CN110573889B - Inspection jig and substrate inspection apparatus - Google Patents
Inspection jig and substrate inspection apparatus Download PDFInfo
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- CN110573889B CN110573889B CN201880027222.9A CN201880027222A CN110573889B CN 110573889 B CN110573889 B CN 110573889B CN 201880027222 A CN201880027222 A CN 201880027222A CN 110573889 B CN110573889 B CN 110573889B
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- 238000007689 inspection Methods 0.000 title claims abstract description 245
- 239000000758 substrate Substances 0.000 title claims abstract description 85
- 239000000523 sample Substances 0.000 claims abstract description 331
- 238000006073 displacement reaction Methods 0.000 claims abstract description 6
- 238000003780 insertion Methods 0.000 claims description 34
- 230000037431 insertion Effects 0.000 claims description 34
- 230000000149 penetrating effect Effects 0.000 claims description 11
- 238000002955 isolation Methods 0.000 claims description 9
- 230000001105 regulatory effect Effects 0.000 claims description 7
- 238000005192 partition Methods 0.000 description 12
- 230000008878 coupling Effects 0.000 description 10
- 238000010168 coupling process Methods 0.000 description 10
- 238000005859 coupling reaction Methods 0.000 description 10
- 239000004020 conductor Substances 0.000 description 8
- 238000005259 measurement Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000010030 laminating Methods 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005401 electroluminescence Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000452 restraining effect Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
The invention provides an inspection jig and a substrate inspection device, which can keep a probe in a bent state and can easily replace the probe. The inspection jig includes a positioning hole and a receiving hole which are capable of switching between an allowable state in which the movable plate is movable in an allowable direction parallel to the flat surface and a restrained state in which the movable plate is disposed so that the center of the probe through hole is displaced by a predetermined displacement amount in the allowable direction from the center of the probe supporting hole.
Description
Technical Field
The present invention relates to an inspection jig for bringing a probe (probe) into contact with an inspection point provided on a substrate to be inspected, and a substrate inspection apparatus including the inspection jig.
Background
The inspection jig is used for supplying electric power (electric signals and the like) from an inspection apparatus to an inspection target portion (inspection point) of an inspection target including a substrate via a probe (contact pin), and detecting an electric output signal from the inspection target to detect an electric characteristic of the inspection target, perform an operation test, and the like. In the present specification, an inspection target portion set on an inspection target substrate is referred to as an "inspection point".
For example, when mounting a semiconductor circuit such as an Integrated Circuit (IC) or an electric or electronic component such as a resistor on a substrate to be inspected, electrodes such as wirings and solder bumps (bumps) serve as inspection points. In this case, since the inspection point ensures that the electrical signal can be accurately transmitted to the mounted components, electrical characteristics such as resistance values between predetermined inspection points on the wiring formed on the printed wiring board, the liquid crystal panel, or the plasma display panel (plasma display panel) before the electrical and electronic components are packaged are measured to determine whether the wiring is good or bad.
Specifically, the determination of the quality of the wiring is performed as follows: a probe for current supply and a probe for voltage measurement are brought into contact with each inspection point of an inspection object, a current for measurement is supplied from the probe for current supply to the inspection point, a voltage generated in a wiring between tips of the probes for voltage measurement brought into contact with the inspection point is measured, and a resistance value of the wiring between predetermined inspection points is calculated based on the supplied current and the measured voltage.
There is known an inspection jig configured as follows: in order to bring the probe into contact with the inspection point, two guide plates (guide plates) are fixed to the frame body and arranged to face each other with a predetermined space therebetween, and the probe is inserted through the two guide plates to hold the probe. Further, the following inspection jigs are known: by holding such a probe in a bent state by the two guide plates, the probe is brought into elastic contact with the inspection point, thereby improving the contact stability (for example, see patent document 1).
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open No. 9-274054
Disclosure of Invention
However, there are cases where: when the substrate inspection is repeated, the probes are repeatedly brought into and out of contact with the inspection points, and the probes are damaged. The damaged probe must be removed from both guide plates and replaced. However, it is difficult to directly pull out the probe held in a bent state from the two guide plates. Therefore, for example, the inspection jig must be disassembled by removing screws or the like for fixing the guide plate to the housing, and the inspection jig must be assembled again by replacing the probe, which causes a problem that it takes time to replace the probe.
The invention aims to provide an inspection jig and a substrate inspection device, which can hold a probe in a bent state and can easily replace the probe.
An inspection jig according to an aspect of the present invention is an inspection jig for bringing a probe into contact with an inspection point provided on a substrate to be inspected, the inspection jig including: an inspection side support having a facing plate provided with a facing surface disposed to face the substrate; an electrode-side support body disposed opposite to the facing surface of the facing plate, and having a support plate and a flat surface; a connecting member for holding the examination-side support and the electrode-side support at a predetermined distance from each other; and movable flat plates disposed in opposite directions to be slidable in parallel to the flat surfaces; the inspection jig further includes a switching portion capable of switching between an allowable state in which the movable plate is movable in an allowable direction parallel to the flat surface and a restrained state in which the movable plate is disposed such that the center of the probe through hole is displaced from the center of the probe support hole by a predetermined displacement amount in the allowable direction.
In addition, a substrate inspection apparatus according to an aspect of the present invention includes: the inspection jig; an electrode which is in contact with a rear end portion of the probe on a side of the electrode-side support opposite to the flat surface; and an inspection unit that performs substrate inspection based on the electric signal obtained from the probe via the electrode.
In addition, a substrate inspection apparatus according to an aspect of the present invention includes: the inspection jig; an electrode plate on which an electrode is formed that contacts the rear end portion of the probe on the side opposite to the flat surface of the electrode-side support; and an inspection unit that performs substrate inspection based on an electrical signal obtained from the probe via the electrode; and the pin is vertically arranged on the electrode plate.
Drawings
Fig. 1 is a front view schematically showing a configuration of a substrate inspection apparatus including an inspection jig according to an embodiment of the present invention.
Fig. 2 is a perspective view showing an example of the inspection jig shown in fig. 1.
Fig. 3 is an exploded perspective view of the inspection jig shown in fig. 2.
Fig. 4 is a sectional view taken along line IV-IV of the inspection jig shown in fig. 2 and 3.
Fig. 5 is a sectional view of the inspection jig shown in fig. 4 in a permissive state.
Fig. 6 is an enlarged cross-sectional view of the inspection jig in the restrained state shown in fig. 4, showing the vicinity of one probe and a pin.
Fig. 7 is an explanatory view for explaining the inspection jig in the acceptable state.
Description of the symbols
1: substrate inspection device
2: control unit
4. 4U, 4L: inspection jig
5: examination side support
6: electrode-side support
7: connecting component (isolation limiting component)
8: movable flat plate
9: electrode plate
11: frame body
12: substrate fixing device
13: first inspection part (inspection part)
14: second inspection part (inspection part)
15: inspection unit moving mechanism
16: probe insertion hole
16 a: large diameter part
16 b: small diameter part
16c, 18c, 23 c: center of a ship
18: probe through hole
18 a: movable side large diameter part
18 b: small diameter part on movable side
19: positioning hole (switching part)
20: receiving hole (switching part)
20 a: opening edge part
21: probe guide hole
21a, 21 b: large diameter part
21 c: small diameter part
23: probe support hole
23 a: support side large diameter part
23 b: support side small diameter part
31: conductor part
32: insulating part
51: opposite flat plate
52: guide plate
61: support flat plate
62: partition plate
63: separating film
64: concave part
71. 72, 73: wall part
91: electrode for electrochemical cell
92: cable with a flexible connection
100: substrate
621. 631, 711, 721, 731: opening a: region(s)
B: back side of the panel
d: difference (D)
F: facing surface
La, Lb: deviation amount
P: pin
P1: inclined plane
Pr: probe needle
R: angle of inclination
W1, W2, Wp: width of
X: flat surface
Detailed Description
Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings, the same reference numerals denote the same components, and a description thereof will be omitted. For convenience of explanation, directions in the front, rear, left, and right directions are appropriately marked in the drawings, and the explanation will be made based on the directions.
(embodiment 1)
Fig. 1 is a front view schematically showing a configuration of a substrate inspection apparatus 1 including an inspection jig according to an embodiment of the present invention. The substrate inspection apparatus 1 shown in fig. 1 is an apparatus for inspecting a circuit pattern formed on a substrate 100 to be inspected.
The substrate inspection apparatus 1 shown in fig. 1 includes a housing 11. In the internal space of the housing 11, a substrate fixing device 12, a first inspection unit 13 (inspection unit), and a second inspection unit 14 (inspection unit) are mainly provided. The substrate fixing device 12 is configured to fix a substrate 100 to be inspected at a predetermined position.
The substrate 100 may be various substrates such as a printed wiring board, a glass epoxy substrate, a flexible substrate, a ceramic multilayer wiring board, an electrode plate for a display such as a liquid crystal display or an Electroluminescence (EL) display, a transparent conductive plate for a touch panel, a package substrate or a film carrier for semiconductor packaging, a semiconductor substrate such as a semiconductor wafer or a semiconductor Chip or a Chip Size Package (CSP), and the like. The substrate 100 is formed with inspection points such as wiring patterns and solder bumps.
The first inspection portion 13 is located above the substrate 100 fixed to the substrate fixing device 12. The second inspection section 14 is located below the substrate 100 fixed to the substrate fixing device 12. The first inspection unit 13 and the second inspection unit 14 include an electrode plate 9 on which an electrode 91 is formed to be electrically connected to the probe Pr. Each of the electrode plates 9 of the first inspection unit 13 and the second inspection unit 14 is mounted with an inspection jig 4U and an inspection jig 4L for inspecting a circuit pattern formed on the substrate 100. A plurality of probes Pr are mounted on the inspection jig 4U and the inspection jig 4L. The first inspection unit 13 and the second inspection unit 14 include a scanner circuit (scanner circuit), which will be omitted from the drawings, and an inspection unit moving mechanism 15 for appropriately moving the inspection units within the housing 11.
The substrate inspection apparatus 1 includes a control unit 2 that controls operations of the substrate fixing device 12, the first inspection unit 13, the second inspection unit 14, and the like. The control unit 2 is configured by a microcomputer (micro computer), for example. The control unit 2 is configured as follows: by moving the first inspection unit 13 and the second inspection unit 14 appropriately, the probes Pr of the inspection jig 4U and the inspection jig 4L are brought into contact with the substrate 100 fixed to the substrate fixing device 12, and the circuit pattern formed on the substrate 100 is inspected by the inspection jig 4U and the inspection jig 4L. The inspection jig 4U and the inspection jig 4L are configured similarly to each other. Hereinafter, the inspection jig 4U and the inspection jig 4L are collectively referred to as the inspection jig 4.
Fig. 2 is a perspective view showing an example of the inspection jig 4 shown in fig. 1. Fig. 3 is an exploded perspective view of the inspection jig 4 shown in fig. 2. Fig. 4 is a sectional view taken along line IV-IV of the inspection jig 4 shown in fig. 2 and 3. Fig. 5 is a sectional view of the inspection jig 4 shown in fig. 4 in a permissive state. Fig. 2 and 4 show the inspection jig 4 in the restrained state, and fig. 3 and 5 show the inspection jig 4 in the allowed state. In FIGS. 2 and 3, the probe Pr is not shown.
The drawing showing the inspection jig 4 shows the direction of the inspection jig 4L attached to the lower second inspection unit 14, and the upper inspection jig 4U is attached to the first inspection unit 13 in the opposite direction to the vertical and horizontal directions shown in the drawing.
The inspection jig 4 shown in fig. 2 to 5 includes an inspection side support 5 disposed to face the substrate 100, an electrode side support 6 disposed to face the inspection side support 5 on the opposite side of the substrate 100, a connecting member 7 holding the inspection side support 5 and the electrode side support 6 in parallel with each other at a predetermined distance, and a movable flat plate 8.
The inspection side support 5 is configured by laminating a facing flat plate 51 and a guide flat plate 52 in this order from above the arrangement substrate 100. The opposing plate 51 includes an opposing surface F disposed to face the substrate 100. The opposing plate 51 is integrally fixed to the guide plate 52 by a detachable fixing means such as a bolt.
A plurality of probe insertion holes 16 (see fig. 6) described later for inserting the tip end portions of the probes Pr are formed in the opposing flat plate 51. Each of the probe insertion holes 16 guides the tip of the probe Pr to a plurality of inspection points provided on the substrate 100. The guide plate 52 has a plurality of probe guide holes 21, which will be described later, formed therein and communicate with the plurality of probe insertion holes 16.
The electrode-side support 6 is formed by laminating a support plate 61, a separator film (spacer film)63, and a separator plate (spacer plate)62 in this order from the side opposite to the facing surface F. The lower surface of the support plate 61 is brought into contact with the rear surface B of the electrode plate 9 on which the electrode 91 described later is formed. A plurality of probe support holes 23 (fig. 6) described later are formed in the support plate 61 so as to correspond to the plurality of probe insertion holes 16.
The movable plate 8 is housed in the recess 64. The movable plate 8 is provided with a plurality of probe through holes 18 (fig. 6) for allowing the probes Pr to pass through, corresponding to the plurality of probe support holes 23. As shown in fig. 3, the width W1 in the left-right direction, which is the allowable direction of the movable flat plate 8, is smaller than the width W2 in the left-right direction of the recess 64.
Thus, when the probe Pr is not inserted, the movable plate 8 can slide freely in the concave portion 64 and can move in the left-right direction (allowable direction) within the range of the difference d between the width W1 and the width W2. When the difference d is set to about 2mm, for example, and the movable plate 8 is positioned at the center of the recess 64, the movable plate 8 can move by 1mm with respect to both the left and right sides.
In the movable plate 8, receiving holes 20 are formed that can receive pins P that penetrate the support plate 61 and protrude from the positioning holes 19 in the restrained state (fig. 4). The receiving holes 20 are provided at two places on the diagonal of the movable plate 8, for example (fig. 3).
The connecting member 7 includes a wall portion 71 extending in the front-rear direction and standing on the guide flat plate 52, a wall portion 72 disposed opposite to the wall portion 71 with a space therebetween substantially parallel thereto, and a wall portion 73 connecting rear end portions of the wall portion 71 and the wall portion 72. Wall 71, wall 72, and wall 73 have opening 711, opening 721, and opening 731 formed therein to extend through the windows.
The coupling member 7 is attached to the guide plate 52 so that the lower surface of the coupling member 7 is an area a spanning the edge of the recess 64. Thus, the lower end of the connecting member 7 protrudes inward of the recess 64, and covers the edge of the movable plate 8 housed in the recess 64. As a result, the movement of the movable flat plate 8 in the direction perpendicular to the flat surface X is restricted by the lower end portion of the connecting member 7. The coupling member 7 corresponds to an example of the isolation restriction member, and serves as both the coupling member and the isolation restriction member.
The movable plate 8 and the partition plate 62 are formed of a plate material having the same thickness. By laminating the partition plate 62 and the partition film 63 on the support plate 61, the depth of the recess 64 is made deeper than the thickness of the movable plate 8 by the thickness of the partition film 63. As a result, a gap is formed between the lower end portion of the coupling member 7 and the upper surface of the movable plate 8, and the movable plate 8 is not sandwiched between the coupling member 7 and the flat surface X, so that the frictional resistance when the movable plate 8 moves in the left-right direction (allowable direction) is reduced, and the movable plate can slide freely.
The connecting member 7 restricts the movement of the movable flat plate 8 in the direction perpendicular to the flat surface X beyond a vertical movement allowable distance set in advance in accordance with the thickness of the separation film 63. The upper inspection jig 4U is inverted from the upper to lower directions in fig. 2 to 5, and the movable plate 8 is supported by the connecting member 7 (separation regulating member), so that a gap of a vertical movement allowable distance is generated between the movable plate 8 and the flat surface X.
Further, the partition film 63 does not necessarily have to be laminated, and the thickness of the partition flat plate 62 may be made thicker than the thickness of the movable flat plate 8 by a vertically movable allowable distance. The electrode-side support 6 is not limited to the example including the partition plate 62 and the support plate 61, and the electrode-side support 6 may include one support plate 61 and the recess 64 may be formed in the upper surface of the support plate 61.
The electrode-side support 6 is not limited to the example in which the recess 64 is formed. The upper surface of the electrode-side support 6 may be a flat surface X, or the electrode-side support 6 may include one support plate 61, and the upper surface of the support plate 61 may be a flat surface X.
In addition, the example in which the coupling member 7 also serves as the isolation restriction member is not limited. The coupling member 7 may be configured not to protrude into the recess 64, and a separation restricting member may be provided separately from the coupling member 7. In the lower inspection jig 4L, the movable plate 8 is in contact with the flat surface X by its own weight, and therefore, it is not always necessary to provide an isolation regulating member. However, it is preferable to provide the isolation regulating member also in the inspection jig 4L from the viewpoint of preventing the floating of the movable flat plate 8 from the flat surface X when the pin P is inserted or when the probe Pr is bent.
Fig. 6 is an enlarged cross-sectional view of the inspection jig 4 in the restrained state shown in fig. 4, showing the vicinity of one probe Pr and the pin P. Fig. 6 shows a state in which the inspection jig 4 is mounted on the electrode plate 9 of the second inspection unit 14.
The opposing plate 51 is formed with a probe insertion hole 16 for inserting the probe Pr vertically through the opposing plate 51. A plurality of probe insertion holes 16 are formed corresponding to inspection points provided on the substrate 100. The probe insertion hole 16 is provided with a large diameter portion 16a and a small diameter portion 16b concentric with the large diameter portion 16a and having a smaller diameter than the large diameter portion 16 a.
The guide plate 52 has a probe guide hole 21 vertically penetrating the guide plate 52 for guiding the probe Pr. The probe guide holes 21 are formed in a plurality corresponding to the probe insertion holes 16, concentrically with the probe insertion holes 16. The probe guide hole 21 is provided with a large diameter portion 21a, a large diameter portion 21b, and a small diameter portion 21c concentric with the large diameter portion 21a and the large diameter portion 21b and having a smaller diameter than the large diameter portion 21a and the large diameter portion 21 b.
The probe Pr includes, for example, a rod-shaped conductor portion 31 having a diameter of about 100 μm, and an insulating portion 32 covering an outer peripheral surface of the conductor portion 31. As the conductor part 31, for example, a palladium alloy having elasticity and hardly adhering to solder can be suitably used. The insulating portion 32 is formed of an insulator such as synthetic resin. The insulating section 32 may be formed by applying an insulating coating to the surface of the conductor section 31.
The insulation portion 32 is not formed at the front end portion and the rear end portion of the probe Pr, and an exposed portion where the conductor portion 31 is exposed is provided. The exposed portion of the tip portion of the probe Pr protrudes from the small diameter portion 16b of the probe insertion hole 16 and comes into contact with the inspection point of the substrate 100.
The inner diameters of the small diameter portion 16b and the small diameter portion 21c are slightly larger than the outer diameter of the conductor portion 31, and the inner diameter of the small diameter portion 21c is slightly smaller than the outer diameter of the insulating portion 32. Thus, the conductor part 31 is guided to the inspection point with high accuracy by the small diameter part 16b, and the probe Pr is prevented from falling off from the facing surface F by the interference of the insulating part 32 with the small diameter part 21 c.
One end of a cable (wire cable)92 is inserted into the electrode plate 9 so as to penetrate through the electrode plate 9 in the thickness direction from the back surface opposite to the mounting surface facing the electrode-side support 6. The mounting surface of the electrode plate 9 facing the electrode-side support 6 is polished flat, and the end surfaces of the plurality of cables 92 are exposed. The exposed end surface of these wires 92 is used as an electrode 91. Each cable 92 is connected to the scanner circuit.
Further, a pin P projecting perpendicularly from the surface attached to the support plate 61 is attached to the electrode plate 9. The protruding length of the pin P from the electrode plate 9 is made longer than the thickness of the support plate 61. At the tip end of the pin P, an inclined surface P1 is formed that is continuous with the outer periphery of the pin P and is inclined toward the axial center. The shape of the tip end of the pin P may be any of various shapes having the inclined surface P1, for example, a conical shape or a hemispherical shape.
In the support plate 61, a probe support hole 23 is formed to guide the rear end portion of the probe Pr to the electrode 91. The probe supporting hole 23 vertically penetrates the supporting plate 61 and supports the rear end portion of the probe Pr by inserting the rear end portion. A plurality of probe support holes 23 are formed corresponding to the probe insertion holes 16 and the electrodes 91.
The probe support hole 23 is provided with: a support-side large diameter portion 23a having an opening formed in a surface of the support plate 61 on the movable plate 8 side; and a support side small diameter part 23b formed on a side farther from the movable plate 8 than the support side large diameter part 23a, concentric with the support side large diameter part 23a, and having a diameter smaller than the support side large diameter part 23 a. The rear end of the probe Pr inserted into the probe support hole 23 protrudes from the support-side small diameter portion 23b and contacts the electrode 91.
Further, the support plate 61 is formed with a positioning hole 19 penetrating the support plate 61. The positioning hole 19 is inserted with a pin P for restricting the position of the movable plate 8.
The movable plate 8 is provided with a plurality of probe through holes 18 for allowing the probes Pr to pass through, corresponding to the probe support holes 23 of the support plate 61. The probe through hole 18 is formed with a movable-side large diameter portion 18a that opens toward the surface of the movable plate 8 on the support plate 61 side. The probe through hole 18 is formed with a movable small diameter portion 18b, and the movable small diameter portion 18b is formed on a side farther from the support plate 61 than the movable large diameter portion 18a, is concentric with the movable large diameter portion 18a, and has a smaller diameter than the movable large diameter portion 18 a.
Further, the movable plate 8 is formed with a receiving hole 20 formed to receive a pin P which penetrates the support plate 61 and protrudes from the positioning hole 19. The pin P is inserted into the positioning hole 19 and the receiving hole 20, so that the center line of the positioning hole 19 and the center line of the receiving hole 20 are aligned, and the movable plate 8 is positioned relative to the support plate 61, thereby being in the restrained state.
The positioning hole 19 and the receiving hole 20 are disposed so that the center of the probe through hole 18 is offset from the center of the probe support hole 23 by a predetermined offset La in an allowable direction (left-right direction in the drawing) in the restrained state. The deviation La in the restrained state is smaller than the difference between the total of the radius of the support-side large diameter portion 23a and the radius of the movable-side large diameter portion 18a and the outer diameter of the probe Pr. Thus, the probe Pr can be inserted through the probe support hole 23 and the probe through hole 18 even in the restrained state.
The positioning hole 19 and the receiving hole 20 correspond to an example of a switching portion for switching between an allowable state in which the movable plate 8 is movable in an allowable direction parallel to the flat surface X and a restrained state in which the movable plate 8 is disposed so that the center of the probe through hole 18 is offset from the center of the probe support hole 23 by a predetermined offset La in the allowable direction.
The receiving hole 20 is not necessarily limited to the example of penetrating the movable plate 8, and may be a hole (recess) having a bottom. The switching portion is not limited to the positioning hole 19 and the receiving hole 20. The switching portion may be a hook or the like that can switch between an allowable state in which the movable plate 8 is movable in an allowable direction parallel to the flat surface X and a restrained state in which the movable plate 8 is disposed so that the center of the probe through hole 18 is offset from the center of the probe support hole 23 by a predetermined offset La in the allowable direction.
Since the pin P is provided upright on the electrode plate 9, the movable plate 8 is positioned in the restrained state by inserting the pin P into the positioning hole 19 and the receiving hole 20 by attaching the inspection jig 4 to the electrode plate 9, and the pin P is pulled out from the positioning hole 19 and the receiving hole 20 by detaching the inspection jig 4 from the electrode plate 9 to switch to the permission state.
As shown in fig. 6, in the restrained state, the center 18c of the probe through-hole 18 is offset from the center 23c of the probe support hole 23 by an offset La in the allowable direction (left-right direction). Therefore, the probe Pr inserted into the positioning hole 19 and held at the tip by the support-side small diameter portion 23b is bent leftward in fig. 6 by the offset La in the allowable direction by the movable-side small diameter portion 18b of the probe through hole 18. As a result, the probe Pr is bent in a substantially S-shape.
The probe through hole 18 includes a movable-side large diameter portion 18a and a movable-side small diameter portion 18b, and the probe support hole 23 includes a support-side large diameter portion 23a and a support-side small diameter portion 23 b. Therefore, the probe Pr is supported by the movable-side small diameter portion 18b and the support-side small diameter portion 23b, and is inclined inside the movable-side large diameter portion 18a and the support-side large diameter portion 23 a. As a result, the probe Pr can be smoothly bent.
The probe through hole 18 may be formed by only the movable-side large diameter portion 18a, and the probe support hole 23 may be formed by only the support-side large diameter portion 23 a. However, when the probe through-hole 18 is constituted only by the movable side large diameter portion 18a and the probe support hole 23 is constituted only by the support side large diameter portion 23a, there is a possibility that: in the restrained state, the probes Pr move in parallel in the offset direction (the left direction in fig. 6) without being inclined inside the probe through-holes 18 and the probe support holes 23. If the probes Pr move in parallel without being inclined inside the probe through-holes 18 and the probe support holes 23, the probes Pr are less likely to bend in a substantially S-shape. Therefore, it is preferable that the probe through hole 18 includes a movable-side large diameter portion 18a and a movable-side small diameter portion 18b, and the probe support hole 23 includes a support-side large diameter portion 23a and a support-side small diameter portion 23 b.
When the opposing surface F of the inspection jig 4 is not in contact with the substrate 100, the tip of the probe Pr protrudes from the opposing surface F. When the opposing surface F of the inspection jig 4 is brought into contact with the substrate 100 to inspect the substrate 100, the tip of the probe Pr comes into contact with the inspection point, and the protruding portion is pushed into the probe insertion hole 16.
At this time, the probe Pr is bent in a substantially S-shape, so that the probe Pr is smoothly bent in accordance with the pushing of the tip portion, and the pushed amount is absorbed. Further, the probe Pr bent in a substantially S-shape biases the tip of the probe Pr to the inspection point by the elastic restoring force, so that the tip of the probe Pr can be brought into elastic contact with the inspection point. As a result, the contact stability between the inspection point and the probe Pr can be improved.
As described above, when the inspection jig 4 is attached to the electrode plate 9, the pin P erected on the electrode plate 9 is inserted into the positioning hole 19 and the receiving hole 20 to bring the movable plate 8 into the restrained state, and the probe Pr is bent in a substantially S-shape to be in a state suitable for the inspection of the substrate 100.
In addition, the center 23c of the probe support hole 23 is deviated by only the amount Lb from the center 16c of the probe insertion hole 16 in the direction parallel to the flat surface. The center 16c may also be the center of the probe guide hole 21. The direction of deviation of the center 23c of the probe support hole 23 from the center 16c of the probe insertion hole 16 (the left direction in fig. 6) is the same as the direction of deviation of the center 18c of the probe through hole 18 in the restrained state from the center 23c of the probe support hole 23 (the left direction in fig. 6).
Thus, in the restrained state, the portion held by the movable small diameter portion 18b of the probe Pr is deviated in the deviation direction (left direction in fig. 6) from the center 16c of the probe insertion hole 16 by a length corresponding to the sum of the deviation La and the deviation Lb, and as a result, the bending amount of the probe Pr can be increased.
The direction of the deviation of the center 23c of the probe support hole 23 from the center 16c of the probe insertion hole 16 and the direction of the deviation of the center 18c of the probe through hole 18 in the restrained state from the center 23c of the probe support hole 23 may be different.
The probes Pr are provided in the number of inspection points, for example, several thousand probes are provided in each of the inspection jigs 4U and 4L. When one of the probes is deteriorated, damaged, or the like and needs to be replaced, the damaged probe Pr needs to be pulled out from the inspection jig 4 and a new probe Pr needs to be inserted into the inspection jig 4 again.
When the probe held in a bent state is replaced, the bent probe cannot be inserted or removed. Therefore, conventionally, it is necessary to disassemble the inspection jig by removing screws or the like for fixing the flat plate, replace the probe, and reassemble the inspection jig.
On the other hand, in the case of the substrate inspection apparatus 1, the probe Pr can be replaced as follows. That is, when the probe Pr is replaced, the user first removes the inspection jig 4 from the electrode plate 9. When the inspection jig 4 is detached from the electrode plate 9, the pin P erected on the electrode plate 9 is pulled out from the receiving hole 20 and the positioning hole 19, and the movable plate 8 is switched to an allowable state in which it can move in an allowable direction.
Fig. 7 is an explanatory diagram for explaining the inspection jig 4 in the acceptable state. When the state is allowed, the flexible probe Pr attempts to return to the linear elastic restoring force, and the movable plate 8 moves in the direction (right direction in fig. 7) opposite to the deviating direction (left direction in fig. 7). At this time, since the centers 16c of the probe insertion holes 16 and the probe guide holes 21 and the center 23c of the probe support hole 23 are deviated by the deviation amount Lb in the allowable direction, the probe Pr attempts to return to a straight line linking the probe support hole 23 and the guide flat plate 52. As a result, the probe Pr is inclined at an inclination angle R in a direction perpendicular to the flat surface X.
The inclination angle R is, for example, 0.5 to 2 degrees, and more preferably approximately 1 degree. When the probe Pr is inclined at such a slight inclination angle in the allowable state, the probe insertion hole 16, the probe guide hole 21, the probe through hole 18, and the probe support hole 23 interfere with the probe Pr, and a slight frictional force is generated. Due to the frictional force, even when the inspection jig 4 is detached from the electrode plate 9 and the back surface B faces downward, the probe Pr is less likely to fall off from the inspection jig 4. This reduces the possibility that the probe Pr which does not need to be replaced comes off the inspection jig 4.
The centers 16c of the probe insertion holes 16 and the probe guide holes 21 and the center 23c of the probe support hole 23 may not necessarily be offset, and the holes may be provided on a straight line perpendicular to the opposing surface F. In this case, the probe Pr can be easily replaced.
In the allowable state, the movable plate 8 moves by the elastic restoring force of the probe Pr to restore the probe Pr to a linear shape, and thus the probe Pr becomes substantially linear. Therefore, in the acceptable state, the force with which the inspection jig 4 holds the probe Pr is only a slight frictional force generated by the slight inclination angle R. The frictional force is a slight resistance to the extent that the probe Pr is prevented from falling. Therefore, the user can easily extract the probe Pr from the inspection jig 4 against the frictional force and insert a new probe Pr into the inspection jig 4.
Since the opening 711, the opening 721, and the opening 731 are formed in the wall 71, the wall 72, and the wall 73 of the coupling member 7, when the user replaces the probe Pr, the user can replace the probe Pr while visually observing the probe Pr from the opening 711, the opening 721, and the opening 731 in the space between the inspection side support 5 and the electrode side support 6. As a result, the probe Pr can be easily replaced.
According to the substrate inspection apparatus 1, when the probe Pr is replaced, the inspection jig 4 is switched from the constraint state in which the probe Pr is bent to the allowable state in which the probe Pr is substantially linear by detaching the inspection jig 4 from the substrate inspection apparatus 1, and therefore the probe Pr can be held in a state in which the probe Pr is bent, and replacement of the probe Pr is facilitated.
Further, the projection length Lc is made smaller than the width Wp of the inclined surface P1 of the pin P in the direction orthogonal to the axial center, and the projection length Lc is a length by which the opening edge portion 20a of the opening peripheral edge of the lower end (the end on the support plate 61 side) of the receiving hole 20 projects with respect to the inner wall surface of the positioning hole 19 after the movable plate 8 is moved by the restoring force of the probe Pr.
Therefore, when the pin P is inserted into the positioning hole 19 in the allowable state and the pin P is pushed in, the opening edge portion 20a of the receiving hole 20 abuts on the inclined surface P1 of the pin P. When the pin P is further pushed from here, the inclined surface P1 slides on the opening edge portion 20a, and the movable plate 8 is moved in a direction (left direction) in which the positioning hole 19 coincides with the center of the receiving hole 20 with the advance of the pin P, so that the pin P is inserted into the receiving hole 20 and the movable plate 8 is in the restrained state.
Therefore, after the user replaces the probe Pr, the inspection jig 4 is attached to the substrate inspection apparatus 1, the pin P is inserted into the positioning hole 19 and the receiving hole 20 to place the movable plate 8 in the restrained state, and the probe Pr is bent in a substantially S-shape to be in a state suitable for inspection. Thus, the user can easily set the inspection jig 4 in a state suitable for inspection after replacing the probe Pr by attaching the inspection jig 4 to the substrate inspection apparatus 1 while keeping the movable plate 8 in the restrained state.
The pin P may not necessarily be vertically provided on the electrode plate 9. Even if the pin P is not vertically provided on the electrode plate 9, the inspection jig 4 is in the restraint state by inserting the pin P into the positioning hole 19 and the receiving hole 20, and is in the permission state by pulling out the pin P from the receiving hole 20, so that the probe Pr is easily replaced. Therefore, even if the pin P is not vertically provided on the electrode plate 9, the inspection jig 4 holds the probe Pr in a state where the probe Pr is bent, and the probe Pr can be easily replaced.
The inclined surface P1 may not be formed on the probe Pr. Even if the inclined surface P1 is not formed, the inspection jig 4 is brought into the restrained state by inserting the pin P in accordance with the positions of the positioning hole 19 and the receiving hole 20, and the inspection jig 4 is brought into the allowed state by pulling out the pin P from the receiving hole 20.
Next, the first inspection unit 13, the second inspection unit 14, and the control unit 2 shown in fig. 1 will be described. The first inspection unit 13 and the second inspection unit 14 accommodate scanner circuits, which are not shown, including a galvanometer, a voltmeter, a current source, a multiplexer (multiplexer), a switch circuit, and the like. To the scanner circuit, a cable 92 shown in fig. 6 is connected. Thus, when the inspection jig 4 is attached to the electrode plate 9, the rear end portion of each probe Pr comes into contact with the electrode 91, and each probe Pr is electrically connected to the scanner circuit.
When the substrate 100 is pressed against the opposing flat plate 51 in this state, the tip of the probe Pr is pressed by the substrate 100, and the tip of the probe Pr is pressed against the inspection point of the substrate 100 by the force applied according to the elasticity of the probe Pr.
The scanner circuit supplies a predetermined current between the pair of probes Pr corresponding to the inspection site, for example, in accordance with a control signal from the control unit 2, measures a voltage between the pair of probes Pr corresponding to the inspection site, and transmits the measurement result to the control unit 2.
The control unit 2 performs substrate inspection based on the measurement result obtained from the scanner circuit. Specifically, for example, the controller 2 brings the inspection side support 5 of the inspection jig 4 into pressure contact with the substrate 100 and brings the probes Pr into contact with the inspection points. Then, the control unit 2 causes a predetermined inspection current to flow between the probe Pr in contact with one of the inspection points and the probe Pr in contact with the other inspection point between the two inspection points to be inspected by the scanner circuit, and measures a voltage between the probe Pr in contact with the one inspection point and the probe Pr in contact with the other inspection point as a detection voltage by the scanner circuit. The control unit 2 compares an electric signal such as the detection voltage or a resistance value between inspection points obtained from the detection voltage with a preset reference value, for example, to determine whether the substrate 100 is good or bad. In this way, the substrate inspection apparatus 1 can perform the inspection of the substrate 100 using the inspection jig 4.
That is, an inspection jig according to an aspect of the present invention is an inspection jig for bringing a probe into contact with an inspection point provided on a substrate to be inspected, the inspection jig including: an inspection side support having a facing flat plate provided with a facing surface disposed to face the substrate; an electrode-side support body disposed opposite to the facing surface of the facing plate, and having a support plate and a flat surface; a connecting member for holding the examination-side support and the electrode-side support at a predetermined distance from each other; and movable flat plates disposed in opposite directions to be slidable in parallel to the flat surfaces; the inspection jig further includes a switching portion capable of switching between an allowable state in which the movable plate is movable in an allowable direction parallel to the flat surface and a restrained state in which the movable plate is disposed such that the center of the probe through hole is displaced from the center of the probe support hole by a predetermined displacement amount in the allowable direction.
According to the above configuration, the restricted state and the allowed state can be switched by the switching unit. In the restrained state, the center of the probe through hole through which the probe penetrates is displaced from the center of the probe support hole supporting the rear end portion of the probe by a predetermined displacement amount in the allowable direction. The probe is held in a bent state by the deviation. On the other hand, in the allowable state, the movable plate through which the probe penetrates can be moved in an allowable direction parallel to the flat surface. Then, in the allowable state, the movable plate is moved by the elastic restoring force of the bent probe, and the probe becomes substantially linear. The substantially linear probe is easily inserted into and removed from the examination-side support and the electrode-side support. Therefore, the probe can be held in a state where the bending occurs, and the replacement of the probe becomes easy.
In addition, it is preferable that: the switching unit includes: a positioning hole through which a pin is inserted, the pin penetrating the support plate and being used to restrain the position of the movable plate; and a receiving hole formed in the movable plate to receive the pin, the pin penetrating through the support plate and protruding from the positioning hole.
According to the above configuration, the pin is inserted through the positioning hole of the support plate, and the pin is inserted into the receiving hole, so that switching to the restraining state in which the movable plate is restrained with respect to the support plate is facilitated.
In addition, it is preferable that: the tip end of the pin is formed with an inclined surface inclined from the outer periphery of the pin toward the axis.
According to the above configuration, the inclined surface can be brought into contact with the opening edge of the receiving hole by further pressing the pin inserted into the positioning hole. The inclined surface and the opening edge portion slide by further pushing the pin, and the movable plate is moved in a direction in which the positioning hole coincides with the center of the receiving hole along with the travel of the pin, so that the pin is received in the receiving hole, and the movable plate is in a restrained state. In this case, the movable plate can be positioned in the restrained state by simply inserting the pin into the positioning hole and the receiving hole, and therefore, switching to the restrained state is facilitated.
In addition, it is preferable that: the deviation amount in the restrained state is smaller than a difference between a total value of the radius of the probe support hole and the radius of the probe through hole and the diameter of the probe.
According to the above configuration, the probe can be passed through the probe support hole and the probe through-hole in the restrained state.
In addition, it is preferable that: the probe supporting hole includes: a support-side large diameter portion having an opening formed toward a surface of the support plate on the movable plate side; and a support-side small diameter portion formed on a side farther from the movable plate than the support-side large diameter portion and having a diameter smaller than the support-side large diameter portion; and the probe through-hole includes: a movable-side large diameter portion having an opening formed in a surface of the movable plate on the support plate side; and a movable side small diameter portion formed on a side farther from the support plate than the movable side large diameter portion and having a diameter smaller than the movable side large diameter portion; the deviation amount in the restrained state is smaller than a difference between a sum of the radius of the support-side large diameter portion and the radius of the movable-side large diameter portion and the diameter of the probe.
According to the above configuration, the probe can be supported by the movable-side small diameter portion and the support-side small diameter portion, and the probe can be tilted in the inside of the movable-side large diameter portion and the support-side large diameter portion in the restrained state. As a result, the probe can be smoothly bent in the restrained state.
In addition, it is preferable that: further comprising an isolation regulating member for regulating the movement of the movable plate in a direction perpendicular to the flat surface.
According to the above configuration, the movable plate can be prevented from being detached from the support plate.
In addition, it is preferable that: the electrode-side support includes a recess for accommodating the movable plate, a bottom surface of the recess is the flat surface, and a distance between side walls of the recess facing each other in the direction of the offset is larger than a length of the movable plate in the direction of the offset by the offset amount or more.
According to the above configuration, excessive movement of the movable plate in the direction parallel to the flat surface can be prevented while the movable plate accommodated in the recess portion is held in the allowable state and the restrained state.
In addition, it is preferable that: the center of the probe supporting hole is deviated from the center of the probe insertion hole in a direction parallel to the flat surface.
According to the above configuration, when the probe is in the allowable state, the movable plate is moved by the elastic restoring force with which the bent probe tries to restore to the linear shape, and the probe becomes substantially linear. At this time, the center of the probe insertion hole is deviated from the center of the probe support hole, and thus the probe attempts to be restored to a straight line linking the probe insertion hole and the probe support hole. As a result, the probe is inclined in the direction perpendicular to the flat surface. By tilting the probe, the probe insertion hole and the probe support hole interfere with the probe, thereby generating a slight frictional force. Through the friction force, the possibility that the probe which does not need to be replaced falls off from the inspection jig is reduced.
In addition, it is preferable that: the deviation direction of the center of the probe supporting hole relative to the center of the probe insertion hole is the same as the deviation direction of the probe through hole relative to the probe supporting hole in the restrained state.
According to the above configuration, in the restrained state, the amount of deviation of the portion of the probe held in the probe through-hole from the probe insertion hole is a deviation obtained by adding the amount of deviation of the probe supporting hole from the probe insertion hole to the amount of deviation of the probe through-hole from the probe supporting hole. As a result, the amount of bending of the probe in the restrained state can be increased.
In addition, it is preferable that: further comprising the probe, wherein the movable plate is positioned based on an elastic restoring force of the probe in the allowable state.
According to the above configuration, in the allowable state, the movable plate is moved and positioned by the elastic restoring force of the probe to be substantially linear. Therefore, by switching to the permission state, the movable plate can be automatically positioned at a position where the probe can be substantially linearly formed.
In addition, a substrate inspection apparatus according to an aspect of the present invention includes: the inspection jig; an electrode which is in contact with a rear end portion of the probe on a side of the electrode-side support opposite to the flat surface; and an inspection unit that performs substrate inspection based on the electric signal obtained from the probe via the electrode.
According to the above configuration, it is possible to provide a substrate inspection apparatus capable of holding a probe in a state where a bend occurs and facilitating replacement of the probe.
In addition, a substrate inspection apparatus according to an aspect of the present invention includes: the inspection jig; an electrode plate on which an electrode is formed that contacts the rear end portion of the probe on the side opposite to the flat surface of the electrode-side support; and an inspection unit that performs substrate inspection based on an electrical signal obtained from the probe via the electrode; and the pin is vertically arranged on the electrode plate.
According to the above configuration, when the probe is replaced, the inspection jig is detached from the electrode plate of the substrate inspection apparatus, and the pin is pulled out from the inspection jig, so that the probe is switched from the constraint state in which the probe is bent to the allowable state in which the probe is substantially linear.
The inspection jig and the substrate inspection apparatus having such a configuration can hold the probe Pr in a state where the probe is bent, and can facilitate the replacement of the probe.
The present application is based on Japanese patent application laid-open at 27/4/2017, Japanese patent application laid-open at 2017, and the content thereof is included in the present application. The specific embodiments and examples in the section for carrying out the invention are the subject of the present invention, and the present invention is not limited to these specific embodiments and is to be interpreted in a narrow sense.
Claims (18)
1. An inspection jig for bringing a probe into contact with an inspection point provided on a substrate to be inspected, comprising:
an inspection side support having a facing plate provided with a facing surface disposed to face the substrate;
an electrode-side support body disposed opposite to the facing surface of the facing plate, and having a support plate and a flat surface;
a connecting member for holding the examination-side support and the electrode-side support at a predetermined distance; and
movable flat plates disposed in parallel to the flat surfaces and slidably facing each other; and is
A probe insertion hole for inserting a tip portion of the probe is formed in the opposing flat plate,
a probe supporting hole for supporting the rear end of the probe by inserting the rear end of the probe is provided in the supporting plate corresponding to the probe insertion hole of the opposing plate,
a probe through hole for passing the probe therethrough is provided in the movable plate corresponding to the probe support hole of the support plate,
the inspection jig further includes a switching unit capable of switching between an allowable state in which the movable flat plate is movable in an allowable direction parallel to the flat surface and a restrained state in which the movable flat plate is disposed so that the center of the probe through-hole is displaced from the center of the probe support hole by a predetermined displacement amount in the allowable direction,
the probe supporting hole includes:
a support-side large diameter portion having an opening formed toward a surface of the support plate on the movable plate side; and
a support-side small diameter portion formed on a side farther from the movable plate than the support-side large diameter portion and having a smaller diameter than the support-side large diameter portion; and is
The probe through-hole includes:
a movable-side large diameter portion having an opening formed in a surface of the movable plate on the support plate side; and
a movable side small diameter portion formed on a side farther from the support plate than the movable side large diameter portion and having a smaller diameter than the movable side large diameter portion;
the deviation amount in the restrained state is smaller than a difference between a sum of the radius of the support-side large diameter portion and the radius of the movable-side large diameter portion and the diameter of the probe.
2. The inspection jig of claim 1, wherein
The switching unit includes:
a positioning hole through which a pin can be inserted, the pin penetrating the support plate and being used to restrict the position of the movable plate; and
and a receiving hole formed in the movable plate to receive the pin, the pin penetrating through the support plate and protruding from the positioning hole.
3. The inspection jig according to claim 2, wherein an inclined surface inclined from an outer periphery of the pin toward an axial center is formed at a tip end portion of the pin.
4. The inspection jig according to any one of claims 1 to 3, further comprising: and an isolation regulating member that regulates movement of the movable flat plate in a direction perpendicular to the flat surface.
5. The inspection jig according to any one of claims 1 to 3, wherein
The electrode-side support includes a recess for receiving the movable plate,
the bottom surface of the recess is set to the flat surface,
the distance between the side walls of the concave portion facing each other in the direction of the offset is larger than the length of the movable flat plate in the direction of the offset by the offset amount or more.
6. The inspection jig according to any one of claims 1 to 3, wherein a center of the probe support hole is offset with respect to a center of the probe insertion hole in a direction parallel to the flat surface.
7. The inspection jig according to claim 6, wherein a direction of deviation of a center of the probe supporting hole from a center of the probe insertion hole is the same as a direction of deviation of the probe through hole from the probe supporting hole in the restrained state.
8. The inspection jig according to any one of claims 1 to 3, further comprising:
the probe; and is
The movable plate is positioned based on an elastic restoring force of the probe in the allowance state.
9. An inspection jig for bringing a probe into contact with an inspection point provided on a substrate to be inspected, comprising:
an inspection side support having a facing plate provided with a facing surface disposed to face the substrate;
an electrode-side support body disposed opposite to the facing surface of the facing plate, and having a support plate and a flat surface;
a connecting member for holding the examination-side support and the electrode-side support at a predetermined distance; and
movable flat plates disposed in parallel to the flat surfaces and slidably facing each other; and is
A probe insertion hole for inserting a tip portion of the probe is formed in the opposing flat plate,
a probe supporting hole for supporting the rear end of the probe by inserting the rear end of the probe is provided in the supporting plate corresponding to the probe insertion hole of the opposing plate,
a probe through hole for passing the probe therethrough is provided in the movable plate corresponding to the probe support hole of the support plate,
the inspection jig further includes a switching unit capable of switching between an allowable state in which the movable flat plate is movable in an allowable direction parallel to the flat surface and a restrained state in which the movable flat plate is disposed so that the center of the probe through-hole is displaced from the center of the probe support hole by a predetermined displacement amount in the allowable direction,
the center of the probe supporting hole is deviated in a direction parallel to the flat surface with respect to the center of the probe insertion hole,
the deviation direction of the center of the probe supporting hole relative to the center of the probe inserting hole is the same as the deviation direction of the probe through hole relative to the probe supporting hole in the restrained state.
10. The inspection jig of claim 9, wherein
The switching unit includes:
a positioning hole through which a pin can be inserted, the pin penetrating the support plate and being used to restrict the position of the movable plate; and
and a receiving hole formed in the movable plate to receive the pin, the pin penetrating through the support plate and protruding from the positioning hole.
11. The inspection jig according to claim 10, wherein an inclined surface inclined from an outer periphery of the pin toward an axial center is formed at a tip end portion of the pin.
12. The inspection jig according to any one of claims 9 to 11, wherein the deviation amount in the restrained state is smaller than a difference between a sum of a radius of the probe support hole and a radius of the probe through-hole and a diameter of the probe.
13. The inspection jig according to any one of claims 9 to 11, wherein
The probe supporting hole includes:
a support-side large diameter portion having an opening formed toward a surface of the support plate on the movable plate side; and
a support-side small diameter portion formed on a side farther from the movable plate than the support-side large diameter portion and having a smaller diameter than the support-side large diameter portion; and is
The probe through-hole includes:
a movable-side large diameter portion having an opening formed in a surface of the movable plate on the support plate side; and
a movable side small diameter portion formed on a side farther from the support plate than the movable side large diameter portion and having a smaller diameter than the movable side large diameter portion;
the deviation amount in the restrained state is smaller than a difference between a sum of the radius of the support-side large diameter portion and the radius of the movable-side large diameter portion and the diameter of the probe.
14. The inspection jig according to any one of claims 9 to 11, further comprising: and an isolation regulating member that regulates movement of the movable flat plate in a direction perpendicular to the flat surface.
15. The inspection jig according to any one of claims 9 to 11, wherein
The electrode-side support includes a recess for receiving the movable plate,
the bottom surface of the recess is set to the flat surface,
the distance between the side walls of the concave portion facing each other in the direction of the offset is larger than the length of the movable flat plate in the direction of the offset by the offset amount or more.
16. The inspection jig according to any one of claims 9 to 11, further comprising:
the probe; and is
The movable plate is positioned based on an elastic restoring force of the probe in the allowance state.
17. A substrate inspection apparatus comprising:
an inspection jig according to any one of claims 1 to 16;
an electrode which is in contact with a rear end portion of the probe on a side of the electrode-side support opposite to the flat surface; and
and an inspection unit for inspecting the substrate based on the electric signal obtained from the probe via the electrode.
18. A substrate inspection apparatus comprising:
an inspection jig according to claim 2, 3, 10 or 11;
an electrode plate on which an electrode is formed that is in contact with a rear end portion of the probe on a side of the electrode-side support opposite to the flat surface; and
an inspection unit that performs substrate inspection based on an electrical signal obtained from the probe via the electrode; and is
The pin is vertically arranged on the electrode plate.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017088539 | 2017-04-27 | ||
| JP2017-088539 | 2017-04-27 | ||
| PCT/JP2018/015727 WO2018198859A1 (en) | 2017-04-27 | 2018-04-16 | Inspection jig, and substrate inspecting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110573889A CN110573889A (en) | 2019-12-13 |
| CN110573889B true CN110573889B (en) | 2022-04-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880027222.9A Active CN110573889B (en) | 2017-04-27 | 2018-04-16 | Inspection jig and substrate inspection apparatus |
Country Status (4)
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| JP (1) | JP7148212B2 (en) |
| CN (1) | CN110573889B (en) |
| TW (1) | TWI775836B (en) |
| WO (1) | WO2018198859A1 (en) |
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|---|---|---|---|---|
| TWM587751U (en) * | 2018-11-02 | 2019-12-11 | 旺矽科技股份有限公司 | Probe module suitable for multiple to-be-tested units with inclined conductive contacts |
| JP2020101427A (en) * | 2018-12-21 | 2020-07-02 | 日本電産リード株式会社 | Inspection jig, manufacturing method of inspection jig, and inspection device including inspection jig |
| TWI733239B (en) * | 2019-11-04 | 2021-07-11 | 韓商Ｓｄａ有限公司 | Probe card head block |
| TWI728665B (en) * | 2020-01-21 | 2021-05-21 | 中華精測科技股份有限公司 | Probe card device having directivity probe |
| WO2021206185A1 (en) * | 2020-04-10 | 2021-10-14 | 日本電産リード株式会社 | Inspection jig and inspection device |
| JP7477393B2 (en) * | 2020-08-03 | 2024-05-01 | 株式会社日本マイクロニクス | Test connection device |
| JP7453891B2 (en) * | 2020-10-06 | 2024-03-21 | 日本航空電子工業株式会社 | Electrical component inspection equipment |
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| JP2011108734A (en) * | 2009-11-13 | 2011-06-02 | Toshiba Corp | Wafer prober, and failure analysis method using the same |
| TW201629498A (en) * | 2015-01-04 | 2016-08-16 | 金日 | Contact test device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110573889A (en) | 2019-12-13 |
| TWI775836B (en) | 2022-09-01 |
| TW201843462A (en) | 2018-12-16 |
| JP7148212B2 (en) | 2022-10-05 |
| JPWO2018198859A1 (en) | 2020-03-12 |
| WO2018198859A1 (en) | 2018-11-01 |
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