CN110556318B - Wafer bonding method based on wafer bonding equipment - Google Patents
Wafer bonding method based on wafer bonding equipment Download PDFInfo
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- CN110556318B CN110556318B CN201910832710.3A CN201910832710A CN110556318B CN 110556318 B CN110556318 B CN 110556318B CN 201910832710 A CN201910832710 A CN 201910832710A CN 110556318 B CN110556318 B CN 110556318B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0075—Processes for devices with an active region comprising only III-V compounds comprising nitride compounds
Abstract
The invention relates to the field of LED automatic processing equipment, and particularly discloses a wafer bonding method based on wafer bonding equipment. Mainly solved exist among the prior art because degree of automation is lower, and then bring and can appear sticking the piece plane degree error great after pasting, not in the tolerance range, the position of laminating is not accurate technical problem. The wafer bonding equipment comprises a frame; the wax homogenizing device is arranged at the left end of the rack; the drying oven device is arranged on the right side of the wax homogenizing device; the rotary platform is arranged on the right side of the oven device; the tabletting device is arranged behind the rotating platform; the pneumatic manipulator is arranged below the tabletting device; the cooling device is arranged at the right end of the rack; control panel, set up in the upper left side of equal wax device has increased the degree of automation of wafer bonding equipment, makes the laminating contact ratio of wafer bonding process more accurate simultaneously, has reduced the error, can effectual increase production efficiency.
Description
Technical Field
The invention relates to the field of LED automatic processing equipment, in particular to a wafer bonding method based on wafer bonding equipment.
Background
The substrate material applied to the LED chip, the equipment for manufacturing the LED chip mainly comprises an epitaxial furnace, a photoetching machine, an etching machine, an ion implanter cleaner, a substrate thinning , a scribing machine, a chip sorting machine, detection equipment and the like.
The waxing patch is an important process for processing the substrate in the production process of the LED chip, and the waxing patch equipment directly influences the production capacity and precision of the LED chip. At present, the waxing chip mounter works in a single working position, the interval time of each working procedure is long, and the production efficiency is low.
According to recent data, it has been shown that the production of LED chips in countries of the world, both developed and developing, is semi-automatic or completely manual. Some developed countries have started to study LED chip production automation pipelines, but are still in the experimental stage. The equipment used by domestic LED chip manufacturers is imported from foreign countries basically. But to the equipment of the wafer paster of this product, it has degree of automation lower, and then brings and can appear sticking the piece plane degree error great after pasting, not in the tolerance range, the inaccurate technical problem in position of laminating.
Disclosure of Invention
One of the purposes of the present invention is to provide a wafer bonding apparatus, so as to solve the technical problems that the automation degree is low, and thus the flatness error of the bonded wafer is large after bonding, the bonded wafer is not within the tolerance range, and the bonding position is not accurate in the prior art.
The second objective of the present invention is to provide a wafer bonding method based on the wafer bonding equipment.
In order to achieve one of the purposes, the invention adopts the following technical scheme:
a wafer bonding apparatus, comprising: a frame 1; the wax homogenizing device 2 is arranged at the left end of the rack 1; the drying oven device 3 is arranged on the right side of the wax homogenizing device 2; the rotating platform 4 is arranged on the right side of the oven device 3; the tabletting device 6 is arranged behind the rotary platform 4; a pneumatic manipulator 7 provided below the sheeting device 6; the cooling device 5 is arranged at the right end of the frame 1; and the control panel 8 is arranged at the upper left part of the wax homogenizing device 2.
By adopting the technical means, the device realizes the uniform waxing of products and the integrated operation of drying and cooling through the cooperation of the wax homogenizing device, the oven device, the rotating platform, the tabletting device and the cooling device, is convenient to operate and fast to switch, and increases the automation degree of wafer sticking equipment. Meanwhile, when a baking oven device in the wafer bonding equipment is used for drying the products which are well homogenized in wax and are placed on the bearing plate, the proximity sensor and the electromagnetic valve are used for acting together, and then the cylinder is controlled to move in the X direction according to the designated stroke, so that the X direction movement of the baking plate is realized, and the products which are well homogenized in wax and are placed on the bearing plate are dried; meanwhile, when the tabletting device is used for carrying out the tablet sticking operation on the dried product, the tabletting air cylinder acts in the Y direction according to the appointed stroke to drive the tablet sticking disc to stick the product placed on the preheating disc. Namely, the X, Y air cylinders in two running directions are used simultaneously, so that the laminating contact ratio in the wafer bonding process is more accurate, the error is reduced, and the production efficiency can be effectively increased; and simple structure, economic performance is good, and stability is high, and is multiple functional. The technical problems that in the prior art, due to the fact that the automation degree of equipment is low, the flatness error of the sticky sheet is large after the sticky sheet is pasted, the sticky sheet is not in a tolerance range, and the position of the sticking is not accurate are solved.
According to an embodiment of the present invention, wherein the wax homogenizing device 2 comprises: the motor I12 is arranged at the lower end of the wax homogenizing device 2; the motor base 13 is used for fixing the motor I12 on a panel of the wax homogenizing device 2; the wax homogenizing plate 9 is connected with the motor I12 through a transmission shaft and a coupling I11, and the transmission shaft and the wax homogenizing plate 9 are fixed through screws; and the bearing 10 is used for clamping the transmission shaft, so that the wax homogenizing plate 9 is fixed. Adopt above-mentioned technical means, when equipment carries out the wax homogenizing operation, at first put the product on wax homogenizing board 9, manual operation control panel 8, a starter motor 12, a motor 12 is connected with wax homogenizing board 9, and then drives wax plate 9 rotatory, and simultaneously, the manual work is paintd wax on the surface of wafer, because the even unanimous rotational speed of a motor 12 for the wax that the wafer of placing on wax homogenizing board 9 was paintd is even unanimous, and then realizes the even waxing to the product.
According to an embodiment of the present invention, wherein the oven device 3 comprises: the air inlet interface 15 is arranged at the top of the oven device 3; the air outlet interface 16 is arranged at the top of the oven device 3; the guide rail 17 is arranged below the air inlet interface 15 and the air outlet interface 16; a slide block 18, wherein the slide block 19 is matched with the guide rail 17; the air cylinder 19 is fixed with the sliding block 18 through screws; a baking plate 20 fixed below the cylinder 19 by screws; two receiving discs 21 are arranged, a proximity sensor is arranged on each receiving disc 21, and the two receiving discs 21 are arranged below the baking plate 20; the first fixing frame 22 is used for fixedly supporting the bearing disc 21. By adopting the technical means, the wax-homogenized product is placed on the bearing disc 21, the proximity sensor arranged on the bearing disc 21 senses the product, a signal is fed back to the electromagnetic valve, and meanwhile, the air cylinder 19 acts in the X direction according to the appointed stroke through the existence of the air source and the air source through the air inlet interface 15 and the air outlet interface 16 and the reversing of the electromagnetic valve, so that the X direction action of the baking plate 20 is realized, and the wax-homogenized product placed on the bearing disc 21 is dried.
According to one embodiment of the present invention, wherein the rotating platform 4 comprises: the fixed support 30 is fixed above the rack 1 and used for fixedly supporting the rotating platform 4; a panel disposed above the fixing bracket 30; the product tray 23 is fixed on the panel and used for manually storing products, and a correlation sensor is arranged on the product tray 23 and used for preventing a workpiece from arriving at the platform; and the second motor 29 is fixedly connected with the fixed support 30 through screws.
According to an embodiment of the present invention, wherein the rotating platform 4 further comprises: the bearing seat 26 is fixedly arranged on the fixed bracket 30; the transmission shaft 27 is connected with the second motor 29 through a second coupling 28; the transmission shaft 27 is fixed on the bearing seat 26 through a clamp spring; the rotating frame 25, the rotating frame 25 is connected with the transmission shaft 27; and the suction nozzle 24 is tightly matched with the rotating frame 25 through screws. By adopting the technical means, after the dried product is placed on the product tray 23, the second motor 29 is started, the second shaft coupling 28 and the transmission shaft 27 are used for transmission, so that the rotating frame 25 is driven to move, the rotating frame 25 drives the suction nozzle 24 to rotate, the suction nozzle 24 sucks the product, the product is overturned for 180 degrees, and the product is overturned to the upper surface of the preheating tray 38.
According to one embodiment of the present invention, wherein the sheeting device 6 comprises: a tabletting cylinder 43 arranged on the top of the tabletting device 6; the sticky sheet disc 37 is arranged right below the tabletting air cylinder 43, the sticky sheet disc 37 is connected with the tabletting air cylinder 43 through a connecting shaft, and the sticky sheet disc 37 can be lifted up and down under the action of the tabletting air cylinder 43; a rotating disk 39 provided directly below the adhesive sheet disk 37; a preheating tray 38 provided below the rotating tray 39; and the motor III 41 is arranged right below the tabletting device 6, and the motor III 41 is connected with the rotating disc 39 through a coupling III 40. By adopting the technical means, after the product is turned over to the preheating disc 38, the tabletting air cylinder 43 is started, the tabletting air cylinder 43 acts in the Y direction according to the designated stroke to drive the sticking disc 37 to stick the product placed on the preheating disc 38, after the sticking is finished, the tabletting air cylinder 43 contracts, and the air cylinder moving manipulator 42 acts to move the product to the rotating disc 39.
According to one embodiment of the invention, wherein the pneumatic manipulator 7 comprises: the air cylinder moving manipulator 42 is arranged inside the tabletting device 6, and the air cylinder moving manipulator 42 is provided with a sliding block; the sticking plate 37 and the pressing cylinder 43 are integrally moved back and forth on the slider of the cylinder moving robot 42 by screws.
According to an embodiment of the present invention, wherein the cooling device 5 comprises: a material-bearing tray 31 arranged on the top of the cooling device 5; the cooling plate 32 is arranged right below the material bearing disc 31, and the cooling plate 32 is provided with a cooling liquid input pipe 33 and a cooling liquid output pipe 36; the fixing plate 35, the cooling plate 32 is disposed right above the fixing plate 35, and the cooling liquid input pipe 33 and the cooling liquid output pipe 36 respectively penetrate through the fixing plate 35; jacking cylinder 34, jacking cylinder 34 with holding dish 31 passes through threaded connection, jacking cylinder 35 drives through the up-and-down action holding dish 31 with the isolation and the contact of cooling plate 32. By adopting the technical means, after the product is taken down from the rotating disc 39 and placed on the material bearing disc 31, the jacking cylinder 34 acts up and down to drive the material bearing disc 31 to be isolated and contacted with the cooling plate 32, meanwhile, the cooling plate 32 can continuously circulate and flow the cooling liquid in the cooling plate 32 through the cooling liquid input pipe 33 and the cooling liquid output pipe 36, and then the product is cooled.
In order to achieve the second purpose, the invention adopts the following technical scheme:
a wafer bonding method based on wafer bonding equipment comprises the following steps:
the device is free of hidden danger in inspection, a product is placed on the wax homogenizing plate 9, the control panel 8 is manually operated, the motor I12 is started, the motor I12 is connected with the wax homogenizing plate 9, the wax homogenizing plate 9 is further driven to rotate, wax is manually smeared on the surface of a wafer, and the uniform rotating speed of the motor I12 enables the wax smeared on the wafer placed on the wax homogenizing plate 9 to be uniform;
the wax-homogenized product is placed on the bearing disc 21, a proximity sensor arranged on the bearing disc 21 senses the product, a signal is fed back to the electromagnetic valve, and meanwhile, the air cylinder 19 acts in the X direction according to a specified stroke through the existence of an air source and the air source through the air inlet interface 15 and the air outlet interface 16 and the reversing of the electromagnetic valve, so that the X-direction action of the baking plate 20 is realized, and the wax-homogenized product placed on the bearing disc 21 is dried;
the dried product is placed on the product tray 23, the second motor 29 is started, the second shaft coupling 28 and the transmission shaft 27 are used for transmission, the rotating frame 25 is driven to move, the rotating frame 25 drives the suction nozzle 24 to rotate, the suction nozzle 24 sucks the product, and the product is turned over for 180 degrees so as to turn over the product onto the preheating tray 38;
the tabletting air cylinder 43 is started, the tabletting air cylinder 43 acts in the Y direction according to the designated stroke to drive the sticking plate 37 to stick the product placed on the preheating plate 38, the tabletting air cylinder 43 contracts after sticking the sheet, and the air cylinder moving manipulator 42 acts to move the product to the rotating plate 39;
taking down the product on the rotating disc 39 and placing the product on the material bearing disc 31, and enabling the jacking cylinder 34 to act up and down so as to drive the material bearing disc 31 to be isolated from and contacted with the cooling plate 32;
and (4) after the wafer is adhered, stopping the equipment, cleaning the equipment, checking that the heating device is to be cooled, and waiting for the next starting action if the equipment is not abnormal.
According to an embodiment of the present invention, further, during the process of the lifting cylinder 34 moving up and down to separate and contact the material tray 31 and the cooling plate 32, the cooling plate 32 circulates the cooling liquid in the cooling plate 32 continuously through the cooling liquid input pipe 33 and the cooling liquid output pipe 36, thereby cooling the product.
Has the advantages that:
according to the wafer bonding equipment and the wafer bonding method thereof, the wax homogenizing device, the oven device, the rotating platform, the tabletting device and the cooling device are matched to work, so that the integrated operation of uniform waxing and drying and cooling of a product is realized, the operation is convenient, the switching is rapid, and the automation degree of the wafer bonding equipment is increased.
Meanwhile, when a baking oven device in the wafer bonding equipment is used for drying the products which are well homogenized in wax and are placed on the bearing plate, the proximity sensor and the electromagnetic valve are used for acting together, and then the cylinder is controlled to act in the X direction according to a specified stroke, so that the X direction action of the baking plate is realized, and the products which are well homogenized in wax and are placed on the bearing plate are dried; meanwhile, when the tabletting device is used for carrying out the tablet sticking operation on the dried product, the tabletting air cylinder acts in the Y direction according to the appointed stroke to drive the tablet sticking disc to stick the product placed on the preheating disc. Namely, the X, Y air cylinders in two running directions are used simultaneously, so that the laminating contact ratio in the wafer bonding process is more accurate, the error is reduced, and the production efficiency can be effectively increased; and simple structure, economic performance is good, and stability is high, and is multiple functional. The technical problems that in the prior art, due to the fact that the automation degree of equipment is low, the flatness error of the sticky sheet is large after the sticky sheet is pasted, the sticky sheet is not in a tolerance range, and the position of the sticking is not accurate are solved.
Drawings
The invention is further illustrated with reference to the following figures and examples.
Fig. 1 is a front view of the present invention.
Fig. 2 is a top view of the present invention.
Fig. 3 is a side view of the present invention.
FIG. 4 is a front view of the wax homogenizing device of the present invention.
FIG. 5 is a top view of the homowax device of the present invention.
FIG. 6 is a side view of the homowax device of the present invention.
Fig. 7 is a front view of the oven apparatus of the present invention.
Fig. 8 is a top view of the oven apparatus of the present invention.
Fig. 9 is a side view of the oven apparatus of the present invention.
Fig. 10 is a perspective view of the rotary platform of the present invention.
FIG. 11 is a top view of the rotating platform of the present invention.
Figure 12 is a side view of a sheeting apparatus of the present invention.
Figure 13 is a top view of a sheeting apparatus of the present invention.
Figure 14 is a further side view of a sheeting apparatus of the present invention.
Fig. 15 is a cross-sectional view of the cooling device of the present invention.
Fig. 16 is a side view of the cooling device of the present invention.
FIG. 17 is a schematic representation of the product before homowaxing.
FIG. 18 is a schematic representation of the product after homowaxing.
In the drawings:
1. frame 2, wax homogenizing device 3, oven device
4. Rotating platform 5, cooling device 6 and tabletting device
7. Pneumatic manipulator 8, control panel 9, wax homogenizing plate
10. Bearing 11, coupling I12 and motor I
13. Motor cabinet 14, wax equalizing disc 15, air inlet interface
16. Air outlet connector 17, guide rail 18 and sliding block
19. Cylinder 20, baking plate 21, receiving tray
22. First fixing frame 23, second product tray 24 and suction nozzle
25. Rotating frame 26, bearing block 27 and transmission shaft
28. Second coupling 29, second motor 30 and fixing support
31. Material-bearing tray 32, cooling plate 33, and cold liquid input tube
34. Jacking cylinder 35, fixed plate 36 and cold night output pipe
37. Pasting disk 38, preheating disk 39 and rotating disk
40. Three shaft couplings 41, three motors 42 and cylinder moving manipulator
43. Cylinder moving manipulator 44, product 45, wax homogenizing layer
46. Surface mount layer
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clear and fully described, embodiments of the present invention are further described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are illustrative of some, but not all embodiments of the invention and are intended to be exemplary only, and that all other embodiments can be devised by those skilled in the art without departing from the scope of the invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "inner", "outer", "top", "bottom", "side", "vertical", "horizontal", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "a," "an," "first," "second," "third," "fourth," "fifth," and "sixth" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
For simplicity and illustrative purposes, the principles of the embodiments are described by referring mainly to examples. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the embodiments. It will be apparent, however, to one skilled in the art that the embodiments may be practiced without these specific details. In some instances, well-known methods and structures have not been described in detail so as not to unnecessarily obscure the embodiments. In addition, all embodiments may be used in combination with each other.
As shown in fig. 1 to 3, a die bonding apparatus includes: a frame 1; the wax homogenizing device 2 is arranged at the left end of the rack 1; the drying oven device 3 is arranged on the right side of the wax homogenizing device 2; the rotating platform 4 is arranged on the right side of the oven device 3; the tabletting device 6 is arranged behind the rotary platform 4; a pneumatic manipulator 7 provided below the sheeting device 6; the cooling device 5 is arranged at the right end of the frame 1; and the control panel 8 is arranged at the upper left part of the wax homogenizing device 2. The frame 1 adopts the welding of steel casting for the rectangle square steel as the skeleton, and the frame is stable, and welding side pipe production simple process, production efficiency is high, and the variety specification is many, and equipment resources is few, and pipe production simple process, production efficiency is high, and is with low costs, develops very fast.
By adopting the technical means, the wax homogenizing device, the oven device, the rotary platform, the tabletting device and the cooling device are matched to work, so that the integrated operation of uniform waxing and drying and cooling of the product is realized, the operation is convenient, the switching is rapid, and the automation degree of the wafer sticking equipment is increased. Meanwhile, when a baking oven device in the wafer bonding equipment is used for drying the products which are well homogenized in wax and are placed on the bearing plate, the proximity sensor and the electromagnetic valve are used for acting together, and then the cylinder is controlled to move in the X direction according to the designated stroke, so that the X direction movement of the baking plate is realized, and the products which are well homogenized in wax and are placed on the bearing plate are dried; meanwhile, when the tabletting device is used for carrying out the tablet sticking operation on the dried product, the tabletting air cylinder acts in the Y direction according to the appointed stroke to drive the tablet sticking disc to stick the product placed on the preheating disc. Namely, the X, Y air cylinders in two running directions are used simultaneously, so that the laminating contact ratio in the wafer bonding process is more accurate, the error is reduced, and the production efficiency can be effectively increased; and simple structure, economic performance is good, and stability is high, and is multiple functional. The technical problems that in the prior art, due to the fact that the automation degree of equipment is low, the flatness error of the sticky sheet is large after the sticky sheet is pasted, the sticky sheet is not in a tolerance range, and the position of the sticking is not accurate are solved.
As shown in fig. 4 to 6, the wax device 2 includes: the motor I12 is arranged at the lower end of the wax homogenizing device 2; the motor base 13 is used for fixing the motor I12 on a panel of the wax homogenizing device 2; the wax homogenizing plate 9 is connected with the motor I12 through a transmission shaft and a coupling I11, and the transmission shaft and the wax homogenizing plate 9 are fixed through screws; and the bearing 10 is used for clamping the transmission shaft, so that the wax homogenizing plate 9 is fixed. Adopt above-mentioned technical means, when equipment carries out the wax homogenizing operation, at first put the product on wax homogenizing board 9, manual operation control panel 8, a starter motor 12, a motor 12 is connected with wax homogenizing board 9, and then drives wax plate 9 rotatory, and simultaneously, the manual work is paintd wax on the surface of wafer, because the even unanimous rotational speed of a motor 12 for the wax that the wafer of placing on wax homogenizing board 9 was paintd is even unanimous, and then realizes the even waxing to the product.
As shown in fig. 7 to 9, the oven device 3 includes: the air inlet interface 15 is arranged at the top of the oven device 3; the air outlet interface 16 is arranged at the top of the oven device 3; the guide rail 17 is arranged below the air inlet interface 15 and the air outlet interface 16; a slide block 18, the slide block 19 is mutually matched with the guide rail 17; the air cylinder 19 is fixed with the sliding block 18 through screws; a baking plate 20 fixed below the cylinder 19 by screws; two receiving trays 21 are arranged, a proximity sensor is arranged on each receiving tray 21, and both the two receiving trays 21 are arranged below the baking plate 20; and the first fixing frame 22 is used for fixedly supporting the bearing disc 21. In the assembly, two bearing discs 21 are respectively fixed on corresponding first fixing frames 22, one bearing disc 21 is used for standby, while one bearing disc is baked, the other bearing disc is waited for baking, and the baking is circulated one by one; after being baked, the baking oven is close to the wax homogenizing device 2, so that the operation is convenient, and the time for manually placing the product is saved; the coating touch is prohibited under the condition of high temperature, and the mechanical arm is prohibited from moving back and forth during the process of placing the product. By adopting the technical means, the wax-homogenized product is placed on the bearing disc 21, the proximity sensor arranged on the bearing disc 21 senses the product, a signal is fed back to the electromagnetic valve, and meanwhile, the air cylinder 19 acts in the X direction according to the appointed stroke through the existence of the air source and the air source through the air inlet interface 15 and the air outlet interface 16 and the reversing of the electromagnetic valve, so that the X direction action of the baking plate 20 is realized, and the wax-homogenized product placed on the bearing disc 21 is dried.
As shown in fig. 10 and 11, the rotary table 4 includes: the fixed support 30 is fixed above the rack 1 and used for fixedly supporting the rotating platform 4; a panel disposed above the fixing bracket 30; the product tray 23 is fixed on the panel and used for manually storing products, and a correlation sensor is arranged on the product tray 23 and used for preventing a workpiece from arriving at the platform; and the second motor 29 is fixedly connected with the fixed support 30 through screws. The bearing seat 26 is fixedly arranged on the fixed bracket 30; the transmission shaft 27 is connected with the second motor 29 through a second coupling 28; the transmission shaft 27 is fixed on the bearing seat 26 through a clamp spring; the rotating frame 25, the rotating frame 25 is connected with the transmission shaft 27; and the suction nozzle 24 is tightly matched with the rotating frame 25 through screws. By adopting the technical means, after the dried product is placed on the product tray 23, the second motor 29 is started, the second shaft coupling 28 and the transmission shaft 27 are used for transmission, so that the rotating frame 25 is driven to move, the rotating frame 25 drives the suction nozzle 24 to rotate, the suction nozzle 24 sucks the product, and the product is turned over for 180 degrees, so that the product is turned over onto the preheating tray 38.
As shown in fig. 12 to 14, the sheet pressing device 6 includes: a tabletting cylinder 43 arranged on the top of the tabletting device 6; the sticky sheet disc 37 is arranged right below the tabletting air cylinder 43, the sticky sheet disc 37 is connected with the tabletting air cylinder 43 through a connecting shaft, and the sticky sheet disc 37 can be lifted up and down under the action of the tabletting air cylinder 43; a rotating disk 39 provided directly below the adhesive sheet disk 37; a preheating tray 38 provided below the rotating tray 39; and the motor III 41 is arranged right below the tabletting device 6, and the motor III 41 is connected with the rotating disc 39 through a coupling III 40. By adopting the technical means, after the product is turned over to the preheating disc 38, the tabletting air cylinder 43 is started, the tabletting air cylinder 43 acts in the Y direction according to the designated stroke to drive the sticking disc 37 to stick the product placed on the preheating disc 38, after the sticking is finished, the tabletting air cylinder 43 contracts, and the air cylinder moving manipulator 42 acts to move the product to the rotating disc 39.
The pneumatic manipulator 7 includes: the air cylinder moving manipulator 42 is arranged inside the tabletting device 6, and the air cylinder moving manipulator 42 is provided with a sliding block; the sticking plate 37 and the pressing cylinder 43 are integrally moved back and forth on the slider of the cylinder moving robot 42 by screws.
As shown in fig. 15 to 18, the cooling device 5 includes: a material-bearing tray 31 arranged on the top of the cooling device 5; the cooling plate 32 is arranged right below the material bearing disc 31, and the cooling plate 32 is provided with a cooling liquid input pipe 33 and a cooling liquid output pipe 36; the fixing plate 35, the cooling plate 32 is disposed right above the fixing plate 35, and the cooling liquid input pipe 33 and the cooling liquid output pipe 36 respectively penetrate through the fixing plate 35; jacking cylinder 34, jacking cylinder 34 with holding dish 31 passes through threaded connection, jacking cylinder 35 drives through the up-and-down action holding dish 31 with the isolation and the contact of cooling plate 32. By adopting the technical means, after the product is taken down from the rotating disc 39 and placed on the material bearing disc 31, the jacking cylinder 34 acts up and down to drive the material bearing disc 31 to be isolated and contacted with the cooling plate 32, meanwhile, the cooling plate 32 can continuously circulate and flow the cooling liquid in the cooling plate 32 through the cooling liquid input pipe 33 and the cooling liquid output pipe 36, and then the product is cooled.
A wafer bonding method based on wafer bonding equipment comprises the following steps:
the device is inspected to have no hidden danger, a product is placed on the wax homogenizing plate 9, the control panel 8 is manually operated, the first motor 12 is started, the first motor 12 is connected with the wax homogenizing plate 9, the wax homogenizing plate 9 is further driven to rotate, wax is manually smeared on the surface of a wafer, and the uniform rotating speed of the first motor 12 enables the wax smeared on the wafer placed on the wax homogenizing plate 9 to be uniform and consistent;
the wax-homogenized product is placed on the bearing disc 21, a proximity sensor arranged on the bearing disc 21 senses the product, a signal is fed back to the electromagnetic valve, and meanwhile, the air cylinder 19 acts in the X direction according to a specified stroke through the existence of an air source and the air source through the air inlet interface 15 and the air outlet interface 16 and the reversing of the electromagnetic valve, so that the X-direction action of the baking plate 20 is realized, and the wax-homogenized product placed on the bearing disc 21 is dried;
the dried product is placed on the product tray 23, the second motor 29 is started, the second shaft coupling 28 and the transmission shaft 27 are used for transmission, the rotating frame 25 is driven to move, the rotating frame 25 drives the suction nozzle 24 to rotate, the suction nozzle 24 sucks the product, and the product is turned over for 180 degrees so as to turn over the product onto the preheating tray 38;
the tabletting air cylinder 43 is started, the tabletting air cylinder 43 acts in the Y direction according to the appointed stroke to drive the sticking disc 37 to stick the product placed on the preheating disc 38, the tabletting air cylinder 43 contracts after the sticking is finished, and the air cylinder moving manipulator 42 acts to move the product to the rotating disc 39;
taking down the product on the rotating disc 39 and placing the product on the material bearing disc 31, and enabling the jacking cylinder 34 to act up and down so as to drive the material bearing disc 31 to be isolated and contacted with the cooling plate 32;
and (4) after the wafer is adhered, stopping the equipment, cleaning the equipment, checking that the heating device is to be cooled, and waiting for the next starting action if the equipment is not abnormal.
According to an embodiment of the present invention, further, during the process of the lifting cylinder 34 moving up and down to separate and contact the material tray 31 and the cooling plate 32, the cooling plate 32 is configured to circulate the cooling liquid through the cooling liquid input pipe 33 and the cooling liquid output pipe 36 continuously inside the cooling plate 32, so as to cool the product.
Although the illustrative embodiments of the present invention have been described above to enable those skilled in the art to understand the present invention, the present invention is not limited to the scope of the embodiments, and it is apparent to those skilled in the art that all the inventive concepts using the present invention are protected as long as they can be changed within the spirit and scope of the present invention as defined and defined by the appended claims.
Claims (2)
1. A wafer bonding method based on wafer bonding equipment,
the wafer bonding device comprises: a frame (1); the wax homogenizing device (2) is arranged at the left end of the rack (1); the drying oven device (3) is arranged on the right side of the wax homogenizing device (2); the rotating platform (4) is arranged on the right side of the oven device (3); the tabletting device (6) is arranged behind the rotating platform (4); the pneumatic manipulator (7) is arranged below the tabletting device (6); the cooling device (5) is arranged at the right end of the rack (1); the control panel (8) is arranged above the left side of the wax homogenizing device (2);
the oven device (3) comprises: the air inlet interface (15) is arranged at the top of the oven device (3); the air outlet interface (16) is arranged at the top of the oven device (3); the guide rail (17) is arranged below the air inlet interface (15) and the air outlet interface (16); -a slide (18), said slide (18) cooperating with said guide (17); the air cylinder (19), the said air cylinder (19) is fixed with the said slide block (18) through the screw; a baking plate (20) fixed below the cylinder (19) through screws; two bearing discs (21) are arranged, a proximity sensor is arranged on each bearing disc (21), and the two bearing discs (21) are arranged below the baking plate (20); the first fixing frame (22) is used for fixedly supporting the bearing disc (21);
the sheeting device (6) comprises: the tabletting air cylinder (43) is arranged at the top of the tabletting device (6); the sticky sheet disc (37) is arranged right below the pressing cylinder (43), the sticky sheet disc (37) is connected with the pressing cylinder (43) through a connecting shaft, and the sticky sheet disc (37) can be lifted up and down under the action of the pressing cylinder (43); a rotating disk (39) provided directly below the adhesive sheet disk (37); a preheating tray (38) disposed below the rotating tray (39); the motor III (41) is arranged right below the tabletting device (6), and the motor III (41) is connected with the rotating disc (39) through a coupling III (40);
the method comprises the following steps:
the device is free of hidden danger in inspection, a product is placed on the wax homogenizing plate (9), the control panel (8) is manually operated, the motor I (12) is started, the motor I (12) is connected with the wax homogenizing plate (9) to further drive the wax homogenizing plate (9) to rotate, wax is manually smeared on the surface of the wafer, and the uniform rotating speed of the motor I (12) enables the wax smeared on the wafer placed on the wax homogenizing plate (9) to be uniform;
the wax-homogenized product is placed on the bearing disc (21), a proximity sensor arranged on the bearing disc (21) senses the product, a signal is fed back to the electromagnetic valve, and meanwhile, the air cylinder (19) acts in the X direction according to a specified stroke through the existence of an air source and the air source through the air inlet interface (15) and the air outlet interface (16) and the reversing of the electromagnetic valve, so that the X-direction action of the baking plate (20) is realized, and the wax-homogenized product placed on the bearing disc (21) is dried;
the dried product is placed on the product tray (23), the motor II (29) is started, the rotating frame (25) is driven to move through the transmission of the shaft coupling II (28) and the transmission shaft (27), the rotating frame (25) drives the suction nozzle (24) to rotate, the suction nozzle (24) sucks the product, and the product is turned over for 180 degrees, so that the product is turned over to the preheating disc (38);
the tabletting air cylinder (43) is started, the tabletting air cylinder (43) acts in the Y direction according to a specified stroke, the sticking plate disc (37) is driven to stick the product placed on the preheating disc (38), the tabletting air cylinder (43) contracts after the sticking is finished, and the air cylinder moving manipulator (42) acts to move the product to the rotating disc (39);
taking down the product on the rotating disc (39) and placing the product on the material bearing disc (31), and enabling the jacking cylinder (34) to act up and down so as to drive the material bearing disc (31) to be isolated and contacted with the cooling plate (32);
and (4) after the wafer is adhered, stopping the equipment, cleaning the equipment, checking that the heating device is to be cooled, and waiting for the next starting action if the equipment is not abnormal.
2. The wafer bonding method based on wafer bonding equipment as claimed in claim 1, further comprising the step of continuously circulating the cooling liquid in the cooling plate (32) through the cooling liquid input pipe (33) and the cooling liquid output pipe (36) inside the cooling plate (32) during the process of the lifting cylinder (34) moving up and down to drive the material carrying tray (31) and the cooling plate (32) to be isolated and contacted, thereby cooling the product.
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| CN114352704B (en) * | 2022-01-14 | 2024-03-15 | 深圳特斯特半导体设备有限公司 | Blade spindle structure of dicing saw |
| CN115547895B (en) * | 2022-11-24 | 2023-03-10 | 深圳新控半导体技术有限公司 | Chip pasting tool |
| CN116351644B (en) * | 2023-03-17 | 2023-10-20 | 江苏晶工半导体设备有限公司 | Semiconductor wafer waxing machine |
| CN116453984B (en) * | 2023-06-19 | 2023-08-18 | 通威微电子有限公司 | Wax pasting fixing device and wax pasting fixing method for wafers with different sizes |
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| JP5016510B2 (en) * | 2007-02-09 | 2012-09-05 | 日本碍子株式会社 | Semiconductor support equipment |
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