CN219371002U - Self-centering non-contact wafer gripper - Google Patents
Self-centering non-contact wafer gripper Download PDFInfo
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- CN219371002U CN219371002U CN202320346194.5U CN202320346194U CN219371002U CN 219371002 U CN219371002 U CN 219371002U CN 202320346194 U CN202320346194 U CN 202320346194U CN 219371002 U CN219371002 U CN 219371002U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to the technical field of wafers, in particular to a self-centering non-contact wafer gripper, which comprises a mounting plate, fixing rods and a connecting frame, wherein a positioning assembly and a grabbing assembly are arranged on the outer wall of the mounting plate; the grabbing component comprises a connecting frame arranged at the other output end of the hydraulic rod, bernoulli suckers are arranged at the bottom of the connecting frame, mounting frames are arranged on two sides of the connecting frame, and connecting rods and clamping blocks are arranged on the inner walls of the two mounting frames. The utility model can position and move the wafer, change the wafer transfer from contact to non-contact, effectively reduce the scrap rate, prevent the wafer from being scratched, and improve the production efficiency and the qualification rate.
Description
Technical Field
The utility model relates to the technical field of wafers, in particular to a self-centering non-contact wafer gripper.
Background
The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because of its circular shape, and various circuit element structures can be manufactured on the silicon wafer to form an IC product having a specific electrical function.
According to the intelligent sorting device for semiconductor wafer detection provided by the patent document with the application number of CN202122034600.8, the intelligent sorting device comprises a bottom plate, a driving frame is fixedly connected to the right side of the top of the bottom plate, a first motor is fixedly connected to the bottom of an inner cavity of the driving frame, a vertical rod is fixedly connected to the output end of the first motor, a transverse plate is fixedly connected to the top of the left side of the vertical rod, and a second electric telescopic rod is fixedly connected to the surface of the transverse plate. According to the sorting device for detecting the semiconductor wafers, the functions of good using effect can be achieved through the bottom plate, the first electric telescopic rod, the top plate, the transmission frame, the driving frame, the first motor, the vertical rod, the transverse plate, the clamping frame, the limiting rod, the second electric telescopic rod, the clamping claw, the third electric telescopic rod, the vertical plate, the transmission belt, the output roller and the second motor, the problem that the sorting device for detecting the semiconductor wafers in the existing market does not have the functions of good using effect, is difficult to break due to direct clamping and is not beneficial to operation and use of users is solved.
The intelligent sorting device for semiconductor wafer detection solves the problems that the sorting device for semiconductor wafer detection in the prior market does not have a function with good use effect, and is difficult to operate and use due to the fact that the sorting device is easy to crack when being directly clamped. At present, the transfer of the sapphire wafer in the production process is in contact type, and the cost loss is serious due to scratch.
Disclosure of Invention
The present utility model is directed to a self-centering contact-free wafer gripper to solve the above-mentioned problems.
In order to achieve the above purpose, the present utility model provides the following technical solutions:
the self-centering non-contact wafer gripper comprises a mounting plate, fixing rods and a connecting frame, wherein a positioning assembly and a grabbing assembly are arranged on the outer wall of the mounting plate, the positioning assembly comprises two hydraulic rods arranged at the top of the mounting plate, one of the output ends of the hydraulic rods is provided with a fixing rod, and a positioning block is arranged at the bottom of the fixing rod;
the grabbing component comprises a connecting frame arranged at the other output end of the hydraulic rod, bernoulli suckers are arranged at the bottom of the connecting frame, mounting frames are arranged on two sides of the connecting frame, and connecting rods and clamping blocks are arranged on the inner walls of the two mounting frames.
As a preferable scheme of the utility model, the positioning assembly further comprises fixing blocks arranged on two sides of the outer wall of the fixing rod.
As a preferable scheme of the utility model, the two hydraulic rods are connected with the mounting plate through bolts, one of the output ends of the hydraulic rods is connected with the fixing rod and the fixing block through bolts, the two fixing blocks are integrally formed with the fixing rod, and the positioning block is connected with the bottom of the fixing rod through bolts.
As a preferable scheme of the utility model, the inner wall of the positioning block is in a buckling bowl shape.
As a preferable scheme of the utility model, the grabbing component comprises telescopic rods arranged on the inner walls of the connecting frames, sliding grooves are formed in the inner walls of the two mounting frames, air cylinders are arranged on the inner walls of the sliding grooves, connecting rods are arranged at the output ends of the air cylinders, and clamping blocks are arranged at one ends, far away from the mounting frames, of the connecting rods.
As a preferable scheme of the utility model, the other output end of the hydraulic rod is connected with the connecting frame through a bolt, one end of the telescopic rod is connected with the inner wall of the connecting frame through a bolt, and the output end of the telescopic rod is connected with the Bernoulli sucker through a bolt.
As the preferable scheme of the utility model, the two mounting frames are integrally formed with the outer wall of the connecting frame, the air cylinder is connected with the inner wall of the chute through bolts, the output end of the air cylinder is connected with the connecting rod through bolts, the connecting rod is connected with the inner wall of the chute through a sliding rail, and one end of the connecting rod, which is far away from the chute, is connected with the clamping block through bolts.
As a preferable scheme of the utility model, the top of the mounting plate is provided with a turntable.
Compared with the prior art, the utility model has the beneficial effects that: to the problem that proposes among the background art, this application has adopted locating component and snatchs the subassembly, is connected through carousel and rotating system and can drive the mounting panel and rotate the position of adjustment locating piece and Bernoulli sucking disc, detain the bowl design through the locating piece in and can fix a position the adjustment position to the wafer, then absorb the wafer through the Bernoulli basin to through the clamp splice butt clamp, make the wafer centering, can accurately put the appointed position with the wafer. The utility model can position and move the wafer, change the wafer transfer from contact to non-contact, effectively reduce the scrap rate, prevent the wafer from being scratched, and improve the production efficiency and the qualification rate.
Drawings
FIG. 1 is a perspective view of the overall structure of the present utility model;
FIG. 2 is a cross-sectional view of a securing lever of the present utility model;
fig. 3 is a cross-sectional view of a connection frame of the present utility model.
In the figure: 1. a mounting plate; 2. a turntable; 3. a hydraulic rod; 4. a fixed rod; 401. a positioning block; 402. a fixed block; 5. a connection frame; 501. a telescopic rod; 6. bernoulli suction cups; 7. a mounting frame; 701. a chute; 8. a cylinder; 9. a connecting rod; 901. and clamping blocks.
Detailed Description
The technical solutions of the embodiments of the present utility model will be clearly and completely described below in conjunction with the embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, but not all embodiments, and all other embodiments obtained by those skilled in the art without making any inventive effort based on the embodiments of the present utility model are within the scope of protection of the present utility model.
In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings. Several embodiments of the utility model are presented. This utility model may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "mounted" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1-3, the present utility model provides a technical solution: the utility model provides a self-centering contactless wafer tongs, includes mounting panel 1, dead lever 4 and connecting frame 5, mounting panel 1 outer wall is provided with locating component and snatchs the subassembly, locating component is including setting up two hydraulic levers 3 at mounting panel 1 top, can be used to drive dead lever 4 and connecting frame 5 and stretch out and draw back, one of them hydraulic lever 3 output is provided with dead lever 4, the dead lever 4 bottom is provided with locating piece 401 and is used for carrying out the location to the wafer;
the grabbing component comprises a connecting frame 5 arranged at the other output end of the hydraulic rod 3, bernoulli suckers 6 arranged at the bottom of the connecting frame 5 and used for sucking wafers, mounting frames 7 arranged on two sides of the connecting frame 5, connecting rods 9 and clamping blocks 901 arranged on the inner walls of the mounting frames 7 and used for clamping the wafers in pairs, and centering the wafers.
At present, the transfer of the sapphire wafer in the production process is in contact type, and the cost loss is serious due to scratch.
All electrical components in this embodiment are controlled by a conventional controller.
Referring to fig. 1-2, the positioning assembly further includes fixing blocks 402 disposed on two sides of an outer wall of the fixing rod 4, two hydraulic rods 3 are connected with the mounting plate 1 through bolts, one of output ends of the hydraulic rods 3 is connected with the fixing rod 4 and the fixing blocks 402 through bolts, two fixing blocks 402 are integrally formed with the fixing rod 4, the positioning block 401 is connected with the bottom of the fixing rod 4 through bolts, and an inner wall of the positioning block 401 is in a shape of a buckling bowl, so that a wafer can move to the center of the positioning block 401 through the buckling bowl.
Referring to fig. 1-3, the grabbing component includes a telescopic rod 501 disposed on an inner wall of a connection frame 5 and used for driving a bernoulli chuck 6 to stretch out and draw back, two inner walls of a mounting frame 7 are respectively provided with a chute 701, an inner wall of the chute 701 is provided with a cylinder 8 for pushing a connecting rod 9 to slide in the chute 701 and driving a clamp block 901 to move synchronously, an output end of the cylinder 8 is provided with a connecting rod 9, one end of the connecting rod 9 far away from the mounting frame 7 is provided with a clamp block 901 for clamping a wafer and centering the wafer, another output end of the hydraulic rod 3 is connected with the connection frame 5 through a bolt, one end of the telescopic rod 501 is connected with the inner wall of the connection frame 5 through a bolt, an output end of the telescopic rod 501 is connected with the bernoulli chuck 6 through a bolt, two inner walls of the mounting frame 7 are respectively integrally formed with an outer wall of the connection frame 5, the cylinder 8 is connected with the inner wall of the chute 701 through a bolt, an output end of the cylinder 8 is connected with the connecting rod 9 through a bolt, the connecting rod 9 is connected with the inner wall of the chute 701 through a slide rail, one end of the connecting rod 9 far away from the chute 701 from the end of the mounting frame is connected with the clamp block 901 through a bolt, and the top of the connecting rod 1 is connected with the clamp block 901, and the top of the turntable 2 is driven by the turntable 2 and the turntable 2 is arranged to rotate by the top position of the turntable 2. When the device is used, firstly, the mounting plate 1 is driven to rotate to a designated position through the turntable 2, then one of the hydraulic rods 3 is controlled to operate to drive the positioning block 401 to move downwards to contact with a wafer and position the wafer, after the positioning is carried out, the mounting plate 1 is rotated to the designated position, then the other hydraulic rod 3 is controlled to operate to drive the connecting frame 5 to stretch to the designated position, meanwhile, the telescopic rod 501 is controlled to drive the Bernoulli sucker 6 to contact with and suck the wafer, then the cylinder 8 is controlled to operate to drive the connecting rod 9 to slide in the chute 701 and drive the clamping block 901 to clamp the wafer, so that the wafer is centered, and then the wafer is moved to the designated position.
The working flow of the utility model is as follows: when the device is used, firstly, the mounting plate 1 is driven to rotate to a designated position through the turntable 2, then one of the hydraulic rods 3 is controlled to operate to drive the positioning block 401 to move downwards to contact with a wafer and position the wafer, after the positioning is carried out, the mounting plate 1 is rotated to the designated position, then the other hydraulic rod 3 is controlled to operate to drive the connecting frame 5 to stretch to the designated position, meanwhile, the telescopic rod 501 is controlled to drive the Bernoulli sucker 6 to contact with and suck the wafer, then the cylinder 8 is controlled to operate to drive the connecting rod 9 to slide in the chute 701 and drive the clamping block 901 to clamp the wafer, so that the wafer is centered, and then the wafer is moved to the designated position. The utility model can position and move the wafer, change the wafer transfer from contact to non-contact, effectively reduce the scrap rate, prevent the wafer from being scratched, and improve the production efficiency and the qualification rate.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The utility model provides a from non-contact wafer tongs of centering, includes mounting panel (1), dead lever (4) and connecting frame (5), its characterized in that: the automatic clamping device is characterized in that a positioning assembly and a grabbing assembly are arranged on the outer wall of the mounting plate (1), the positioning assembly comprises two hydraulic rods (3) arranged at the top of the mounting plate (1), a fixing rod (4) is arranged at the output end of one hydraulic rod (3), and a positioning block (401) is arranged at the bottom of the fixing rod (4);
the grabbing component comprises a connecting frame (5) arranged at the other output end of the hydraulic rod (3), bernoulli suckers (6) are arranged at the bottom of the connecting frame (5), mounting frames (7) are arranged on two sides of the connecting frame (5), and connecting rods (9) and clamping blocks (901) are arranged on the inner walls of the mounting frames (7).
2. The self-centering, non-contact wafer gripper of claim 1, wherein: the positioning assembly further comprises fixing blocks (402) arranged on two sides of the outer wall of the fixing rod (4).
3. A self-centering, non-contact wafer gripper as claimed in claim 2, wherein: two hydraulic rods (3) are connected with the mounting plate (1) through bolts, wherein one output end of each hydraulic rod (3) is connected with the corresponding fixing rod (4) and the corresponding fixing block (402) through bolts, the two fixing blocks (402) are integrally formed with the corresponding fixing rods (4), and the corresponding positioning blocks (401) are connected with the bottoms of the corresponding fixing rods (4) through bolts.
4. The self-centering, non-contact wafer gripper of claim 1, wherein: the inner wall of the positioning block (401) is in a buckling bowl shape.
5. The self-centering, non-contact wafer gripper of claim 1, wherein: the grabbing component comprises telescopic rods (501) arranged on the inner walls of the connecting frames (5), sliding grooves (701) are formed in the inner walls of the mounting frames (7), air cylinders (8) are arranged on the inner walls of the sliding grooves (701), connecting rods (9) are arranged at the output ends of the air cylinders (8), and clamping blocks (901) are arranged at one ends, far away from the mounting frames (7), of the connecting rods (9).
6. The self-centering, non-contact wafer gripper of claim 5, wherein: the other output end of the hydraulic rod (3) is connected with the connecting frame (5) through a bolt, one end of the telescopic rod (501) is connected with the inner wall of the connecting frame (5) through a bolt, and the output end of the telescopic rod (501) is connected with the Bernoulli sucker (6) through a bolt.
7. The self-centering, non-contact wafer gripper of claim 5, wherein: the two mounting frames (7) are integrally formed with the outer wall of the connecting frame (5), the air cylinder (8) is connected with the inner wall of the sliding groove (701) through bolts, the output end of the air cylinder (8) is connected with the connecting rod (9) through bolts, the connecting rod (9) is connected with the inner wall of the sliding groove (701) through sliding rails, and one end, far away from the sliding groove (701), of the connecting rod (9) is connected with the clamping block (901) through bolts.
8. The self-centering, non-contact wafer gripper of claim 1, wherein: the top of the mounting plate (1) is provided with a rotary table (2).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202320346194.5U CN219371002U (en) | 2023-03-01 | 2023-03-01 | Self-centering non-contact wafer gripper |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202320346194.5U CN219371002U (en) | 2023-03-01 | 2023-03-01 | Self-centering non-contact wafer gripper |
Publications (1)
Publication Number | Publication Date |
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CN219371002U true CN219371002U (en) | 2023-07-18 |
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ID=87145358
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202320346194.5U Active CN219371002U (en) | 2023-03-01 | 2023-03-01 | Self-centering non-contact wafer gripper |
Country Status (1)
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CN (1) | CN219371002U (en) |
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2023
- 2023-03-01 CN CN202320346194.5U patent/CN219371002U/en active Active
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