CN110545948B - 借助激光诱导的深度蚀刻来加工、尤其分割基板的方法 - Google Patents

借助激光诱导的深度蚀刻来加工、尤其分割基板的方法 Download PDF

Info

Publication number
CN110545948B
CN110545948B CN201880025435.8A CN201880025435A CN110545948B CN 110545948 B CN110545948 B CN 110545948B CN 201880025435 A CN201880025435 A CN 201880025435A CN 110545948 B CN110545948 B CN 110545948B
Authority
CN
China
Prior art keywords
etching
substrate
unit
thickness
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201880025435.8A
Other languages
English (en)
Chinese (zh)
Other versions
CN110545948A (zh
Inventor
R.奥斯索尔特
N.安布罗修斯
D.邓克尔
A.施努尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lepuke Shanghai Optoelectronics Co ltd
Original Assignee
LPKF Laser and Electronics AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LPKF Laser and Electronics AG filed Critical LPKF Laser and Electronics AG
Publication of CN110545948A publication Critical patent/CN110545948A/zh
Application granted granted Critical
Publication of CN110545948B publication Critical patent/CN110545948B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
    • C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/54—Glass

Landscapes

  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Laser Beam Processing (AREA)
  • Surface Treatment Of Glass (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
CN201880025435.8A 2017-05-15 2018-04-06 借助激光诱导的深度蚀刻来加工、尤其分割基板的方法 Active CN110545948B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102017110542.5 2017-05-15
DE102017110542 2017-05-15
PCT/EP2018/058882 WO2018210484A1 (de) 2017-05-15 2018-04-06 Verfahren zur bearbeitung, insbesondere zum trennen eines substrates mittels laserinduziertem tiefenätzen

Publications (2)

Publication Number Publication Date
CN110545948A CN110545948A (zh) 2019-12-06
CN110545948B true CN110545948B (zh) 2022-02-25

Family

ID=61972103

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880025435.8A Active CN110545948B (zh) 2017-05-15 2018-04-06 借助激光诱导的深度蚀刻来加工、尤其分割基板的方法

Country Status (6)

Country Link
US (1) US11065716B2 (https=)
EP (1) EP3624982A1 (https=)
JP (2) JP7396899B2 (https=)
KR (1) KR102260931B1 (https=)
CN (1) CN110545948B (https=)
WO (1) WO2018210484A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2756175C1 (ru) * 2020-03-30 2021-09-28 Акционерное Общество "Государственный Научный Центр Российской Федерации Троицкий Институт Инновационных И Термоядерных Исследований" Роботизированный лазерный комплекс и способ демонтажа металлоконструкций аэс
DE102020114195A1 (de) * 2020-05-27 2021-12-02 Lpkf Laser & Electronics Aktiengesellschaft Verfahren zum Einbringen einer Ausnehmung in ein Substrat
JP2023544669A (ja) * 2021-08-30 2023-10-25 アブソリックス インコーポレイテッド パッケージング基板、半導体パッケージ、パッケージング基板の製造方法、及び半導体パッケージの製造方法
DE102022116783B3 (de) * 2022-07-05 2023-09-14 Lpkf Laser & Electronics Aktiengesellschaft Mikrostruktur aus Glas, Mikro-Mechanik und zugehörige Verwendung

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6709881B2 (en) * 2000-11-28 2004-03-23 Matsushita Electric Industrial Co., Ltd. Method for manufacturing semiconductor and method for manufacturing semiconductor device
CN1819878A (zh) * 2003-07-08 2006-08-16 光谱技术有限公司 激光从基底去除层或涂层
CN102468153A (zh) * 2010-10-29 2012-05-23 株式会社电装 半导体器件的制造方法
WO2014161534A2 (de) * 2013-04-04 2014-10-09 Lpkf Laser & Electronics Ag Verfahren und vorrichtung zum einbringen von durchbrechungen in ein substrat sowie ein derart hergestelltes substrat
WO2016010954A2 (en) * 2014-07-14 2016-01-21 Corning Incorporated Systems and methods for processing transparent materials using adjustable laser beam focal lines

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05185270A (ja) * 1992-01-16 1993-07-27 Kosaka Kenkyusho:Kk ガラスパネルの割断方法
JP3691221B2 (ja) * 1997-09-24 2005-09-07 三菱電機株式会社 レーザ加工方法
JP4672689B2 (ja) * 2006-02-22 2011-04-20 日本板硝子株式会社 レーザを用いたガラスの加工方法および加工装置
KR20140082993A (ko) * 2011-09-27 2014-07-03 칩워크스, 인코포레이티드 상이한 에칭 속도에 기초하여 p-채널 또는 n-채널 디바이스들을 구별하는 방법
JP6062287B2 (ja) * 2013-03-01 2017-01-18 株式会社ディスコ ウエーハの加工方法
CN103264227B (zh) * 2013-04-11 2015-05-13 温州大学 一种激光直接刻蚀聚合物基体表面覆盖金属膜的方法
CN103252262A (zh) * 2013-04-15 2013-08-21 中国人民解放军军事医学科学院卫生学环境医学研究所 一种聚甲基丙烯酸甲酯材料微流控芯片加工技术方法
JP2016534008A (ja) * 2013-08-07 2016-11-04 トルンプフ レーザー− ウント ジュステームテヒニク ゲゼルシャフト ミット ベシュレンクテル ハフツングＴＲＵＭＰＦ Ｌａｓｅｒ− ｕｎｄ Ｓｙｓｔｅｍｔｅｃｈｎｉｋ ＧｍｂＨ 透明の、ガラス状の、ガラス質の、セラミックのかつ／又は結晶質の層を有する板状のワークピースを加工する方法、並びにこのようなワークピース用の分離装置、並びにこのようなワークピースから成る製品
US10293436B2 (en) * 2013-12-17 2019-05-21 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US20150243559A1 (en) * 2014-02-27 2015-08-27 Jungrae Park Hybrid wafer dicing approach using temporally-controlled laser scribing process and plasma etch
JP6383977B2 (ja) * 2014-06-27 2018-09-05 Ａｇｃ株式会社 ガラス基板の切断方法
US10082333B2 (en) 2014-07-02 2018-09-25 Praxair Technology, Inc. Argon condensation system and method
WO2016010949A1 (en) 2014-07-14 2016-01-21 Corning Incorporated Method and system for forming perforations
KR20180048891A (ko) 2015-08-31 2018-05-10 닛본 이따 가라스 가부시끼가이샤 미세 구조를 갖는 유리의 제조 방법
TW201831414A (zh) * 2016-12-13 2018-09-01 美商康寧公司 藉由形成劃痕線來雷射處理透明工件的方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6709881B2 (en) * 2000-11-28 2004-03-23 Matsushita Electric Industrial Co., Ltd. Method for manufacturing semiconductor and method for manufacturing semiconductor device
CN1819878A (zh) * 2003-07-08 2006-08-16 光谱技术有限公司 激光从基底去除层或涂层
CN102468153A (zh) * 2010-10-29 2012-05-23 株式会社电装 半导体器件的制造方法
WO2014161534A2 (de) * 2013-04-04 2014-10-09 Lpkf Laser & Electronics Ag Verfahren und vorrichtung zum einbringen von durchbrechungen in ein substrat sowie ein derart hergestelltes substrat
WO2016010954A2 (en) * 2014-07-14 2016-01-21 Corning Incorporated Systems and methods for processing transparent materials using adjustable laser beam focal lines

Also Published As

Publication number Publication date
KR102260931B1 (ko) 2021-06-04
JP7538175B2 (ja) 2024-08-21
JP2022116133A (ja) 2022-08-09
CN110545948A (zh) 2019-12-06
WO2018210484A1 (de) 2018-11-22
US11065716B2 (en) 2021-07-20
KR20190132461A (ko) 2019-11-27
EP3624982A1 (de) 2020-03-25
JP7396899B2 (ja) 2023-12-12
JP2020517570A (ja) 2020-06-18
US20200180068A1 (en) 2020-06-11

Similar Documents

Publication Publication Date Title
CN110545948B (zh) 借助激光诱导的深度蚀刻来加工、尤其分割基板的方法
KR102356415B1 (ko) 전자기 방사선과 후속 에칭공정을 이용해 재료 안으로 적어도 하나의 리세스를 도입하기 위한 방법
CN104308368B (zh) 多脉冲激光烧蚀金属覆层定量去除方法
WO1999010922A1 (de) Verfahren zum anisotropen ätzen von silizium
KR102481312B1 (ko) 기술적 마스크를 제조하기 위한 방법
CN115697625A (zh) 用于在基材中开设凹部的方法
US20150309474A1 (en) Process for manufacturing a strengthened timepiece component and corresponding timepiece component and timepiece
TW200512791A (en) Etching method
EP1696477A3 (de) Verfahren zur Herstellung von sublithographischen Strukturen
JP2020517570A5 (https=)
JP2018207109A5 (https=)
CN112222630A (zh) 激光加工方法
Friedrich et al. Precision structuring and functionalization of ceramics with ultra-short laser pulses
JP6751274B2 (ja) 圧電素子の製造方法
US11020108B2 (en) Needle with rounded edge
US6398943B1 (en) Process for producing a porous layer by an electrochemical etching process
WO2007009129A3 (en) Method for forming an etched soft edge metal foil and the product thereof
JP2008056544A (ja) 微細な直線溝を有するガラス板の製造方法及びガラス板
CA2514265A1 (en) Stencil manufacture
Baskevicius et al. Optimization of Laser-Ablation Micromachining by Choice of Scanning Algorithms and Use of Laser-Induced-Breakdown Spectroscopy
IL313221A (en) Coating dielectric surfaces with patterned metal layer
CN102172108A (zh) 用于处理面状物品表面的方法、面状物品以及应用
KR20060100144A (ko) 박막 형성 방법 및 이를 위한 장치
KR20190024067A (ko) 레이저 식각을 이용한 rf 필터 제조방법
TW201720934A (zh) 微篩網的製程方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20250327

Address after: Room 613-3, No. 1615 Cao'an Road, Zhenxin Street, Jiading District, Shanghai, 201800

Patentee after: Lepuke (Shanghai) Optoelectronics Co.,Ltd.

Country or region after: China

Address before: Galbsen, Germany

Patentee before: LPKF LASER & ELECTRONICS AG

Country or region before: Germany