且没有涂层材料可以从分配喷嘴1滴落到待涂布的基底上。

Claims (14)

1.一种用于将涂层涂敷到基底上的分配喷嘴(1),具有:阀座(16);阀元件(14),所述阀元件适于在关闭位置与打开位置之间移位,在所述关闭位置中,所述阀元件与所述阀座(16)相互作用以关闭所述分配喷嘴(1)的涂层材料入口(2)与涂层材料出口(3)之间的连接,在所述打开位置中,所述连接被打开;并且进一步具有收回元件(24),所述收回元件适于在前部位置与后部位置之间移位,所述收回元件(24)与所述分配喷嘴(1)的在所述阀元件(14)的下游的分配通道(18)流体连通,其中所述收回元件(24)为在一个侧部上暴露于所述分配通道(18)的隔膜。
2.根据权利要求1所述的分配喷嘴(1),其中,所述收回元件(24)横向于所述分配通道(18)布置,尤其是在所述分配喷嘴(1)的喷嘴主体(10)中。
3.根据权利要求1所述的分配喷嘴(1),其中,所述收回元件(24)布置在所述阀元件(14)中并且与所述分配通道(18)流体连接。
4.根据权利要求1所述的分配喷嘴(1),其中,所述阀元件(14)是套筒,所述隔膜(24)被夹持到所述阀元件(14)。
5.根据权利要求1所述的分配喷嘴(1),其中,提供了密封元件(34),所述密封元件密封在所述分配喷嘴(1)的阀元件(14)与喷嘴主体(10)之间。
6.根据权利要求5结合权利要求4所述的分配喷嘴(1),其中,所述密封元件(34)旋拧到所述阀元件(14)中,并且将所述隔膜(24)夹持在其中。
7.根据权利要求1所述的分配喷嘴(1),其中,所述收回元件是活塞,所述活塞在一个侧部上暴露于所述分配通道(18)。
8.根据权利要求1所述的分配喷嘴(1),其中,设置有收回控制腔室(62),所述收回控制腔室操作性地连接至所述收回元件(24)。
9.根据权利要求8所述的分配喷嘴(1),其中,设置有收回控制活塞(64),所述收回控制活塞暴露于所述收回控制腔室(62)中的压力。
10.根据权利要求9所述的分配喷嘴(1),其中,设置有可调节收回对接件(72),用于调节所述收回控制活塞(64)的最大行程。
11.根据权利要求9结合权利要求6所述的分配喷嘴(1),其中,所述密封元件(34)在所述收回控制活塞(64)上被引导。
12.根据权利要求11所述的分配喷嘴(1),其中,所述收回控制活塞(64)旋拧在所述隔膜(24)的突起(30)上。
13.根据权利要求1所述的分配喷嘴(1),其中,设置有分配控制腔室(52),所述分配控制腔室操作性地连接至所述阀元件(14)。
14.根据权利要求13所述的分配喷嘴(1),其中,设置有可调节分配对接件(58),用于调节所述阀元件(14)的最大行程。
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