CN110531586B

CN110531586B - Detection apparatus, lithographic apparatus, and article manufacturing method

Info

Publication number: CN110531586B
Application number: CN201910416179.1A
Authority: CN
Inventors: 松田光一郎
Original assignee: Canon Inc
Current assignee: Canon Inc
Priority date: 2018-05-23
Filing date: 2019-05-20
Publication date: 2022-07-29
Anticipated expiration: 2039-05-20
Also published as: KR102526946B1; JP7138479B2; JP2019203991A; CN110531586A; KR20190133599A

Abstract

The invention relates to a detection apparatus, a lithographic apparatus and an article manufacturing method. A detection device for detecting the position of a side surface of a substrate is provided with: a sensor including a light irradiation section and a light detection section; and a processor that processes the signal output from the sensor, wherein the light irradiation section irradiates light to a side surface of the substrate, and the light detection section detects the light from the side surface, and the processor determines a position of the side surface of the substrate based on a 1 st signal output from the light detection section in a state where the substrate is present and a 2 nd signal output from the light detection section in a state where the substrate is absent.

Description

Detection apparatus, lithographic apparatus, and article manufacturing method

Technical Field

The invention relates to a detection apparatus, a lithographic apparatus and an article manufacturing method.

Background

In a lithography apparatus such as an exposure apparatus and an imprint apparatus that transfer a pattern onto a substrate, the position of a side surface (edge) of the substrate can be detected. The position of the side of the substrate can be used, for example, to pre-align the substrate. The pre-alignment is, for example, an operation of acquiring positional information of the substrate so that a mark provided on the substrate is brought into a field of view of an alignment Scope (Scope) or driving the substrate so that the mark is brought into the field of view of the alignment Scope based on the positional information. Patent document 1 describes a lithographic apparatus including: an illumination unit configured to emit light to a side surface of the substrate; and a detection unit disposed below the side surface of the substrate and having a processing unit for determining the position of the side surface of the substrate based on the detection result of the detection unit.

Documents of the prior art

Patent document 1: japanese patent laid-open publication No. 2017-116868

Disclosure of Invention

Various structures may be present on the substrate or the chuck holding the substrate. Alternatively, the chuck holding the substrate may be positioned under various structures. If the structure is located on the substrate, light may also enter the structure when the light enters the side surface of the substrate, and the reflected light from the structure may enter the detection unit. In this case, there is a possibility that the side surface of the substrate cannot be accurately detected.

The present invention has been made in view of the above-described recognition of the problems, and an object thereof is to provide a technique advantageous for accurately measuring the position of the side surface of the substrate.

The 1 st aspect of the present invention relates to a detection device for detecting a position of a side surface of a substrate, the detection device including: a sensor including a light irradiation section and a light detection section; and a processor that processes the signal output from the sensor, wherein the light irradiation section irradiates light to a side surface of the substrate, and the light detection section detects the light from the side surface, and the processor determines a position of the side surface of the substrate based on a 1 st signal output from the light detection section in a state where the substrate is present and a 2 nd signal output from the light detection section in a state where the substrate is absent.

The invention according to claim 2 is directed to a lithographic apparatus for transferring a pattern onto a substrate, the lithographic apparatus comprising a substrate positioning mechanism including a substrate holding portion for holding the substrate and a driving mechanism for driving the substrate holding portion, and the detection device according to claim 1, wherein the sensor of the detection device is attached to the substrate holding portion.

The 3 rd aspect of the present invention relates to an article manufacturing method including a step of transferring a pattern onto a substrate by the lithography apparatus according to the 2 nd aspect, and a step of performing a process on the substrate on which the pattern is transferred, and manufacturing an article from the substrate on which the process is completed.

The 4 th aspect of the present invention relates to a detection device for detecting a position of a side surface of a substrate, the detection device including: a sensor including a light irradiation section and a light detection section; and a processor for processing the signal output from the sensor, wherein the light irradiation unit irradiates light to a side surface of the substrate, the light detection unit detects the light from the side surface, and the processor determines a position of the side surface of the substrate based on a waveform of the signal output from the light detection unit and a reference waveform registered in advance.

The invention according to claim 5 is directed to a lithographic apparatus for transferring a pattern onto a substrate, the lithographic apparatus comprising a substrate positioning mechanism including a substrate holding portion for holding the substrate and a driving mechanism for driving the substrate holding portion, and the detection device according to claim 4, wherein the sensor of the detection device is attached to the substrate holding portion.

The 6 th aspect of the present invention relates to an article manufacturing method including a step of transferring a pattern onto a substrate by the lithography apparatus according to the 5 th aspect, and a step of performing a process on the substrate to which the pattern has been transferred, and manufacturing an article from the substrate on which the process has been completed.

According to the present invention, a technique advantageous for measuring the position of the side surface of the substrate with high accuracy is provided.

Drawings

FIG. 1 is a diagram showing a structure of a lithographic apparatus according to an embodiment of the present invention.

Fig. 2 is a diagram showing an example of the arrangement of the sensors.

Fig. 3 is a diagram showing a configuration example of the sensor.

Fig. 4 is a diagram for explaining the possibility that the structure may affect the detection of the position of the side surface of the substrate.

Fig. 5 is a diagram for explaining the preprocessing.

Fig. 6 is a diagram illustrating a signal output from a sensor (light detection unit).

Fig. 7 is a diagram showing a flow of preparation processing in embodiment 1.

Fig. 8 is a diagram showing a flow of substrate processing according to embodiment 1.

Fig. 9 is a diagram showing a flow (a) of the preparation process of embodiment 2 and a flow (b) of the substrate process of embodiment 2.

Fig. 10 is a diagram illustrating waveforms.

(description of reference numerals)

100: a lithographic apparatus; 1: original edition; 5; a substrate; 10: a sensor; 40: a processor; and LI: a light irradiation section; DET: a light detection unit; 12: a structure.

Detailed Description

The present invention will be described below according to exemplary embodiments thereof with reference to the accompanying drawings.

FIG. 1 schematically depicts a structure of a lithographic apparatus 100 according to embodiment 1 of the invention. The lithography apparatus 100 is configured to transfer the pattern of the original plate 1 onto the substrate 5. When the lithography apparatus 100 is configured as a projection exposure apparatus, the pattern of the original plate 1 may be projected onto a photosensitive material coated or disposed on the substrate 5, and the pattern may be transferred to form a latent image on the photosensitive material. Such a latent image can be converted into a physical pattern (resist pattern) by development with a developing device. Alternatively, when the lithography apparatus 100 is configured as an imprint apparatus, the pattern can be transferred by imprinting. The imprinting may be a process of curing the imprint material disposed on the substrate 5 while the pattern portion of the original plate is in contact with the imprint material, and then separating the cured imprint material from the pattern portion. The lithography apparatus 100 may include a detection device 50 (detection means) for detecting the position of the side surface of the substrate 5. The inspection apparatus 50 may be used without being incorporated into the lithography apparatus 100, or may be incorporated into another apparatus (e.g., an apparatus for transferring a substrate).

An example in which the lithography apparatus 100 is configured as a projection exposure apparatus is described below. Here, the direction is defined by an XYZ coordinate system with the horizontal plane as an XY plane. The substrate 5 can be held in a posture in which the surface thereof is parallel to the XY plane. The lithographic apparatus 100 may include an illumination system 3, a master positioning mechanism 2, a projection optical system 4, a substrate positioning mechanism 30, a measuring instrument 9, a detection device 50, and a control unit 90. The illumination system 3 illuminates the original plate 1 with exposure light. The original plate positioning mechanism 2 holds and positions the original plate 1. The projection optical system 4 projects the pattern of the original plate 1 onto the substrate 5. The projection optical system 4 is supported by a support member 13. The structure 12 can be disposed at a position where the substrate 5 held by the substrate holding portion 31 of the substrate positioning mechanism 30 can face. The structure 12 can be supported by the support member 13. The structure 12 may include, for example, at least 1 of a measuring instrument, a member for holding the measuring instrument, and a correction mechanism for correcting the optical characteristics of the projection optical system 4.

The substrate positioning mechanism 30 may include: a substrate holding unit 31 for holding the substrate 5; and a drive mechanism 32 for driving or positioning the substrate 5 by driving or positioning the substrate holding portion 31. The substrate holding section 31 may include a substrate chuck 6 and a mounting table 7 holding the substrate chuck 6. Although the drive mechanism 32 is shown in fig. 1 for simplicity, the drive mechanism 32 can include: a guide mechanism for guiding the substrate holder 31; and an actuator that drives the substrate holding portion 31. The substrate positioning mechanism 30 can position the substrate 5 about 6 axes, for example, an X axis, a Y axis, a Z axis, rotation about the X axis, rotation about the Y axis, and rotation about the Z axis. The position of the substrate holding portion 31 can be measured by the measuring instrument 9. The measuring instrument 9 is, for example, a laser interferometer, and can measure the position of the substrate holding portion 31 using the mirror 8 provided in the substrate holding portion 31. The control unit 90 controls the illumination system 3, the original plate positioning mechanism 2, the projection optical system 4, the substrate positioning mechanism 30, the measuring instrument 9, and the detection device 50. The control unit 90 may be constituted by, for example, PLD (Programmable Logic Device) such as FPGA (Field Programmable Gate Array), ASIC (Application Specific Integrated Circuit), general-purpose or special-purpose computer with a program embedded therein, or a combination of all or a part of them.

The detection device 50 can include a processor 40 and 1 or more sensors 10. The processor 40 processes signals output from 1 or more sensors 10. In this example, the processor 40 is configured as a part of the control unit 90, and a main control unit (not shown) of the control unit 90 operates the processor 40 as necessary. However, the processor 40 may be configured independently of the control unit 90. In addition, the processor 40 may be provided for each sensor 10, or may be provided for all the sensors 10 in common. Further, a part of the functions of the processor 40 may be embedded in the control unit 90, and the other part may be configured as a separate body from the control unit 90.

For example, 1 or a plurality of sensors 10 can be mounted on the substrate holding portion 31. Fig. 2 shows an example in which 3 sensors 10 are mounted on the substrate holding portion 31. The processor 40 can detect the positions of 1 or more portions in the side surface (edge) of the substrate 5 by processing the signals output from the 1 or more sensors 10. The processor 40 can detect a placement error (relative position and relative posture) of the substrate 5 with respect to the substrate holding portion 31 by processing signals output from the plurality of sensors 10. The placement errors can include errors relating to the X-axis direction, the Y-axis direction, and rotation about the Z-axis.

Fig. 3 illustrates the structure of the sensor 10. The sensor 10 can include a light irradiation section LI and a light detection section DET. The light irradiation section LI irradiates the side surface 5s of the substrate 5 with light 24, and the light detection section DET detects light 19 from the side surface 5s of the substrate 5. The processor 40 can detect the position of the side surface 5s of the substrate 5 based on the 1 st signal output from the light detection section DET in the state where the substrate 5 is present and the 2 nd signal output from the light detection section DET in the state where the substrate 5 is not present. That is, the processor 40 or the detection device 50 detects the position of the side surface 5s of the substrate 5 based on the 1 st signal and the 2 nd signal.

The light irradiation section LI may include, for example, a light source 11 and an optical system 14. The optical system 14 may comprise, for example, a mirror. In one example, the light source 11 is capable of generating light 24 in a wavelength range of 500nm or more and 1200nm or less. The light 24 emitted from the light source 11 is irradiated to the side surface 5s of the substrate 5 via the optical system 14. The direction of the light 24 incident on the side face 5s of the substrate 5 is typically parallel to the surface (upper surface) of the substrate 5, but may be non-parallel. The light 24 is reflected by the side surface 5s of the substrate 5, and reflected light (possibly including scattered light) is generated. The light 19 as a part of the reflected light enters the light detection section DET. The light detection section DET can include an optical system 15 and a photoelectric conversion section 17. The optical system 15 can include, for example, 1 or more lenses. The photoelectric conversion unit 17 may include, for example, a two-dimensional image sensor or a one-dimensional image sensor (line sensor). In the case of using a one-dimensional image sensor, the arrangement direction of the pixels is preferably a direction orthogonal to the side surface 5s of the substrate 5 when the substrate 5 is arranged in an ideal state. The photoelectric conversion unit 17 detects a light intensity distribution (image) formed on the imaging surface thereof as an electric signal, and sends the electric signal to the processor 40. The waveform of the electric signal indicates the light intensity distribution formed on the imaging surface of the photoelectric conversion unit 17, and includes information indicating the position of the side surface 5S of the substrate S.

As illustrated in fig. 4, the light 24 from the light irradiation section LI may be reflected at an object different from the substrate 5, for example, the structure 12, and the light 20 from the structure 12 may enter the light detection section DET. In such a case, if the light 19 from the side surface 5s of the substrate 5 and the light 20 from the structure 12 cannot be distinguished, the position of the side surface 5s of the substrate 5 may be erroneously detected. The relative position between the substrate holding portion 31 (substrate 5) and the structure 12 is changed by driving the substrate holding portion 31 (substrate 5) by the driving mechanism 32. When the substrate holder 31 (substrate 5) is disposed at a specific position, the light 20 from the structure 12 may enter the light detector DET. However, in an extreme case, the light 20 from the structure 12 may enter the light detection unit DET regardless of the position of the substrate holding unit 31 (substrate 5) within the movable region.

As a countermeasure for such a problem, it is conceivable to reduce the sectional size of the light 24 generated by the light irradiation unit LI (that is, to reduce the width of the light beam). However, such countermeasures are limited. For example, the thickness of the substrate 5 to be processed is not constant in many cases (for example, 0.3 to 1.0 mm). In addition, the substrate 5 may be warped. In addition, it may be required to dispose the surface of the substrate 5 and the structure 12 close to each other. In addition, in order to allow for an arrangement error when arranging the substrate 5 on the substrate chuck 6, a corresponding space (for example, 10mm) may be provided between the optical system 14 and the substrate chuck 6. For the above reasons, it is difficult to solve the above problem by reducing the width of the light beam.

Therefore, in the present embodiment, as described above, the processor 40 obtains the position of the side surface 5s of the substrate 5 from the 1 st signal output from the light detection section DET in the state where the substrate 5 is present and the 2 nd signal output from the light detection section DET in the state where the substrate 5 is not present. Fig. 4 schematically shows a case where the detection operation is performed by the sensor 10 in a state where the substrate 5 is present, and the 1 st signal is detected by the light detection unit DET. Fig. 5 schematically shows a case where the detection operation is performed by the sensor 10 in a state where the substrate 5 is not present, and the 2 nd signal is detected by the light detection unit DET.

Fig. 6 (a) illustrates a signal (output signal from the light detection unit DET) detected by the light detection unit DET when light from an object different from the substrate 5 is not incident on the light detection unit DET in a state where the substrate 5 is present. The waveform of the signal shown in fig. 6 (a) includes information a indicating the position of the side surface 5s of the substrate 5. Fig. 6 (b) shows an example of a signal (output signal from the light detection unit DET) (1 st signal) detected by the light detection unit DET when light from the substrate 5 and the structure 12 enters the light detection unit DET in a state where the substrate 5 is present. The waveform of the signal shown in fig. 6 (B) includes, in addition to the information a indicating the position of the side surface 5s of the substrate 5, the false information B based on the light from the structure 12. Fig. 6 (c) shows an example of a signal (output signal from the light detection unit DET) (2 nd signal) detected by the light detection unit DET when light from the structure 12 enters the light detection unit DET in a state where the substrate 5 is not present. The waveform of the signal shown in fig. 6 (c) includes not information a indicating the position of the side surface 5s of the substrate 5 but false information B based on the light from the structure 12. Here, fig. 6 (b) and 6 (c) show signals detected by the light detection unit DET in a state where the substrate holding unit 31 (substrate 5) is disposed at the same position. That is, fig. 6 (b) and 6 (c) differ only in the presence or absence of the substrate 5.

As is apparent from fig. 6 (b) and 6 (c), the processor 40 can determine the position of the side surface 5s of the substrate 5 from the 1 st signal shown in fig. 6 (b) and the 2 nd signal shown in fig. 6 (c) without being spoofed by light from the structure 12. Specifically, for example, the processor 40 removes or reduces the information B, which is the influence of light from the structure 12, by subtracting the 2 nd signal shown in fig. 6 (c) from the 1 st signal shown in fig. 6 (B). Then, the processor 40 can determine the position of the side surface 5s of the substrate 5 from the information a based on the light from the side surface 5s of the substrate 5 based on the signal obtained by subtracting the 2 nd signal from the 1 st signal. The 2 nd signal can also be understood as a correction signal for correcting the 1 st signal.

The preprocessing for acquiring the 2 nd signal (correction signal) will be described below with reference to fig. 7. The preprocessing is controlled by the control section 90. As illustrated in fig. 5, the pretreatment is performed in a state where the substrate 5 is not disposed on the substrate holding portion 31. In step S601, the control unit 90 controls the drive mechanism 32 so that the substrate holding unit 31 is positioned at 1 signal acquisition position selected from the plurality of signal acquisition positions. In step S602, the processor 40 of the control unit 90 causes the detection device 50 to execute the detection operation to acquire the 2 nd signal (correction signal). In this detection operation, the light irradiation unit LI emits light and the light detection unit DET detects light in the detection device 50. At this time, since the substrate 5 is not disposed on the substrate holding portion 31, the light from the substrate 5 does not enter the light detection portion DET. On the other hand, when the structure 12 exists in the vicinity of the sensor 10 of the detection device 50, there is a possibility that the light emitted from the light irradiation section LI and reflected by the structure 12 enters the light detection section DET. The signal detected by the sensor 10 (light detection section DET) in this detection operation is the 2 nd signal (correction signal). The processor 40 of the control unit 90 stores the 2 nd signal (correction signal) supplied from the sensor 10 in the memory 91 in association with the position at which the substrate holding unit 31 is positioned in step S601.

In step S603, the processor 40 of the control unit 90 determines whether or not steps S601 and S602 have been performed for all of the plurality of signal acquisition positions, and if there are signal acquisition positions that have not yet been performed, steps S601 and S602 are performed for the signal acquisition positions. When steps S601 and S602 have been performed for all of the plurality of signal acquisition positions, the control unit 90 ends the preprocessing.

As described above, the processor 40 performs the operation of acquiring, as the 2 nd signal, the signal output from the light detection section DET in the state where the substrate 5 is not held by the substrate holding section 31 and the substrate holding section 31 is disposed at the signal acquisition position, for the plurality of signal acquisition positions. Thereby, the processor 40 acquires the plurality of 2 nd signals corresponding to the plurality of signal acquisition positions, respectively.

Hereinafter, a substrate process for transferring a pattern to the substrate 5 will be described with reference to fig. 8. The substrate processing is controlled by the control section 90. The substrate processing includes detection processing for detecting the position of the side surface S of the substrate 5 (arrangement error of the substrate 5) by using the detection device 50. In step S701, the controller 90 controls a conveyance mechanism (not shown) so as to dispose (load) the substrate 5 on the substrate holder 31. The substrate 5 may be placed (loaded) on the substrate holding portion 31 by the controller 90 allowing the transfer mechanism to transfer the substrate 5.

In step S702, the control unit 90 controls the drive mechanism 32 so that the substrate holding unit 31 holding the substrate 5 is positioned at the detection position specified by the control information (format file) for controlling the substrate processing. In step S703, the processor 40 of the control unit 90 causes the detection device 50 to execute a detection operation to acquire the 1 st signal. In this detection operation, the detection device 50 causes the light irradiation unit LI to emit light and causes the light detection unit DET to detect light. At this time, since the substrate 5 is disposed on the substrate holding portion 31, the light from the substrate 5 enters the light detection portion DET. In addition, when the structure 12 exists in the vicinity of the sensor 10 of the detection device 50, the light emitted from the light irradiation unit LI and reflected by the structure 12 may enter the light detection unit DET.

In step S704, the processor 40 of the control unit 90 loads the 2 nd signal acquired at the same position as the detection position or a position near the detection position in the preparation process from the memory 91. The position in the vicinity of the detection position may be, for example, a signal acquisition position closest to the detection position among a plurality of signal acquisition positions in the preparation process. In step S705, the processor 40 of the control unit 90 subtracts the 2 nd signal loaded in step S704 from the 1 st signal acquired in step S703, thereby removing or reducing the information B that is the influence of the light from the structure 12. Then, the processor 40 obtains the position of the side surface 5s of the substrate 5 from the information a based on the light from the side surface 5s of the substrate 5 based on the signal obtained by subtracting the 2 nd signal from the 1 st signal. This processing corresponds to processing for subtracting the 2 nd signal shown in fig. 6 (c) from the 1 st signal shown in fig. 6 (B) to remove or reduce information B that is the influence of light from the structure 12, and obtaining the position of the side surface 5s of the substrate 5 from information a based on light from the side surface 5s of the substrate 5. In other words, the processor 40 can be configured to determine the position of the side surface 5s of the substrate 5 from a signal obtained by removing a component specified by the waveform of the 2 nd signal from the waveform of the 1 st signal.

Here, the 1 st signal and the 2 nd signal generally contain a noise component. Therefore, it is preferable to prevent erroneous detection due to the noise component. As a method for preventing false detection, for example, a method of subtracting a value obtained by multiplying the 2 nd signal by a predetermined multiple (a positive value larger than 1) from the 1 st signal is known. This corresponds to a signal obtained by subtracting the waveform of the portion of the 2 nd signal shown in fig. 6 (c) in which the information B is larger than it is actually from the 1 st signal shown in fig. 6 (B). In this case, the portion indicating a negative value in the subtraction result may be ignored (i.e., excluded from the detection target on the side surface 5s of the substrate 5).

In step S702, the substrate holding unit 31 may be positioned so that the 2 nd signal is corrected and used when the detection position for acquiring the 1 st signal in step S703 is offset from the signal acquisition position for acquiring the 2 nd signal loaded in step S704. Specifically, a signal obtained by shifting the waveform of the portion of the information B in the 2 nd signal shown in fig. 6 (c) by the amount of the shift may be subtracted from the 1 st signal shown in fig. 6 (B). In the case where a plurality of sensors 10 are provided as illustrated in fig. 2, the control unit 90 can detect an arrangement error of the substrate 5 based on signals output from the plurality of sensors 10. Alternatively, the control unit 90 may limit the detection position to any of a plurality of signal acquisition positions.

In step S706, the control unit 90 controls the drive mechanism 32 based on the arrangement error of the substrate 5 detected in step S705, thereby positioning the substrate 5 so that the mark of the substrate 5 enters the field of view of the alignment scope, not shown. Then, the control section 90 detects the position of the mark of the substrate 5 using the alignment viewer. The substrate 5 has a plurality of marks whose positions can be detected. In step S707, the control unit 90 controls the transfer of the pattern onto the substrate 5 while controlling the positioning of the substrate 5 by the drive mechanism 32 based on the detection result in step S706. In step S708, the controller 90 controls a conveyance mechanism (not shown) so as to remove (detach) the substrate 5 from the substrate holding unit 31. The control unit 90 may allow the conveyance mechanism to convey the substrate 5, thereby removing (detaching) the substrate 5 from the substrate holding unit 31.

In the case where the detection position is fixedly determined, the preparation process shown in fig. 7 may be carried out only for the detection position. Alternatively, when the detection position is fixedly determined, in the substrate processing shown in fig. 7, in a state where the substrate holding portion 31 is positioned at the detection position, a preparation process may be performed for the detection position before the substrate is loaded.

Embodiment 2 of the present invention will be described below. Matters not mentioned as embodiment 2 may be according to embodiment 1. In embodiment 2, the processor 40 detects the position of the side surface 5s of the substrate 5 based on the waveform of the signal output from the light detection section DET in the detection process and a reference waveform registered in advance. More specifically, the processor 40 may be configured to perform a process of determining the position of the side surface 5s of the substrate 5 from a portion of the waveform of the signal output from the light detection unit DET in the detection process, the portion having a correlation with the reference waveform higher than the reference value. The processor 40 may be configured to exclude from the target of the detection process a portion of the waveform of the signal output from the light detection unit DET, the portion having a correlation with the reference waveform lower than the reference value.

The substrate 5 may be made of a material having a low reflectance (e.g., glass), and the structure 12 may have a reflectance higher than that of the substrate 5. In this case, the waveform (for example, the area and the maximum value of the waveform) of the above-described false information B may be larger than the waveform of the information a indicating the position of the side surface 5s of the substrate 5. Since the substrates 5 used in the same job or the same process are generally the same in thickness and chamfering amount, the waveform of the information a indicating the position of the side surface 5s of the substrate 5 has high correlation among the plurality of substrates 5. The 2 nd embodiment is an embodiment in which such characteristics are taken into consideration.

The correlation between the waveform of the signal output from the light detection section DET and the reference waveform in the detection process can be evaluated based on a correlation function. The correlation function may be a function for calculating an inner product of a signal value group indicating a waveform of the signal output from the light detection unit DET and a signal value group of the reference waveform, for example. Alternatively, more simply, the correlation between the waveform of the signal output from the light detection unit DET and the reference waveform in the detection process may be performed by comparing at least one of the peak value and the half-value width of the both as an evaluation item (parameter). The evaluation method of the correlation or the parameter used for the evaluation may be set for each task or process.

Next, preprocessing for acquiring a reference waveform will be described with reference to fig. 9 (a). The preprocessing is controlled by the control section 90. The pretreatment can be performed in a state where the substrate 5 having the same specification as that of the substrate 5 used in a task or process to be performed by the substrate treatment described later is placed on the substrate holding portion 31. In step S901, the control unit 90 controls the drive mechanism 32 so as to position the substrate holding unit 31 at the signal acquisition position. The signal acquisition position is preferably a position at which light from an object other than the substrate 5 does not enter the light detection unit DET. In step S902, the processor 40 of the control unit 90 causes the detection device 50 to execute the detection operation to acquire the 2 nd signal (correction signal) and register (store) the acquired signal in the memory 91. Fig. 10 (a) shows an example of the reference waveform R obtained in step S902.

Hereinafter, a substrate process for transferring a pattern to the substrate 5 will be described with reference to fig. 9 (b). The substrate processing is controlled by the control unit 90. The substrate processing includes processing for detecting the position of the side surface S of the substrate 5 (arrangement error of the substrate 5) by using the detection device 50. In step S1001, the controller 90 controls a conveyance mechanism (not shown) so that the substrate 5 is placed (loaded) on the substrate holder 31. The substrate 5 may be placed (loaded) on the substrate holding portion 31 by the controller 90 allowing the transfer mechanism to transfer the substrate 5.

In step S1002, the processor 40 of the control section 90 controls the drive mechanism 32 so that the substrate holding section 31 holding the substrate 5 is positioned at the detection position specified by the control information (format file) for controlling the substrate processing. In step S1003, the processor 40 of the control unit 90 causes the sensor 10 to execute a detection operation to acquire a signal. In this detection operation, the light irradiation unit LI emits light and the light detection unit DET detects light in the sensor 10. At this time, since the substrate 5 is disposed on the substrate holding portion 31, the light from the substrate 5 enters the light detection portion DET. In addition, when the structure 12 exists in the vicinity of the sensor 10 of the detection device 50, the light emitted from the light irradiation unit LI and reflected by the structure 12 may enter the light detection unit DET. Fig. 10 (b) shows an example of the waveform of the signal that can be acquired by the detection device 50 in step S1002.

In step S1004, the processor 40 of the control section 90 detects the position of the side surface 5S of the substrate 5 based on the waveform of the signal acquired in step S1002 and the reference waveform R registered in advance in the preparation process shown in fig. 9 (a). More specifically, the processor 40 may be configured to perform a process of determining the position of the side surface 5s of the substrate 5 from a portion of the waveform of the signal output from the light detection unit DET in the detection process, the portion having a correlation with the reference waveform R higher than a reference value. The processor 40 is configured to exclude from the target of the detection process a portion of the waveform of the signal output from the light detection unit DET during the detection process, the portion having a correlation with the reference waveform lower than the reference value. In the example of fig. 10 (b), the waveform of the portion of the information a indicating the position of the side surface 5s of the substrate 5 is a portion having a correlation with the reference waveform R higher than the reference value. Therefore, the processor 40 can perform processing for determining the position of the side surface 5s of the substrate 5 from the portion of the information a having a correlation with the reference waveform R higher than the reference value in the waveform of the signal output from the light detection section DET. In the example of fig. 10 (B), the waveform of the portion of the pseudo information B based on the light from the structure 12 is a portion of which the correlation with the reference waveform R is lower than the reference value. Therefore, a portion of the waveform of the signal output from the light detection unit DET, which has a correlation with the reference waveform R lower than the reference value, is excluded from the target of the detection process. Fig. 10 (c) illustrates waveforms in which, from among waveforms of signals output from the light detection unit DET, a portion having a correlation with the reference waveform R lower than the reference value is excluded from the target of the detection process.

Steps S1005, S1006, and S1007 are the same as steps S706, S707, and S708 in fig. 7.

An article manufacturing method for manufacturing an article using a patterning device typified by the lithography device 100 of embodiment 1 or 2 will be described below. The article manufacturing method includes, for example, a step of transferring a pattern onto a substrate by the lithography apparatus 100 and a step of performing a process on the substrate to which the pattern has been transferred, and manufactures an article from the substrate on which the process has been completed. The processing may include, for example, processing of forming a physical pattern by developing the pattern when the pattern is a latent image, and processing of processing the substrate using the physical pattern (for example, processing of etching, processing of implanting ions). The treatment may include, for example, a treatment (for example, an etching treatment or an ion implantation treatment) of treating the substrate with the pattern when the pattern is a pattern formed of a hardened material of the imprint material. The article may be any of a display device such as a liquid crystal display device, a flash memory, a memory device such as a DRAM, an image pickup device, a signal processing device, a MEMS, and the like, for example.

Claims

1. A detection device that detects a position of a side surface of a substrate, the detection device comprising:

A sensor including a light irradiation section and a light detection section; and

a processor that processes signals output from the sensors,

the light irradiation unit irradiates light to a side surface of the substrate, and the light detection unit detects light from the side surface,

the processor obtains the position of the side surface of the substrate based on a 1 st signal output from the light detection unit in a state where the substrate is present and a 2 nd signal output from the light detection unit in a state where the substrate is not present.

2. The detection apparatus according to claim 1,

the substrate is positioned by a substrate positioning mechanism including a substrate holding portion that holds the substrate and a driving mechanism that drives the substrate holding portion,

the sensor is attached to the substrate holding portion.

3. The detection apparatus according to claim 2,

the processor acquires a signal output from the light detection section in a state where the substrate is not held by the substrate holding section and the substrate holding section is arranged at a signal acquisition position as the 2 nd signal,

the processor acquires, as the 1 st signal, a signal output from the light detection unit in a state where the substrate is held by the substrate holding unit and the substrate holding unit is arranged at the signal acquisition position or a position near the signal acquisition position, and obtains the position of the side surface of the substrate from the 1 st signal and the 2 nd signal.

4. The detection apparatus according to claim 2,

the processor executes an operation of acquiring, as the 2 nd signal, a signal output from the photodetection unit in a state where the substrate is not held by the substrate holding unit and the substrate holding unit is arranged at a signal acquisition position, for a plurality of signal acquisition positions, and thereby acquires a plurality of 2 nd signals corresponding to the plurality of signal acquisition positions, respectively,

the processor acquires, as the 1 st signal, a signal output from the light detection unit in a state where the substrate is held by the substrate holding unit and the substrate holding unit is arranged at a detection position, and obtains the position of the side surface of the substrate from the 1 st signal and a 2 nd signal corresponding to the detection position or a position in the vicinity thereof among the plurality of 2 nd signals.

5. The detection apparatus according to claim 1,

the processor obtains the position of the side surface of the substrate from a signal obtained by removing a component specified by the waveform of the 2 nd signal from the waveform of the 1 st signal.

6. The detection apparatus according to claim 1,

The 2 nd signal is a signal generated by light from an object different from the substrate.

7. A lithographic apparatus for transferring a pattern onto a substrate, comprising:

a substrate positioning mechanism including a substrate holding portion that holds the substrate and a driving mechanism that drives the substrate holding portion; and

the detection apparatus of any one of claims 1 to 6,

the sensor of the detection device is attached to the substrate holding portion.

8. A method of manufacturing an article, comprising:

transferring a pattern onto a substrate by the lithographic apparatus of claim 7; and

a step of performing a process for the substrate to which the pattern is transferred,

manufacturing an article from the substrate on which the process is completed.

9. A detection device that detects a position of a side surface of a substrate, the detection device comprising:

a processor that processes signals output from the sensors,

the processor obtains the position of the side surface of the substrate based on a waveform of a signal output from the light detection unit and a reference waveform registered in advance.

10. The detection apparatus according to claim 9,

the processor performs processing for determining the position of the side surface of the substrate from a portion of the waveform of the signal output from the light detection unit, the portion having a correlation with the reference waveform higher than a reference value.

11. The detection apparatus according to claim 10,

the processor excludes, from the object of the processing, a portion of the waveform of the signal output from the light detection section, which has a correlation with the reference waveform lower than the reference value.

12. A lithographic apparatus for transferring a pattern onto a substrate, comprising:

the detection apparatus according to any one of claims 9 to 11,

13. A method of manufacturing an article, comprising:

transferring a pattern onto a substrate by the lithographic apparatus of claim 12; and

Fabricating an article from the substrate on which the processing is completed.