TWM587751U - Probe module suitable for multiple to-be-tested units with inclined conductive contacts - Google Patents
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Abstract
一種探針模組,係用以同時檢測側邊緣相鄰之二待測單元,該二待測單元分別有一鄰近其第二主邊緣及相鄰側邊緣之交界接點;該探針模組包含一探針座,以及複數設於該探針座之交界探針,當該探針模組檢測該等待測單元時,各待測單元之第一主邊緣較第二主邊緣更靠近探針座,該等交界探針係以其懸臂段經過待測單元之第一主邊緣上方而延伸至交界接點上方進而以其點觸段點觸交界接點;藉此,該等交界探針可避免彼此過於靠近或相互干涉。A probe module is used to simultaneously detect two units to be tested adjacent to each other at a side edge, and the two units to be tested each have a junction point adjacent to a second main edge and an adjacent side edge; the probe module includes A probe base and a plurality of boundary probes provided on the probe base. When the probe module detects the waiting unit, the first main edge of each unit to be tested is closer to the probe base than the second main edge. These junction probes are extended by the cantilever segment above the first main edge of the unit under test to the junction junction and then touch the junction junction with their touch points; thus, these junction probes can be avoided Too close to each other or interfere with each other.
Description
本創作係與探針卡之探針模組有關,特別是關於一種適用於具有傾斜導電接點之多待測單元(multi-UUT)的探針模組。This creation is related to the probe module of the probe card, and particularly relates to a probe module suitable for a multi-UUT with inclined conductive contacts.
請參閱圖1,其中顯示一具有傾斜導電接點之待測單元10(unit under test;簡稱UUT),該待測單元10可為未封裝之晶片(die)或已封裝之晶片(chip),該待測單元10具有排成一或多行之複數用於輸出訊號之第一導電接點11,以及排成一行之複數用於輸入訊號之第二導電接點12,例如圖1所示之待測單元10具有由其一基板13之一第一長邊131朝向一第二長邊132排列之三行第一導電接點11,以及沿該基板13之第二長邊132設置的一行第二導電接點12,該等第一、二導電接點11、12排成多列,每一列之排列方向係實質上平行於一垂直於第一、二長邊131、132之假想分界軸線L,且靠近該假想分界軸線L之列,例如圖1中一中間區塊14所包含者,其中之第一、二導電接點11、12的長邊111、121係實質上平行於該假想分界軸線L,而距離該假想分界軸線L較遠之列的第一、二導電接點11、12則為傾斜導電接點,其較靠近基板13第一長邊131之一端亦較靠近該假想分界軸線L,較遠離基板13第一長邊131之一端則亦較遠離該假想分界軸線L,亦即傾斜導電接點以圖1之方向來看是由上而下且由內而外地傾斜,且距離該假想分界軸線L越遠之第一、二導電接點11、12相對於該假想分界軸線L之角度越大,例如圖1中二外側區塊15、16所包含之第一、二導電接點11、12之長邊111、121相對於該假想分界軸線L之角度θ1、θ2最大。Please refer to FIG. 1, which shows a unit under test (UUT) with inclined conductive contacts. The unit under test 10 may be an unpackaged die or a packaged chip. The unit under test 10 has a plurality of first conductive contacts 11 arranged in one or more rows for output signals, and a plurality of second conductive contacts 12 arranged in one row for input signals, such as shown in FIG. 1 The unit under test 10 has three rows of first conductive contacts 11 arranged from a first long side 131 of a substrate 13 toward a second long side 132 and a row of first conductive contacts 11 arranged along the second long side 132 of the substrate 13. Two conductive contacts 12, the first and second conductive contacts 11, 12 are arranged in a plurality of rows, and the arrangement direction of each row is substantially parallel to an imaginary dividing axis L perpendicular to the first and second long sides 131 and 132 And is close to the imaginary boundary axis L, such as the one included in an intermediate block 14 in FIG. 1, where the long sides 111, 121 of the first and second conductive contacts 11, 12 are substantially parallel to the imaginary boundary Axis L, and the first and second conductive contacts 11 and 12 in the row farther from the imaginary boundary axis L To incline the conductive contact, it is closer to one end of the first long side 131 of the substrate 13 and closer to the imaginary boundary axis L, and one end farther from the first long side 131 of the substrate 13 is further away from the imaginary boundary axis L, that is, The inclined conductive contacts are tilted from top to bottom and from the inside to the outside as viewed in the direction of FIG. 1, and the first and second conductive contacts 11 and 12 that are farther from the imaginary boundary axis L are relative to the imaginary boundary axis L The larger the angle is, for example, the angles θ1 and θ2 of the long sides 111 and 121 of the first and second conductive contacts 11 and 12 included in the two outer blocks 15 and 16 in FIG. 1 with respect to the imaginary boundary axis L are the largest.
前述之待測單元10可利用具有懸臂式探針的探針卡進行檢測,為簡化圖式,圖1中僅示意性地顯示一對應最左邊之第二導電接點12的探針17,實際上每一導電接點11、12皆對應一探針,該探針17之懸臂段171可自一位於該待測單元10之第二長邊132外側上方的探針座18延伸至導電接點12上方,使得探針17之一自其懸臂段171末端向下延伸的點觸段(圖中未示)可點觸對應之導電接點12。The aforementioned unit under test 10 can be detected by using a probe card with a cantilever probe. In order to simplify the diagram, only a probe 17 corresponding to the leftmost second conductive contact 12 is schematically shown in FIG. Each of the conductive contacts 11 and 12 corresponds to a probe. The cantilever section 171 of the probe 17 can extend from a probe base 18 located above the second long side 132 of the unit under test 10 to the conductive contact. 12 above, so that a touch section (not shown) of one of the probes 17 extending downward from the end of the cantilever section 171 can touch the corresponding conductive contact 12.
然而,由於該待測單元10具有傾斜角度不一致之傾斜導電接點,其檢測所需之探針難以配置於探針座上,尤其對於多待測單元之檢測,亦即同時檢測至少二該待測單元10,將會有探針17相互干涉之疑慮,因此目前仍未有適用之檢測裝置。However, since the unit under test 10 has inclined conductive contacts with inconsistent tilt angles, the probes required for its detection are difficult to configure on the probe base, especially for the detection of multiple units under test, that is, detecting at least two of the units to be tested simultaneously. There is a concern that the probes 17 interfere with each other in the testing unit 10, so there is currently no applicable testing device.
有鑑於上述缺失,本創作之主要目的在於提供一種探針模組,係適用於類同上述之具有傾斜導電接點之多待測單元的檢測,以避免探針彼此過於靠近或甚至相互干涉。In view of the above-mentioned shortcomings, the main purpose of this creation is to provide a probe module that is suitable for the detection of many units under test with inclined conductive contacts as described above to avoid the probes being too close to each other or even interfering with each other.
為達成上述目的,本創作所提供之探針模組係用以同時檢測複數待測單元,各該待測單元具有一第一主邊緣、一第二主邊緣、連接該第一主邊緣及該第二主邊緣之一第一側邊緣及一第二側邊緣,以及複數導電接點,該複數待測單元中包含一第一待測單元及一第二待測單元,該第一待測單元之第二側邊緣係與該第二待測單元之第一側邊緣相鄰,該第一待測單元之導電接點中包含一鄰近該第一待測單元之第二主邊緣及第二側邊緣的第一交界接點,該第二待測單元之導電接點中包含一鄰近該第二待測單元之第二主邊緣及第一側邊緣的第二交界接點。In order to achieve the above purpose, the probe module provided in this creation is used to simultaneously detect a plurality of units under test, each of the units under test has a first main edge, a second main edge, a connection between the first main edge and the One of the second main edge, a first side edge and a second side edge, and a plurality of conductive contacts. The plurality of units under test includes a first unit under test and a second unit under test. The first unit under test. The second side edge is adjacent to the first side edge of the second unit under test. The conductive contact of the first unit under test includes a second main edge and a second side adjacent to the first unit under test. The first junction junction at the edge, and the conductive junction of the second unit under test includes a second junction junction adjacent to the second main edge and the first side edge of the second unit under test.
該探針模組包含有至少一探針座,以及複數探針,各該探針包含有一懸臂段及一點觸段,該懸臂段具有一與該探針座固接之固定部,以及一連接於該固定部且自該探針座一內側面延伸而出之外露部,該點觸段係連接於該外露部。其中,該至少一探針座中包含一第一探針座,該複數探針中包含複數設置於該第一探針座之交界探針,當該探針模組檢測該等待測單元時,各該待測單元之第一主邊緣係較第二主邊緣更靠近該第一探針座,該探針模組之至少部份交界探針係以其懸臂段經過該等待測單元之第一主邊緣上方而延伸至該第一交界接點及該第二交界接點上方進而以其點觸段點觸該第一交界接點及該第二交界接點。The probe module includes at least one probe base and a plurality of probes, each of which includes a cantilever segment and a one-point contact segment, the cantilever segment has a fixing portion fixedly connected to the probe base, and a connection The touch portion is connected to the exposed portion at the fixed portion and extending from an inner side surface of the probe base. The at least one probe base includes a first probe base, and the plurality of probes includes a plurality of boundary probes disposed on the first probe base. When the probe module detects the waiting unit, The first main edge of each unit under test is closer to the first probe base than the second main edge, and at least part of the boundary probe of the probe module passes through the first of the waiting unit with its cantilever segment. The main edge extends above the first junction junction and the second junction junction, and then touches the first junction junction and the second junction junction with its touch points.
換言之,本創作係針對相鄰待測單元之相鄰側邊緣鄰近第二主邊緣之處的導電接點,亦即第一、二交界接點,本創作之探針模組係藉由對應待測單元之第一主邊緣的第一探針座所延伸而出之探針跨越較遠之距離而點觸鄰近第二主邊緣之第一、二交界接點。該探針模組用以點觸該等待測單元之其他導電接點的探針配置則不限定。In other words, this creation is aimed at the conductive contact where the adjacent side edge of the adjacent unit under test is close to the second main edge, that is, the junction between the first and second junctions. The probe extended from the first probe base of the first main edge of the measuring unit spans a relatively long distance and touches the first and second junctions adjacent to the second main edge. The probe configuration used by the probe module to touch other conductive contacts of the waiting unit is not limited.
藉此,即使第一、二交界接點朝向第二主邊緣之延伸方向係相互靠近,該等交界探針之懸臂段的外露部自第一探針座延伸而出之方向仍可配合第一、二交界接點之延伸方向,以避免探針在點測時意外滑動至非對應的導電接點上,亦即,該等交界探針之懸臂段的外露部係自第一探針座逐漸朝待測單元之相鄰側邊緣(亦即第一待測單元之第二側邊緣與第二待測單元之第一側邊緣)靠近,且僅分別延伸至對應之第一、二交界接點上方,因此該等交界探針不會過於靠近或甚至跨越所述相鄰側邊緣,如此即可避免該等交界探針彼此過於靠近或甚至相互干涉。With this, even if the extension directions of the first and second junctions toward the second main edge are close to each other, the exposed portions of the cantilever sections of these junction probes can still cooperate with the first direction The extension direction of the two junction contacts to avoid the probe from accidentally sliding onto non-corresponding conductive contacts during the spot measurement, that is, the exposed part of the cantilever section of these junction probes gradually from the first probe base. Close to the adjacent side edge of the unit under test (that is, the second side edge of the first unit to be tested and the first side edge of the second unit to be tested), and only extend to the corresponding first and second junctions respectively Above, so the junction probes will not be too close to or even across the adjacent side edges, so that the junction probes can be prevented from being too close to each other or even interfering with each other.
有關本創作所提供之適用於具有傾斜導電接點之多待測單元的探針模組的詳細構造、特點、組裝或使用方式,將於後續的實施方式詳細說明中予以描述。然而,在本創作領域中具有通常知識者應能瞭解,該等詳細說明以及實施本創作所列舉的特定實施例,僅係用於說明本創作,並非用以限制本創作之專利申請範圍。The detailed structure, characteristics, assembly or use method of the probe module provided in this creation and applicable to a plurality of units under test with inclined conductive contacts will be described in the detailed description of the subsequent embodiments. However, those with ordinary knowledge in the field of creation should be able to understand that the detailed descriptions and the specific embodiments listed in the implementation of this creation are only used to illustrate this creation and are not intended to limit the scope of patent applications for this creation.
申請人首先在此說明,在以下將要介紹之實施例以及圖式中,相同之參考號碼,表示相同或類似之元件或其結構特徵。需注意的是,圖式中的各元件及構造為例示方便並非依據真實比例及數量繪製,且若實施上為可能,不同實施例的特徵係可以交互應用。The applicant first explains here that in the embodiments and drawings to be described below, the same reference numerals represent the same or similar elements or their structural features. It should be noted that the elements and structures in the drawings are for convenience of illustration and are not drawn according to the actual scale and quantity, and if implementation is possible, the features of different embodiments can be applied interactively.
請參閱圖3至圖7,本創作一第一較佳實施例所提供之探針模組20主要包含有一第一探針座21、一第二探針座22,以及複數探針30a~f。Please refer to FIGS. 3 to 7. The probe module 20 provided in the first preferred embodiment of the present invention mainly includes a first probe holder 21, a second probe holder 22, and a plurality of probes 30 a to f. .
各該探針30a~f係由導電材料(例如金屬)製成之直線針藉由機械加工彎曲而成,如圖4所示,各該探針30a~f包含有一懸臂段31及一點觸段32,該懸臂段31具有一與該第一探針座21或第二探針座22固接之固定部311,以及一連接於該固定部311且自該第一探針座21之一內側面211或第二探針座22之一內側面221延伸而出之外露部312。如圖3及5~7所示,部分之探針30a~f的懸臂段31未經彎折而使其固定部311與外露部312呈一直線,而另一部分之探針30a~f的懸臂段31則經由彎折而使其固定部311與外露部312非呈一直線。如圖4所示,各該探針30a~f之點觸段32係自外露部312末端向下延伸。Each of the probes 30a to f is a straight needle made of a conductive material (such as metal) and is bent by machining. As shown in FIG. 4, each of the probes 30a to f includes a cantilever section 31 and a contact point. 32. The cantilever segment 31 has a fixing portion 311 fixedly connected to the first probe holder 21 or the second probe holder 22, and a fixing portion 311 connected to the fixing portion 311 and from one of the first probe holders 21. An inner side surface 221 of the side surface 211 or one of the second probe bases 22 extends out of the exposed portion 312. As shown in Figs. 3 and 5 ~ 7, the cantilever section 31 of some of the probes 30a ~ f has not been bent so that the fixed portion 311 and the exposed portion 312 are in line, and the cantilever section of the other probes 30a ~ f 31 is bent so that the fixing portion 311 and the exposed portion 312 are not aligned. As shown in FIG. 4, the contact segments 32 of each of the probes 30 a to f extend downward from the ends of the exposed portions 312.
該第一探針座21及該第二探針座22係由絕緣材料(例如黑膠)製成,該第一、二探針座21、22係以其內側面211、221相面對地設置,且通常係固定於一電路板40之底面41(如圖4所示),使得該電路板40、該第一、二探針座21、22以及該等探針30a~f結合成一探針卡。The first probe base 21 and the second probe base 22 are made of an insulating material (for example, black plastic). The first and second probe bases 21 and 22 face each other with their inner sides 211 and 221 facing each other. Set, and is usually fixed to the bottom surface 41 of a circuit board 40 (as shown in FIG. 4), so that the circuit board 40, the first and second probe holders 21, 22, and the probes 30 a to f are combined into one probe. Pin card.
在本創作之實施例中,各該探針30a~f之固定部311係位於第一或第二探針座21、22內,其固定方式係利用黑膠同時將同一針層(詳述於下文)之探針設置於探針座上的預定位置,再將黑膠烤乾而使探針固定於探針座上。然而,各該探針30a~f之固定部311亦可藉由黏膠固定於第一或第二探針座21、22之外表面。各該探針30a~f可更具有一自該第一探針座21之一外側面212或第二探針座22之一外側面222延伸而出之連接段(圖中未示),以藉由該連接段電性連接於該電路板40底面41的導電接點(圖中未示)。In the embodiment of the present creation, the fixing portions 311 of each of the probes 30a to f are located in the first or second probe holders 21 and 22, and the fixing method is to use black glue to simultaneously use the same needle layer (detailed in Below) the probe is set at a predetermined position on the probe base, and then the black glue is dried to fix the probe on the probe base. However, the fixing portions 311 of each of the probes 30a to f can also be fixed to the outer surfaces of the first or second probe holders 21 and 22 by an adhesive. Each of the probes 30a-f may further have a connecting section (not shown) extending from an outer side surface 212 of the first probe base 21 or an outer side surface 222 of the second probe base 22 to The connection section is electrically connected to a conductive contact (not shown) on the bottom surface 41 of the circuit board 40.
詳而言之,本實施例中的傾斜探針30a~f(外露部312呈傾斜者)之固定部311包含有一與外露部312連接的內側區段311a,以及一自內側區段311a延伸至探針座外側面而與前述之連接段連接之外側區段311b,該內側區段311a係與外露部312成一直線而呈傾斜,該外側區段311b則與前述之連接段成一直線且垂直於探針座之內、外側面(亦即平行於未傾斜之探針),如此之探針形成傾斜之方式,係先根據所對應之導電接點的延伸方向D2(詳述於下文)將直線針擺放於探針座上並以黑膠固定其固定部311之內側區段311a,以將探針之外露部312固定於所需之角度(亦即平行於對應之導電接點的延伸方向D2),此時探針已固定於探針座上,再彎折其固定部311而使其外側區段311b連同該連接段垂直於探針座之內、外側面,然後再以黑膠固定外側區段311b,如此之方式可利於彎折作業之進行,並可使探針之彎折角度固定良好而不易回彈。Specifically, the fixed portion 311 of the tilt probe 30a to f (the exposed portion 312 is inclined) in this embodiment includes an inner portion 311a connected to the exposed portion 312, and an extending portion from the inner portion 311a to The outer side of the probe base is connected to the outer section 311b, the inner section 311a is inclined in line with the exposed portion 312, and the outer section 311b is aligned with and perpendicular to the aforementioned connection section. The inner and outer sides of the probe base (that is, parallel to the untilted probe). In such a way that the probe is tilted, a straight line is first drawn according to the corresponding extension direction D2 of the conductive contact (detailed below). The needle is placed on the probe base and the inner section 311a of the fixing portion 311 is fixed with black glue to fix the exposed portion 312 of the probe at a desired angle (that is, parallel to the extension direction of the corresponding conductive contact) D2) At this time, the probe has been fixed on the probe base, and then the fixing portion 311 is bent so that the outer section 311b and the connecting section are perpendicular to the inner and outer sides of the probe base, and then fixed with black glue. Outer section 311b, in this way can facilitate the bending operation Line and the bending angle can be difficult to probe the fixed good rebound.
本創作之探針模組係用以進行多待測單元之檢測,亦即同時檢測複數待測單元,例如,本實施例之探針模組20係用以同時檢測一第一待測單元50A及一第二待測單元50B。本創作之實施例中的待測單元係與先前技術中所述之待測單元10(如圖1所示)相同,惟為了更明確地描述本創作之特徵,在實施例中以不同的描述方式搭配與圖1中不同的元件標號而更進一步地說明該待測單元。The created probe module is used to detect multiple units under test, that is, to detect multiple units under test at the same time. For example, the probe module 20 of this embodiment is used to simultaneously detect a first unit under test 50A. And a second unit under test 50B. The unit under test in the embodiment of this creation is the same as the unit under test 10 (shown in Figure 1) described in the prior art, but in order to more clearly describe the characteristics of this creation, different descriptions are used in the embodiments. The method is further explained with reference to different component numbers in FIG. 1.
如圖3及圖4所示,各該待測單元50A、50B之一上表面56具有朝向相反方向之第一、二主邊緣51、52(通常為長邊)、連接第一、二主邊緣51、52且朝向相反方向之第一、二側邊緣53、54(通常為短邊),以及複數導電接點55a~f,該第一待測單元50A之第二側邊緣54係與該第二待測單元50B之第一側邊緣53相鄰。當該探針模組20檢測該等待測單元50A、50B時,該第一、二探針座21、22係分別位於待測單元50A、50B之第一主邊緣51外側上方及第二主邊緣52外側上方,換言之,各該待測單元50A、50B之第一主邊緣51係較第二主邊緣52更靠近該第一探針座21,各該待測單元50A、50B之第二主邊緣52係較第一主邊緣51更靠近該第二探針座22,該探針模組20係整體(連同前述之電路板40)向下移動進而以該等探針30a~f分別點觸該等導電接點55a~f。As shown in FIG. 3 and FIG. 4, an upper surface 56 of each of the units under test 50A and 50B has first and second main edges 51 and 52 (usually long sides) facing in opposite directions, and connects the first and second main edges. 51, 52 and first and second side edges 53, 54 (usually short sides) facing in opposite directions, and a plurality of conductive contacts 55a-f, the second side edge 54 of the first unit 50A to be tested is connected to the first The first side edges 53 of the two units under test 50B are adjacent. When the probe module 20 detects the waiting units 50A and 50B, the first and second probe seats 21 and 22 are located above the outside of the first main edge 51 and the second major edge of the units 50A and 50B, respectively. Above the outside 52, in other words, the first main edge 51 of each of the units under test 50A, 50B is closer to the first probe base 21 than the second main edge 52, and the second main edge of each of the units under test 50A, 50B 52 is closer to the second probe base 22 than the first main edge 51. The probe module 20 is moved downwards (together with the aforementioned circuit board 40) and then touches the probes with the probes 30a ~ f, respectively. Equivalent conductive contacts 55a ~ f.
在此須先說明的是,本創作係將探針30a~f之點觸方向D1(如圖4所示)定義為向下,並以此為基準描述其他特徵之方向性(例如上、下、頂、底等用語),例如,前述各該待測單元50A、50B設有導電接點55a~f之該上表面56即為面向該點觸方向D1之相反方向的表面,前述該電路板40固設第一、二探針座21、22之該底面41即為面向該點觸方向D1之表面。然而,前述之方向性只是描述各特徵是趨於該點觸方向D1(例如向下)或該點觸方向D1之相反方向(例如向上),而非毫無誤差地符合該點觸方向D1或該點觸方向D1之相反方向,例如,前述各該探針30a~f之點觸段32係自外露部312末端向下延伸,其意思可包含該點觸段32係朝該點觸方向D1延伸,或者,該點觸段32係如圖4所示地趨於該點觸方向D1地相對該點觸方向D1呈傾斜。What needs to be explained here is that in this creation, the touch direction D1 of the probes 30a ~ f (as shown in Figure 4) is defined as downward, and the directivity of other features (such as up and down) is described on this basis. , Top, bottom, etc.), for example, the upper surface 56 of each of the units under test 50A, 50B provided with conductive contacts 55a-f is the surface facing the opposite direction of the touch direction D1. The bottom surface 41 on which the first and second probe bases 21 and 22 are fixed is the surface facing the touch direction D1. However, the aforementioned directivity only describes that each feature tends to the touch direction D1 (for example, downward) or the opposite direction (for example, upward) of the touch direction D1, and does not conform to the touch direction D1 or The direction of the touch direction D1 is the opposite direction. For example, the touch points 32 of the probes 30a to f each extend downward from the end of the exposed portion 312. The meaning may include that the touch point 32 is toward the touch direction D1. Extending, or as shown in FIG. 4, the touch section 32 is inclined toward the touch direction D1 as shown in FIG. 4.
在各該待測單元50A、50B中,各該導電接點55a~f具有一朝向該第一主邊緣51之第一端551以及一朝向該第二主邊緣52之第二端552,為簡化圖式,僅在圖5中的三第二導電接點上標示出其第一端551及第二端552,各該導電接點55a~f能定義出一自其第一端551往第二端552之延伸方向D2。如圖3所示,在本實施例中,各該待測單元50A、50B能定義出一假想分界軸線A1,各該待測單元50A、50B之假想分界軸線A1與第一側邊緣53之間的導電接點55a~e之延伸方向D2係平行於該假想分界軸線A1(例如位於圖5所標示之中間區塊57的導電接點)或朝該第一側邊緣53靠近地相對於該假想分界軸線A1呈傾斜(例如位於圖5所標示之左側區塊58的導電接點),各該待測單元50A、50B之假想分界軸線A1與第二側邊緣54之間的導電接點55a~d、55f之延伸方向D2係平行於該假想分界軸線A1(例如位於圖5所標示之中間區塊57的導電接點)或朝該第二側邊緣54靠近地相對於該假想分界軸線A1呈傾斜(例如位於圖5所標示之右側區塊59的導電接點)。更明確地說,在該假想分界軸線A1附近的導電接點55a~d(位於中間區塊57者)之延伸方向D2係平行於該假想分界軸線A1,距離該假想分界軸線A1越遠的導電接點55a~f,其相對於該假想分界軸線A1傾斜的程度越大。In each of the units under test 50A, 50B, each of the conductive contacts 55a-f has a first end 551 facing the first main edge 51 and a second end 552 facing the second main edge 52, for simplicity In the drawing, only the first end 551 and the second end 552 of the three second conductive contacts in FIG. 5 are marked, and each of the conductive contacts 55a-f can define a first from the first end 551 to the second The extending direction D2 of the end 552. As shown in FIG. 3, in this embodiment, each of the units under test 50A, 50B can define an imaginary boundary axis A1, and between the imaginary border axis A1 of each of the units under test 50A, 50B and the first side edge 53. The extending direction D2 of the conductive contacts 55a ~ e is parallel to the imaginary boundary axis A1 (for example, the conductive contact located in the middle block 57 indicated in FIG. 5) or closer to the first side edge 53 relative to the imaginary The boundary axis A1 is inclined (for example, the conductive contact located on the left block 58 shown in FIG. 5), and the conductive contact 55 a between the imaginary boundary axis A1 and the second side edge 54 of each of the units under test 50A, 50B ~ The extending direction D2 of d and 55f is parallel to the imaginary delimitation axis A1 (for example, the conductive contact located in the middle block 57 marked in FIG. 5) or close to the second side edge 54 relative to the imaginary delimitation axis A1. Inclined (for example, the conductive contact located on the right block 59 marked in FIG. 5). More specifically, the extension direction D2 of the conductive contacts 55a to d (those located in the middle block 57) near the imaginary boundary axis A1 is parallel to the imaginary boundary axis A1, and the further away from the imaginary boundary axis A1 is the conductive The contact points 55a to f are more inclined with respect to the imaginary boundary axis A1.
如圖3所示,在各該待測單元50A、50B中,該等導電接點55a~f係區分為鄰近於第一主邊緣51的第一導電接點55a~c,以及鄰近於第二主邊緣52的第二導電接點55d~f,其中,第一導電接點55a係實質上平行於一水平假想軸線A2地沿該第一主邊緣51排成一第一行L1(如圖5所示),第一導電接點55b係實質上平行於該水平假想軸線A2地排成一緊鄰該第一行L1之第二行L2(如圖6所示),第一導電接點55c係實質上平行於該水平假想軸線A2地排成一緊鄰該第二行L2之第三行L3(如圖7所示),該第一至第三行L1~L3係依序自該第一主邊緣51朝該第二主邊緣52之方向排列。如圖3所示,各該待測單元50A、50B之第二導電接點55d~f係實質上平行於該水平假想軸線A2地沿該第二主邊緣52排成一行,其中包含距離第一、二側邊緣53、54較遠之複數中間接點55d、位於該等中間接點55d與該第一側邊緣53之間的三個第一側接點55e,以及位於該等中間接點55d與該第二側邊緣54之間的三個第二側接點55f。由於該第一待測單元50A之第二側邊緣54係與該第二待測單元50B之第一側邊緣53相鄰,該第一待測單元50A之第二側接點55f係定義為第一交界接點61,該第二待測單元50B之第一側接點55e係定義為第二交界接點62。As shown in FIG. 3, in each of the units under test 50A, 50B, the conductive contacts 55a-f are divided into first conductive contacts 55a-c adjacent to the first main edge 51, and adjacent to the second The second conductive contacts 55d ~ f of the main edge 52, wherein the first conductive contacts 55a are arranged in a first row L1 along the first main edge 51 substantially parallel to a horizontal imaginary axis A2 (as shown in FIG. 5). (Shown), the first conductive contact 55b is substantially parallel to the horizontal imaginary axis A2 in a second line L2 (as shown in FIG. 6) next to the first line L1, and the first conductive contact 55c is Substantially parallel to the horizontal imaginary axis A2, a third line L3 (as shown in FIG. 7) next to the second line L2 is arranged, and the first to third lines L1 to L3 are sequentially from the first main The edge 51 is aligned in the direction of the second main edge 52. As shown in FIG. 3, the second conductive contacts 55d to f of each of the units under test 50A, 50B are substantially parallel to the horizontal imaginary axis A2 in a row along the second main edge 52, which includes a distance from the first , The plural intermediate indirect points 55d which are farther away from the two-side edges 53, 54, the three first-side contact points 55e located between the intermediate indirect points 55d and the first lateral edge 53, and the intermediate indirect points 55d Three second side contacts 55f with the second side edge 54. Since the second side edge 54 of the first unit under test 50A is adjacent to the first side edge 53 of the second unit under test 50B, the second side contact 55f of the first unit under test 50A is defined as the first A junction point 61 is defined as the second junction point 62 of the first side contact point 55e of the second unit under test 50B.
請參閱圖2,其中顯示該第一、二待測單元50A、50B設有該等第一、二交界接點61、62的部分、該第二探針座22之局部及二假想之探針63,如圖2所示,該等第一交界接點61及第二交界接點62所對應之探針63若設置於該第二探針座22,會有探針63彼此過於靠近甚至相互干涉之疑慮,本實施例係設定最靠近各第一、二側邊緣53、54的三個第二導電接點可能產生此疑慮,因此各待測單元50A、50B之第一、二側接點55e、55f各有三個,然而,各待測單元50A、50B之第一、二側接點55e、55f的數量可分別為至少一個,其餘之第二導電接點則皆為中間接點55d,換言之,第一、二交界接點61、62的數量亦可分別為至少一個。Please refer to FIG. 2, which shows that the first and second units 50A and 50B are provided with the first and second junctions 61 and 62, a part of the second probe base 22 and two imaginary probes. 63. As shown in FIG. 2, if the probes 63 corresponding to the first junction point 61 and the second junction point 62 are provided in the second probe base 22, the probes 63 are too close to each other or even each other Concerns of interference, this embodiment is set to the three second conductive contacts closest to each of the first and second side edges 53, 54 may cause this doubt, so the first and second side contacts of each unit under test 50A, 50B 55e and 55f each have three, however, the number of the first and second side contacts 55e and 55f of each unit 50A and 50B to be tested can be at least one, and the remaining second conductive contacts are all intermediate points 55d. In other words, the number of the first and second junctions 61 and 62 may be at least one each.
該探針模組20之探針30a~f係區分為設置於第一探針座21且用以點觸該等第一導電接點55a~c之第一探針30a~c(如圖5至圖7所示)、設置於第二探針座22且用以點觸該等中間接點55d之第二探針30d(如圖3所示),以及設置於第一探針座21且用以點觸該等第一、二側接點55e、55f之交界探針30e、30f(如圖3所示)。如圖4及圖5所示,該等第一探針30a係以實質上對應該等第一導電接點55a之排列方式在一假想水平面P1上排成一行。如圖4及圖6所示,該等第一探針30b係以實質上對應該等第一導電接點55b之排列方式在一高於假想水平面P1之假想水平面P2上排成一行。如圖4及圖7所示,該等第一探針30c係以實質上對應該等第一導電接點55c之排列方式在一高於假想水平面P2之假想水平面P3上排成一行。換言之,該等第一探針30a~c係排成三行(與第一導電接點55a~c行數相同),其順序係由下而上地對應第一導電接點55a~c之第一至第三行L1~L3的順序。如圖4所示,該等交界探針30e、30f係位於一高於假想水平面P3之假想水平面P4上,亦即高於該等第一探針30a~c。The probes 30a ~ f of the probe module 20 are divided into first probes 30a ~ c which are disposed on the first probe base 21 and are used to touch the first conductive contacts 55a ~ c (see FIG. 5). To FIG. 7), a second probe 30 d (as shown in FIG. 3) provided on the second probe base 22 and used to touch these indirect points 55 d, and provided on the first probe base 21 and It is used to touch the boundary probes 30e and 30f of the first and second side contacts 55e and 55f (as shown in FIG. 3). As shown in FIGS. 4 and 5, the first probes 30 a are arranged in a row on an imaginary horizontal plane P1 in an arrangement manner substantially corresponding to the first conductive contacts 55 a. As shown in FIGS. 4 and 6, the first probes 30 b are arranged in a row on an imaginary horizontal plane P2 higher than the imaginary horizontal plane P1 in an arrangement manner substantially corresponding to the first conductive contacts 55 b. As shown in FIGS. 4 and 7, the first probes 30 c are arranged in a row on an imaginary horizontal plane P3 higher than the imaginary horizontal plane P2 in an arrangement manner substantially corresponding to the first conductive contacts 55 c. In other words, the first probes 30a ~ c are arranged in three rows (the same number of rows as the first conductive contacts 55a ~ c), and the order is from bottom to top corresponding to the first conductive contacts 55a ~ c. The order of the first to third lines L1 to L3. As shown in FIG. 4, the boundary probes 30e, 30f are located on an imaginary horizontal plane P4 higher than the imaginary horizontal plane P3, that is, higher than the first probes 30a ~ c.
換言之,該第一探針座21係設置分別位於假想水平面P1~P4之四針層,位置越高之針層的探針係用以點觸距離該第一探針座21越遠的導電接點,且位置越高之針層的探針之懸臂段越長,因此由下而上數來第一至三針層(依序位於假想平面P1~P3)的探針係分別對應第一至第三行L1~L3的第一導電接點55a~c,該等交界探針30e~f係位於該第一探針座21最高之針層,用以點觸距離該第一探針座21最遠的一行導電接點55d~f中的第一、二交界接點55e~f,而與該等第一、二交界接點55e~f同一行的導電接點55d則由該第二探針座22所設置之一針層的探針30d點觸。In other words, the first probe base 21 is provided with four needle layers respectively located on the imaginary horizontal planes P1 to P4. The probes with higher needle positions are used to touch the conductive contacts further away from the first probe base 21. Points, and the higher the cantilever segment of the needle layer, the longer the cantilever segment, so the number of probes from the first to the third needle layer (sequentially located on the imaginary plane P1 to P3) from the bottom to the top corresponds to the first to The first conductive contacts 55a ~ c of the third row L1 ~ L3, the boundary probes 30e ~ f are located at the highest needle layer of the first probe base 21, and are used to touch the distance from the first probe base 21 Among the farthest row of conductive contacts 55d ~ f, the first and second junction contacts 55e ~ f, and the conductive row 55d on the same row as the first and second junction contacts 55e ~ f are determined by the second probe. The probe 30d of a needle layer provided in the needle base 22 is touched.
當該探針模組20檢測該等待測單元50A、50B時,該等第一探針30a係以其懸臂段31經過該等待測單元50A、50B之第一主邊緣51上方而延伸至該等第一導電接點55a上方(如圖5所示)進而以其點觸段32點觸該等第一導電接點55a,該等第一探針30b係以其懸臂段31經過該等待測單元50A、50B之第一主邊緣51上方而延伸至該等第一導電接點55b上方(如圖6所示)進而以其點觸段32點觸該等第一導電接點55b,該等第一探針30c係以其懸臂段31經過該等待測單元50A、50B之第一主邊緣51上方而延伸至該等第一導電接點55c上方(如圖7所示)進而以其點觸段32點觸該等第一導電接點55c,該等第二探針30d係以其懸臂段31經過該等待測單元50A、50B之第二主邊緣52上方而延伸至該等中間接點55d上方(如圖3所示)進而以其點觸段32點觸該等中間接點55d,該等交界探針30e、30f係以其懸臂段31經過該等待測單元50A、50B之第一主邊緣51上方而延伸至該等第一、二側接點55e、55f上方(如圖3所示)進而以其點觸段32點觸該等第一、二側接點55e、55f。When the probe module 20 detects the waiting-to-be-measured units 50A, 50B, the first probes 30a extend over the first main edge 51 of the waiting-to-be-measured units 50A, 50B with their cantilever segments 31 and extend to the Above the first conductive contact 55 a (as shown in FIG. 5), the touch points 32 touch the first conductive contacts 55 a, and the first probes 30 b pass through the waiting unit with their cantilever sections 31. The first main edges 51 of 50A and 50B extend above the first conductive contacts 55b (as shown in FIG. 6), and then touch the first conductive contacts 55b with their touch segments 32, and the first A probe 30c extends with its cantilever section 31 above the first main edge 51 of the waiting unit 50A, 50B to the first conductive contacts 55c (as shown in FIG. 7), and then touches its section 32 points touch the first conductive contacts 55c, and the second probes 30d extend with their cantilever segments 31 above the second main edge 52 of the waiting test unit 50A, 50B to the intermediate indirect points 55d. (As shown in FIG. 3) and then touch the intermediate point 55d with its touch section 32, and the boundary probes 30e and 30f pass through the cantilever section 31 The measurement units 50A and 50B extend above the first main edge 51 and extend above the first and second side contacts 55e and 55f (as shown in FIG. 3), and then touch the first and second points with their touch points 32. The side contacts 55e and 55f.
在本實施例中,各該探針30a~f之外露部312自探針座21、22延伸而出之方向係實質上對應其所屬探針30a~f將點觸之導電接點55a~f的延伸方向D2,此處所稱「實質上對應」,係指外露部312自探針座21、22延伸而出之方向不一定要與對應之導電接點55a~f的延伸方向D2相同或相反,而是從上往下看時(亦即圖3及5~7之方向),外露部312係概與其對應之導電接點55a~f的延伸方向D2平行,如此可避免探針30a~f之點觸段32在進行點觸時偏離至對應的導電接點55a~f之外而產生點觸不確實之問題。In this embodiment, the direction in which the exposed portions 312 of each of the probes 30a to f extend from the probe bases 21 and 22 is substantially corresponding to the conductive contacts 55a to f to which the probes 30a to f will touch. The extending direction D2 of the “substantially corresponding” means that the direction in which the exposed portion 312 extends from the probe bases 21 and 22 does not have to be the same or opposite to the extending direction D2 of the corresponding conductive contacts 55a to f. , But when viewed from above (that is, in the directions of FIGS. 3 and 5 to 7), the exposed portion 312 is almost parallel to the extending direction D2 of its corresponding conductive contact 55a to f, so that the probes 30a to f can be avoided The point contact section 32 deviates beyond the corresponding conductive contacts 55a-f during the point contact, thereby causing the problem of inaccurate point contact.
換言之,該等探針30a~f之外露部312的傾斜角度配置係類同於該等導電接點55a~f之傾斜角度配置。詳而言之,各該探針座21、22能定義出垂直於其內、外側面211、212、221、222之一第一假想分界線L4,以及分別位於該第一假想分界線L4之一第一側(左側)及一第二側(右側)之一第二假想分界線L5(與第一待測單元50A之假想分界軸線A1重合)及一第三假想分界線L6(與第二待測單元50B之假想分界軸線A1重合),該第一假想分界線L4係將各該探針座21、22劃分成一對應第一待測單元50A的部分(左半部)以及一對應第二待測單元50B的部分(右半部),該第二假想分界線L5及該第三假想分界線L6則分別為該左半部及該右半部之探針的傾斜角度配置之分界,例如,如圖3所示,該第二假想分界線L5將該第一探針座21之左半部區分成一未鄰接該第一假想分界線L4的第一區域AR1以及一鄰接該第一假想分界線L4的第二區域AR2,該第三假想分界線L6將該第一探針座21之右半部區分成一鄰接該第一假想分界線L4的第三區域AR3以及一未鄰接該第一假想分界線L4的第四區域AR4。更進一步而言,對於設置在第一探針座21之左半部(亦即第一區域AR1及第二區域AR2)的探針,其外露部312自內側面211延伸而出之方向係平行於該第二假想分界線L5(例如對應圖5所標示之中間區塊57的探針)或遠離該第二假想分界線L5地相對於該第二假想分界線L5呈傾斜(例如對應圖5所標示之左、右側區塊58、59的探針);對於設置在第一探針座21之右半部(亦即第三區域AR3及第四區域AR4)的探針,其外露部312自內側面211延伸而出之方向係平行於該第三假想分界線L6(例如對應圖5所標示之中間區塊57的探針)或遠離該第三假想分界線L6地相對於該第三假想分界線L6呈傾斜(例如對應圖5所標示之左、右側區塊58、59的探針)。相反地,對於設置在第二探針座22之左半部的探針,其外露部312自內側面221延伸而出之方向係平行於該第二假想分界線L5(例如對應圖5所標示之中間區塊57的探針)或朝該第二假想分界線L5靠近地相對於該第二假想分界線L5呈傾斜(例如對應圖5所標示之左、右側區塊58、59的探針);對於設置在第二探針座22之右半部的探針,其外露部312自內側面221延伸而出之方向係平行於該第三假想分界線L6(例如對應圖5所標示之中間區塊57的探針)或朝該第三假想分界線L6靠近地相對於該第三假想分界線L6呈傾斜(例如對應圖5所標示之左、右側區塊58、59的探針)。In other words, the inclination angle arrangement of the exposed portions 312 of the probes 30a to f is similar to the inclination angle arrangement of the conductive contacts 55a to f. In detail, each of the probe seats 21 and 22 can define a first imaginary dividing line L4 perpendicular to one of its inner and outer sides 211, 212, 221, and 222, and respectively located on the first imaginary dividing line L4. A first (left) and a second (right) second imaginary boundary line L5 (which coincides with the imaginary boundary axis A1 of the first unit 50A to be measured) and a third imaginary boundary line L6 (which is identical to the second The imaginary boundary axis A1 of the unit under test 50B coincides), the first imaginary boundary line L4 divides each of the probe bases 21 and 22 into a part (left half) corresponding to the first unit 50A and a second For the part (right half) of the unit to be tested 50B, the second imaginary boundary line L5 and the third imaginary boundary line L6 are the boundaries of the inclination angle configuration of the probes of the left half and the right half, for example As shown in FIG. 3, the second imaginary dividing line L5 divides the left half of the first probe base 21 into a first area AR1 which is not adjacent to the first imaginary dividing line L4 and a first imaginary dividing line. The second area AR2 of the boundary line L4, the third imaginary boundary line L6, the right half of the first probe base 21 Into a first virtual boundary line adjacent to the third region AR3 L4 and a non-adjacent to the first virtual boundary line of the fourth region AR4 L4. Furthermore, for the probes provided on the left half of the first probe base 21 (that is, the first area AR1 and the second area AR2), the direction in which the exposed portion 312 extends from the inner side surface 211 is parallel. It is inclined with respect to the second imaginary boundary line L5 at the second imaginary boundary line L5 (for example, the probe corresponding to the middle block 57 indicated in FIG. 5) or away from the second imaginary boundary line L5 (for example, corresponding to FIG. 5 The probes on the left and right blocks 58, 59); for the probes provided on the right half of the first probe holder 21 (ie, the third area AR3 and the fourth area AR4), the exposed portion 312 The direction extending from the inner side surface 211 is parallel to the third imaginary dividing line L6 (for example, a probe corresponding to the middle block 57 marked in FIG. 5) or away from the third imaginary dividing line L6 with respect to the third The imaginary dividing line L6 is inclined (for example, the probes corresponding to the left and right blocks 58 and 59 indicated in FIG. 5). Conversely, for the probe provided on the left half of the second probe base 22, the direction in which the exposed portion 312 extends from the inner side surface 221 is parallel to the second imaginary dividing line L5 (for example, corresponding to the label shown in FIG. 5) The probe of the middle block 57) or inclined toward the second imaginary boundary line L5 relative to the second imaginary boundary line L5 (for example, the probes corresponding to the left and right blocks 58 and 59 as shown in FIG. 5) ); For the probe provided in the right half of the second probe base 22, the direction of the exposed portion 312 extending from the inner side surface 221 is parallel to the third imaginary dividing line L6 (for example, corresponding to the one shown in FIG. 5) The probe of the middle block 57) or inclined toward the third imaginary boundary line L6 relative to the third imaginary boundary line L6 (for example, the probes corresponding to the left and right blocks 58 and 59 indicated in FIG. 5) .
藉由本創作之探針模組的探針配置,可在將如此繁多之探針以適當間距配置於探針座的前提下,仍可達到前述之確保探針點觸確實之功效。此外,在本實施例中,該等探針30a~f之固定部311的外側區段311b係實質上相互平行,如此係較方便於將探針配置於探針座;然而,藉由本創作之探針模組的探針配置,亦可便於將固定部311與外露部312實質上呈一直線之探針(例如圖8所示之探針30d~f)配置於探針座,如此更可簡化探針之彎折加工程序。With the probe configuration of the probe module created by the present invention, the above-mentioned effect of ensuring the accurate touch of the probe can still be achieved under the premise that so many probes are arranged in the probe base at an appropriate distance. In addition, in this embodiment, the outer sections 311b of the fixing portions 311 of the probes 30a to f are substantially parallel to each other, so it is more convenient to arrange the probes in the probe holder; however, with this creation The probe module of the probe module can also facilitate the arrangement of the probes (such as the probes 30d to 30f shown in FIG. 8) that are substantially in line with the fixed portion 311 and the exposed portion 312, which can further simplify The bending process of the probe.
更重要的是,如圖3所示,雖然該等第一交界接點61之延伸方向D2係朝該第一待測單元50A之第二側邊緣54靠近地呈相當程度之傾斜,該等第二交界接點62之延伸方向D2亦朝該第二待測單元50B之第一側邊緣53靠近地呈相當程度之傾斜,但本創作之探針模組20係藉由自第一探針座21延伸而出之交界探針30e、30f點觸第一、二交界接點61、62,即使用以點觸第一、二交界接點61、62之交界探針30e、30f的外露部312自第一探針座21延伸而出之方向係配合對應的第一、二交界接點61、62之延伸方向D2,該等交界探針30e、30f之懸臂段31的外露部312係自第一探針座21逐漸朝待測單元之相鄰側邊緣(亦即第一待測單元50A之第二側邊緣54與第二待測單元50B之第一側邊緣53)靠近,且僅延伸至對應之第一、二交界接點61、62上方,因此該等交界探針30e、30f不會過於靠近或甚至跨越所述相鄰側邊緣,如此即可避免該等交界探針30e、30f彼此過於靠近或甚至相互干涉。More importantly, as shown in FIG. 3, although the extending direction D2 of the first junctions 61 is inclined toward the second side edge 54 of the first unit 50A to be measured, the first The extending direction D2 of the second junction contact 62 is also inclined toward the ground of the first side edge 53 of the second unit 50B to be measured. However, the probe module 20 of this creation is obtained from the first probe base. 21 The extended boundary probes 30e and 30f touch the first and second boundary contacts 61 and 62, even if they are used to touch the exposed portions 312 of the boundary probes 30e and 30f of the first and second boundary contacts 61 and 62. The direction extending from the first probe base 21 corresponds to the extending direction D2 of the corresponding first and second junctions 61 and 62, and the exposed portion 312 of the cantilever section 31 of these junction probes 30e and 30f is from the first A probe base 21 gradually approaches the adjacent side edge of the unit under test (ie, the second side edge 54 of the first unit under test 50A and the first side edge 53 of the second unit under test 50B), and only extends to The corresponding first and second junctions 61, 62 are above, so the junction probes 30e, 30f will not be too close or even span the adjacent sides Edge, so the junction to avoid such probes 30e, 30f are too close to each other or interfere with each other even.
可想而知,在該第一待測單元50A之第一側邊緣53及第二待測單元50B之第二側邊緣54亦與其他待測單元相鄰的情況下(亦即有四個並排之待測單元),最左側之三交界探針30e及最右側之三交界探針30f亦可發揮前述之功效。而在該第一待測單元50A之第一側邊緣53及第二待測單元50B之第二側邊緣54未與其他待測單元相鄰的情況下,該第一待測單元50A之第一側接點55e及第二待測單元50B之第二側接點55f亦可藉由第二探針座22延伸而出之第二探針進行點測,亦即如圖9A所示,該第一探針座21未設置圖3中最左側之三交界探針30e及最右側之三交界探針30f,而是由第二探針座22之最左側及最右側所分別增設之三第二探針30d來點觸第一待測單元50A之第一側接點55e及第二待測單元50B之第二側接點55f。此外,本創作之探針模組不限於如圖3及圖9A所示地在該第一探針座21之第二區域AR2及第三區域AR3設有以該第一假想分界線L4為對稱軸而呈對稱設置之交界探針30e、30f,例如可為圖9B所示之態樣,該第一探針座21僅第三區域AR3設有交界探針30e,用以點測鄰近第二待測單元50B之第一側邊緣53的第二交界探針62,而鄰近第一待測單元50A之第二側邊緣54的第一交界探針61則由第二探針座22延伸而出之第二探針30d進行點測,或者可為圖9C 所示之態樣,該第一探針座21僅第二區域AR2設有交界探針30f,用以點測鄰近第一待測單元50A之第二側邊緣54的第一交界探針61,而鄰近第二待測單元50B之第一側邊緣53的第二交界探針62則由第二探針座22延伸而出之第二探針30d進行點測。It is conceivable that when the first side edge 53 of the first unit under test 50A and the second side edge 54 of the second unit 50B are also adjacent to other units under test (that is, there are four side by side) The unit to be tested), the leftmost three-junction probe 30e and the rightmost three-junction probe 30f can also exert the aforementioned effects. In the case where the first side edge 53 of the first unit 50A and the second side edge 54 of the second unit 50B are not adjacent to other units under test, the first The side contact 55e and the second side contact 55f of the second unit 50B to be tested can also be spot-tested by a second probe extended from the second probe base 22, that is, as shown in FIG. 9A, the first A probe base 21 is not provided with the left-most three-boundary probe 30e and the right-most three-boundary probe 30f in FIG. The probe 30d touches the first side contact 55e of the first unit under test 50A and the second side contact 55f of the second unit 50B under test. In addition, the probe module of this creation is not limited to being provided in the second region AR2 and the third region AR3 of the first probe base 21 as shown in FIG. 3 and FIG. 9A with the first imaginary dividing line L4 being symmetrical. The boundary probes 30e, 30f which are symmetrically arranged on the axis can be, for example, as shown in FIG. 9B. The first probe base 21 is provided with the boundary probe 30e only in the third area AR3, for spotting adjacent second The second boundary probe 62 of the first side edge 53 of the unit under test 50B, and the first boundary probe 61 adjacent to the second side edge 54 of the first unit 50A to be tested extends from the second probe base 22 The second probe 30d is used for spot measurement, or may be in the state shown in FIG. 9C. The first probe base 21 is provided with a boundary probe 30f only in the second area AR2 for spot measurement adjacent to the first unit under test. The first boundary probe 61 of the second side edge 54 of 50A, and the second boundary probe 62 adjacent to the first side edge 53 of the second unit 50B to be tested extends from the second probe base 22 The probe 30d performs spot measurement.
請參閱圖10及圖11,本創作一第二較佳實施例所提供之探針模組20’係用以同時檢測呈矩陣排列之第一至第四待測單元50A~D,其中,針對圖10中左下及右下之第一、二待測單元50A、50B,該探針模組20’係採用如同第一較佳實施例之探針模組20的探針配置,為簡化圖式,圖10中未顯示此部分之探針。而對於圖10中左上及右上之第三、四待測單元50C、50D,由於該第三待測單元50C之第二主邊緣52係與該第一待測單元50A之第一主邊緣51相鄰,該第四待測單元50D之第二主邊緣52係與該第二待測單元50B之第一主邊緣51相鄰,第三、四待測單元50C、50D之導電接點55a~f全部都較第一、二待測單元50A、50B之第一導電接點55a~c更靠近第一探針座21,因此,第三、四待測單元50C、50D之導電接點55a~f可全部皆由設置於該第一探針座21之探針30g~j點觸,亦即可在第一探針座21增設四行探針30g~j,如圖11所示,該四行探針30g~j係位於用以點觸第一、二待測單元50A、50B之第一探針30a~c下方,且依由上而下之順序係分別用以點觸第三、四待測單元50C、50D之第二導電接點55d~f以及第一導電接點55a~c之第三至第一行L3~L1。為了簡化圖式,圖10中僅顯示用以點觸第三、四待測單元50C、50D之第二導電接點55d~f的探針30g。Please refer to FIG. 10 and FIG. 11. The probe module 20 ′ provided in the second preferred embodiment of the present invention is used to simultaneously detect the first to fourth units to be tested 50A to D in a matrix arrangement. In the lower left and lower right first and second units under test 50A and 50B in FIG. 10, the probe module 20 ′ uses a probe configuration similar to the probe module 20 of the first preferred embodiment, in order to simplify the diagram The probes in this section are not shown in Figure 10. For the third and fourth units to be tested 50C, 50D in the upper left and upper right in FIG. 10, the second main edge 52 of the third unit 50C is in phase with the first main edge 51 of the first unit 50A. Next, the second main edge 52 of the fourth unit under test 50D is adjacent to the first main edge 51 of the second unit under test 50B, and the conductive contacts 55a ~ f of the third and fourth units under test 50C and 50D are adjacent. All of them are closer to the first probe base 21 than the first conductive contacts 55a ~ c of the first and second units 50A and 50B, so the conductive contacts 55a ~ f of the third and fourth units 50C and 50D to be tested All can be touched by the probes 30g ~ j provided on the first probe base 21, and four rows of probes 30g ~ j can be added to the first probe base 21, as shown in FIG. 11, the four rows The probes 30g ~ j are located below the first probes 30a ~ c for touching the first and second units 50A and 50B, and they are used to touch the third and fourth standbys in order from top to bottom, respectively. The second conductive contacts 55d ~ f of the measurement units 50C and 50D and the third to first rows L3 ~ L1 of the first conductive contacts 55a ~ c. In order to simplify the drawing, only the probe 30g for touching the second conductive contacts 55d to f of the third and fourth units 50C and 50D to be tested is shown in FIG.
最後,必須再次說明,本創作於前揭實施例中所揭露的構成元件,僅為舉例說明,並非用來限制本案之範圍,其他等效元件的替代或變化,亦應為本案之申請專利範圍所涵蓋。Finally, it must be stated again that the constituent elements disclosed in the previously disclosed embodiments of this creation are merely examples, and are not intended to limit the scope of this case. The replacement or change of other equivalent elements should also be the scope of this application for patents. Covered.
[先前技術]
10‧‧‧待測單元[Prior art]
10‧‧‧Unit to be tested
11‧‧‧第一導電接點
111‧‧‧長邊11‧‧‧ the first conductive contact
111‧‧‧long side
12‧‧‧第二導電接點
121‧‧‧長邊12‧‧‧Second conductive contact
121‧‧‧long side
13‧‧‧基板
131‧‧‧第一長邊13‧‧‧ substrate
131‧‧‧first long side
132‧‧‧第二長邊
14‧‧‧中間區塊132‧‧‧Second long side
14‧‧‧ Intermediate Block
15、16‧‧‧外側區塊
17‧‧‧探針15, 16‧‧‧ outside block
17‧‧‧ Probe
171‧‧‧懸臂
18‧‧‧探針座171‧‧‧ cantilever
18‧‧‧ Probe Block
L‧‧‧假想分界軸線
θ1、θ2‧‧‧角度L‧‧‧imaginary boundary axis θ1, θ2‧‧‧angle
A、B‧‧‧局部
[實施例]
20、20’‧‧‧探針模組A, B‧‧‧partial
[Example]
20, 20'‧‧‧ Probe Module
21‧‧‧(第一)探針座
211‧‧‧內側面21‧‧‧ (first) probe holder
211‧‧‧ inside
212‧‧‧外側面
22‧‧‧(第二)探針座212‧‧‧ outside
22‧‧‧ (second) probe holder
221‧‧‧內側面
222‧‧‧外側面
30a~c‧‧‧(第一)探針221‧‧‧ inside
222‧‧‧ Outside
30a ~ c‧‧‧ (first) probe
30d‧‧‧(第二)探針
30e、30f‧‧‧(交界)探針30d‧‧‧ (second) probe
30e, 30f‧‧‧ (junction) probe
30g~j‧‧‧探針
31‧‧‧懸臂段30g ~ j‧‧‧probe
31‧‧‧ cantilever section
311‧‧‧固定部
311a‧‧‧內側區段311‧‧‧Fixed section
311a‧‧‧ inside section
311b‧‧‧外側區段
312‧‧‧外露部311b‧‧‧outside section
312‧‧‧Exposed
32‧‧‧點觸段
40‧‧‧電路板32‧‧‧ touch segment
40‧‧‧Circuit Board
41‧‧‧底面
50A~D‧‧‧第一〜第四待測單元41‧‧‧ underside
50A ~ D‧‧‧The first to the fourth unit under test
51‧‧‧第一主邊緣
52‧‧‧第二主邊緣51‧‧‧first main edge
52‧‧‧Second main edge
53‧‧‧第一側邊緣
54‧‧‧第二側邊緣53‧‧‧ first side edge
54‧‧‧ second side edge
55a~c‧‧‧(第一)導電接點
55d‧‧‧(第二)導電接點(中間接點)
55e‧‧‧(第二)導電接點(第一側接點)
55f‧‧‧(第二)導電接點(第二側接點)
551‧‧‧第一端55a ~ c‧‧‧ (first) conductive contact
55d‧‧‧ (second) conductive contact (middle point)
55e‧‧‧ (second) conductive contact (first side contact)
55f‧‧‧ (second) conductive contact (second side contact)
551‧‧‧first end
552‧‧‧第二端
56‧‧‧上表面552‧‧‧second end
56‧‧‧ Top surface
57‧‧‧中間區塊
58‧‧‧左側區塊57‧‧‧ Intermediate Block
58‧‧‧Left block
59‧‧‧右側區塊
61‧‧‧第一交界接點59‧‧‧Right block
61‧‧‧First Junction Junction
62‧‧‧第二交界接點
A1‧‧‧假想分界軸線62‧‧‧Second Junction Junction
A1‧‧‧imaginary dividing line
A2‧‧‧水平假想軸線
D1‧‧‧點觸方向A2‧‧‧Horizontal imaginary axis
D1‧‧‧Touch direction
D2‧‧‧延伸方向
L1~L3‧‧‧第一〜第三行D2‧‧‧ extension direction
L1 ~ L3‧‧‧ first ~ third line
P1~P4‧‧‧假想水平面
L4~L6‧‧‧第一〜第三假想分界線
AR1~AR4‧‧‧第一〜第四區域
P1 ~ P4‧‧‧imaginary horizontal plane
L4 ~ L6‧‧‧‧First to third imaginary dividing line
AR1 ~ AR4‧‧‧First ~ Fourth Area
圖1為一具有傾斜導電接點之待測單元、一探針及一探針座之頂視示意圖。
圖2為二該待測單元之局部、一探針座之局部及二假想之探針的頂視示意圖。
圖3概為本創作一第一較佳實施例所提供之探針模組、一第一待測單元及一第二待測單元之頂視示意圖,惟未顯示出該探針模組之第一探針。
圖4概為圖3之右視圖,惟其中更顯示出該探針模組之第一探針以及一電路板。
圖5係類同於圖3,惟其中顯示之探針僅為一部份之第一探針。
圖6係類同於圖5,惟其中顯示之探針僅為另一部份之第一探針。
圖7係類同於圖6,惟其中顯示之探針僅為又一部份之第一探針。
圖8係類同於圖3,惟圖8中探針之固定部與外露部呈一直線。
圖9A係類同於圖3,惟圖9A中該第一待測單元之三第一側接點及該第二待測單元之三第二側接點所對應之探針與圖3所示者不同。
圖9B係類同於圖9A,惟圖9B中該第一待測單元之三第二側接點所對應之探針與圖9A所示者不同。
圖9C係類同於圖9A,惟圖9C中該第二待測單元之三第一側接點所對應之探針與圖9A所示者不同。
圖10概為本創作一第二較佳實施例所提供之探針模組以及第一至第四待測單元之頂視示意圖,惟其中顯示之探針僅為一部份之探針。
圖11概為圖10之右視圖,惟其中更顯示出該探針模組之其他探針。
FIG. 1 is a schematic top view of a unit under test with a slanted conductive contact, a probe, and a probe base.
FIG. 2 is a schematic top view of two parts of the unit under test, a part of a probe base, and two imaginary probes.
FIG. 3 is a schematic top view of a probe module, a first unit to be tested and a second unit to be tested provided in a first preferred embodiment of the invention, but the first A probe.
FIG. 4 is a right side view of FIG. 3, but a first probe of the probe module and a circuit board are further shown.
FIG. 5 is similar to FIG. 3 except that the probe shown therein is only a part of the first probe.
FIG. 6 is similar to FIG. 5 except that the probe shown therein is only the first probe of another part.
FIG. 7 is similar to FIG. 6 except that the probe shown therein is only a part of the first probe.
FIG. 8 is similar to FIG. 3 except that the fixed portion and the exposed portion of the probe in FIG. 8 are aligned.
FIG. 9A is similar to FIG. 3, but the probes corresponding to the three first side contacts of the first unit under test and the third second side contacts of the second unit to be tested are shown in FIG. 3 Different.
FIG. 9B is similar to FIG. 9A, except that the probes corresponding to the third and second side contacts of the first unit under test in FIG. 9B are different from those shown in FIG. 9A.
FIG. 9C is similar to FIG. 9A, but the probes corresponding to the three first side contacts of the second unit under test in FIG. 9C are different from those shown in FIG. 9A.
FIG. 10 is a schematic top view of the probe module and the first to fourth units under test provided in a second preferred embodiment of the invention, but the probes shown therein are only a part of the probes.
FIG. 11 is a right side view of FIG. 10 except that other probes of the probe module are further shown.
Claims (20)
至少一探針座;以及
複數探針,各該探針包含有一懸臂段及一點觸段,該懸臂段具有一與該探針座固接之固定部,以及一連接於該固定部且自該探針座一內側面延伸而出之外露部,該點觸段係連接於該外露部;
其中,該至少一探針座中包含一第一探針座,該複數探針中包含複數設置於該第一探針座之交界探針,當該探針模組檢測該等待測單元時,各該待測單元之第一主邊緣係較第二主邊緣更靠近該第一探針座,該探針模組之至少部份交界探針係以其懸臂段經過該等待測單元之第一主邊緣上方而延伸至該第一交界接點及該第二交界接點上方進而以其點觸段點觸該第一交界接點及該第二交界接點。 A probe module suitable for a plurality of units under test with inclined conductive contacts is used to detect a plurality of units under test at the same time, each unit under test has a first main edge, a second main edge, and is connected to the first A main edge, a first side edge and a second side edge of the second main edge, and a plurality of conductive contacts, the plurality of units under test includes a first unit under test and a second unit under test, the The second side edge of the first unit under test is adjacent to the first side edge of the second unit under test. The conductive contact of the first unit under test includes a second main unit adjacent to the first unit under test. The first junction point of the edge and the second side edge, and the conductive contact point of the second unit under test includes a second junction point adjacent to the second main edge and the first side edge of the second unit under test; The probe module contains:
At least one probe base; and a plurality of probes, each of which includes a cantilever segment and a one-point contact segment, the cantilever segment having a fixing portion fixedly connected to the probe base, and a connecting portion connected to the fixing portion and from the An inner side surface of the probe base extends to an exposed portion, and the touch section is connected to the exposed portion;
The at least one probe base includes a first probe base, and the plurality of probes includes a plurality of boundary probes disposed on the first probe base. When the probe module detects the waiting unit, The first main edge of each unit under test is closer to the first probe base than the second main edge, and at least part of the boundary probe of the probe module passes through the first of the waiting unit with its cantilever segment. The main edge extends above the first junction junction and the second junction junction, and then touches the first junction junction and the second junction junction with its touch points.
一第一探針座及一第二探針座;以及
複數探針,係設置於該第一探針座及該第二探針座,並於該第一探針座形成複數針層且於該第二探針座形成至少一針層,其中位於該第一探針座最高之針層的探針係用以點觸該第一交界接點及該第二交界接點,位於該第二探針座之一該針層的探針係用以點觸與該第一交界接點及該第二交界接點同一行的導電接點。 A probe module suitable for a plurality of units under test with inclined conductive contacts is used to detect a first unit under test and a second unit under test, the first unit under test and the second unit under test The unit has a first main edge, a second main edge, a first side edge and a second side edge connected to the first main edge and the second main edge, and a plurality of conductive contacts. The second side edge of the unit under test is adjacent to the first side edge of the second unit under test. The conductive contacts of the first unit under test and the second unit under test include a row adjacent to its second main edge. Conductive contacts, the row of conductive contacts includes a first junction contact adjacent to a second side edge of the first unit under test and a second junction contact adjacent to a first side edge of the second unit under test ; The probe module contains:
A first probe base and a second probe base; and a plurality of probes, which are arranged on the first probe base and the second probe base, and form a plurality of needle layers on the first probe base and The second probe base forms at least one needle layer, and the probe located at the highest needle layer of the first probe base is used to touch the first junction junction and the second junction junction, which are located at the second junction. One of the probe bases, the probe of the needle layer is used to touch the conductive contacts in the same row as the first junction contact and the second junction contact.
至少一探針座;以及
複數探針,係設置於該至少一探針座,各該探針包含有一懸臂段,該懸臂段具有一自該探針座一內側面延伸而出之外露部;
其中,該至少一探針座中包含一第一探針座,該第一探針座能定義出垂直於其內側面之一第一假想分界線、一第二假想分界線及一第三假想分界線,該第二假想分界線及該第三假想分界線係分別位於該第一假想分界線之一第一側及一第二側,該第二假想分界線將該第一探針座位於該第一假想分界線第一側的部分區分成一未鄰接該第一假想分界線的第一區域以及一鄰接該第一假想分界線的第二區域,位於該第一區域及該第二區域之探針的外露部自該內側面延伸而出之方向係平行於該第二假想分界線或遠離該第二假想分界線地相對於該第二假想分界線呈傾斜,該第三假想分界線將該第一探針座位於該第一假想分界線第二側的部分區分成一鄰接該第一假想分界線的第三區域以及一未鄰接該第一假想分界線的第四區域,位於該第三區域及該第四區域之探針的外露部自該內側面延伸而出之方向係平行於該第三假想分界線或遠離該第三假想分界線地相對於該第三假想分界線呈傾斜,該第二區域及該第三區域至少其中之一所設置之探針中包含有至少一交界探針,該至少一交界探針之懸臂段的外露部長度大於其餘探針之懸臂段的外露部長度。 A probe module suitable for a plurality of units under test with inclined conductive contacts, comprising:
At least one probe base; and a plurality of probes disposed on the at least one probe base, each of the probes including a cantilever segment having an exposed portion extending from an inner side of the probe base;
Wherein, the at least one probe base includes a first probe base, and the first probe base can define a first imaginary boundary line, a second imaginary boundary line, and a third imaginary line perpendicular to the inner side surface thereof. The dividing line, the second imaginary dividing line and the third imaginary dividing line are respectively located on a first side and a second side of the first imaginary dividing line, and the second imaginary dividing line locates the first probe seat A portion of the first side of the first imaginary dividing line is divided into a first region that is not adjacent to the first imaginary dividing line and a second region that is adjacent to the first imaginary dividing line, and is located between the first region and the second region. The direction that the exposed portion of the probe extends from the inner side is parallel to the second imaginary dividing line or inclined away from the second imaginary dividing line with respect to the second imaginary dividing line. The third imaginary dividing line will The portion of the first probe seat located on the second side of the first imaginary dividing line is divided into a third region adjacent to the first imaginary dividing line and a fourth region not adjacent to the first imaginary dividing line. Zone and the fourth zone probe The direction in which the exposed portion extends from the inner side is parallel to the third imaginary dividing line or inclined away from the third imaginary dividing line relative to the third imaginary dividing line. The second region and the third region are at least One of the provided probes includes at least one boundary probe, and the length of the exposed portion of the cantilever segment of the at least one boundary probe is greater than the length of the exposed portion of the cantilever segment of the other probes.
Applications Claiming Priority (2)
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US201862755185P | 2018-11-02 | 2018-11-02 | |
US62/755,185 | 2018-11-02 |
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TWM587751U true TWM587751U (en) | 2019-12-11 |
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TW108207337U TWM587751U (en) | 2018-11-02 | 2019-06-10 | Probe module suitable for multiple to-be-tested units with inclined conductive contacts |
TW108119989A TWI704357B (en) | 2018-11-02 | 2019-06-10 | Suitable for probe modules with multiple units to be tested with inclined conductive contacts |
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TW108119989A TWI704357B (en) | 2018-11-02 | 2019-06-10 | Suitable for probe modules with multiple units to be tested with inclined conductive contacts |
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Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
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US6799976B1 (en) * | 1999-07-28 | 2004-10-05 | Nanonexus, Inc. | Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies |
CN101813711B (en) * | 2009-02-20 | 2012-07-25 | 京元电子股份有限公司 | Test probe and probe bed |
JP6737002B2 (en) * | 2016-06-17 | 2020-08-05 | オムロン株式会社 | Probe pin |
TWM547673U (en) * | 2016-09-08 | 2017-08-21 | Ultra Prec Tech Company | Improved structure of wafer testing probe |
TWI775836B (en) * | 2017-04-27 | 2022-09-01 | 日商日本電產理德股份有限公司 | Inspection jig and board inspection device |
TWM557828U (en) * | 2017-11-01 | 2018-04-01 | Chunghwa Precision Test Tech Co Ltd | Probe card device, signal transmission module and rectangular probe |
-
2019
- 2019-06-10 TW TW108207337U patent/TWM587751U/en unknown
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TWI704357B (en) | 2020-09-11 |
TW202018305A (en) | 2020-05-16 |
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