CN110544635A - 压接方法以及压接装置 - Google Patents

压接方法以及压接装置 Download PDF

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Publication number
CN110544635A
CN110544635A CN201910331476.6A CN201910331476A CN110544635A CN 110544635 A CN110544635 A CN 110544635A CN 201910331476 A CN201910331476 A CN 201910331476A CN 110544635 A CN110544635 A CN 110544635A
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CN
China
Prior art keywords
substrate
pressure
holding
suction
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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CN201910331476.6A
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English (en)
Chinese (zh)
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CN110544635B (zh
Inventor
辻泽孝文
山田真五
松尾畅也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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Publication of CN110544635A publication Critical patent/CN110544635A/zh
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Publication of CN110544635B publication Critical patent/CN110544635B/zh
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)
CN201910331476.6A 2018-05-29 2019-04-23 压接方法以及压接装置 Active CN110544635B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-102424 2018-05-29
JP2018102424A JP7129645B2 (ja) 2018-05-29 2018-05-29 圧着方法および圧着装置

Publications (2)

Publication Number Publication Date
CN110544635A true CN110544635A (zh) 2019-12-06
CN110544635B CN110544635B (zh) 2024-08-30

Family

ID=68702687

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910331476.6A Active CN110544635B (zh) 2018-05-29 2019-04-23 压接方法以及压接装置

Country Status (2)

Country Link
JP (1) JP7129645B2 (ja)
CN (1) CN110544635B (ja)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010171088A (ja) * 2009-01-20 2010-08-05 Panasonic Corp 圧着装置及び圧着方法
JP2011165702A (ja) * 2010-02-04 2011-08-25 Shibaura Mechatronics Corp 電子部品の実装装置及び実装方法
JP2014041890A (ja) * 2012-08-22 2014-03-06 Panasonic Corp 部品実装装置及び部品実装方法
US20160113164A1 (en) * 2014-10-20 2016-04-21 Panasonic Intellectual Property Management Co., Ltd. Component crimping apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010171088A (ja) * 2009-01-20 2010-08-05 Panasonic Corp 圧着装置及び圧着方法
JP2011165702A (ja) * 2010-02-04 2011-08-25 Shibaura Mechatronics Corp 電子部品の実装装置及び実装方法
JP2014041890A (ja) * 2012-08-22 2014-03-06 Panasonic Corp 部品実装装置及び部品実装方法
US20160113164A1 (en) * 2014-10-20 2016-04-21 Panasonic Intellectual Property Management Co., Ltd. Component crimping apparatus

Also Published As

Publication number Publication date
JP7129645B2 (ja) 2022-09-02
JP2019207939A (ja) 2019-12-05
CN110544635B (zh) 2024-08-30

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