JP7138479B2 - Detection apparatus, detection method, lithographic apparatus and article manufacturing method - Google Patents

Description

The present invention relates to a detection apparatus, a detection method, a lithographic apparatus and an article manufacturing method.

In a lithographic apparatus such as an exposure apparatus and an imprint apparatus that transfers a pattern onto a substrate, the position of the side (edge) of the substrate can be detected. The position of the side of the substrate can be used, for example, to pre-align the substrate. Pre-alignment is, for example, acquiring substrate position information so that a mark provided on the substrate falls within the field of view of an alignment scope, or acquiring position information so that the mark falls within the field of view of an alignment scope based on the position information. This is the operation to drive the substrate. Japanese Patent Application Laid-Open No. 2002-200002 discloses a processing unit that includes an illumination unit that illuminates a side surface of a substrate and a detection unit that is arranged below the side surface of the substrate, and obtains the position of the side surface of the substrate based on the detection result of the detection unit. is described.

JP 2017-116868 A

Various structures can exist on the substrate or the chuck that holds it. Alternatively, the chuck holding the substrate can be positioned under various structures. When the structure is positioned on the substrate, when the light is incident on the side surface of the substrate, the light is also incident on the structure, and the reflected light from the structure may be incident on the detection unit. In that case, there is a possibility that the side surface of the substrate cannot be detected correctly.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an advantageous technique for measuring the position of the side surface of a substrate with high accuracy.

One aspect of the present invention relates to a detection device for detecting the position of a side surface of a substrate, the detection device comprising a sensor including a light irradiation unit and a light detection unit, and a processor that processes signals output from the sensor. and a substrate positioning mechanism including a substrate holding portion for holding the substrate and a driving mechanism for driving the substrate holding portion , wherein the light irradiation portion irradiates the side surface of the substrate with light, and the light detection portion , the light from the side surface is detected, and the processor detects a first signal output from the photodetector in the presence of the substrate and a second signal output from the photodetector in the absence of the substrate. The position of the side surface of the substrate is determined based on the signals, and the second signals are a plurality of signals output from the photodetector at a plurality of positions where the substrate holding unit is arranged in a state where the substrate does not exist. is a signal selected from the signals of

ADVANTAGE OF THE INVENTION According to this invention, an advantageous technique is provided in order to measure the position of the side surface of a board|substrate with high precision.

1 depicts an arrangement of a lithographic apparatus according to an embodiment of the invention; FIG. FIG. 4 is a diagram showing an example of arrangement of sensors; The figure which shows the structural example of a sensor. FIG. 4 is a diagram for explaining that a structure can affect detection of the position of the side surface of the substrate; The figure for demonstrating a preliminary process. FIG. 4 is a diagram exemplifying a signal output from a sensor (photodetector); The figure which shows the flow of the preparation process of 1st Embodiment. 4A and 4B are diagrams showing the flow of substrate processing according to the first embodiment; FIG. The figure which shows the flow (a) of the preparation process of 2nd Embodiment, and the flow (b) of substrate processing of 2nd Embodiment. FIG. 4 is a diagram illustrating waveforms;

The invention will now be described through its exemplary embodiments with reference to the accompanying drawings.

FIG. 1 schematically shows the configuration of a lithographic apparatus 100 according to a first embodiment of the invention. Lithographic apparatus 100 may be configured to transfer the pattern of master 1 onto substrate 5 . When the lithographic apparatus 100 is configured as a projection exposure apparatus, pattern transfer is performed by projecting the pattern of the original 1 onto a photosensitive material applied or arranged on the substrate 5 to form a latent image on the photosensitive material. sell. Such a latent image can be converted into a physical pattern (resist pattern) by being developed by a developing device. Alternatively, pattern transfer is by imprinting, when lithographic apparatus 100 is configured as an imprinting apparatus. In imprinting, the imprinting material placed on the substrate 5 is cured while the pattern portion of the original plate is in contact with the imprinting material, and then the cured imprinting material and the pattern portion are separated. can be processing. Lithographic apparatus 100 may comprise a detection device 50 (detection instrument) for detecting the position of the side of substrate 5 . Detecting apparatus 50 may be used without being integrated into lithographic apparatus 100 or may be used being integrated into another apparatus (eg, an apparatus for transporting substrates).

In the following, an example will be described in which the lithographic apparatus 100 is configured as a projection exposure apparatus. Here, directions are defined by an XYZ coordinate system in which the horizontal plane is the XY plane. The substrate 5 can be held with its surface parallel to the XY plane. The lithographic apparatus 100 may comprise an illumination system 3 , a master positioning mechanism 2 , a projection optical system 4 , a substrate positioning mechanism 30 , a metrology instrument 9 , a detection device 50 and a controller 90 . An illumination system 3 illuminates the original 1 with exposure light. The original positioning mechanism 2 holds and positions the original 1 . A projection optical system 4 projects the pattern of the original 1 onto the substrate 5 . The projection optical system 4 can be supported by a support member 13 . A structure 12 can be arranged at a position where the substrate 5 held by the substrate holding part 31 of the substrate positioning mechanism 30 can face. Structure 12 may be supported by support members 13 . The structure 12 can include at least one of, for example, a measuring instrument, a member for holding the measuring instrument, and a correction mechanism for correcting optical characteristics of the projection optical system 4 .

The substrate positioning mechanism 30 can include a substrate holder 31 that holds the substrate 5 and a drive mechanism 32 that drives or positions the substrate 5 by driving or positioning the substrate holder 31 . The substrate holder 31 can include the substrate chuck 6 and the stage 7 that holds the substrate chuck 6 . Although the drive mechanism 32 is shown in simplified form in FIG. 1 , it can include a guide mechanism that guides the substrate holder 31 and an actuator that drives the substrate holder 31 . The substrate positioning mechanism 30 can, for example, position the substrate 5 with respect to six axes: X-axis, Y-axis, Z-axis, rotation about the X-axis, rotation about the Y-axis, and rotation about the Z-axis. The position of the substrate holder 31 can be measured by the measuring device 9 . The measuring device 9 is, for example, a laser interferometer, and can measure the position of the substrate holder 31 using the mirror 8 provided on the substrate holder 31 . The control unit 90 controls the illumination system 3 , the original positioning mechanism 2 , the projection optical system 4 , the substrate positioning mechanism 30 , the measuring instrument 9 and the detection device 50 . The control unit 90 is, for example, PLD (abbreviation of Programmable Logic Device) such as FPGA (abbreviation of Field Programmable Gate Array), or ASIC (abbreviation of Application Specific Integrated Circuit), or a general-purpose device in which a program is incorporated. or a dedicated computer, or a combination of all or part of these.

Sensing device 50 may include one or more sensors 10 and processor 40 . Processor 40 processes signals output from one or more sensors 10 . In this example, the processor 40 is configured as part of the controller 90, and a main controller (not shown) of the controller 90 operates the processor 40 as necessary. However, the processor 40 may be configured separately from the controller 90 . Moreover, the processor 40 may be provided for each individual sensor 10 or may be provided commonly for all the sensors 10 . Also, part of the functions of the processor 40 may be incorporated in the control unit 90 and the other part may be configured separately from the control unit 90 .

One or more sensors 10 may be attached to the substrate holder 31, for example. FIG. 2 shows an example in which three sensors 10 are attached to the substrate holder 31 . Processor 40 may detect the position of one or more points on the side (edge) of substrate 5 by processing signals output from one or more sensors 10 . The processor 40 can detect placement errors (relative position and relative attitude) of the substrate 5 with respect to the substrate holder 31 by processing signals output from the plurality of sensors 10 . Placement errors can include errors in the X-axis direction, Y-axis direction, and rotation about the Z-axis.

FIG. 3 illustrates the configuration of the sensor 10. As shown in FIG. The sensor 10 can include a light emitter LI and a light detector DET. The light irradiation unit LI irradiates the side surface 5 s of the substrate 5 with light 24 , and the light detection unit DET detects the light 19 from the side surface 5 s of the substrate 5 . The processor 40 detects the side surface 5s of the substrate 5 based on the first signal output from the photodetector DET when the substrate 5 exists and the second signal output from the photodetector DET when the substrate 5 does not exist. position can be detected. That is, the processor 40 or the detection device 50 detects the position of the side surface 5s of the substrate 5 based on the first signal and the second signal.

The light irradiation unit LI can include the light source 11 and the optical system 14, for example. Optics 14 may include, for example, mirrors. In one example, light source 11 may generate light 24 in the wavelength range of 500 nm to 1200 nm. Light 24 emitted from the light source 11 is irradiated onto the side surface 5 s of the substrate 5 via the optical system 14 . The direction of the light 24 incident on the side surface 5s of the substrate 5 is typically parallel to the surface (upper surface) of the substrate 5, but may not be parallel. The light 24 is reflected by the side surface 5s of the substrate 5 to generate reflected light (which may include scattered light). Light 19, which is part of the reflected light, enters the photodetector DET. The photodetector DET can include an optical system 15 and a photoelectric converter 17 . Optical system 15 may include, for example, one or more lenses. The photoelectric conversion unit 17 can include, for example, a two-dimensional image sensor or a one-dimensional image sensor (line sensor). When a one-dimensional image sensor is employed, the direction in which the pixels are arranged is desirably the direction orthogonal to the side surface 5s of the substrate 5 when the substrate 5 is arranged in an ideal state. The photoelectric conversion unit 17 detects the light intensity distribution (image) formed on the imaging surface as an electrical signal and transmits the electrical signal to the processor 40 . The waveform of the electrical signal represents the light intensity distribution formed on the imaging surface of the photoelectric conversion unit 17 and includes information indicating the position of the side surface 5s of the substrate S.

As exemplified in FIG. 4, light 24 from the light irradiation unit LI may be reflected by an object different from the substrate 5, such as the structure 12, and the light 20 from the structure 12 may enter the light detection unit DET. . In such a case, if the light 19 from the side surface 5s of the substrate 5 and the light 20 from the structure 12 cannot be distinguished, the position of the side surface 5s of the substrate 5 may be erroneously detected. The relative position between the substrate holding part 31 (substrate 5) and the structure 12 changes when the driving mechanism 32 drives the substrate holding part 31 (substrate 5). In a case where the substrate holding portion 31 (substrate 5) is arranged at a specific position, the light 20 from the structure 12 may enter the photodetector DET. However, in an extreme case, the light 20 from the structure 12 may enter the photodetector DET regardless of where the substrate holder 31 (substrate 5) is positioned within its movable range. do not have.

As a countermeasure for such a problem, it is conceivable to reduce the cross-sectional dimension of the light 24 generated by the light irradiation unit LI (that is, reduce the width of the luminous flux). However, such measures have limitations. For example, the thickness of the substrate 5 to be processed is often not constant (eg 0.3-1.0 mm). Also, the substrate 5 may have warpage. Also, it may be required to place the surface of the substrate 5 and the structure 12 in close proximity. Also, a suitable space (for example, 10 mm) may be provided between the optical system 14 and the substrate chuck 6 to allow for placement errors when placing the substrate 5 on the substrate chuck 6 . For the reasons described above, it is difficult to solve the above problems by reducing the width of the light flux.

Therefore, in the present embodiment, as described above, the processor 40 outputs the first signal output from the photodetector DET in the presence of the substrate 5 and the first signal output from the photodetector DET in the absence of the substrate 5. The position of the side surface 5s of the substrate 5 is obtained based on the second signal. FIG. 4 schematically shows how the sensor 10 performs the detection operation in the presence of the substrate 5 and the first signal is detected by the photodetector DET. FIG. 5 schematically shows how the sensor 10 performs the detection operation in the absence of the substrate 5 and the second signal is detected by the photodetector DET.

FIG. 6A shows a signal detected by the photodetector DET when the substrate 5 is present and light from an object different from the substrate 5 is not incident on the photodetector DET. output signal) are exemplified. The waveform of the signal shown in FIG. 6(a) includes information A indicating the position of the side surface 5s of the substrate 5. As shown in FIG. FIG. 6B shows a signal (a output signal) (first signal) is illustrated. The waveform of the signal shown in FIG. 6B includes false information B due to light from the structure 12 in addition to the information A indicating the position of the side surface 5 s of the substrate 5 . FIG. 6C shows a signal (output signal from the photodetector DET) detected by the photodetector DET when the light from the structure 12 is incident on the photodetector DET without the substrate 5 present. (second signal) is illustrated. The waveform of the signal shown in FIG. 6( c ) does not contain the information A indicating the position of the side surface 5 s of the substrate 5 , but contains false information B due to light from the structure 12 . Here, FIGS. 6B and 6C show signals detected by the photodetector DET when the substrate holder 31 (substrate 5) is arranged at the same position. That is, only the presence or absence of the substrate 5 is different between FIG. 6(b) and FIG. 6(c).

As can be seen from FIGS. 6(b) and 6(c), processor 40, based on the first signal shown in FIG. 6(b) and the second signal shown in FIG. 6(c), The position of the side surface 5s of the substrate 5 can be determined without being deceived by the light from the structure 12. FIG. Specifically, for example, the processor 40 subtracts the second signal shown in FIG. 6(c) from the first signal shown in FIG. Remove or reduce some information B. Then, the processor 40 can obtain the position of the side surface 5s of the substrate 5 from the information A by the light from the side surface 5s of the substrate 5 based on the signal obtained by subtracting the second signal from the first signal. The second signal may be understood as a correction signal for correcting the first signal.

Preliminary processing for acquiring the second signal (correction signal) will be described below with reference to FIG. Preliminary processing is controlled by the control unit 90 . The pretreatment is performed in a state in which the substrate 5 is not placed on the substrate holder 31, as illustrated in FIG. In step S601, the controller 90 controls the drive mechanism 32 so that the substrate holder 31 is positioned at one signal acquisition position selected from a plurality of signal acquisition positions. In step S602, the processor 40 of the control unit 90 causes the detection device 50 to perform a detection operation to obtain a second signal (correction signal). In this detection operation, the detection device 50 causes the light irradiation unit LI to emit light and the light detection unit DET to detect the light. At this time, since the substrate 5 is not placed on the substrate holding portion 31, the light from the substrate 5 does not enter the photodetector DET. On the other hand, when the structure 12 exists in the vicinity of the sensor 10 of the detection device 50, the light emitted from the light irradiation unit LI and reflected by the structure 12 can enter the light detection unit DET. The signal detected by the sensor 10 (photodetector DET) in this detection operation is the second signal (correction signal). The processor 40 of the control unit 90 stores the second signal (correction signal) provided from the sensor 10 in the memory 91 in association with the position where the substrate holding unit 31 is positioned in step S601.

In step S603, the processor 40 of the control unit 90 determines whether steps S601 and S602 have been performed for all of the plurality of signal acquisition positions described above. Steps S601 and S602 are performed for the signal acquisition position. When steps S601 and S602 have been performed for all of the plurality of signal acquisition positions, the control section 90 ends the preliminary processing.

As described above, the processor 40 acquires, as the second signal, the signal output from the photodetector DET when the substrate 5 is not held by the substrate holding portion 31 and the substrate holding portion 31 is arranged at the signal acquisition position. Operations are performed for multiple signal acquisition locations. Thereby, the processor 40 acquires a plurality of second signals respectively corresponding to a plurality of signal acquisition positions.

Substrate processing for transferring a pattern to the substrate 5 will be described below with reference to FIG. Substrate processing is controlled by the controller 90 . The substrate processing includes detection processing for detecting the position of the side surface S of the substrate 5 (disposition error of the substrate 5) using the detection device 50. FIG. In step S<b>701 , the controller 90 controls a transport mechanism (not shown) so that the substrate 5 is placed (loaded) on the substrate holder 31 . The placement (loading) of the substrate 5 on the substrate holder 31 may be performed by the controller 90 permitting the transport mechanism to transport the substrate 5 .

In step S702, the control unit 90 controls the driving mechanism 32 so that the substrate holding unit 31 holding the substrate 5 is positioned at the detection position specified by the control information (recipe file) for controlling substrate processing. do. At step S703, the processor 40 of the control unit 90 causes the detection device 50 to perform a detection operation to obtain a first signal. In this detection operation, the detection device 50 causes the light irradiation unit LI to emit light and the light detection unit DET to detect the light. At this time, since the substrate 5 is arranged on the substrate holding portion 31, the light from the substrate 5 enters the photodetection portion DET. Further, when the structure 12 exists near the sensor 10 of the detection device 50, the light emitted from the light irradiation unit LI and reflected by the structure 12 may also enter the light detection unit DET.

In step S704, the processor 40 of the control unit 90 loads from the memory 91 the second signal obtained at the same position as the detection position or at a position near the detection position in the preparatory process. The position near the detection position can be, for example, the signal acquisition position closest to the detection position among the plurality of signal acquisition positions in the preparatory process. In step S705, the processor 40 of the control unit 90 removes or reduces the information B, which is the effect of light from the structure 12, by subtracting the second signal loaded in step S704 from the first signal obtained in step S703. do. Then, the processor 40 obtains the position of the side surface 5s of the substrate 5 from the information A by the light from the side surface 5s of the substrate 5 based on the signal obtained by subtracting the second signal from the first signal. This process removes or reduces the information B, which is the effect of light from the structure 12, by subtracting the second signal shown in FIG. 6(c) from the first signal shown in FIG. 6(b). and the position of the side surface 5 s of the substrate 5 is obtained from the information A obtained by the light from the side surface 5 s of the substrate 5 . In other words, the processor 40 may be configured to determine the position of the side surface 5s of the substrate 5 based on the signal obtained by removing the component identified by the waveform of the second signal from the waveform of the first signal.

Here, the first signal and the second signal may normally contain noise components. Therefore, it is desirable to prevent erroneous detection due to this noise component. As a method of preventing erroneous detection, for example, there is a method of subtracting a value obtained by multiplying the second signal by a predetermined multiple (positive value greater than 1) from the first signal. This corresponds to subtracting from the first signal shown in FIG. 6(b) the signal in which the waveform of the portion of information B in the second signal shown in FIG. 6(c) is made larger than the actual waveform. In this case, the portion showing a negative value in the subtraction result may be ignored (that is, excluded from the side surface 5S of the substrate 5 to be detected).

If there is a deviation between the detection position where the substrate holding unit 31 is positioned in step S702 and the first signal is acquired in step S703 and the signal acquisition position where the second signal to be loaded in step S704 is acquired, the second signal is acquired. May be modified and used. Specifically, a signal obtained by shifting the waveform of the portion of information B in the second signal shown in FIG. should be subtracted from When a plurality of sensors 10 are provided as illustrated in FIG. 2 , the control section 90 can detect the placement error of the substrate 5 based on the signals output from the plurality of sensors 10 . Alternatively, the control unit 90 may limit the detection position to any one of a plurality of signal acquisition positions.

In step S706, the controller 90 controls the drive mechanism 32 based on the placement error of the substrate 5 detected in step S705, thereby moving the substrate 5 so that the marks on the substrate 5 are within the field of view of an alignment scope (not shown). position it. Then, the controller 90 detects the position of the mark on the substrate 5 using the alignment scope. The substrate 5 has a plurality of marks, the positions of which can be detected. In step S707, the control unit 90 controls the transfer of the pattern onto the substrate 5 while controlling the positioning of the substrate 5 by the drive mechanism 32 based on the detection result in step S706. In step S<b>708 , the controller 90 controls a transport mechanism (not shown) so that the substrate 5 is removed (unloaded) from the substrate holder 31 . The removal (unloading) of the substrate 5 from the substrate holding unit 31 may be performed by the control unit 90 permitting the transport mechanism to transport the substrate 5 .

If the detection position is fixedly determined, the preparation process shown in FIG. 7 can be performed only for that detection position. Alternatively, if the detection position is fixedly determined, in the substrate processing shown in FIG. 7, with the substrate holder 31 positioned at the detection position, before the substrate is loaded, the detection position Preparatory processing may be performed for

A second embodiment of the present invention will be described below. Matters not mentioned in the second embodiment may follow the first embodiment. In the second embodiment, the processor 40 detects the position of the side surface 5s of the substrate 5 based on the waveform of the signal output from the photodetector DET and the pre-registered reference waveform in the detection process. More specifically, the processor 40 determines the position of the side surface 5s of the substrate 5 based on a portion of the waveform of the signal output from the photodetector DET in the detection process that has a higher correlation with the reference waveform than the reference value. It may be configured to perform the desired processing. Further, the processor 40 can be configured to exclude from the target of the detection processing, a portion of the waveform of the signal output from the photodetector DET that has a lower correlation with the reference waveform than the reference value.

The substrate 5 may be made of a material with low reflectivity (eg, glass) and the structure 12 may have a higher reflectivity than the substrate 5 . In this case, the waveform of the fake information B (for example, the area of the waveform, the maximum value) can be larger than the waveform of the information A indicating the position of the side surface 5 s of the substrate 5 . In addition, since the substrates 5 used in the same job or the same process usually have the same thickness and chamfering amount, the waveform of the information A indicating the position of the side surface 5s of the substrate 5 has a high correlation among the plurality of substrates 5. . 2nd Embodiment considers such a characteristic.

Correlation between the waveform of the signal output from the photodetector DET and the reference waveform in the detection process can be evaluated based on the correlation function. The correlation function can be, for example, a function that calculates an inner product between a signal value group representing the waveform of the signal output from the photodetector DET and a signal value group of the reference waveform. Alternatively, more simply, the correlation between the waveform of the signal output from the photodetector DET and the reference waveform in the detection process is performed by comparing at least one of the peak and the half-value width of both as an evaluation item (parameter). may The correlation evaluation method or parameters used for evaluation may be set for each job or process.

Preliminary processing for obtaining a reference waveform will be described below with reference to FIG. Preliminary processing is controlled by the control unit 90 . Preliminary processing can be performed in a state in which a substrate 5 having the same specifications as the substrate 5 used in a job or process to be subjected to substrate processing, which will be described later, is placed on the substrate holder 31 . In step S901, the controller 90 controls the drive mechanism 32 so that the substrate holder 31 is positioned at the signal acquisition position. The signal acquisition position is preferably a position where light from an object other than the substrate 5 does not enter the photodetector DET. In step S<b>902 , the processor 40 of the control unit 90 causes the detection device 50 to perform a detection operation, acquires a second signal (correction signal), and registers (stores) it in the memory 91 . FIG. 10(a) illustrates the reference waveform R obtained in step S902.

Hereinafter, substrate processing for transferring a pattern to the substrate 5 will be described with reference to FIG. 9(b). Substrate processing is controlled by the controller 90 . The substrate processing includes processing for detecting the position of the side surface S of the substrate 5 (disposition error of the substrate 5) using the detection device 50. FIG. In step S<b>1001 , the controller 90 controls a transport mechanism (not shown) so that the substrate 5 is placed (loaded) on the substrate holder 31 . The placement (loading) of the substrate 5 on the substrate holder 31 may be performed by the controller 90 permitting the transport mechanism to transport the substrate 5 .

In step S1002, the processor 40 of the control unit 90 controls the driving mechanism so that the substrate holding unit 31 holding the substrate 5 is positioned at the detection position specified by control information (recipe file) for controlling substrate processing. 32. In step S1003, the processor 40 of the control unit 90 causes the sensor 10 to perform a detection operation and obtain a signal. In this detection operation, the sensor 10 causes the light irradiation unit LI to emit light and the light detection unit DET to detect the light. At this time, since the substrate 5 is arranged on the substrate holding portion 31, the light from the substrate 5 enters the photodetection portion DET. Further, when the structure 12 exists near the sensor 10 of the detection device 50, the light emitted from the light irradiation unit LI and reflected by the structure 12 may also enter the light detection unit DET. FIG. 10(b) illustrates waveforms of signals that may be obtained by the detection device 50 in step S1002.

In step S1004, the processor 40 of the control unit 90 adjusts the side surface 5s of the substrate 5 based on the waveform of the signal acquired in step S1002 and the reference waveform R registered in advance in the preparation process shown in FIG. Detect location. More specifically, the processor 40 determines the position of the side surface 5 s of the substrate 5 based on the portion of the waveform of the signal output from the photodetector DET in the detection process that has a higher correlation with the reference waveform R than the reference value. can be configured to perform processing for obtaining Further, the processor 40 can be configured to exclude from the target of the detection process a portion of the waveform of the signal output from the photodetector DET in the detection process, the portion of which the correlation with the reference waveform is lower than the reference value. In the example of FIG. 10(b), the waveform of the portion of the information A indicating the position of the side surface 5s of the substrate 5 has a higher correlation with the reference waveform R than the reference value. Therefore, the processor 40 performs processing for determining the position of the side surface 5s of the substrate 5 based on the portion of the information A having a higher correlation with the reference waveform R than the reference value in the waveform of the signal output from the photodetector DET. sell. In the example of FIG. 10(b), the waveform of the part of the false information B caused by the light from the structure 12 has a lower correlation with the reference waveform R than the reference value. Therefore, the portion of the waveform of the signal output from the photodetector DET that has a lower correlation with the reference waveform R than the reference value can be excluded from the target of the detection process. FIG. 10(c) illustrates a waveform obtained by excluding a portion of the waveform of the signal output from the photodetector DET whose correlation with the reference waveform R is lower than the reference value from the target of detection processing.

Steps S1005, S1006 and S1007 are the same as steps S706, S707 and S708 in FIG.

An article manufacturing method for manufacturing an article using a pattern forming apparatus represented by the lithographic apparatus 100 of the first or second embodiment will be described below. The method for manufacturing an article includes, for example, transferring a pattern onto a substrate using the lithographic apparatus 100, and processing the substrate to which the pattern has been transferred, and manufacturing an article from the processed substrate. do. For example, when the pattern is a latent image, the process includes developing the pattern to form a physical pattern, using the physical pattern to process the underlying layer (e.g., etching). treatment, treatment of implanting ions). For example, when the pattern is a pattern made of a cured product of an imprint material, the treatment may include treatment of the base using the pattern (e.g., etching treatment, ion implantation treatment). . The article can be, for example, a display device such as a liquid crystal display device, a memory device such as a flash memory or a DRAM, an imaging device, a signal processing device, MEMS, or the like.

100: lithographic apparatus, 1: master, 5, substrate, 10: sensor, 40: processor, LI: light irradiation unit, DET: light detection unit, 12: structure

Claims (9)

A detection device for detecting the position of a side surface of a substrate,
a sensor including a light irradiation unit and a light detection unit;
a processor that processes signals output from the sensor;
a substrate positioning mechanism including a substrate holding portion that holds the substrate and a drive mechanism that drives the substrate holding portion;
The light irradiation unit irradiates the side surface of the substrate with light, the light detection unit detects the light from the side surface,
Based on a first signal output from the photodetector in the presence of the substrate and a second signal output from the photodetector in the absence of the substrate, the processor detects the photodetector of the substrate. find the position of the side,
The second signal is a signal selected from a plurality of signals output from the photodetector at a plurality of positions where the substrate holding unit is arranged in a state where the substrate does not exist.
A detection device characterized by: The substrate is positioned by the substrate positioning mechanism,
The sensor is attached to the substrate holder,
The detection device according to claim 1, characterized in that: the processor acquires, as the second signal, a signal output from the photodetector in a state in which the substrate is not held by the substrate holding unit and the substrate holding unit is arranged at a signal acquisition position;
The processor acquires, as the first signal, a signal output from the photodetector while the substrate is held by the substrate holding unit and the substrate holding unit is placed at or near the signal acquisition position. and determining the position of the side surface of the substrate based on the first signal and the second signal;
3. The detection device according to claim 1 or 2, characterized in that: The processor performs a plurality of operations of acquiring, as the second signal, a signal output from the photodetector while the substrate is not held by the substrate holding unit and the substrate holding unit is placed at the signal acquisition position. obtaining a plurality of second signals respectively corresponding to the plurality of signal acquisition positions by executing on the signal acquisition positions;
The processor acquires, as the first signal, a signal output from the photodetector while the substrate is held by the substrate holding unit and the substrate holding unit is placed at the detection position, and the signal is the first signal. determining the position of the side surface of the substrate based on a second signal corresponding to the detection position or a position in the vicinity thereof among the plurality of second signals;
3. The detection device according to claim 1 or 2, characterized in that: The processor determines the position of the side surface of the substrate based on a signal obtained by removing the component specified by the waveform of the second signal from the waveform of the first signal.
5. The detection device according to any one of claims 1 to 4, characterized in that: wherein the second signal is a signal generated by light from an object different from the substrate;
6. The detection device according to any one of claims 1 to 5, characterized in that: A detection method for detecting the position of a side surface of a substrate with a detection device,
The detection device is
a sensor including a light irradiation unit and a light detection unit;
a substrate positioning mechanism including a substrate holding portion that holds the substrate and a drive mechanism that drives the substrate holding portion;
The detection method includes
A first signal detected by the photodetector by irradiating the side surface of the substrate with the light irradiator in the presence of the substrate and a first signal detected by the photodetector in the absence of the substrate. determining the position of the side surface of the substrate based on a second signal from
The second signal is a signal selected from a plurality of signals detected by the photodetector at a plurality of positions where the substrate holding unit is arranged without the substrate.
A detection method characterized by: A lithographic apparatus for transferring a pattern onto a substrate, comprising:
a substrate positioning mechanism including a substrate holding portion for holding the substrate and a driving mechanism for driving the substrate holding portion;
A detection device according to any one of claims 1 to 6,
wherein the sensor of the detection device is attached to the substrate holder;
A lithographic apparatus characterized by: transferring a pattern onto a substrate by means of a lithographic apparatus according to claim 8;
and performing a process on the substrate to which the pattern has been transferred,
A method for manufacturing an article, comprising manufacturing an article from the substrate that has been subjected to the treatment.

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